A semiconductor chip die bonding apparatus

Abstract

The application provides a semiconductor chip die bonding device, and relates to the technical field of chip die bonding, which comprises a cabinet and a protection box arranged on the top of the cabinet. The top of the cabinet is provided with an adjusting mechanism in the protection box. The adjusting mechanism is provided with a lifting mechanism. The lifting mechanism is connected with a glue dispensing head. The lifting mechanism is also connected with a receiving mechanism. The receiving mechanism comprises a third support frame arranged on the lifting mechanism. A gas cylinder is mounted on the side surface of the third support frame. The piston rod of the gas cylinder penetrates through the third support frame and is connected with a connecting plate. One side of the connecting plate is fixedly connected with a support ring. The inner wall of the support ring is inserted with a receiving box. The gas cylinder can drive the connecting plate to move, and then the connecting plate, the support ring and the receiving box can move. In the glue dispensing gap, the receiving box can be moved to the position below the glue dispensing head to receive the glue dropped from the glue dispensing head, thereby reducing the pollution problem caused by the glue drop and reducing the frequency and difficulty of equipment cleaning and maintenance.

Description

Technical Field

[0001] This utility model relates to the field of chip die bonding technology, and more specifically, to a semiconductor chip die bonding device. Background Technology

[0002] In the semiconductor chip manufacturing industry, die bonding is one of the most crucial processes. The dispensing operation directly affects the bonding quality and reliability between the chip and the substrate. Existing semiconductor chip die bonding equipment typically uses a single dispensing head structure. During continuous production, when switching between different workpieces for dispensing, residual adhesive inside the dispensing head is prone to dripping due to gravity or pressure changes. This dripping adhesive contaminates the worktable of the die bonding equipment, increasing the difficulty and workload of cleaning and maintenance. Therefore, we propose an improved semiconductor chip die bonding device. Utility Model Content

[0003] This utility model provides a semiconductor chip die bonding device, including a cabinet and a protective box installed on the top of the cabinet. The top of the cabinet is provided with an adjustment mechanism located inside the protective box. The adjustment mechanism is provided with a lifting mechanism. The lifting mechanism is connected to a dispensing head. The lifting mechanism is also connected to a receiving mechanism. The receiving mechanism includes a third support frame installed on the lifting mechanism. A cylinder is installed on the side of the third support frame. The piston rod of the cylinder passes through the third support frame and is connected to a connecting plate. A support ring is fixedly connected to one side of the connecting plate. A receiving box is inserted into the inner wall of the support ring. Both sides of the protective box are open, and a conveyor is installed on the top of the cabinet at the open. The conveyor is located below the dispensing head.

[0004] As a preferred technical solution of this application, a fastening bolt is threadedly connected to the support ring, and one end of the fastening bolt passes through the support ring and abuts against the outer side of the receiving box.

[0005] As a preferred technical solution of this application, a second limiting rod is fixedly connected to the side of the connecting plate near the cylinder, and the end of the second limiting rod away from the connecting plate passes through the third support frame.

[0006] As a preferred technical solution of this application, the lifting mechanism includes a second support frame connected to the adjustment mechanism. Two second support seats are installed on the second support frame. A second lead screw is connected between the two second support seats through a bearing. A lifting seat is threaded onto the outer surface of the second lead screw. A third support plate is installed on one side of the lifting seat. A mounting frame is provided on the third support plate, and a dispensing head is installed on the mounting frame. One side of the third support frame is fixedly connected to the third support plate.

[0007] As a preferred technical solution of this application, a second motor is installed on the second support frame, and the output group of the second motor is connected to one end of the second lead screw through a coupling.

[0008] As a preferred technical solution of this application, a first limiting rod is connected between the two second support seats, and the outer surface of the first limiting rod passes through the lifting seat.

[0009] As a preferred technical solution of this application, the adjustment mechanism includes two first support frames installed on the top of the cabinet, each of the two first support frames having a slide rail installed on its top, each of the two slide rails having a slider slidably connected to it, and a first support plate connecting the tops of the two sliders, the first support plate being connected to the second support frame.

[0010] As a preferred technical solution of this application, a driving component is provided between the first support plate and one of the first support frames.

[0011] As a preferred technical solution of this application, the driving component includes two first support seats mounted on the top of one of the first support frames, and a first lead screw is rotatably connected between the two first support seats via a bearing. A transmission seat is threadedly connected to the outer surface of the first lead screw, and the transmission seat is mounted on the top of the first support plate.

[0012] As a preferred technical solution of this application, the driving component further includes a first motor, which is mounted on the top of one of the first support frames, and the output shaft of the first motor is connected to a first lead screw via a coupling.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: In the scheme of this application: This application utilizes a receiving mechanism where a cylinder can drive a connecting plate to move, which in turn drives the connecting plate, support ring, and receiving box to move. During the dispensing interval, the receiving box is moved below the dispensing head to catch the glue dripping from the dispensing head, reducing the problem of contamination after glue drips and lowering the frequency and difficulty of equipment cleaning and maintenance. Attached Figure Description

[0014] Figure 1 A schematic diagram of the semiconductor chip die bonding device provided in this application; Figure 2 Another structural schematic diagram of the semiconductor chip die bonding device provided in this application; Figure 3 A top view of the semiconductor chip die bonding device provided in this application; Figure 4 The diagram shows the structure of the lifting mechanism and the receiving mechanism provided in this application.

[0015] The image shows: 1. Cabinet; 101. Protective Box; 2. Adjustment Mechanism; 201. First Support Frame; 202. First Support Plate; 203. Slide Rail; 204. Slider; 205. First Support Seat; 206. First Lead Screw; 207. First Motor; 208. Transmission Seat; 3. Lifting Mechanism; 301. Second Support Frame; 302. Second Support Seat; 303. Second Lead Screw; 304. Second Motor; 305. Lifting Seat; 306. First Limiting Rod; 307. Third Support Plate; 308. Mounting Frame; 4. Receiving Mechanism; 401. Third Support Frame; 402. Cylinder; 403. Connecting Plate; 404. Support Ring; 405. Receiving Box; 406. Fastening Bolt; 407. Second Limiting Rod; 5. Conveyor; 6. Dispensing Head. Detailed Implementation

[0016] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0017] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] For an example, please refer to... Figures 1-4A semiconductor chip die bonding device includes a cabinet 1 and a protective box 101 disposed on the top of the cabinet 1. An adjustment mechanism 2 is disposed on the top of the cabinet 1 and located inside the protective box 101. A lifting mechanism 3 is disposed on the adjustment mechanism 2. The lifting mechanism 3 is connected to a dispensing head 6 and a receiving mechanism 4. The receiving mechanism 4 includes a third support frame 401 disposed on the lifting mechanism 3. A cylinder 402 is mounted on the side of the third support frame 401. The piston rod of the cylinder 402 passes through the third support frame 401 and is connected to a connecting plate 403. A support ring 404 is fixedly connected to one side of the connecting plate 403. A receiving box 405 is inserted into the inner wall; both sides of the protective box 101 are open, and a conveyor 5 is installed on the top of the cabinet 1 at the open, with the conveyor 5 located below the dispensing head 6; the cylinder 402 can drive the connecting plate 403 to move, which in turn can drive the connecting plate 403, the support ring 404, and the receiving box 405 to move. During the dispensing interval, the receiving box 405 is moved to the bottom of the dispensing head 6 to receive the glue dripping from the dispensing head 6, reducing the problem of contamination after glue dripping and reducing the frequency and difficulty of equipment cleaning and maintenance; the dispensing head 6 is an existing component, and its specific structure and principle are existing technologies, which will not be described in detail in this application. The receiving box 405 is located below the dispensing head 6, and the receiving box 405 and the dispensing head 6 rise and fall synchronously. The receiving box 405 is located on the side of the conveyor 5 away from the dispensing head 6. Therefore, the receiving box 405 descends when the dispensing head 6 dispenses glue and does not come into contact with the conveyor 5.

[0020] Furthermore, a fastening bolt 406 is threaded onto the support ring 404. One end of the fastening bolt 406 passes through the support ring 404 and abuts against the outer side of the receiving box 405. The fastening bolt 406 is used to fix the receiving box 405. After loosening the fastening bolt 406, the receiving box 405 can be removed by pulling it upwards, so that the receiving box 405 can be removed for cleaning and replacement.

[0021] Furthermore, a second limiting rod 407 is fixedly connected to the side of the connecting plate 403 near the cylinder 402. The end of the second limiting rod 407 away from the connecting plate 403 passes through the third support frame 401. The second limiting rod 407 can limit the connecting plate 403 to improve the stability of the connecting plate 403 when it moves.

[0022] Furthermore, the lifting mechanism 3 includes a second support frame 301 connected to the adjusting mechanism 2. Two second support seats 302 are mounted on the second support frame 301. A second lead screw 303 is connected between the two second support seats 302 via a bearing. A lifting seat 305 is threaded onto the outer surface of the second lead screw 303. A third support plate 307 is mounted on one side of the lifting seat 305. A mounting bracket 308 is provided on the third support plate 307, and the dispensing head 6 is mounted on the mounting bracket 308. One side of the third support frame 401 is fixedly connected to the third support plate 307. During the rotation of the second lead screw 303, it can drive the lifting seat 305 to rise and fall, thereby driving the dispensing head 6 to rise and fall.

[0023] Furthermore, a second motor 304 is mounted on the second support frame 301. The output group of the second motor 304 is connected to one end of the second lead screw 303 via a coupling. The second motor 304 is used to drive the second lead screw 303 to rotate.

[0024] Furthermore, a first limiting rod 306 is connected between the two second support seats 302. The outer surface of the first limiting rod 306 passes through the lifting seat 305. The first limiting rod 306 can limit the lifting seat 305 to prevent the lifting seat 305 from rotating.

[0025] Furthermore, the adjustment mechanism 2 includes two first support frames 201 mounted on the top of the cabinet 1. Each of the two first support frames 201 is equipped with a slide rail 203. Each of the two slide rails 203 is slidably connected to a slider 204. A first support plate 202 is connected between the tops of the two sliders 204. The first support plate 202 is connected to the second support frame 301. The first support frame 201, slide rail 203 and slider 204 cooperate with each other to support the second support frame 301.

[0026] Furthermore, a driving component is provided between the first support plate 202 and one of the first support frames 201; the driving component includes two first support seats 205 mounted on the top of one of the first support frames 201, and a first lead screw 206 is rotatably connected between the two first support seats 205 via bearings. A transmission seat 208 is threadedly connected to the outer surface of the first lead screw 206, and the transmission seat 208 is mounted on the top of the first support plate 202; the driving component also includes a first motor 207, which is mounted on the top of one of the first support frames 201, and the output shaft of the first motor 207 is connected to the first lead screw 206 via a coupling. The first motor 207 and the first lead screw 206 cooperate to drive the transmission seat 208 to move along the slide rail 203, thereby driving the first support plate 202 to move. The first support plate 202 is used to drive the lifting mechanism 3 and the dispensing head 6 to move, so as to adjust the position of the dispensing head 6.

[0027] The first support frame 201 and the conveyor 5 are both bolted to the top of the cabinet 1. The slide rail 203 is bolted to the top of the first support frame 201. The first support plate 202 is bolted to the two sliders 204. The second support frame 301 is bolted to the first support plate 202. The first motor 207 and the first support base 205 are both bolted to the first support frame 201. The transmission base 208 is bolted to the first support plate 202. The second support base 302 and the second motor 304 are bolted to the first support frame 201. All components are connected to the second support frame 301 by bolts. The second support seat 302 is connected to the first limiting rod 306 by bolts. The third support plate 307 is welded together with the lifting seat 305 and the third support frame 401. The mounting frame 308 is connected to the third support plate 307 and the dispensing head 6 by bolts. The cylinder 402 is connected to the third support frame 401 by bolts. The connecting plate 403 is welded together with the second limiting rod 407 and the third support frame 401. The piston rod of the cylinder 402 is welded together with the support ring 404.

[0028] When the substrate is conveyed by the conveyor 5 to the area below the dispensing head 6, the cylinder 402 first moves the receiving box 405 and the support ring 404 through the connecting plate 403, so that the receiving box 405 is moved away from the area below the dispensing head 6. Then, the second motor 304 drives the second lead screw 303 to rotate, so that the lifting seat 305 descends, thereby driving the dispensing head 6 to descend, and then dispensing glue to the substrate at the die bonding station. After dispensing, the dispensing head 6 rises, and the cylinder 402 drives the receiving box 405 to move to the area below the dispensing head 6 to receive the glue dripping from the dispensing head 6. After dispensing, the substrate is conveyed to the outside by the conveyor 5, and the existing robot is used to transfer the semiconductor chip to the die bonding station with the glue already dispensed to complete the die bonding.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A semiconductor chip die bonding device, characterized in that, The system includes a server rack (1) and a protective box (101) mounted on top of the server rack (1). The top of the server rack (1) is equipped with an adjustment mechanism (2) located within the protective box (101). The adjustment mechanism (2) has a lifting mechanism (3) connected to a dowel head (6). The lifting mechanism (3) is also connected to a receiving mechanism (4). The receiving mechanism (4) includes a third support frame (401) mounted on the lifting mechanism (3). A cylinder (402) is installed on the side of the cabinet (101). The piston rod of the cylinder (402) passes through the third support frame (401) and is connected to a connecting plate (403). A support ring (404) is fixedly connected to one side of the connecting plate (403). A receiving box (405) is inserted into the inner wall of the support ring (404). Both sides of the protective box (101) are open. A conveyor (5) is installed on the top of the cabinet (1) at the open. The conveyor (5) is located below the dispensing head (6).

2. The semiconductor chip die bonding apparatus according to claim 1, characterized in that, The support ring (404) is threaded with a fastening bolt (406), one end of which passes through the support ring (404) and abuts against the outer side of the receiving box (405).

3. The semiconductor chip die bonding apparatus according to claim 1, characterized in that, The connecting plate (403) is fixedly connected to a second limiting rod (407) on the side near the cylinder (402), and the end of the second limiting rod (407) away from the connecting plate (403) passes through the third support frame (401).

4. The semiconductor chip die bonding apparatus according to claim 1, characterized in that, The lifting mechanism (3) includes a second support frame (301) connected to the adjustment mechanism (2). Two second support seats (302) are installed on the second support frame (301). A second lead screw (303) is connected between the two second support seats (302) through a bearing. A lifting seat (305) is threaded on the outer surface of the second lead screw (303). A third support plate (307) is installed on one side of the lifting seat (305). A mounting bracket (308) is provided on the third support plate (307), and a dispensing head (6) is installed on the mounting bracket (308). One side of the third support frame (401) is fixedly connected to the third support plate (307).

5. The semiconductor chip die bonding apparatus according to claim 4, characterized in that, The second support frame (301) is equipped with a second motor (304), and the output group of the second motor (304) is connected to one end of the second lead screw (303) via a coupling.

6. The semiconductor chip die bonding apparatus according to claim 5, characterized in that, A first limiting rod (306) is connected between the two second support seats (302), and the outer surface of the first limiting rod (306) passes through the lifting seat (305).

7. The semiconductor chip die bonding apparatus according to claim 6, characterized in that, The adjustment mechanism (2) includes two first support frames (201) installed on the top of the cabinet (1). Each of the two first support frames (201) is equipped with a slide rail (203). Each of the two slide rails (203) is slidably connected with a slider (204). A first support plate (202) is connected between the tops of the two sliders (204). The first support plate (202) is connected to the second support frame (301).

8. The semiconductor chip die bonding apparatus according to claim 7, characterized in that, A driving element is provided between the first support plate (202) and one of the first support frames (201).

9. The semiconductor chip die bonding apparatus according to claim 8, characterized in that, The drive unit includes two first support seats (205) mounted on the top of one of the first support frames (201), and a first lead screw (206) is rotatably connected between the two first support seats (205) via a bearing. A transmission seat (208) is threaded onto the outer surface of the first lead screw (206), and the transmission seat (208) is mounted on the top of the first support plate (202).

10. The semiconductor chip die bonding apparatus according to claim 9, characterized in that, The drive unit also includes a first motor (207), which is mounted on the top of one of the first support frames (201), and the output shaft of the first motor (207) is connected to a first lead screw (206) via a coupling.

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