Temperature-controllable epoxy resin glue quantitative taking and integrating device

Abstract

The utility model discloses a kind of epoxy resin glue quantitative glue taking integrated device of temperature control, belong to epoxy resin glue taking equipment technical field;The quantitative glue taking integrated device of temperature control of the utility model includes thermostat, quantitative pump, outlet and mixing table;The thermostat is closed cavity, built-in glue liquid container, heating component and temperature sensor, temperature can be controlled at 32-38 ℃ to ensure that glue liquid fluidity;Quantitative pump is connected glue liquid container by pipeline, and its flow control module realizes accurate glue taking;Glue liquid is discharged from the outlet, and the mixing table below is completed by adjustable stirring blade glue liquid mixing;The quantitative glue taking integrated device of temperature control of the utility model integrates temperature control, quantitative glue taking and stirring function, solve the problem that epoxy resin glue low temperature fluidity is poor, proportioning precision is low and mixed is not even, improve operation efficiency and glue quality.

Description

Technical Field

[0001] This utility model relates to the technical field of epoxy resin adhesive dispensing equipment, specifically to an integrated device for quantitative dispensing of temperature-controlled epoxy resin adhesive. Background Technology

[0002] Epoxy resin adhesive is a bonding material made by mixing epoxy resin and a curing agent in a specific ratio. It is widely used in electronic packaging, mechanical assembly, building reinforcement, and other fields. There are three core problems in its use: First, the viscosity of epoxy resin adhesive increases significantly and its fluidity decreases below 25℃, leading to difficulties in dispensing and low efficiency. Second, manual dispensing or using simple tools makes it difficult to ensure the accuracy of the epoxy resin-curing agent ratio (the error often exceeds 5%), directly affecting the bonding strength and curing effect. Third, after dispensing, the adhesive needs to be transferred to a separate container for stirring, which is cumbersome and prone to fluctuations in adhesive properties due to uneven mixing.

[0003] Based on this situation, a temperature-controlled epoxy resin adhesive quantitative dispensing integrated device is provided, including a constant temperature chamber, a metering pump, an outlet, and a stirring table. The constant temperature chamber is a closed cavity with a built-in adhesive container, heating components, and a temperature sensor, which can control the temperature at 32-38℃ to ensure the fluidity of the adhesive. The metering pump is connected to the adhesive container through a pipeline, and its flow control module enables precise dispensing of adhesive. The outlet discharges the adhesive, and the stirring table below completes the mixing of the adhesive through adjustable stirring blades. The temperature-controlled epoxy resin adhesive quantitative dispensing integrated device integrates temperature control, quantitative dispensing, and stirring functions, solving the problems of poor low-temperature fluidity, low proportioning accuracy, and uneven mixing of epoxy resin adhesive, thus improving operating efficiency and adhesive quality. Utility Model Content

[0004] To solve the above-mentioned technical problems, the technical solution provided by this utility model is as follows:

[0005] According to an embodiment of the present invention, a temperature-controlled epoxy resin adhesive dispensing device includes a constant temperature chamber, a metering pump, an outlet, and a stirring table.

[0006] The constant temperature chamber is a closed cavity, inside which are installed a glue container, a heating assembly, and a temperature sensor; the heating assembly includes a silicone heating pad, a temperature controller, and a relay. The silicone heating pad is attached to the inner wall of the cavity. The temperature controller is electrically connected to the temperature sensor and the relay respectively. The relay is electrically connected to the silicone heating pad, which can control the internal temperature at 32-38℃.

[0007] The inlet of the metering pump is connected to the adhesive container in the constant temperature chamber through a pipeline. The metering pump is equipped with a flow control module, which includes a PLC controller, a servo motor and a flow sensor. The PLC controller is electrically connected to the servo motor and the flow sensor respectively. The servo motor drives the metering pump to operate.

[0008] The outlet is connected to the liquid outlet of the metering pump for discharging the adhesive solution;

[0009] The stirring platform is located below the outlet. The stirring platform is equipped with stirring blades, a drive motor and a hollow mounting column. The stirring blades are mounted on the mounting column. The output end of the drive motor is electrically connected to the stirring blades, and the wires pass through the inside of the mounting column.

[0010] The constant temperature chamber has at least two independent placement areas, which are used to place epoxy resin containers and curing agent containers respectively. Each independent placement area corresponds to a set of metering pumps and an outlet.

[0011] The metering pump is a plunger pump or a gear pump, and the flow control accuracy is not less than ±0.5%.

[0012] The constant temperature chamber is equipped with a touch screen on the outside. The touch screen is electrically connected to the temperature controller, the PLC controller and the drive motor, and is used to set the temperature parameters, the amount of adhesive dispensed by the metering pump and the stirring speed of the stirring blades.

[0013] A manual telescopic rod is provided at the connection between the stirring blade and the mounting column. The manual telescopic rod is equipped with a manual knob for fixing the length of the manual telescopic rod to fix the height of the stirring blade.

[0014] The advantages of this invention compared to existing technologies are as follows: This invention provides a temperature-controlled integrated device for quantitative dispensing of epoxy resin adhesive. It employs a heating assembly consisting of a silicone heating element, a PT100 sensor, and a relay to control the temperature between 32-38℃, solving the problem of poor flowability of epoxy resin adhesive at low temperatures and ensuring smooth dispensing. A flow control module composed of a PLC controller, a servo motor, and a flow sensor, combined with a plunger pump or gear pump, achieves a dispensing accuracy of ±0.5%, ensuring accurate mixing ratios of epoxy resin and curing agent and improving the stability of bonding performance. The height of the stirring blades can be adjusted via a manual telescopic rod and fixed via a manual knob, adapting to different amounts of adhesive and ensuring the blades are immersed in the optimal mixing position to prevent uneven mixing. The integrated temperature control, quantitative dispensing, and stirring functions reduce manual transfer steps and significantly improve operational efficiency. The independent placement area design allows for separate dispensing of two-component adhesives, making it widely applicable. Attached Figure Description

[0015] Figure 1This is a schematic diagram of the overall structure of the temperature-controlled epoxy resin adhesive quantitative dispensing integrated device of this utility model.

[0016] Figure 2 This is a schematic diagram of the internal structure of the temperature-controlled epoxy resin adhesive quantitative dispensing integrated device of this utility model.

[0017] Figure 3 This is a schematic diagram of the internal circuit connection of the temperature-controlled epoxy resin adhesive dispensing integrated device of this utility model.

[0018] Figure label:

[0019] Temperature-controlled epoxy resin adhesive dispensing device 1;

[0020] 10. Incubator; 11. Heating assembly; 11-a. Silicone heating element; 11-b. Temperature controller; 11-c. Relay; 12. Temperature sensor; 13. Independent placement area; 14. Touch screen;

[0021] 20; Flow control module 21; PLC controller 21-a; Servo motor 21-b; Flow sensor 21-c;

[0022] Outlet 30;

[0023] 40. Stirring platform; 41. Stirring blade; 42. Drive motor; 43. Mounting column; 44. Manual telescopic rod; 44-a. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Example: According to an embodiment of the present invention, a temperature-controlled epoxy resin adhesive dispensing device 1 is provided, such as... Figures 1 to 3 As shown, specifically, it includes a constant temperature chamber, a metering pump, an outlet, and a stirring table.

[0026] The constant temperature chamber 10 is a rectangular closed cavity with polyurethane insulation to ensure good heat preservation performance. A heating assembly 11 and a temperature sensor 12 are installed inside the cavity. The heating assembly 11 consists of a silicone heating element 11-a, a temperature controller 11-b, and a relay 11-c. The silicone heating element 11-a is attached to the inner wall of the cavity (power 500W, heating uniformity ±2℃). The temperature sensor 12 (preferably a PT100 platinum resistance thermometer, measurement accuracy ±0.1℃) is fixed to the top of the cavity for real-time monitoring of the internal temperature. Temperature controller 11-b is electrically connected to temperature sensor 12 and relay 11-c respectively. Relay 11-c is electrically connected to silicone heating element 11-a. The target temperature (32-38℃) is set by temperature controller 11-b. When temperature sensor 12 detects that the temperature inside the cavity is lower than the set value, temperature controller 11-b triggers relay 11-c to turn on the power to silicone heating element 11-a for heating. When the temperature is higher than the set value, relay 11-c turns off the power to stop heating, thereby achieving constant temperature control.

[0027] The constant temperature chamber 10 is provided with at least two independent placement areas 13, which are used to place epoxy resin adhesive containers and curing agent containers respectively. Each independent placement area 13 corresponds to a set of metering pumps 20 and outlets 30.

[0028] The inlet of the metering pump 20 is connected to the bottom of the adhesive container in the independent placement area 13 inside the constant temperature chamber via a corrosion-resistant hose (made of polytetrafluoroethylene), ensuring that most of the adhesive in the container can be drawn; the metering pump 20 is equipped with a flow control module 21, which includes a PLC controller 21-a (model S7-200). The system includes a SMART servo motor 21-b (rated speed 3000 r / min) and a flow sensor 21-c (preferably a turbine flow sensor, measuring range 0.1-100 ml / min, accuracy ±0.2%). The PLC controller 21-a is electrically connected to the servo motor 21-b and the flow sensor 21-c. The servo motor 21-b drives the metering pump 20 (plunger pump or gear pump) through a coupling. The flow sensor 21-c detects the glue flow rate in real time and feeds it back to the PLC controller 21-a. The PLC controller 21-a adjusts the speed of the servo motor 21-b according to the set glue dispensing amount to achieve precise metering control (accuracy not less than ±0.5%).

[0029] The outlet 30 is a metal nozzle (made of 304 stainless steel) and is connected to the liquid outlet of the metering pump 20 through a pipeline. The inner diameter of the nozzle is 3-5mm to ensure smooth discharge of the adhesive.

[0030] The mixing table 40 is located directly below the outlet 30. The table surface is made of stainless steel (2mm thick). An inverted L-shaped hollow mounting column 43 is provided on the side opposite to the outlet 30. The mixing blade 41 (made of polytetrafluoroethylene, corrosion resistant) is located at the top end of the mounting column, which is suspended in the air. The drive motor 42 (DC motor, adjustable speed 50-500r / min) is located at the bottom of the mixing table 40 and the top surface inside the constant temperature chamber 10. The mixing blade 41 is electrically connected to the output end of the drive motor 42, and the connecting wire passes through the mounting column 43. A manual telescopic rod 44 is provided at the connection between the mixing blade 41 and the mounting column 43. The manual telescopic rod 44 is provided with a manual knob 44-a for fixing the position of the manual telescopic rod 44 to fix the height of the mixing blade 41.

[0031] The constant temperature chamber 10 is equipped with a touch screen 14 on its outside. The touch screen 14 is electrically connected to the temperature controller 11-b, the PLC controller 21-a and the drive motor 42, respectively, and is used to set the temperature parameters, the amount of glue taken by the metering pump 20 and the stirring speed of the stirring blade 41.

[0032] When using the temperature-controlled epoxy resin adhesive dispensing integrated device 1, first open the door of the constant temperature chamber 10, and place the container containing the epoxy resin adhesive and the container containing the curing agent into the two independent placement areas 13 inside the constant temperature chamber 10 (if it is a single-component adhesive, only one placement area is needed). Insert the inlet hose of the metering pump 20 into the bottom of the container (a filter screen can be installed at the end of the hose to prevent impurities from entering), and close the chamber door. Set the constant temperature to 35℃ (this temperature is suitable for the optimal flowability requirements of most epoxy resin adhesives) through the touch screen 14 on the outside of the constant temperature chamber 10. The temperature controller 11-b drives the relay 11-c to connect the power supply to the silicone heating element 11-a, and heating begins. The temperature sensor 12 feeds back the temperature inside the chamber to the touch screen 14 in real time. When the temperature reaches 35℃, the heating automatically stops and maintains a constant temperature. Set the amount of epoxy resin adhesive and curing agent dispensed through the touch screen 14. The PLC controller 21-a will wait for triggering; place the mixing container (such as a beaker) in the mixing table 40 and adjust the container position so that it is aligned with the outlet 30; click the "Dispense Adhesive" button on the touch screen, and the PLC controller 21-a will drive the servo motor 21-b to run. The epoxy resin adhesive and curing agent will be injected into the container from the outlet 30 through the corresponding metering pump 20; when the flow sensor 21-c detects that the amount of adhesive has reached the set value, it will send a feedback signal to the PLC controller 21-a, and the servo motor 21-b will stop running, completing the metered dispensing of adhesive; according to the amount of adhesive in the container, fix the height of the stirring blade 41 by manually turning the knob 44-a (so that its immersion depth in the adhesive is 1 / 2-2 / 3 of the total height of the adhesive), set the stirring speed and time through the touch screen 14, start the drive motor 42, and the stirring blade 41 will rotate to mix the adhesive; after the set time is reached, the motor will stop, completing the mixing operation.

[0033] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A temperature-controlled epoxy resin adhesive dispensing device, characterized in that, Includes a constant temperature chamber, a metering pump, an outlet, and a stirring table; The constant temperature chamber is a closed cavity, inside which are installed a glue container, a heating assembly, and a temperature sensor; the heating assembly includes a silicone heating pad, a temperature controller, and a relay. The silicone heating pad is attached to the inner wall of the cavity. The temperature controller is electrically connected to the temperature sensor and the relay respectively. The relay is electrically connected to the silicone heating pad, which can control the internal temperature at 32-38℃. The inlet of the metering pump is connected to the adhesive container in the constant temperature chamber through a pipeline. The metering pump is equipped with a flow control module, which includes a PLC controller, a servo motor and a flow sensor. The PLC controller is electrically connected to the servo motor and the flow sensor respectively. The servo motor drives the metering pump to operate. The outlet is connected to the liquid outlet of the metering pump for discharging the adhesive solution; The stirring platform is located below the outlet. The stirring platform is equipped with stirring blades, a drive motor and a hollow mounting column. The stirring blades are mounted on the mounting column. The output end of the drive motor is electrically connected to the stirring blades, and the wires pass through the inside of the mounting column.

2. The temperature-controlled epoxy resin adhesive dispensing device according to claim 1, characterized in that, The constant temperature chamber has at least two independent placement areas, which are used to place epoxy resin containers and curing agent containers respectively. Each independent placement area corresponds to a set of metering pumps and an outlet.

3. The temperature-controlled epoxy resin adhesive dispensing device according to claim 1, characterized in that, The metering pump is a plunger pump or a gear pump, and the flow control accuracy is not less than ±0.5%.

4. The temperature-controlled epoxy resin adhesive dispensing device according to claim 1, characterized in that, The constant temperature chamber is equipped with a touch screen on the outside. The touch screen is electrically connected to the temperature controller, the PLC controller and the drive motor, and is used to set the temperature parameters, the amount of adhesive dispensed by the metering pump and the stirring speed of the stirring blades.

5. The temperature-controlled epoxy resin adhesive dispensing device according to claim 1, characterized in that, A manual telescopic rod is provided at the connection between the stirring blade and the mounting column. The manual telescopic rod is equipped with a manual knob for fixing the length of the manual telescopic rod to fix the height of the stirring blade.

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