A new type of welding head mechanism

Abstract

The utility model relates to the field of semiconductor manufacturing or electronic assembly especially relates to a new type of welding head mechanism, including fixed plate and adjustment seat etc., adjustment seat is connected on fixed plate, and the front end slidingly connected with mounting panel has of adjustment seat, and the top of mounting panel is equipped with servo motor, and the front end of mounting panel is provided with the integral ball spline of gyration, and the inside slidingly connected with connecting pipe has of integral ball spline, and the bottom connecting seat has of connecting pipe, and the bottom slidingly connected with suction nozzle has of connecting seat, and the top screw thread connection has with rotating cap of connecting pipe, and the side setting of rotating cap has gas connector, and the top setting of rotating cap has buffer assembly, and mounting panel is provided with the distance measuring assembly of detecting distance. Through magnet and hall sensor cooperation, when suction nozzle contacts chip and pushes the connecting pipe to move, hall sensor accurately captures the instant of suction nozzle and chip contact, thereby accurately measuring the distance of fixed plate overall drop, reaches chip height measurement accurate, the purpose of pickup position accurate.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing or electronic assembly, and in particular to a novel welding head mechanism. Background Technology

[0002] Semiconductor chips, as core components of the modern electronic information industry, are widely used in consumer electronics, automotive electronics, artificial intelligence, 5G communications, and other fields. With advancements in semiconductor technology, chips are rapidly evolving towards miniaturization and high integration, with packaging precision requirements reaching the micrometer or even nanometer level. In semiconductor packaging processes, the soldering or mounting step is a crucial step in ensuring a reliable connection between the chip and the substrate; its precision directly affects the product's electrical performance, thermal stability, and lifespan. Therefore, packaging equipment places extremely high demands on the pick-up, positioning, and soldering precision of chips.

[0003] In current semiconductor packaging equipment, the relative distance between the pickup head and the chip surface is typically measured in advance using a ranging device when performing chip pickup operations. Common ranging methods include laser triangulation, vision recognition systems, or contact sensors. For example, a laser rangefinder calculates the vertical distance between the pickup head and the chip by emitting a laser beam and receiving the reflected signal; a vision system uses a camera to capture the chip's position and combines it with image processing algorithms to determine its spatial coordinates. These technologies aim to adjust the pickup head's descent height through real-time distance feedback, preventing chip breakage or pad damage due to overvoltage.

[0004] However, laser ranging is susceptible to interference from ambient light, reflective properties of the chip surface, or media contamination, leading to fluctuations in measurement values. Vision systems, on the other hand, are highly dependent on the clarity of markings on the chip surface and the accuracy of camera calibration, and are prone to inaccuracies in scenarios involving tiny or unmarked chips. Furthermore, after long-term operation, wear and tear on mechanical components or aging of sensors will further reduce ranging stability. Utility Model Content

[0005] To overcome the drawback of low ranging accuracy, the technical problem of this utility model is to provide a novel welding head mechanism, which aims to solve the above-mentioned shortcomings.

[0006] A novel welding head mechanism includes a fixed plate and an adjusting seat. The adjusting seat is connected to the fixed plate. A mounting plate is slidably connected to the front end of the adjusting seat. A servo motor is mounted on the top of the mounting plate. A rotary integrated ball spline is provided at the front end of the mounting plate. A connecting tube is slidably connected inside the rotary integrated ball spline. A transmission pulley set is provided between the output shaft of the servo motor and the connecting tube. A connecting seat is connected to the bottom of the connecting tube. A suction nozzle is slidably connected to the bottom of the connecting seat. A connecting screw and a rotating cap are threadedly connected to the top of the connecting tube. An air inlet is provided on the side of the rotating cap. The air inlet, the rotating cap, the connecting tube, the connecting seat, and the suction nozzle are hollowly connected. A buffer assembly is provided on the top of the rotating cap. A distance measuring assembly for detecting distance is provided on the mounting plate.

[0007] Furthermore, it is particularly preferred that the ranging component includes a Hall sensor, the connecting tube is fixedly connected to a magnet, the Hall sensor is mounted in the middle of the mounting plate, the magnet is located in front of the Hall sensor, and a photoelectric sensor is mounted on the left side of the mounting plate.

[0008] Furthermore, it is particularly preferred that the buffer assembly includes a return spring, a fixed vertical plate is connected to the front side of the mounting plate, a fixed horizontal plate is connected to the rear side of the top of the fixed vertical plate, the top of the return spring is connected to the bottom surface of the fixed horizontal plate, and the bottom of the return spring is connected to the top of the rotating cap.

[0009] Furthermore, it is particularly preferred that a sealing ring is provided at the top of the connecting pipe, and the sealing ring is fitted inside the rotating cap.

[0010] Furthermore, it is particularly preferred that the bottom of the connector is connected to a magnetic ring, and the top connection of the suction nozzle is made of magnetic metal.

[0011] Furthermore, it is particularly preferred that the adjusting seat is rotatably connected to an adjusting screw, which is threadedly connected to the mounting plate.

[0012] Compared with the prior art, the present invention has the following advantages: By combining a magnet with a Hall sensor, when the nozzle contacts the chip and pushes the connecting tube to move, the Hall sensor accurately captures the moment when the nozzle contacts the chip, thereby accurately measuring the distance the entire fixing plate descends. The chip height is then calculated based on this distance, achieving the goal of accurate chip height measurement and precise pickup position. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic diagram of the installation structure of the rotary integrated ball spline and connecting pipe of this utility model.

[0015] Figure 3 This is a schematic diagram of the installation structure of the mounting plate and the fixed vertical plate of this utility model.

[0016] Figure 4 This is an exploded view of the installation structure of the connecting screw and rotating cap of this utility model.

[0017] Figure 5 This is an exploded view of the installation structure of the magnet and connector of this utility model.

[0018] The above-mentioned attached drawings include the following reference numerals: 1. Fixing plate, 2. Adjusting seat, 3. Mounting plate, 4. Servo motor, 5. Rotary integrated ball spline, 6. Connecting pipe, 7. Connecting screw, 8. Rotating cap, 9. Air inlet, 10. Connecting seat, 11. Suction nozzle, 12. Magnet, 13. Hall sensor, 14. Photoelectric sensor, 15. Fixing vertical plate, 16. Fixing horizontal plate, 17. Return spring, 18. Sealing ring, 19. Magnetic ring, 20. Adjusting screw. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be understood that these descriptions are merely exemplary and not intended to limit the scope of this utility model. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of this utility model.

[0020] Example: A novel welding head mechanism, such as Figures 1-5 As shown, the assembly includes a fixed plate 1, an adjusting seat 2, a mounting plate 3, a servo motor 4, a rotary ball spline 5, a connecting pipe 6, a connecting screw 7, a rotating cap 8, an air inlet 9, a connecting seat 10, a suction nozzle 11, a ranging component, and a buffer component. The adjusting seat 2 is connected to the fixed plate 1. The mounting plate 3 is slidably connected to the front end of the adjusting seat 2. The servo motor 4 is mounted on the top of the mounting plate 3. The rotary ball spline 5 is located at the front end of the mounting plate 3. The connecting pipe 6 is slidably connected inside the rotary ball spline 5. The servo motor 4... A transmission pulley set is provided between the output shaft and the connecting pipe 6. The bottom of the connecting pipe 6 is connected to the connecting seat 10. The bottom of the connecting seat 10 is slidably connected to the suction nozzle 11. The suction nozzle 11 and the connecting seat 10 are interference fit. The top of the connecting pipe 6 is threaded with the connecting screw 7 and the rotating cap 8. The side of the rotating cap 8 is provided with the air inlet 9. The air inlet 9, the rotating cap 8, the connecting pipe 6, the connecting seat 10 and the suction nozzle 11 are hollowly connected. The top of the rotating cap 8 is provided with the buffer assembly. The mounting plate 3 is provided with the distance measuring assembly for detecting distance.

[0021] like Figure 1 and Figure 3As shown, the ranging component includes a magnet 12, a Hall sensor 13, and a photoelectric sensor 14. The magnet 12 is fixedly connected to the connecting tube 6. The magnet 12 is made of neodymium iron boron strong magnetic material and is reinforced by adhesive at the fixing point. The Hall sensor 13 is installed in the middle of the mounting plate 3, and the magnet 12 is located in front of the Hall sensor 13. The Hall sensor 13 is encapsulated in plastic resin, which has strong anti-interference ability. The photoelectric sensor 14 is installed on the left side of the mounting plate 3.

[0022] like Figure 3 As shown, the buffer assembly includes a fixed vertical plate 15, a fixed horizontal plate 16, and a return spring 17. The fixed vertical plate 15 is connected to the front side of the mounting plate 3, and the fixed horizontal plate 16 is connected to the rear side of the top of the fixed vertical plate 15. The fixed vertical plate 15 is made of aluminum alloy profile with an oxidized surface. The fixed horizontal plate 16 is made of PC plastic sheet, which is thin and has good rigidity. The top of the return spring 17 is connected to the bottom surface of the fixed horizontal plate 16, and the bottom of the return spring 17 is connected to the top of the rotating cap 8. A rubber gasket is provided at the connection between the return spring 17 and the rotating cap 8.

[0023] like Figure 4 As shown, it also includes a sealing ring 18. A sealing ring 18 is provided on the top of the connecting pipe 6. The sealing ring 18 is fitted inside the rotating cap 8. The sealing ring 18 is made of fluororubber. The sealing ring 18 maintains elasticity under the high temperature of welding to prevent air leakage and ensure the reliability of negative pressure adsorption.

[0024] like Figure 5 As shown, it also includes a magnetic ring 19, with the magnetic ring 19 connected to the bottom of the connector 10, and the top of the suction nozzle 11 is a magnetic metal connection.

[0025] like Figure 2 As shown, it also includes an adjusting screw 20. The adjusting seat 2 is rotatably connected to the adjusting screw 20. The adjusting screw 20 is threadedly connected to the mounting plate 3. The adjusting screw 20 is a fine-thread stainless steel screw. The fine-thread screw has high adjustment precision, ensuring the fineness of the position adjustment of the mounting plate 3.

[0026] Before chip soldering, the position needs to be adjusted and the pick-up height measured. When installing the nozzle 11 at the bottom of the connector 10, the nozzle 11 is directly inserted into the connector 10. The top of the nozzle 11 is magnetically attracted to the magnetic ring 19, and the top of the nozzle 11 is interference-fitted with the connector 10 to ensure stable installation and airtight gas flow. Because the top surface of chips in the same batch is at a similar height from the workstation, the height needs to be measured before picking up. The photoelectric sensor 14 first detects the chip position and the height of the chip from the mounting plate 3. The operator rotates the adjusting screw 20 to adjust the left and right position of the mounting plate 3 so that the nozzle 11 is precisely aligned with the center area of ​​the chip. Subsequently, the drive plate 1 moves downwards as a whole, and the adjusting seat 2 and mounting plate 3 move downwards synchronously. When the bottom of the nozzle 11 contacts the chip, the reaction force of the chip pushes the connecting seat 10 and the internally sliding connecting tube 6 upwards. The connecting tube 6 drives the top threaded rotating cap 8 to move upwards synchronously, compressing the return spring 17 between the rotating cap 8 and the fixed vertical plate 15. At the same time, the magnet 12 fixed on the connecting tube 6 moves upwards, generating relative motion with the Hall sensor 13 fixed in the middle of the mounting plate 3. The Hall sensor 13 detects the change in magnetic field at the instant, determining that the nozzle 11 has contacted the chip. The chip height is calculated and recorded based on the displacement of the entire downward movement of the drive plate 1, providing data support for subsequent pickup.

[0027] After the height measurement is completed, the fixing plate 1 is moved upwards a certain distance. The operator then starts the air pump connected to the air inlet 9. The air pump creates a negative pressure inside the suction nozzle 11, and the external atmospheric pressure presses the chip firmly onto the suction nozzle 11, achieving stable adsorption. During the adsorption process, the elasticity of the return spring 17 buffers any possible displacement deviation of the fixing plate 1, preventing excessive force between the suction nozzle 11 and the chip from damaging the chip or the suction nozzle 11, thus ensuring a safe adsorption process.

[0028] After the chip is adsorbed, the servo motor 4 drives the connecting tube 6 to rotate via the transmission pulley set, causing the suction nozzle 11 and the adsorbed chip to rotate synchronously, adjusting the chip to the required welding angle. The integrated ball spline 5 ensures the stability of the connecting tube 6's rotation. The connecting tube 6 is threadedly connected to the rotating cap 8, and the two rotate relative to each other during rotation. The rotating cap 8 moves slightly synchronously with the connecting tube 6, and the return spring 17 adapts to this movement through elastic deformation. The sealing ring 18 always seals the threaded connection, ensuring the airtightness of the hollow channel. After adjustment, the drive fixing plate 1 moves downward, placing the chip with the adjusted angle smoothly on the welding station. The photoelectric sensor 14 on the left side of the mounting plate 3 assists in positioning, ensuring accurate chip placement and providing a foundation for subsequent welding operations.

[0029] After all soldering work is completed, the pick-up component performs a pick-up operation based on the previously measured height data, driving the fixing plate 1 to move above the chip and then downwards so that the suction nozzle 11 contacts the chip. After being adsorbed by negative pressure, the chip is smoothly transferred to the packaging process. During the transfer, the photoelectric sensor 14 monitors the chip position in real time, and the elasticity of the reset spring 17 buffers the vibration during movement, ensuring accurate chip positioning and preventing it from falling off or colliding, ultimately completing the automated transfer of the chip.

[0030] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit the scope of protection of this utility model. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the essence and scope of the technical solutions of this utility model.

Claims

1. A novel welding head mechanism, characterized by: Includes a fixed plate (1) and an adjusting seat (2). The adjusting seat (2) is connected to the fixed plate (1). A mounting plate (3) is slidably connected to the front end of the adjusting seat (2). A servo motor (4) is mounted on the top of the mounting plate (3). A rotary integrated ball spline (5) is provided at the front end of the mounting plate (3). A connecting pipe (6) is slidably connected inside the rotary integrated ball spline (5). A transmission pulley set is provided between the output shaft of the servo motor (4) and the connecting pipe (6). The bottom of the connecting pipe (6) The part is connected to a connecting seat (10), and a suction nozzle (11) is slidably connected to the bottom of the connecting seat (10). A connecting screw (7) and a rotating cap (8) are threadedly connected to the top of the connecting tube (6). An air inlet (9) is provided on the side of the rotating cap (8). The air inlet (9), the rotating cap (8), the connecting tube (6), the connecting seat (10) and the suction nozzle (11) are hollowly connected. A buffer component is provided on the top of the rotating cap (8). A distance measuring component for detecting distance is provided on the mounting plate (3).

2. A novel welding head mechanism according to claim 1, characterized in that: The ranging assembly includes a Hall sensor (13), a magnet (12) is fixedly connected to the connecting tube (6), the Hall sensor (13) is installed in the middle of the mounting plate (3), the magnet (12) is located in front of the Hall sensor (13), and a photoelectric sensor (14) is installed on the left side of the mounting plate (3).

3. A novel welding head mechanism according to claim 2, characterized in that: The buffer assembly includes a reset spring (17), a fixed vertical plate (15) is connected to the front side of the mounting plate (3), a fixed horizontal plate (16) is connected to the rear side of the top of the fixed vertical plate (15), the top of the reset spring (17) is connected to the bottom surface of the fixed horizontal plate (16), and the bottom of the reset spring (17) is connected to the top of the rotating cap (8).

4. A novel welding head mechanism according to claim 3, characterized in that: A sealing ring (18) is provided at the top of the connecting pipe (6), and the sealing ring (18) is fitted inside the rotating cap (8).

5. A novel welding head mechanism according to claim 4, characterized in that: The bottom of the connector (10) is connected to a magnetic ring (19), and the top of the suction nozzle (11) is connected to a magnetic metal.

6. A novel welding head mechanism according to claim 5, characterized in that: The adjusting seat (2) is rotatably connected to an adjusting screw (20), which is threadedly connected to the mounting plate (3).

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