Packaging structure
Patent Information
- Application Number
- CN202522283782.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-09-22
- Estimated Expiration
- 2035-10-28
AI Technical Summary
本公开实施例提供的封装结构中，阻挡块设置于散热板的外周端部，阻挡块顶部凸出于散热板顶面，塑封层填充于芯片周侧基板与散热板之间；本公开实施例中，阻挡块设置于散热板的外周端部且凸出于散热板顶面，则在封装模具中对芯片进行塑封形成塑封层时，凸出于散热板顶面的阻挡块能够与封装模具顶部相接触并进行适度挤压，使得散热板的外周端部的阻挡块均与封装模具顶部有效接触，有利于阻挡塑封时的塑封料溢出至散热板顶面，从而有利于尽可能地避免塑封料残留在散热板本体的表面，进而有利于保障封装结构散热板的散热性能和外观整洁。
Smart Images
Figure CN224791099U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of semiconductor packaging, and more particularly to a packaging structure. Background Technology
[0002] As the integration level and frequency of packaging structures continue to increase, the heat dissipation requirements of packaging structures are becoming increasingly prominent.
[0003] Heat accumulation inside the packaging structure can cause excessively high temperatures in the functional chips, devices, and other electronic components, thus affecting their performance and potentially shortening the lifespan of the packaging structure.
[0004] Currently, in semiconductor packaging structures, heat dissipation is achieved by covering the chip's surface away from the substrate with a heat sink, and the heat sink and chip are bonded together using adhesive materials such as thermal interface materials (TIM). Utility Model Content
[0005] The problem addressed by the embodiments of this disclosure is to provide a packaging structure that helps to ensure the heat dissipation performance and neat appearance of the heat sink of the packaging structure.
[0006] To address the aforementioned issues, this disclosure provides a packaging structure comprising: a substrate; a chip soldered onto the substrate; a heat sink mounted on the top of the chip; a blocking block disposed at the outer periphery of the heat sink, the top of the blocking block protruding from the top surface of the heat sink; and a molding compound filling the space between the substrate and the heat sink around the chip.
[0007] Optionally, the blocking block is an elastic structure.
[0008] Optionally, the material of the blocking block includes one or more of rubber, TPE, and latex.
[0009] Optionally, the blocking block is attached around the top surface of the outer peripheral end of the heat sink.
[0010] Optionally, the blocking block is embedded around the top of the outer peripheral end of the heat sink.
[0011] Optionally, a first recess is formed on the top surface of the outer peripheral end of the heat sink; a portion of the blocking block is located in the first recess, and the remaining portion of the blocking block protrudes from the first recess.
[0012] Optionally, the blocking block includes two intersecting extensions, with one of the two extensions serving as the first extension and the other protruding from the first extension serving as the second extension. The second extension is located in the first recess, and the first extension covers the top surface of the heat sink.
[0013] Optionally, the sidewall of the first extension is flush with the sidewall of the heat sink.
[0014] Optionally, the blocking block is embedded around the side of the outer periphery of the heat sink and protrudes from the side wall of the heat sink, and the portion of the blocking block protruding from the side wall of the heat sink protrudes from the top surface of the heat sink.
[0015] Optionally, a second recess is formed on the sidewall of the outer peripheral end of the heat sink; a portion of the blocking block is located in the second recess, and the remaining portion of the blocking block protrudes from the second recess, the portion of the blocking block protruding from the second recess extending along the sidewall of the heat sink and protruding from the top surface of the heat sink.
[0016] Optionally, the blocking block includes two intersecting extensions, with one of the two extensions serving as the first extension and the other protruding from the first extension serving as the second extension. The second extension is located in the second recess, and the first extension covers the sidewall of the heat sink plate, extending along the sidewall of the heat sink plate and protruding from the top surface of the heat sink plate.
[0017] Optionally, the first extension completely covers the sidewall of the heat sink.
[0018] Optionally, the two intersecting extensions form a "T" shape; or, the two intersecting extensions form a "+" shape; or, the two intersecting extensions form an "L" shape.
[0019] Optionally, the two intersecting extensions are perpendicular to each other.
[0020] Compared with the prior art, the technical solution of the present disclosure has the following advantages: In the packaging structure provided in this embodiment, a blocking block is disposed at the outer peripheral end of the heat sink, with the top of the blocking block protruding from the top surface of the heat sink. The molding compound is filled between the chip peripheral substrate and the heat sink. In this embodiment, since the blocking block is disposed at the outer peripheral end of the heat sink and protrudes from the top surface of the heat sink, when the chip is molded in the packaging mold to form the molding compound, the blocking block protruding from the top surface of the heat sink can contact the top of the packaging mold and be moderately squeezed, so that the blocking blocks at the outer peripheral end of the heat sink can effectively contact the top of the packaging mold. This helps to prevent the molding compound from overflowing to the top surface of the heat sink during molding, thereby helping to avoid the molding compound remaining on the surface of the heat sink body as much as possible, and thus helping to ensure the heat dissipation performance and clean appearance of the heat sink in the packaging structure. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the structure corresponding to the first embodiment of the packaging structure disclosed herein; Figure 2 This is a schematic diagram of the second embodiment of the packaging structure disclosed herein; Figure 3 This is a schematic diagram of the structure corresponding to the third embodiment of the packaging structure disclosed herein; Figure 4 This is a schematic diagram of the structure corresponding to the fourth embodiment of the packaging structure disclosed herein; Figure 5 This is a schematic diagram of the fifth embodiment of the packaging structure disclosed herein. Detailed Implementation
[0022] As the background technology shows, currently, the common practice is to design a heat sink groove on the packaging mold. During the molding of the encapsulant, the top surface of the heat sink contacts the top of the packaging mold and adheres to the encapsulant under the action of the packaging mold. However, the top surface of the heat sink usually cannot effectively contact the top of the mold, resulting in a gap between the heat sink and the top of the packaging mold. When the encapsulant is injected, it is easy for the encapsulant to overflow onto the surface of the heat sink. Once there is overflow on the top surface of the heat sink, it will directly affect the heat dissipation efficiency of the heat sink and the appearance of the product. In order to remove the overflow on the top surface of the heat sink, mechanical grinding or high-energy laser removal is required, which directly increases the packaging cost and the risk of damage to the heat sink.
[0023] To address the aforementioned technical problems, this disclosure provides a packaging structure, comprising: a substrate; a chip soldered onto the substrate; a heat sink mounted on the top of the chip; a blocking block disposed at the outer periphery of the heat sink, the top of the blocking block protruding from the top surface of the heat sink; and a molding compound filling the space between the substrate and the heat sink around the chip.
[0024] In this embodiment, the blocking block is disposed at the outer peripheral end of the heat sink and protrudes from the top surface of the heat sink. When the chip is encapsulated in the packaging mold to form a molding layer, the blocking block protruding from the top surface of the heat sink can contact the top of the packaging mold and be moderately squeezed, so that the blocking blocks at the outer peripheral end of the heat sink can effectively contact the top of the packaging mold. This helps to prevent the molding material from overflowing to the top surface of the heat sink during molding, thereby helping to avoid the molding material remaining on the surface of the heat sink body as much as possible, and thus helping to ensure the heat dissipation performance and appearance of the heat sink of the packaging structure.
[0025] To make the above-mentioned objects, features and advantages of the embodiments of this disclosure more apparent and understandable, the specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.
[0026] Figure 1 This is a schematic diagram of the first embodiment of the packaging structure disclosed herein.
[0027] refer to Figure 1 The packaging structure includes: a substrate 100; a chip 200 soldered onto the substrate 100; a heat sink 300 mounted on the top of the chip 200; a blocking block 400 disposed at the outer periphery of the heat sink 300, with the top of the blocking block 400 protruding from the top surface of the heat sink 300; and a molding layer 500 filled between the substrate 100 and the heat sink 300 around the chip 200.
[0028] The substrate 100 is used to provide a process operation basis for realizing the chip 200 packaging.
[0029] In some embodiments, the substrate 100 includes a substrate and an interconnect layer located in the substrate, wherein the exposed surface of the interconnect layer is a process operation platform.
[0030] In some embodiments, the interconnect layer is a redistribution layer (RDL). Specifically, the redistribution layer may include one or more redistribution interconnect layers.
[0031] Electrical connections between chip 200 and external circuits are achieved through interconnect layers in the substrate.
[0032] Specifically, in some embodiments, the substrate is a packaging substrate, which can be an existing ceramic substrate, a multilayer substrate, a MIS (Molded Interconnect System) plastic-encapsulated interconnect substrate, or a redistribution stack layer, etc. These substrate materials and technologies each have their own characteristics: ceramic substrates have excellent thermal conductivity and mechanical strength, making them suitable for high-power and high-reliability scenarios; multilayer substrates achieve high-density interconnection through multilayer wiring, making them suitable for complex circuit designs; MIS plastic-encapsulated interconnect substrates combine injection molding and interconnection technologies, offering advantages in high integration and low cost; and redistribution stack layers achieve higher integration density and performance optimization through vertical stacking and redistribution technologies.
[0033] Chip 200 is used to implement the basic functions of the package structure.
[0034] Specifically, chips 200 with different functions can be selected based on the performance requirements of the packaging structure.
[0035] In some embodiments, the packaging structure further includes a first conductive bump 210 located between the substrate 100 and the chip 200, and electrically connected to the substrate 100 and the chip 200.
[0036] The first conductive bump 210 is used to realize the electrical connection between the chip 200 and the substrate 100.
[0037] In some embodiments, the material of the first conductive bump 210 includes one or more of tin, copper, aluminum, tungsten, cobalt, nickel, titanium, tantalum, titanium nitride, and tantalum nitride. As an example, the material of the first conductive bump 210 is tin.
[0038] In some embodiments, the first conductive bump 210 can be a microbump (uBump), which has a high density and is beneficial to improving the communication speed between the chip 200 and the substrate 100.
[0039] Heat sink 300 is used to dissipate heat from the package structure.
[0040] In some embodiments, the heat sink 300 also extends laterally (e.g. Figure 1 (As shown in the X direction) Extends to the top of the side of the chip 200, which further increases the heat dissipation area of the heat sink 300, thereby improving the heat dissipation capacity of the package structure.
[0041] In some embodiments, a first notch 310 is formed on the top surface of the outer peripheral end of the heat sink 300.
[0042] The first notch 310 is used to position the blocking block 400 and to provide space for setting the blocking block 400.
[0043] In some embodiments, the first notch 310 is along the longitudinal direction (e.g. Figure 1(As shown in the Y direction) Extends into the heat sink 300 of a certain thickness, which helps to make the blocking block 400 more stably set in the first recess 310 of the heat sink 300.
[0044] In some embodiments, the heat sink 300 is made of a metallic material.
[0045] In some embodiments, the packaging structure further includes a thermal interface material (TIM) layer 220 located between the top of the chip 200 and the heat sink 300.
[0046] The thermal interface material layer 220 is used to bond the heat sink 300 to the top of the chip 200.
[0047] The blocking block 400 is used to prevent the molding compound from overflowing onto the top surface of the heat sink 300 when the chip 200 is being molded.
[0048] In some embodiments, the blocking block 400 is a ring-shaped closed structure. The blocking block 400 is disposed around the outer peripheral end of the heat sink 300 and protrudes from the top surface of the heat sink 300. When the chip 200 is encapsulated in the packaging mold to form the encapsulation layer 500, the blocking block 400 protruding from the top surface of the heat sink 300 can contact the top of the packaging mold and be moderately squeezed, so that the blocking blocks 400 at the outer peripheral end of the heat sink 300 can effectively contact the top of the packaging mold. This helps to prevent the encapsulation material from overflowing to the top surface of the heat sink 300 during encapsulation, thereby helping to avoid the encapsulation material remaining on the surface of the heat sink 300 body as much as possible, and thus helping to ensure the heat dissipation performance and clean appearance of the heat sink 300 in the packaging structure.
[0049] In some embodiments, the blocking block 400 is an elastic structure.
[0050] If the blocking block 400 is an elastic structure, when the chip 200 is encapsulated in the packaging mold to form the encapsulation layer 500, the blocking block 400 can contact the top of the packaging mold. Through compression and elastic deformation, the blocking block 400 and the top of the packaging mold are completely and relatively sealed together, minimizing the gaps between the blocking block 400 and the top of the mold. This prevents the encapsulation material from overflowing onto the surface of the heat sink 300 body, thus helping to ensure the heat dissipation performance and clean appearance of the heat sink 300 in the packaging structure.
[0051] In some embodiments, the material of the blocking block 400 includes rubber, TPE, latex, etc.
[0052] The blocking block 400, made of materials such as rubber, TPE, and latex, has good elasticity.
[0053] In some embodiments, the blocking block 400 is embedded in the top of the outer peripheral end of the heat sink 300 and protrudes from the top surface of the heat sink 300.
[0054] The blocking block 400 is embedded in the top of the outer periphery of the heat sink 300 and protrudes from the top surface of the heat sink 300, so that the blocking block 400 can play a good blocking role and be well fixed in the heat sink 300.
[0055] In some embodiments, a portion of the blocking block 400 is located in the first recess 310, and the remaining portion of the blocking block 400 protrudes from the first recess 310.
[0056] Part of the blocking block 400 is located in the first recess 310, so that the blocking block 400 is fixed to the outer peripheral end of the heat sink 300, and the remaining blocking block 400 protrudes from the first recess 310, which is used to block the molding material during molding.
[0057] In some embodiments, the blocking block 400 includes two intersecting extensions 430, one of which is a first extension 410, and the other protruding from the first extension 410 is a second extension 420. The second extension 420 is located in the first recess 310, and the first extension 410 covers the top surface of the heat sink 300.
[0058] The second extension 420 is located in the first recess 310. The blocking block 400 is fixed to the outer peripheral end of the heat sink 300 through the second extension 420. The first extension 410 covers the top surface of the heat sink 300, that is, the first extension 410 protrudes from the top surface of the heat sink 300, so that the first extension 410 plays the role of blocking the molding compound during molding.
[0059] Moreover, the two extensions 430 are connected in a cross manner, and the second extension 420 is located in the first recess 310. The connected first extension 410 covers the top surface of the heat sink 300, so that the two extensions 430 are locked at the corner of the first recess 310, which helps to improve the stability of the blocking block 400 fixed to the outer periphery of the heat sink 300.
[0060] In some embodiments, the two intersecting extensions 430 are perpendicular to each other.
[0061] The two intersecting extensions 430 are perpendicular to each other, so that the two intersecting extensions 430 can be well adapted to the corner of the first notch 310, thereby further improving the stability of the blocking block 400 fixed to the outer periphery of the heat sink 300.
[0062] In some embodiments, the sidewall of the first extension 410 is flush with the sidewall of the heat sink 300.
[0063] When the sidewall of the first extension 410 is flush with the sidewall of the heat sink 300, the first extension 410 can block the molding compound at the outermost edge of the heat sink 300, thus providing relatively complete protection for the top surface of the entire heat sink 300.
[0064] In some embodiments, the two intersecting extensions 430 form a “T” shape.
[0065] The two intersecting extensions 430 form a "T" shape. Correspondingly, the "I"-shaped part of the "T" shape can be used as the first extension 410, covering the top surface of the heat sink 300, and the "|"-shaped part of the "T" shape can be used as the second extension 420, which is disposed in the first recess 310. Alternatively, the "|"-shaped part of the "T" shape can be used as the first extension 410, covering the top surface of the heat sink 300, and the "I"-shaped part of the "T" shape protruding from either end of the "|"-shaped part can be used as the second extension 420, which is disposed in the first recess 310. It should be noted that in this case, the other end of the "I"-shaped part of the "T" shape protruding from the "|"-shaped part also protrudes from the top surface of the heat sink 300, which can work together with the first extension 410 to block the molding compound.
[0066] The molding layer 500 is used to protect and mold the chip 200 to form a package structure.
[0067] In some embodiments, the molding layer 500 is made of a molding material, such as epoxy resin. Epoxy resin has advantages such as low shrinkage, good adhesion, good corrosion resistance, excellent electrical properties, and low cost. In other embodiments, other suitable encapsulation materials may be used for the molding layer.
[0068] In some embodiments, the packaging structure further includes a second conductive bump 110 located at the bottom of the substrate 100.
[0069] The second conductive bump 110 is used to realize the electrical connection between the substrate 100 and the outside.
[0070] In some embodiments, the material of the second conductive bump 110 includes one or more of tin, copper, aluminum, tungsten, cobalt, nickel, titanium, tantalum, titanium nitride, and tantalum nitride. As an example, the material of the second conductive bump 110 is tin.
[0071] In some embodiments, the second conductive bump 110 may be a ball grid array (BGA) structure.
[0072] Figure 2 This is a schematic diagram of the second embodiment of the packaging structure disclosed herein.
[0073] The same features of this embodiment as the foregoing embodiments will not be repeated here. The difference between this embodiment and the foregoing embodiments lies in that two cross-connected extension parts form a cross shape.
[0074] With reference to Figure 2 , the two cross-connected extension parts 431 form a cross shape.
[0075] The two cross-connected extension parts 431 form a cross shape. Correspondingly, the horizontal part of the cross shape may be used as the first extension part 411, which covers the top surface of the heat dissipation plate 301, and the vertical part of the cross shape protruding from either end of the horizontal part is used as the second extension part 421, which is arranged in the first recess 311. At this time, the vertical part of the cross shape protruding from the other end of the horizontal part also protrudes from the top surface of the heat dissipation plate 301, and can block the molding compound together with the first extension part 411. Alternatively, the vertical part of the cross shape may be used as the first extension part 411, which covers the top surface of the heat dissipation plate 301, and the horizontal part of the cross shape protruding from either end of the vertical part is used as the second extension part 421, which is arranged in the first recess 311. At this time, the horizontal part of the cross shape protruding from the other end of the vertical part also protrudes from the top surface of the heat dissipation plate 301, and can block the molding compound together with the first extension part 411.
[0076] For the specific description of the packaging structure in this embodiment, reference may be made to the corresponding description in the foregoing embodiments, which will not be repeated here.
[0077] Figure 3 is a structural schematic diagram corresponding to the third embodiment of the packaging structure of the present disclosure.
[0078] The same features of this embodiment as the foregoing embodiments will not be repeated here. The difference between this embodiment and the foregoing embodiments lies in that two cross-connected extension parts form an L-shape.
[0079] With reference to Figure 3 , the two cross-connected extension parts 432 form an L-shape.
[0080] The two cross-connected extension parts 432 form an L-shape. Correspondingly, the horizontal part of the L-shape may be used as the first extension part 412, which covers the top surface of the heat dissipation plate 302, and the vertical part of the L-shape is used as the second extension part 422, which is arranged in the first recess 312. Alternatively, the vertical part of the L-shape may be used as the first extension part 412, which covers the top surface of the heat dissipation plate 302, and the horizontal part of the L-shape is used as the second extension part 422, which is arranged in the first recess 312.
[0081] For a detailed description of the packaging structure described in this embodiment, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.
[0082] Figure 4 This is a schematic diagram of the fourth embodiment of the packaging structure disclosed herein.
[0083] The similarities between this embodiment and the previous embodiment will not be repeated here. The difference between this embodiment and the previous embodiment is that: the blocking block is embedded around the side of the outer periphery of the heat sink and protrudes from the side wall of the heat sink, and the part of the blocking block protruding from the side wall of the heat sink protrudes from the top surface of the heat sink.
[0084] refer to Figure 4 The blocking block 404 is embedded around the side of the outer periphery of the heat sink 304 and protrudes from the side wall of the heat sink 304. The part of the blocking block 404 that protrudes from the side wall of the heat sink 304 protrudes from the top surface of the heat sink 304.
[0085] The blocking block 404 is embedded in the side of the outer periphery of the heat sink 304, so that the blocking block 404 is fixed to the outer periphery of the heat sink 304. The part of the blocking block 404 that protrudes from the side wall of the heat sink 304 protrudes from the top surface of the heat sink 304, and plays a role in blocking the molding compound.
[0086] Moreover, since the blocking block 404 is embedded in the side of the outer periphery of the heat sink 304 and protrudes from the side wall of the heat sink 304, the blocking block 404 can block the molding compound from the outermost edge of the outer periphery of the heat sink 304, thereby providing relatively complete protection for the entire top surface of the heat sink 304.
[0087] In some embodiments, a second notch 314 is formed on the sidewall of the outer peripheral end of the heat sink 304.
[0088] The second notch 314 is used to position the blocking block 404 and to provide space for setting the blocking block 404.
[0089] In some embodiments, a portion of the blocking block 404 is located in the second recess 314, and the remaining portion of the blocking block 404 protrudes from the second recess 314. The portion of the blocking block 404 protruding from the second recess 314 extends along the sidewall of the heat sink 304 and protrudes from the top surface of the heat sink 304.
[0090] Part of the blocking block 404 is located in the second recess 314, so that the blocking block 404 is fixed to the side of the outer peripheral end of the heat sink 304, and the remaining blocking block 404 protrudes from the second recess 314. The part of the blocking block 404 protruding from the second recess 314 extends along the side wall of the heat sink 304 and protrudes from the top surface of the heat sink 304, which is used to block the molding compound during molding.
[0091] In some embodiments, the blocking block 404 includes two intersecting extensions 434, one of which is a first extension 414, and the other protruding from the first extension 414 is a second extension 424. The second extension 424 is located in the second recess 314, and the first extension 414 covers the sidewall of the heat sink 304. The first extension 414 extends along the sidewall of the heat sink 304 and protrudes from the top surface of the heat sink 304.
[0092] The second extension 424 is located in the second recess 314. The blocking block 404 is fixed to the side of the outer peripheral end of the heat sink 304 through the second extension 424. The first extension 414 covers the side wall of the heat sink 304. The first extension 414 extends along the side wall of the heat sink 304 and protrudes from the top surface of the heat sink 304. That is, the first extension 414 protrudes from the top surface of the heat sink 304, so that the first extension 414 plays the role of blocking the molding compound during molding.
[0093] Moreover, the two extensions 434 are intersected and connected, and the second extension 424 is located in the second recess 314. The connected first extension 414 covers the side wall of the heat sink 304, so that the two extensions 434 are locked at the corner of the second recess 314, which helps to improve the stability of the blocking block 404 fixed to the outer peripheral end of the heat sink 304.
[0094] In some embodiments, the first extension 414 completely covers the sidewall of the heat sink 304.
[0095] The first extension 414 completely covers the side wall of the heat sink 304, providing good protection for the side wall of the heat sink 304. In addition, it also allows the blocking block 404 to fit well with the side wall of the heat sink 304. During the molding process, when the blocking block 404 is pressed against the top of the encapsulation mold, the first extension 414 is subjected to longitudinal compression, ensuring that the blocking block 404 can be fixed more firmly to the side wall of the heat sink 304.
[0096] As an example, such as Figure 4 As shown, the two intersecting extensions 434 form a "T" shape. Alternatively, the two intersecting extensions can form a "+" shape. As yet another example, the two intersecting extensions can also form an "L" shape.
[0097] For a detailed description of the packaging structure described in this embodiment, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.
[0098] Figure 5 This is a schematic diagram of the fifth embodiment of the packaging structure disclosed herein.
[0099] The similarities between this embodiment and the previous embodiment will not be repeated here. The difference between this embodiment and the previous embodiment is that the blocking block is attached around the top surface of the outer periphery of the heat sink.
[0100] refer to Figure 5 The blocking block 403 is attached around the top surface of the outer periphery of the heat sink 303, so that the blocking block 403 is fixed to the outer periphery of the heat sink 303 and protrudes from the top surface of the heat sink 303, and plays the role of blocking the molding compound during the molding process.
[0101] In some embodiments, the sidewall of the blocking block 403 is flush with the sidewall of the heat sink 303.
[0102] If the sidewall of the blocking block 403 is flush with the sidewall of the heat sink 303, the blocking block 403 can block the molding compound from the outermost edge of the heat sink 303, thus providing relatively complete protection for the top surface of the entire heat sink 303.
[0103] For a detailed description of the packaging structure described in this embodiment, please refer to the corresponding descriptions in the foregoing embodiments, which will not be repeated here.
[0104] While the above disclosure is provided, it is not limited thereto. Any person skilled in the art may make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure shall be determined by the scope defined in the claims.
Claims
1. A packaging structure, characterized in that, include: substrate; The chip is soldered onto the substrate; A heat sink is attached to the top of the chip; A blocking block is disposed at the outer peripheral end of the heat sink, with the top of the blocking block protruding from the top surface of the heat sink. A molding layer is filled between the substrate and the heat sink around the chip.
2. The packaging structure as described in claim 1, characterized in that, The blocking block is an elastic structure.
3. The packaging structure as described in claim 2, characterized in that, The material of the blocking block includes one or more of rubber, TPE, and latex.
4. The packaging structure as described in claim 1, characterized in that, The blocking block is attached around the top surface of the outer periphery of the heat sink.
5. The packaging structure as described in claim 1, characterized in that, The blocking block is embedded around the top of the outer periphery of the heat sink.
6. The packaging structure as described in claim 5, characterized in that, A first notch is formed on the top surface of the outer peripheral end of the heat sink. Part of the blocking block is located in the first recess, and the remaining part of the blocking block protrudes from the first recess.
7. The packaging structure as described in claim 6, characterized in that, The blocking block includes two intersecting extensions, one of which is designated as the first extension and the other protruding from the first extension as the second extension. The second extension is located in the first recess, and the first extension covers the top surface of the heat sink.
8. The packaging structure as described in claim 7, characterized in that, The sidewall of the first extension is flush with the sidewall of the heat sink.
9. The packaging structure as described in claim 1, characterized in that, The blocking block is embedded around the side of the outer periphery of the heat sink and protrudes from the side wall of the heat sink. The portion of the blocking block protruding from the side wall of the heat sink protrudes from the top surface of the heat sink.
10. The packaging structure as described in claim 9, characterized in that, A second notch is formed on the side wall of the outer peripheral end of the heat sink. A portion of the blocking block is located in the second recess, and the remaining portion of the blocking block protrudes from the second recess. The portion of the blocking block protruding from the second recess extends along the sidewall of the heat sink and protrudes from the top surface of the heat sink.
11. The packaging structure as described in claim 10, characterized in that, The blocking block includes two intersecting extensions, one of which is designated as the first extension and the other protruding from the first extension as the second extension. The second extension is located in the second recess, and the first extension covers the sidewall of the heat sink. The first extension extends along the sidewall of the heat sink and protrudes from the top surface of the heat sink.
12. The packaging structure as described in claim 11, characterized in that, The first extension completely covers the sidewall of the heat sink.
13. The packaging structure as described in claim 7 or 11, characterized in that, The two intersecting extensions form a "T" shape; Alternatively, the two intersecting extensions may form a cross shape; Alternatively, the two intersecting extensions may form an "L" shape.
14. The packaging structure as described in claim 7 or 11, characterized in that, The two intersecting extensions are perpendicular to each other.