Packaging structure

Abstract

This application discloses a packaging structure comprising: a substrate with a groove; a component with one end of the component facing the substrate embedded in the groove; and solder disposed in the groove to connect the substrate and the component, wherein the solder does not cover the sidewall of the component exposed outside the groove. The purpose of this invention is to achieve precise alignment between the component and the substrate, avoid the use of jigs, thereby reducing costs, and prevent the solder from exceeding the groove, thus avoiding bridging problems.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging, and more specifically, to a packaging structure. Background Technology

[0002] In dual-sided cooling (DSC) packaging, copper spacers are metal layers located between the die and the direct-bonding ceramic substrate (DBC), responsible for improving mechanical stability and thermal conductivity. Copper spacers provide structural support for the die and enhance the mechanical strength of the package, preventing stress concentration caused by thermal expansion coefficient (CTE) mismatch. Current technology relies on alignment jigs to fix the position of the copper spacers; however, the design and fabrication of these jigs require high-precision manufacturing processes, resulting in additional costs and high production costs. Furthermore, after prolonged use, alignment jigs can wear down and deform, requiring the purchase of new jigs, further increasing costs. In addition, the need for manual placement of alignment jigs increases production time, leading to a decrease in unit per hour (UPH) and impacting process efficiency. In addition, the cumulative tolerance between the alignment fixture and the material, the difference in the coefficient of thermal expansion between the alignment fixture and the material, and the deformation of the alignment fixture due to wear can all lead to misalignment of the copper spacers.

[0003] Figure 1 A schematic diagram of a prior art packaging structure is shown. See also... Figure 1 Taking the assembly of substrate 10 and copper spacer 30 as an example, before assembling copper spacer 30 onto substrate 10, an alignment fixture is placed on substrate 10 to determine the final installation position of copper spacer 30 on substrate 10. Then, copper spacer 30 is installed in the alignment fixture and connected to substrate 10 by solder 20. After copper spacer 30 is installed on substrate 10, the alignment fixture is removed. Utility Model Content

[0004] To address the above issues, this application proposes a packaging structure that at least improves the alignment accuracy between components and the substrate, avoids the use of fixtures and thus reduces costs, and ensures that the solder does not exceed the groove, thereby avoiding bridging problems.

[0005] The technical solution of this application is implemented as follows:

[0006] According to one aspect of this application, a packaging structure is provided, comprising: a substrate having a groove thereon; an element having one end of the element facing the substrate embedded in the groove; and solder disposed in the groove to connect the substrate and the element, wherein the solder does not cover the sidewall of the element exposed outside the groove.

[0007] In some embodiments, the substrate includes a first substrate disposed above the element and a second substrate disposed below the element.

[0008] In some embodiments, the element includes a spacer, the first end of which, facing the first substrate, is embedded in a groove on the first substrate.

[0009] In some embodiments, the first end of the spacer tapers along the direction toward the groove.

[0010] In some embodiments, the width of the groove gradually increases from the bottom to the top of the groove.

[0011] In some embodiments, the first end is triangular.

[0012] In some embodiments, the first end is semi-elliptical.

[0013] In some embodiments, the spacer is a copper column.

[0014] In some embodiments, the substrate includes a ceramic layer and copper layers disposed on opposite sides of the ceramic layer, with a groove disposed in the copper layer facing the element.

[0015] In some embodiments, the solder is tin.

[0016] In some embodiments, the component and the copper layer with grooves cover the solder.

[0017] In some embodiments, the element further includes a chip, the side of the chip facing the second substrate being embedded in a groove on the second substrate.

[0018] In some embodiments, the first substrate, the spacer, the chip, and the second substrate are arranged sequentially from top to bottom.

[0019] In some embodiments, the lower surface of the spacer and the upper surface of the chip are welded together.

[0020] In some embodiments, the packaging structure further includes a lead frame disposed on a second substrate.

[0021] In some embodiments, the packaging structure further includes a first lead for electrically connecting the chip to the second substrate.

[0022] In some embodiments, the package structure further includes a second lead for electrically connecting the second substrate to the lead frame.

[0023] In some embodiments, the substrate is an active metal brazed ceramic substrate or a direct copper-clad ceramic substrate.

[0024] In some embodiments, the packaging structure further includes a molding layer disposed between the first substrate and the second substrate and molding the chip and spacers.

[0025] According to another aspect of this application, a packaging structure is provided, the packaging structure comprising: a substrate having a groove thereon; a component having one end of the component facing the substrate disposed in the groove; and solder disposed in the groove to connect the substrate and the component and the solder not extending beyond the groove.

[0026] The beneficial effects of the above technical solution include at least the following: precise alignment of components and substrate, avoiding the use of jigs and thus reducing costs, and solder not exceeding the groove, thus avoiding bridging problems. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A schematic diagram of the packaging structure of the prior art is shown.

[0029] Figure 2 A cross-sectional schematic diagram of a packaging structure according to some embodiments of this application is shown.

[0030] Figure 3 It shows Figure 2 A cross-sectional schematic diagram showing the fit between the spacer in region A and the first substrate.

[0031] Figure 4 It shows Figure 2 A schematic diagram showing the separation of the spacer in region A from the first substrate.

[0032] Figure 5 A schematic diagram of the first end of a spacer according to some embodiments of this application is shown.

[0033] Figure 6 A schematic diagram of the first end of a spacer according to some embodiments of this application is shown.

[0034] Figure 7 A schematic diagram of the engagement between a spacer and a first substrate according to some embodiments of this application is shown.

[0035] Figure 8 A cross-sectional schematic diagram during the manufacturing process of a packaging structure according to some embodiments of this application is shown.

[0036] Figure 9 A cross-sectional schematic diagram during the manufacturing process of a packaging structure according to some embodiments of this application is shown.

[0037] Figure 10 A cross-sectional schematic diagram during the manufacturing process of a packaging structure according to some embodiments of this application is shown.

[0038] Figure 11 A cross-sectional schematic diagram during the manufacturing process of a packaging structure according to some embodiments of this application is shown. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0040] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of elements and arrangements will be described below to simplify the present invention. These are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the present invention. Such repetition is merely for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0041] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] Figure 2 A cross-sectional schematic diagram of a packaging structure 100 according to some embodiments of this application is shown. Figure 3 It shows Figure 2 A cross-sectional view of the engagement between the spacer 130 in region A and the first substrate 111. Figure 4 It shows Figure 2 A schematic diagram showing the separation of the spacer 130 in region A from the first substrate 111. (See attached diagram.) Figure 2 , Figure 3 and Figure 4The package structure 100 includes: a substrate, which may include, for example, a first substrate 111 and a second substrate 112, and a recess 118 is provided on the substrate; a component, which may include, for example, a spacer 130 and a chip 140, with one end of the component facing the substrate embedded in the recess 118; and solder 120 disposed in the recess 118 to connect the substrate and the component, and the solder 120 does not cover the sidewalls of the component exposed outside the recess 118. In some embodiments, the substrate includes a first substrate 111 disposed above the component and a second substrate 112 disposed below the component. Figure 2 , Figure 3 and Figure 4 Taking spacer 130 and first substrate 111 as an example, the first end 131 of spacer 130 facing the first substrate 111 is embedded in a groove 118 on the first substrate 111, and solder 120 does not cover the sidewall of spacer 130 exposed outside the groove 118. Figure 4It is also shown that by providing a groove 118 on the first substrate 111, the spacer 130 can be directly connected to the groove 118 of the first substrate 111 via solder 120, without needing to pre-determine the final position of the spacer 130 using an alignment fixture. At least compared to the prior art, the packaging structure 100 of this application does not require an alignment fixture, reducing costs and eliminating the positioning process of the alignment fixture, as well as the time required for picking up and placing the alignment fixture, thus increasing yield per unit time. Furthermore, the design of the spacer 130 is not limited by the alignment fixture, allowing for greater flexibility. Therefore, at least the alignment of the component (here, spacer 130 is an example, chip 140 is similar) with the substrate (here, first substrate 111 is an example, second substrate 112 is similar) is accurate, avoiding the use of an alignment fixture and thus reducing costs, and the solder 120 does not exceed the groove 118, avoiding bridging problems. Further, in some embodiments, the first end 131 of the spacer 130 tapers along the direction toward the groove 118. Furthermore, adapting to the shape of the first end 131 of the spacer 130, the width of the groove 118 gradually widens from the bottom to the top of the groove 118. By configuring the mating surfaces of the groove 118 and the spacer 130 in this way, precise alignment between the spacer 130 and the first substrate 111 can be achieved without providing an alignment fixture. In some embodiments, the substrate (taking the first substrate 111 as an example, and the second substrate 112 as an example) includes a ceramic layer 1111 and copper layers 1112 respectively disposed on opposite sides of the ceramic layer, and the groove 118 is disposed in the copper layer 1112 facing the component (taking the spacer 130 as an example, and the chip 140 as an example). In some embodiments, the solder 120 is tin. And the component (taking the spacer 130 as an example, and the chip 140 as an example) and the copper layer 1112 with the groove 118 can cover the solder 120. In some embodiments, the substrate (the first substrate 111 and the second substrate 112) is an active metal brazed ceramic substrate or a direct copper-clad ceramic substrate. In some embodiments, the package structure 100 further includes a molding layer 150 disposed between the first substrate 111 and the second substrate 112, and molding the chip 140 and the spacer 130. The package structure 100 may also include a lead frame 160 disposed on the second substrate 112. In some embodiments, the package structure 100 further includes a first lead 170 electrically connecting the chip 140 to the second substrate 112. In some embodiments, the package structure 100 further includes a second lead 180 electrically connecting the second substrate 112 to the lead frame 160.

[0043] See also Figures 2 to 4It is understood that, as previously exemplified by spacer 130, in some embodiments, the element can also be chip 140, and chip 140 has a similar mating relationship with a groove on a substrate (e.g., second substrate 112) as spacer 130. The side of chip 140 facing the second substrate 112 can be embedded in a groove on the second substrate 112 (similar to the arrangement of groove 118 on the first substrate 111). The first substrate 111, spacer 130, chip 140, and second substrate 112 can be arranged sequentially from top to bottom, or they can be arranged upside down. Furthermore, in some embodiments, the lower surface of spacer 130 and the upper surface of chip 140 are soldered together by solder 120.

[0044] Figure 5 A schematic diagram of the first end 131 of the spacer 130 according to some embodiments of this application is shown. Figure 6 A schematic diagram of the first end 131 of the spacer 130 according to some embodiments of this application is shown. See also Figure 5 and Figure 6 The first end 131 of the spacer 130 can have various shapes to accommodate the shapes of various grooves 118 formed on the first substrate 111. In some embodiments, the first end 131 is triangular. In some embodiments, the first end 131 is semi-elliptical. The first end 131 can also have other reasonable shapes to accommodate the shape of the groove 118. It should be understood that it is preferable to set the shape of the first end 131 to match the shape of the groove 118. In some embodiments, the spacer 130 is a copper pillar.

[0045] Figure 7 A schematic diagram showing the engagement of the spacer 130 and the first substrate 111 according to some embodiments of this application is shown. See also Figure 7 The diagram shows spacers 130 of different sizes. In fact, considering the actual manufacturing process, the package structure 100 can be provided with multiple spacers 130, and the spacers 130 can have any reasonable different sizes and shapes.

[0046] This application also provides a packaging structure, which can be referred to in conjunction with it. Figure 2 and Figure 3 To understand this, the package structure 100 includes: a substrate (taking the first substrate 111 as an example, and the second substrate 112 is similar), on which a groove 118 is provided; an element (taking the spacer 130 as an example, and the chip 140 is similar), with one end of the element facing the substrate disposed in the groove 118; and solder 120 disposed in the groove 118 to connect the substrate and the element, and the solder 120 does not extend beyond the groove 118.

[0047] Figure 8 , Figure 9 , Figure 10 as well as Figure 11 A cross-sectional view during the manufacturing process of a package structure 100 according to some embodiments of this application is shown. See also Figure 8 A groove 118 is formed by etching on the copper layer 1112 of the first substrate 111 facing the spacer 130. Alternatively, the groove 118 can be formed using other suitable processes. Then, the first substrate 111, solder (which can be tin foil) 120, and spacer 130 are stacked together. Figure 9 In this process, reflow soldering is performed on the area where the spacer 130 is embedded in the groove 118. Figure 10 In this process, an upper structure is provided, stacked above the spacer 130. The upper structure includes a second substrate 112 and a chip 140. It is understood that in the aforementioned process of stacking the spacer 130 with the first substrate 111 and reflow soldering, the second substrate 112 can also have a groove similar to that of the first substrate 111, and solder 120 is stacked and reflow soldered, so that the chip 140 is embedded into the groove on the second substrate 112. In fact, similar to the spacer 130, the connection between the chip 140 and the second substrate 112 also requires an alignment fixture. A groove is provided on the second substrate 112, and the chip 140 is placed in this groove, similar to the spacer 130, and the solder 120 does not cover the sidewalls of the chip 140 exposed outside the groove. This ensures precise alignment between the chip 140 and the second substrate 112, avoids the use of an alignment fixture to reduce costs, and prevents the solder 120 from exceeding the groove, thus avoiding bridging. Figure 11 In this process, spacer 130 is connected to chip 140 by solder 120, and a molding layer 150 for encapsulating spacer 130 and chip 140 can be subsequently formed (see [link]). Figure 2 To form an encapsulation structure 100.

[0048] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A packaging structure, characterized in that, include: A substrate having grooves provided thereon; An element, one end of which faces the substrate, is embedded in the groove; Solder is disposed in the groove to connect the substrate and the component, and the solder does not cover the sidewalls of the component exposed outside the groove.

2. The packaging structure according to claim 1, characterized in that, The substrate includes a first substrate disposed above the element and a second substrate disposed below the element.

3. The packaging structure according to claim 2, characterized in that, The element includes a spacer, the first end of which, facing the first substrate, is embedded in the groove on the first substrate.

4. The packaging structure according to claim 3, characterized in that, The first end of the spacer tapers in the direction toward the groove.

5. The packaging structure according to claim 4, characterized in that, The width of the groove gradually increases from the bottom to the top of the groove.

6. The packaging structure according to claim 3, characterized in that, The spacer is a copper column.

7. The packaging structure according to claim 1, characterized in that, The substrate includes a ceramic layer and copper layers respectively disposed on opposite sides of the ceramic layer, and the groove is disposed in the copper layer facing the element.

8. The packaging structure according to claim 7, characterized in that, The component and the copper layer with grooves cover the solder.

9. The packaging structure according to claim 3, characterized in that, The component also includes a chip, which is embedded in the groove on the second substrate on the side facing the second substrate.

10. The packaging structure according to claim 1, characterized in that, The substrate is an active metal brazed ceramic substrate or a direct copper-clad ceramic substrate.

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