A drying device for wafer production

Abstract

The utility model relates to wafer drying technology discloses a kind of drying device for wafer production including feeding box, drying cabinet and discharge box.The feeding box, drying cabinet and discharge box are sequentially connected, and the discharge box and the drying cabinet are evenly provided with isolation door between the feeding box and the drying cabinet.The drying cabinet includes second box, and the second box is composed of heat supply cavity and drying cavity, and the heat supply cavity is provided with heat supply air pipe, the sidewall of the drying cavity is provided with multiple air outlet, which is communicated with the heat supply air pipe, the bottom of the drying cavity is provided with transport component, and the heat supply air pipe, multiple air outlet and driving blade in the drying cabinet are synergized, which promotes the uniform distribution and forced circulation of hot air in the drying cavity, eliminates the dead angle of hot air flow, and ensures that wafer is heated uniformly.

Description

Technical Field

[0001] This utility model relates to wafer drying technology, and more particularly to a drying device for wafer production. Background Technology

[0002] Drying is a crucial process in wafer biscuit production, directly affecting the product's taste, quality, and shelf life. Traditional wafer biscuit drying equipment often uses hot air circulation, but this method has several drawbacks in practical applications.

[0003] The flow of hot air inside the drying chamber often has dead zones, resulting in uneven heating of different parts of the wafer. Some areas become too dry and brittle due to overheating, while the center or edge areas may still retain moisture, which seriously affects the overall crispness and shelf life of the product.

[0004] One-time high-temperature drying can cause the surface of wafers to lose water and harden quickly, while the internal moisture is difficult to escape effectively. This may cause the wafers to crack, deform, or damage their internal porous structure, thereby impairing the unique light and crispy texture of wafers.

[0005] Existing drying equipment has low energy efficiency. To achieve the ideal drying effect, it is often necessary to extend the drying time or increase the temperature, resulting in energy waste. Furthermore, it is difficult to achieve continuous production, and the connection with the preceding and following processes is not smooth, resulting in low overall production efficiency.

[0006] Therefore, there is a need in the art for a drying device for wafer production that can achieve uniform drying, protect product quality, and improve energy efficiency and production efficiency. Utility Model Content

[0007] In order to overcome the shortcomings of the existing technology, this utility model proposes a drying device for wafer production.

[0008] The technical solution of this utility model is implemented as follows:

[0009] A drying device for wafer production includes a feeding box, a drying box, and a discharging box, characterized in that...

[0010] The feeding box, drying box and discharging box are connected in sequence, and isolation doors are provided between the feeding box and the drying box and between the discharging box and the drying box;

[0011] The drying chamber includes a second chamber, which consists of a heating chamber and a drying chamber. The heating chamber is equipped with a heating air duct, and the side wall of the drying chamber is provided with multiple air outlets that communicate with the heating air duct. The bottom of the drying chamber is equipped with a transport assembly.

[0012] The isolation door includes a door frame rail, a pair of isolation door bodies slidably disposed on the door frame rail, and a first drive member and a second drive member for driving the isolation door bodies.

[0013] In this wafer production drying device of the present invention, the feeding box includes a first box body, and a plurality of vertically stacked first stacking sheets are arranged inside the first box body.

[0014] In this wafer production drying device of the present invention, a receiving cavity is provided at the top of the heating chamber, and a drive blade is installed in the receiving cavity.

[0015] In this wafer production drying device of the present invention, infrared heating tubes are installed on both sides of the interior of the drying chamber.

[0016] In this wafer production drying device of the present invention, the transport component includes a base plate, a first drive motor and a second drive motor disposed below the base plate, a slide rail, and a tray slidably connected to the slide rail.

[0017] In this wafer production drying device of the present invention, the discharge box includes a third box body, and the third box body is provided with a plurality of vertically stacked second stacking sheets. The number of the second stacking sheets is equal to that of the first stacking sheets in the feeding box and they are at the same height.

[0018] The drying device for wafer production according to this utility model has the following beneficial effects:

[0019] Through the coordinated action of the heating air ducts, multiple air outlets, and drive blades in the drying chamber, the hot air is evenly distributed and forcibly circulated within the drying chamber, eliminating dead zones in the hot air flow and ensuring that all parts of the wafer are heated evenly. This avoids the problem of some areas becoming too dry and brittle or having residual moisture at the edges, thereby improving the overall crispness and shelf life of the product.

[0020] By combining infrared heating tubes with hot air drying, infrared radiation can penetrate the wafer, causing the internal moisture to evaporate quickly. This avoids the "dry outside, wet inside" phenomenon where the surface hardens while the internal moisture is difficult to escape. It effectively prevents the wafer from cracking and deforming, protects its porous internal structure, and maintains its unique light and crispy texture.

[0021] The transport components employ a dual-station drive design, allowing for simultaneous baking and material loading / unloading, achieving true continuous production and significantly improving production efficiency. Simultaneously, the isolation door effectively prevents heat loss, reducing energy waste, and the stacking design in the feeding and unloading bins ensures neat arrangement and smooth flow of wafers, seamlessly connecting with upstream and downstream processes, resulting in a significant improvement in overall energy efficiency and process reliability. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the drying device of this utility model;

[0023] Figure 2 This is a cross-sectional view of the drying device of this utility model;

[0024] Figure 3 This is a partial structural schematic diagram of the drying device of this utility model;

[0025] Figure 4 for Figure 3 A schematic diagram of the large square structure at point A in the middle;

[0026] Figure 5 This is a partial structural schematic diagram of the drying device of this utility model;

[0027] Figure 6 This is a partial structural schematic diagram of the drying device of this utility model.

[0028] The reference numerals in the attached drawings are as follows: 100-drying device, 10-feeding box, 101-first box body, 102-first stacking sheet, 20-drying box, 201-second box body, 202-heating air duct, 203-air outlet, 204-accommodating cavity, 205-drive blade, 206-infrared heating tube, 207-transportation component, 207A-base plate, 207B-first drive motor, 207C-second drive motor, 207D-slide rail, 207E-tray, 30-discharge box, 301-third box body, 302-second stacking sheet, 40-isolation door, 401-door frame rail, 402-isolation door body, 403-first drive component, 404-second drive component. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0030] Reference Figures 1 to 6 As shown, the drying device 100 for wafer production of this utility model includes a feeding box 10, a drying box 20, and a discharging box 30. The feeding box 10, the drying box 20, and the discharging box 30 are connected in sequence. Isolation doors 40 are provided between the feeding box 10 and the drying box 20, and between the discharging box 30 and the drying box 20.

[0031] In this embodiment, the feeding box 10 further includes a first box body 101, and the interior of the first box body 101 is provided with a plurality of vertically stacked first stacking pieces 102.

[0032] Furthermore, the drying chamber 20 includes a second chamber 201, wherein the second chamber 201 is composed of a heating chamber and a drying chamber. A heating air duct 202 is provided inside the heating chamber, extending through the heating chamber to its exterior.

[0033] The drying chamber has multiple air outlets 203 on its side wall, which are connected to a heating air duct 202. The heating air duct 202 is connected to external hot air, which is then sent into the drying chamber. A receiving cavity 204 is located at the top of the heating chamber, and drive blades 205 are installed within the receiving cavity 204.

[0034] Preferably, refer again Figure 2 As shown, infrared heating tubes 206 are installed on both sides of the inside of the drying chamber.

[0035] In this embodiment, a transport assembly 207 is also provided at the bottom of the drying chamber. The transport assembly 207 includes a base plate 207A, and a first drive motor 207B and a second drive motor 207C are arranged below the base plate 207A. The transport assembly 207 is a dual-station drive, with the first drive motor 207B and the second drive motor 207C each controlling one of the stations.

[0036] Furthermore, the transport component 20 also includes a slide rail 207D, along which a tray 207E is slidably connected.

[0037] Furthermore, the discharge box 30 includes a third box body 301, and the interior of the third box body 301 is provided with a second stacking sheet 302 of equal number and height to the first stacking sheet 102.

[0038] Furthermore, the isolation door 40 includes a door frame rail 401, and a pair of isolation door bodies 402 are slidably connected along the door frame rail 401, wherein a first driving member 403 and a second driving member 404 are respectively provided on the two isolation door bodies 402.

[0039] In this embodiment, the feeding box 10 is responsible for feeding the undried wafers into the drying chamber 20 in an orderly and stable manner. Inside, multiple vertically stacked first stacking sheets 102 are provided for temporary storage and stacking of the wafers. This stacking design of the first stacking sheets 102 ensures that the wafers are neatly arranged before entering the drying chamber, avoiding congestion or misalignment, and laying a solid foundation for subsequent uniform drying. The isolation door 40 between the feeding box 10 and the drying chamber 20 effectively prevents heat loss from the drying chamber, improving the overall thermal efficiency of the system.

[0040] In this embodiment, the drying chamber 20 achieves efficient and uniform drying through the coordinated operation of multiple internal components. The heating chamber, serving as the hot air source chamber, houses the heating air duct 202. The heating air duct 202 is connected to an external heat source and is responsible for introducing and delivering hot air to the drying chamber. This constitutes a stable hot air supply system, ensuring that hot air is evenly delivered to the drying chamber through the heating air duct 202, thereby reducing the dead airflow issues common in traditional hot air systems.

[0041] Multiple air outlets 203, located on the side wall of the drying chamber, are connected to the heating air duct 202 to disperse and release concentrated hot air into the drying chamber. The multi-outlet design promotes the uniform distribution of hot air within the drying chamber, prevents localized overheating or undercooling, effectively solves the problem of uneven heating of wafers, and ensures consistent overall crispness.

[0042] The drive blades 205 are installed in the receiving cavity 204 at the top of the heating chamber, and forcefully drive the hot air circulation by rotating. This enhances the flow and circulation efficiency of the hot air in the drying chamber, further eliminating any possible dead corners, ensuring uniform heating of the wafer surface and interior, and reducing the risk of cracking due to localized high temperatures or moisture residue due to poor ventilation.

[0043] Infrared heating tubes 206 are installed on both sides inside the drying chamber, directly heating the wafers through infrared radiation. Infrared heating has penetrating power, enabling rapid evaporation of moisture from the wafers' interior. This avoids the "dry outside, wet inside" phenomenon common with simple hot air drying, where the surface hardens due to rapid water loss while internal moisture remains trapped. This protects the wafers' porous internal structure, preventing cracking or deformation and perfectly maintaining their unique light and crisp texture.

[0044] In this embodiment, the transport component 207 is responsible for carrying and smoothly conveying the wafers through the entire drying chamber 20. It includes a base plate 207A, a slide rail 207D, and a tray 207E, and is driven in a dual-station configuration by a first drive motor 207B and a second drive motor 207C.

[0045] The dual-station design allows for simultaneous baking and material loading / unloading, enabling truly continuous production and significantly improving efficiency. Two drive motors control one station respectively, allowing for precise adjustment of the transport speed and preventing improper dwell time of wafers in the drying zone. This solves the problems of high energy consumption and poor coordination with preceding and following processes caused by discontinuous processes.

[0046] In this embodiment, the discharge box 30 receives and orderly outputs the dried wafers. Inside, there are second stacking sheets 302, equal in number and at the same height as the first stacking sheets 102 in the feeding box 10. The second stacking sheets 302 ensure that the dried wafers are neatly stacked and output during the discharge process, facilitating subsequent automated packaging or processing. The isolation door 40 between the discharge box 30 and the drying chamber 20 also serves to prevent heat loss and maintain a stable temperature inside the drying chamber.

[0047] In this embodiment, the isolation door 40 is disposed between the feeding box 10 and the drying box 20, and between the discharging box 30 and the drying box 20. It includes a door frame rail 401 and a pair of slidable isolation door bodies 402, and their opening and closing are controlled by a first drive member 403 and a second drive member 404, respectively.

[0048] The isolation door 40 is only briefly opened when the wafer tray 207E needs to be moved, and remains closed at other times, effectively isolating the three functional chambers. This minimizes heat loss and external environmental interference caused by air exchange between the chambers, significantly reduces energy waste, improves drying efficiency, and ensures the stability of the drying environment and the reliability of the process.

[0049] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A drying device for wafer production, comprising a feeding box (10), a drying box (20), and a discharging box (30), characterized in that, The feeding box (10), drying box (20) and discharging box (30) are connected in sequence, and isolation doors (40) are provided between the feeding box (10) and the drying box (20) and between the discharging box (30) and the drying box (20). The drying chamber (20) includes a second chamber (201), which is composed of a heating chamber and a drying chamber. A heating air duct (202) is provided in the heating chamber, and a plurality of air outlets (203) communicating with the heating air duct (202) are provided on the side wall of the drying chamber. A transport component (207) is provided at the bottom of the drying chamber. The isolation door (40) includes a door frame rail (401), a pair of isolation door bodies (402) slidably disposed on the door frame rail (401), and a first drive member (403) and a second drive member (404) for driving the isolation door bodies (402).

2. The drying apparatus for wafer production according to claim 1, characterized in that, The feeding box (10) includes a first box body (101), and a plurality of vertically stacked first stacking pieces (102) are arranged inside the first box body (101).

3. The drying apparatus for wafer production according to claim 1, characterized in that, The top of the heating chamber is provided with a receiving cavity (204), and a drive blade (205) is installed in the receiving cavity (204).

4. The drying apparatus for wafer production according to claim 1, characterized in that, Infrared heating tubes (206) are installed on both sides of the interior of the drying chamber.

5. The drying apparatus for wafer production according to claim 1, characterized in that, The transport assembly (207) includes a base plate (207A), a first drive motor (207B) and a second drive motor (207C) disposed below the base plate (207A), a slide rail (207D), and a tray (207E) slidably connected to the slide rail (207D).

6. The drying apparatus for wafer production according to claim 1, characterized in that, The discharge box (30) includes a third box (301), and a plurality of vertically stacked second stacking pieces (302) are provided in the third box (301). The number of the second stacking pieces (302) is equal to that of the first stacking pieces (102) in the feeding box (10) and they are at the same height.

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