A high-efficiency dust removal scrubbing tower for semiconductor tail gas treatment equipment
Patent Information
- Application Number
- CN202522318206.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-31
AI Technical Summary
[0002]在对半导体进行制程加工的方面上,对半导体进行生产制造时会产生大量有害气体,需要对生产排出的有害气体进行收集净化处理后再进行排出,现有的尾气由于气体内部含有大量浮沉,在进入处理箱内部时无法对浮沉进行有效吸附,传统的尾气处理系统在对尾气进入内部时得不到合理的分配,使得气体进入较为集中,不能使得过滤板上可均匀的对尾气进行处理
1、本实用新型使用时,通过设计独特的双功能喷头,将雾化喷淋与常规喷淋结合于一体。上部的侧向雾化喷头形成一道细密的水雾屏障,能有效捕获、凝聚并去除上升气流中夹带的细小水雾和气溶胶颗粒,显著降低了尾气出口的雾沫夹带量和水资源损失。下部的喷淋头则保证了对主体尾气的充分洗涤和降温。喷淋头连接管的缩径设计巧妙地实现了水流分配和水压维持,确保了雾化效果。
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Figure CN224793130U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of industrial waste gas treatment technology, specifically a high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment. Background Technology
[0002] In the process of semiconductor manufacturing, a large amount of harmful gases are generated during the production of semiconductors. These harmful gases need to be collected, purified, and treated before being discharged. Existing exhaust gases contain a large amount of dust, which cannot be effectively adsorbed when entering the treatment chamber. Traditional exhaust gas treatment systems do not distribute the exhaust gases reasonably when they enter the chamber, resulting in a relatively concentrated gas flow and preventing the filter plates from treating the exhaust gases evenly.
[0003] Semiconductor exhaust gases often contain a large number of submicron-sized particles. Traditional spraying produces relatively large droplets, resulting in low collision and capture efficiency with these fine particles, leading to unsatisfactory dust removal. Secondly, to enhance gas-liquid contact, the liquid-to-gas ratio often needs to be increased, but this leads to increased circulating liquid volume, increased energy consumption, and the generation of large amounts of wastewater. Furthermore, the exhaust gas often exits the tower in a saturated state, carrying a large amount of mist, which not only wastes water resources but also allows pollutants entrained in the mist to escape with the water vapor, causing secondary pollution. Although some scrubbing towers are equipped with demisters at the outlet, traditional demisters are prone to clogging and have limited efficiency in removing extremely fine droplets. Utility Model Content
[0004] The purpose of this invention is to provide a high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment, which at least solves the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment includes a tower body and a demister spray device body disposed within the tower body. The demister spray device body includes a high-pressure water pump, a water supply pipeline, a water distribution pipe, a water distribution pipe, and nozzles. The outlet of the high-pressure water pump is connected to the inlet of the water supply pipeline, and the outlet of the water supply pipeline is connected to the water distribution pipe. Several water distribution pipes are arranged at equal intervals and fixedly connected to the water distribution pipe. Multiple nozzles are installed at equal intervals below each water distribution pipe. Each nozzle includes a connecting pipe, an atomizing nozzle, a spray head connecting pipe, and a spray head. The atomizing nozzle is installed on the upper part of the connecting pipe, and the spray holes of the atomizing nozzle are opened on its circumferential side. The outlet of the high-pressure water pump is connected to the inlet of the water supply pipeline to provide power to the system.
[0006] The outlet of the water supply pipeline is connected to a branch pipe, on which several distribution pipes are fixedly connected at equal intervals to form a uniform water distribution system. Multiple specially designed nozzles are installed at equal intervals along the length of each distribution pipe.
[0007] As a further embodiment of this utility model, the upper end of the spray head connecting pipe is fixedly connected to the bottom of the connecting pipe, and the spray head is installed at its lower end. The inner diameter of the spray head connecting pipe is smaller than the inner diameter of the connecting pipe, and the inner diameter of the spray head connecting pipe is one-third of the inner diameter of the connecting pipe.
[0008] As a further embodiment of this utility model, the water supply pipeline includes a lower water supply pipe, a water treatment device, and an upper water supply pipe connected in sequence. One end of the lower water supply pipe is connected to the outlet of the high-pressure water pump, and the other end is connected to the inlet of the water treatment device. One end of the upper water supply pipe is connected to the outlet of the water treatment device, and the other end is connected to the distribution pipe.
[0009] As a further embodiment of this utility model, the water treatment device includes a filter and a descaling device; the inlet of the filter is connected to a high-pressure water pump through a lower water supply pipe, and the outlet of the filter is connected to a distribution pipe through an upper water supply pipe; the descaling device is installed in series on the upper or lower water supply pipe.
[0010] As a further embodiment of this utility model, the filter includes a filter housing, a partition plate, and a high-flow-rate water filter element; the partition plate is horizontally fixedly installed in the middle of the interior of the filter housing, and divides the interior of the filter housing into an upper chamber and a lower chamber.
[0011] As a further embodiment of this utility model, the central partition is provided with a through hole connecting the upper chamber and the lower chamber; the high-flow water filter element is disposed in the lower chamber.
[0012] As a further embodiment of this utility model, the lower part of the side wall of the filter housing is provided with a water inlet communicating with the lower chamber, and the upper part of the side wall of the filter housing is provided with a water outlet communicating with the upper chamber. The high-flow water filter element is an RFP series high-flow water filter element.
[0013] As a further embodiment of this utility model, the specific model of the descaling device (6) is the LJGP-100 electronic descaling device.
[0014] Compared with the prior art, the beneficial effects of this utility model are: 1. In use, this utility model combines atomizing spraying with conventional spraying through a uniquely designed dual-function nozzle. The upper lateral atomizing nozzle forms a fine water mist barrier, effectively capturing, condensing, and removing fine water mist and aerosol particles entrained in the rising airflow, significantly reducing the amount of mist entrained at the exhaust outlet and water loss. The lower spray nozzle ensures thorough washing and cooling of the main exhaust gas. The narrowed diameter design of the spray nozzle connecting pipe cleverly achieves water flow distribution and water pressure maintenance, ensuring the atomization effect.
[0015] 2. In use, this utility model integrates the filter and descaling device into the water supply pipeline. The filter adopts a unique upper and lower chamber structure with a high-flow filter element, resulting in high filtration efficiency, large dirt-holding capacity, and extended filter element replacement cycle. The application of the descaling device inhibits scale formation at its source. This system greatly reduces the risk of nozzle and pipeline clogging, ensures long-term stable and uniform operation of the spray system, and reduces equipment maintenance frequency and downtime.
[0016] 3. When in use, this utility model has a reasonable overall structural design and a high degree of modularity, making it suitable not only for new projects but also for upgrading existing scrubbing towers. By improving dust removal and demisting efficiency and reducing water consumption and maintenance costs, this utility model is particularly suitable for the semiconductor manufacturing industry, which has extremely high requirements for exhaust gas treatment and seeks continuous and stable operation. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of a high-efficiency dust removal and scrubbing tower used in semiconductor exhaust gas treatment equipment.
[0018] Figure 2 This is a schematic diagram of the connection structure of a high-efficiency dust removal and scrubbing tower used in semiconductor exhaust gas treatment equipment.
[0019] Figure 3 This is a schematic diagram of the nozzle structure of a high-efficiency dust removal and scrubbing tower used in semiconductor exhaust gas treatment equipment.
[0020] Figure 4 This is a schematic diagram of the internal structure of a filter in a high-efficiency dust removal and scrubbing tower used in semiconductor exhaust gas treatment equipment.
[0021] In the diagram: 1. Tower body; 2. Main body of demister spray device; 3. High-pressure water pump; 4. Lower water supply pipe; 5. Filter; 6. Descaling device; 7. Water distribution pipe; 8. Water distribution pipe; 9. Spray head; 10. Connecting pipe; 11. Atomizing spray head; 12. Spray head connecting pipe; 13. Spray head; 14. Filter housing; 15. Middle partition; 16. Upper chamber; 17. Lower chamber; 18. Filter element; 19. Upper water supply pipe. Detailed Implementation
[0022] To address the problem of [the aforementioned situation], this invention provides a high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment.
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0024] Please see Figure 1-4 This utility model provides a high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment, including a tower body 1 and a demister spray device body 2 installed in the tower body 1. The demister spray device body 2 includes a high-pressure water pump 3, a water supply pipeline, a water distribution pipe 7, a water distribution pipe 8, and a nozzle 9. The outlet of the high-pressure water pump 3 is connected to the inlet of the water supply pipeline, the outlet of the water supply pipeline is connected to the water distribution pipe 7, and several water distribution pipes 8 are arranged at equal intervals and fixedly connected to the water distribution pipe 7. Multiple nozzles 9 are installed at equal intervals below each water distribution pipe 8. The nozzle 9 includes a connecting pipe 10, an atomizing nozzle 11, a spray head connecting pipe 12, and a spray head 13; The atomizing nozzle 11 is installed on the upper part of the connecting pipe 10, and the spray holes of the atomizing nozzle 11 are opened on its side circumferentially.
[0025] The high-pressure water pump 3 serves as the power source for the system, and its outlet is connected to the beginning of the water supply pipeline. A horizontally arranged distribution pipe 7 is connected to the end of the water supply pipeline. Multiple distribution pipes 8 are vertically fixed to the distribution pipe 7 at equal intervals, forming a uniformly distributed water distribution network. Below each distribution pipe 8, multiple specially designed nozzles 9 of this invention are installed at equal intervals along its length.
[0026] In some embodiments, the upper end of the spray head connecting pipe 12 is fixedly connected to the bottom of the connecting pipe 10, and a spray head 13 is installed at its lower end. The inner diameter of the spray head connecting pipe 12 is smaller than the inner diameter of the connecting pipe 10, and the inner diameter of the spray head connecting pipe 12 is one-third of the inner diameter of the connecting pipe 10.
[0027] All the spray holes of the atomizing nozzle 11 are located circumferentially on the side of the nozzle, causing the water sprayed to form an extremely fine, horizontally dispersed mist. At the bottom of the connecting pipe 10, a spray head connecting pipe 12 is fixedly connected by thread or welding. A conventional, downward-spraying spray head 13 is installed at the end of the spray head connecting pipe 12. The inner diameter of the spray head connecting pipe 12 is machined to one-third the inner diameter of the connecting pipe 10.
[0028] When high-pressure water flows through the connecting pipe 10, a high water pressure is maintained within the connecting pipe 10 due to the narrowing effect of the lower spray head connecting pipe 12. Part of this high-pressure water is supplied to the upper atomizing nozzle 11, creating a fine, horizontally diffused water mist curtain. The main function of this water mist curtain is not to directly wash the main exhaust gas, but rather to act as a "capture net," colliding with and condensing water vapor and small droplets entrained in the nearly saturated exhaust gas flowing upwards. These droplets combine to form larger water droplets, which then fall due to gravity, significantly reducing water evaporation and entrainment losses. Simultaneously, most of the water flow is sprayed from the lower spray head 13 through the narrowing spray head connecting pipe 12, forming larger droplets that are primarily responsible for the main washing, cooling, and absorption processes of the rising exhaust gas. The coordinated work of the upper and lower nozzles achieves a unified system of efficient dust removal and effective demisting.
[0029] In some embodiments, the water supply pipeline includes a lower water supply pipe 4, a water treatment device, and an upper water supply pipe 19 connected in sequence; one end of the lower water supply pipe 4 is connected to the outlet of the high-pressure water pump 3, and the other end is connected to the inlet of the water treatment device; one end of the upper water supply pipe 19 is connected to the outlet of the water treatment device, and the other end is connected to the distribution pipe 7.
[0030] In some embodiments, the water treatment device includes a filter 5 and a descaling device 6; the inlet of the filter 5 is connected to the high-pressure water pump 3 through the lower water supply pipe 4, and the outlet of the filter 5 is connected to the distribution pipe 7 through the upper water supply pipe 19; the descaling device 6 is installed in series on the upper water supply pipe 19 or the lower water supply pipe 4.
[0031] In some embodiments, the filter 5 includes a filter housing 14, a partition 15, and a high-flow water filter element 18; The middle partition 15 is horizontally fixedly installed in the middle of the inside of the filter housing 14, and divides the inside of the filter housing 14 into an upper chamber 16 and a lower chamber 17.
[0032] In some embodiments, the central partition 15 has a through hole connecting the upper chamber 16 and the lower chamber 17; the high-flow water filter element 18 is disposed in the lower chamber 17.
[0033] In some embodiments, the lower side wall of the filter housing 14 is provided with an inlet communicating with the lower chamber 17, and the upper side wall of the filter housing 14 is provided with an outlet communicating with the upper chamber 16. The high-flow water filter element 18 is an RFP series high-flow water filter element, and the descaling device 6 is an electronic descaling device.
[0034] A through-hole is machined in the center of the partition 15 to connect the upper and lower chambers. A high-performance, high-flow-rate water filter element 18, such as the RFP050-40N / PX-L type, is housed in the lower chamber 17. An inlet is located on the lower side wall of the filter housing 14, communicating with the lower chamber 17, while an outlet is located on the upper side wall, communicating with the upper chamber 16. Circulating water enters the lower chamber 17 from the lower water supply pipe 4 through the inlet, is forced to pass through the high-flow-rate water filter element 18 for filtration, and the filtered clean water enters the upper chamber 16 through the central through-hole of the partition 15, finally being delivered to the nozzle 9 via the outlet and the upper water supply pipe 19. This structure ensures thorough water filtration.
[0035] In some embodiments, the descaling device 6 is specifically an LJGP-100 electronic descaling device, such as the Lijin LJGP-100 model. It can be installed on the upper water supply pipe 19 or the lower water supply pipe 4. The descaling device 6 generates an electromagnetic field or electric field of a specific frequency to change the physical properties of scale-forming substances in the water, thereby preventing scale such as calcium carbonate from precipitating and adhering in the nozzles, pipes, and pump body, further ensuring the smooth operation of the system.
[0036] In use, the high-pressure water pump 3 is started, and circulating water enters the filter 5 through the lower water pipe 4 for purification to remove solid particles; it undergoes anti-scaling treatment as it flows through the descaling device 6; then it is pumped into the distribution pipe 7 through the upper water pipe 19, distributed to each distribution pipe 8, and finally sprayed out by each nozzle 9. The specially designed nozzles 9 simultaneously spray water mist upwards and water curtain downwards, effectively washing and demisting the semiconductor exhaust gas flowing in opposite or cross directions. The wastewater after washing is collected at the bottom of the tower and can be recycled after necessary treatment.
[0037] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment, comprising a tower body (1) and a demister spray device body (2) disposed within the tower body (1), characterized in that: The main body (2) of the demister spray device includes a high-pressure water pump (3), a water supply pipeline, a water distribution pipe (7), a water distribution pipe (8), and a spray head (9). The outlet of the high-pressure water pump (3) is connected to the inlet of the water supply pipeline, the outlet of the water supply pipeline is connected to the water distribution pipe (7), and several water distribution pipes (8) are arranged at equal intervals and fixedly connected to the water distribution pipe (7). Multiple nozzles (9) are installed at equal intervals below each water distribution pipe (8). The nozzle (9) includes a connecting pipe (10), an atomizing nozzle (11), a spray head connecting pipe (12), and a spray head (13). The atomizing nozzle (11) is installed on the upper part of the connecting pipe (10), and the spray hole of the atomizing nozzle (11) is opened on its side circumferential direction.
2. The high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 1, characterized in that, The upper end of the spray head connecting pipe (12) is fixedly connected to the bottom of the connecting pipe (10), and the spray head (13) is installed at its lower end. The inner diameter of the spray head connecting pipe (12) is smaller than the inner diameter of the connecting pipe (10), and the inner diameter of the spray head connecting pipe (12) is one-third of the inner diameter of the connecting pipe (10).
3. The high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 1, characterized in that, The water supply pipeline includes a lower water supply pipe (4), a water treatment device, and an upper water supply pipe (19) connected in sequence; one end of the lower water supply pipe (4) is connected to the outlet of the high-pressure water pump (3), and the other end is connected to the inlet of the water treatment device; one end of the upper water supply pipe (19) is connected to the outlet of the water treatment device, and the other end is connected to the water distribution pipe (7).
4. The high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 3, characterized in that, The water treatment device includes a filter (5) and a descaling device (6); the inlet of the filter (5) is connected to a high-pressure water pump (3) through a lower water supply pipe (4), and the outlet of the filter (5) is connected to a distribution pipe (7) through an upper water supply pipe (19); the descaling device (6) is installed in series on the upper water supply pipe (19) or the lower water supply pipe (4).
5. A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 4, characterized in that, The filter (5) includes a filter housing (14), a partition plate (15), and a high-flow water filter element (18). The partition plate (15) is horizontally fixedly installed in the middle of the filter housing (14) and divides the interior of the filter housing (14) into an upper chamber (16) and a lower chamber (17).
6. A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 5, characterized in that, The partition plate (15) has a through hole in the center that connects the upper chamber (16) and the lower chamber (17); the high-flow water filter element (18) is located in the lower chamber (17).
7. A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 5, characterized in that, The lower side wall of the filter housing (14) is provided with an inlet that communicates with the lower chamber (17), and the upper side wall of the filter housing (14) is provided with an outlet that communicates with the upper chamber (16). The high flow rate water filter element (18) is an RFP series high flow rate water filter element, and the descaling device (6) is an electronic descaling device.
8. A high-efficiency dust removal and scrubbing tower for semiconductor exhaust gas treatment equipment according to claim 7, characterized in that, The specific model of the descaling device (6) is LJGP-100 electronic descaling device.