A new semiconductor cooling and heating instrument

Abstract

The utility model discloses a novel semiconductor cold and hot instrument relates to physiotherapy equipment technical field, aims at solving current traditional cold and hot instrument function single, temperature control inflexible technical problem, including equipment main part and detachable liquid water bag of being arranged in the bottom of equipment main part, the bottom one side of equipment main body is fixed with the semiconductor tablet of abutting in liquid water bag for providing energy to liquid water bag to realize one side refrigeration one side heating, and the both sides of equipment main body are provided with elastic band, and the inside of equipment main body is provided with the PCB control panel for integrated control, and the PCB control panel is provided with bluetooth module. The utility model through bluetooth module and a variety of preset work mode's cell -phone terminal application program, realized instrument function diversification and temperature control's flexibility and intelligent, effectively solved traditional cold and hot instrument function single, temperature control inflexible and the problem of low intelligent degree.

Description

Technical Field

[0001] This utility model relates to the field of physiotherapy equipment technology, and more specifically, to a novel semiconductor heating and cooling instrument. Background Technology

[0002] In the current field of hot and cold therapy and related temperature control applications, traditional hot and cold instruments have many shortcomings.

[0003] On the one hand, traditional instruments are lacking in flexibility and intelligence in temperature control. They usually only allow manual temperature adjustment through a limited number of buttons on the instrument, which is not convenient to operate, and they cannot automatically adjust the temperature according to the ambient temperature or the user's personalized needs, resulting in a poor user experience.

[0004] On the other hand, most devices have relatively simple functions, only capable of basic cooling or heating, failing to meet the diverse needs of users. In medical rehabilitation scenarios, patients require alternating pulsed hot and cold stimulation to promote blood circulation and relieve pain, but traditional instruments struggle to provide such functions. Given these issues, a novel semiconductor heating and cooling instrument is urgently needed to overcome the shortcomings of existing technologies. Therefore, we propose a novel semiconductor heating and cooling instrument. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology, adapt to the needs of reality, and provide a new type of semiconductor heating and cooling instrument to solve the technical problems of the current traditional heating and cooling instruments having single function and inflexible temperature control.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a novel semiconductor heating and cooling instrument, comprising a main body of the device and a detachable liquid water bag disposed at the bottom of the main body of the device;

[0007] A semiconductor wafer is fixedly installed on one side of the bottom of the main body of the device, which abuts against the liquid water bag to provide energy to the liquid water bag so as to achieve both cooling and heating. An elastic band is provided between the two sides of the main body of the device.

[0008] The main body of the device is equipped with a PCB control board for integrated control, and the PCB control board is equipped with a Bluetooth module for connecting to a mobile phone via Bluetooth to remotely control the temperature through a mobile phone application with preset working modes.

[0009] Preferably, the elastic band includes two elastic straps, with one end of the two elastic straps being connected to one side of the main body of the device, and the other end of each of the two elastic straps being fixedly provided with a buckle that can be fastened to each other.

[0010] Preferably, the device body is provided with a built-in lithium battery connected to the PCB control board, and a charging port for charging the built-in lithium battery is provided at the center of one end of the device body and connected to the PCB control board.

[0011] Preferably, the top of the device body is provided with a heat dissipation grille, and the top of the device body is provided with a mounting groove that connects to the heat dissipation grille. A cooling fan is fixedly installed at the bottom of the mounting groove, and a laying groove is provided around the top of the device body. A status indicator light strip for displaying the working temperature by changing color is provided in the laying groove.

[0012] Preferably, the main body of the device is further provided with a temperature sensor for real-time monitoring of the temperature of the liquid water bag and feeding it back to the mobile application, and an overheat protector for cutting off the power supply to the semiconductor wafer when the temperature exceeds a preset safety value. The overheat protector is also provided with an overcooling protection mechanism for automatically adjusting the cooling power when the cooling temperature is too low.

[0013] Preferably, the PCB control board is equipped with an ambient temperature sensor for detecting ambient temperature, and the PCB control board is equipped with a timer for setting the working time through a mobile application. The PCB control board is also equipped with a voice control module for realizing voice interaction.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This utility model achieves diversified instrument functions and flexible and intelligent temperature control through the design of a semiconductor wafer, Bluetooth module, and mobile application with multiple preset working modes. The semiconductor wafer can simultaneously cool and heat, meeting the cooling and heating needs of different scenarios; the touch panel allows for convenient manual temperature adjustment, while the mobile application enables remote temperature control. Multiple preset working modes, such as pulse cooling / heating alternation mode and gradient temperature adjustment mode, can meet diverse user needs, effectively solving the problems of traditional cooling and heating instruments having limited functionality, inflexible temperature control, and low intelligence.

[0016] 2. This utility model further solves the problem of poor safety of traditional instruments by using a status indicator light strip, a cooling fan, a heat dissipation grille, an overheat protector, and an overcooling protection mechanism. The cooling fan and heat dissipation grille are used to dissipate heat from the device, and the speed of the cooling fan is controlled by the real-time temperature feedback from the overheat protector. The status indicator light strip shows the working mode, and the overheat protector and overcooling protection mechanism ensure that the instrument works within a safe temperature range, avoiding harm to the user due to excessively high or low temperatures, thus improving the safety and stability of use. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a schematic diagram illustrating the structure of the charging port in this utility model;

[0019] Figure 3 This is a top view of the main body of the device in this utility model.

[0020] Explanation of the labels in the diagram:

[0021] 1. Main body of the equipment; 2. Liquid water bag; 3. Elastic straps; 4. Buckle; 5. Charging port; 6. Heat dissipation grille; 7. Mounting slot; 8. Cooling fan; 9. Status indicator light strip. Detailed Implementation

[0022] like Figures 1 to 3 As shown, this utility model relates to a novel semiconductor heating and cooling instrument, which includes a main body 1 and a detachable liquid water bag 2 located at the bottom of the main body 1.

[0023] A semiconductor wafer is fixedly installed on one side of the bottom end of the main body 1, which abuts against the liquid water bag 2 to provide energy to the liquid water bag 2 to achieve cooling and heating at the same time. An elastic band is provided between the two sides of the main body 1.

[0024] The main body 1 of the device is provided with a PCB control board for integrated control, and the PCB control board is provided with a Bluetooth module for connecting to a mobile phone via Bluetooth to remotely control the temperature through a mobile phone application with a preset working mode.

[0025] Preferably, the elastic band includes two elastic straps 3, with one end of each elastic strap 3 being connected to one side of the main body 1, and the other end of each elastic strap 3 being fixedly provided with a buckle 4 that can be fastened to each other.

[0026] Preferably, the device body 1 is provided with a built-in lithium battery connected to the PCB control board, and a charging port 5 connected to the PCB control board for charging the built-in lithium battery is provided at the center of one end of the device body 1.

[0027] Preferably, the top of the device body 1 is provided with a heat dissipation grille 6, and the top of the device body 1 is provided with a mounting groove 7 that connects to the heat dissipation grille 6. A cooling fan 8 is fixedly installed at the bottom of the mounting groove 7, and a laying groove is provided around the top of the device body 1 around the mounting groove 7. A status indicator light strip 9 for displaying the working temperature by changing color is provided in the laying groove.

[0028] Preferably, the main body 1 of the device is further provided with a temperature sensor for real-time monitoring of the temperature of the liquid water bag 2 and feeding it back to the mobile application, and an overheat protector for cutting off the power supply to the semiconductor wafer when the temperature exceeds a preset safety value. The overheat protector is also provided with an overcooling protection mechanism for automatically adjusting the cooling power when the cooling temperature is too low.

[0029] Preferably, the PCB control board is equipped with an ambient temperature sensor for detecting ambient temperature, and the PCB control board is also equipped with a timer for setting the working time via a mobile application. The timer automatically stops working after the set time is reached, and has an intelligent timed reminder function. Five minutes before the set time ends, a reminder is sent via voice and mobile phone push. The PCB control board is also equipped with a voice control module for realizing voice interaction.

[0030] In embodiments of this utility model, the preset working modes in the mobile application include a regular cold compress mode, a hot compress mode, a pulsed hot and cold alternation mode, a gradient temperature adjustment mode, a rehabilitation training mode, a sleep mode, and an environmental adaptive mode.

[0031] Among them, the pulse cooling and heating alternation mode allows users to customize the pulse frequency and the duration of a single cooling or heating cycle in the mobile application;

[0032] The gradient temperature control mode supports setting multiple temperature nodes and time intervals;

[0033] The rehabilitation training model combines hot and cold stimulation with vibration massage function;

[0034] Sleep mode automatically controls temperature fluctuations, reduces operating noise, and turns off the display backlight.

[0035] The environmental adaptive mode automatically adjusts the cooling or heating effect based on the ambient temperature sensed by the ambient temperature sensor.

[0036] In an embodiment of this utility model, the mobile application has a health data recording function, which is used to record the time, temperature, and mode data of each cold and hot compress, and generate a health report.

[0037] Working Principle: This embodiment provides a novel semiconductor heating and cooling instrument. During operation, the semiconductor wafer provides energy to the liquid water bag 2 to achieve cooling or heating. Users can remotely control the instrument via Bluetooth using a mobile application. An ambient temperature sensor monitors the ambient temperature in real time, providing data for the environmental adaptive mode. The temperature sensor monitors and provides feedback on the temperature of the liquid water bag 2, and overheat and overcooling protection mechanisms ensure safe operation. A timer controls the working duration according to a set time, providing a reminder via voice and mobile push notification 5 minutes before the set time. Different working modes within the mobile application operate according to their respective logic, such as the pulse alternating heating and cooling mode operating according to custom parameters. Data from each use is recorded and a health report is generated.

[0038] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of this utility model based on the above embodiments and make different extensions and variations. However, as long as they do not depart from the spirit of this utility model, they are all within the protection scope of this utility model.

Claims

1. A novel semiconductor heating and cooling instrument, characterized in that, Includes the main body of the equipment (1) and a detachable liquid water bag (2) located at the bottom of the main body of the equipment (1); A semiconductor wafer is fixedly installed on one side of the bottom end of the main body (1) and abuts against the liquid water bag (2) to provide energy to the liquid water bag (2) to achieve cooling and heating at the same time. An elastic band is provided between the two sides of the main body (1). The main body (1) of the device is provided with a PCB control board for integrated control, and the PCB control board is provided with a Bluetooth module for connecting to a mobile phone via Bluetooth to remotely control the temperature through a mobile phone application with a preset working mode.

2. The novel semiconductor heating and cooling instrument according to claim 1, characterized in that, The elastic band includes two elastic straps (3), with one end of each elastic strap (3) being connected to one side of the main body (1) of the equipment, and the other end of each elastic strap (3) being fixedly provided with a buckle (4) that can be fastened to each other.

3. The novel semiconductor heating and cooling instrument according to claim 1, characterized in that, The device body (1) is equipped with a built-in lithium battery connected to the PCB control board, and a charging port (5) connected to the PCB control board for charging the built-in lithium battery is provided at the center of one end of the device body (1).

4. A novel semiconductor heating and cooling instrument according to claim 3, characterized in that, The top of the device body (1) is provided with a heat dissipation grille (6), and the top of the device body (1) is provided with a mounting groove (7) that connects to the heat dissipation grille (6). A cooling fan (8) is fixedly installed at the bottom of the mounting groove (7), and a laying groove is provided around the mounting groove (7) at the top of the device body (1). A status indicator light strip (9) for displaying multiple preset working modes by changing colors is provided in the laying groove.

5. A novel semiconductor heating and cooling instrument according to claim 1, characterized in that, The main body (1) of the device is also equipped with a temperature sensor for real-time monitoring of the temperature of the liquid water bag (2) and feedback to the mobile application, and an overheat protector for cutting off the power supply to the semiconductor wafer when the temperature exceeds the preset safety value. The overheat protector is also equipped with an overcooling protection mechanism for automatically adjusting the cooling power when the cooling temperature is too low.

6. A novel semiconductor heating and cooling instrument according to claim 1, characterized in that, The PCB control board is equipped with an ambient temperature sensor for detecting ambient temperature, a timer for setting the working time via a mobile application, and a voice control module for enabling voice interaction.

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