Chip encapsulation gluing device

Abstract

The utility model relates to chip technical field especially, and it is a kind of chip encapsulation gluing device.The chip encapsulation gluing device, including glue pipe, glue pipe surface is provided with gluing mechanism, glue pipe one end is provided with limiting mechanism, limiting mechanism includes limit groove and limit block, limit groove is opened in glue pipe one end, limit block is installed in glue pipe one end, limit block with limit groove interference fit.Through the combination structure of limiting mechanism connecting block, slide bar, limit block and spring, the fixing and separation of sleeve and glue pipe can be completed without the aid of tools.When new sleeve is installed, after loosening pull plate, spring resets and pushes limit block to be clamped into limit groove, completes fixing, the whole replacement process does not need to disassemble screw thread, solves the replacement problem caused by screw thread adhesion in prior art, greatly shortens needle replacement time, especially in batch production scene, can significantly reduce equipment downtime, improves production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and in particular to a chip packaging adhesive coating device. Background Technology

[0002] In chip packaging, to protect the fragile circuitry after the internal chip pins and gold bumps are bonded, and to prevent damage from external forces, moisture, and dust, underfill is typically used to cover the entire bonding area. Currently, most underfill equipment uses a combination of a tube and a nozzle, employing high-pressure gas to expel the underfill from the nozzle for precise application. However, in practical applications, the flowability of the underfill is highly sensitive to temperature. Unstable temperatures at the tube and nozzle can lead to poor flowability, resulting in application breaks and uneven application, ultimately affecting chip packaging quality.

[0003] For example, a chip packaging adhesive coating device with patent publication number "CN221733874U" has a temperature sensor installed on the outside of the adhesive tube to monitor the temperature of the underfill adhesive inside the adhesive tube in real time and transmit the temperature data to the temperature adjustment unit. The temperature adjustment unit adjusts the temperature of the underfill adhesive inside the adhesive tube according to a preset temperature range through heating or temperature control components, so that the underfill adhesive is always maintained in a suitable temperature range, thereby ensuring the fluidity of the underfill adhesive and reducing coating defects caused by temperature fluctuations.

[0004] However, the threaded connection structure used in the aforementioned patent is prone to the bottom filler glue seeping into the thread gaps and solidifying during long-term use, causing the needle to stick to the glue outlet. Operators need to use tools to turn the needle, which not only increases the difficulty of replacement, but may also damage the glue outlet threads due to improper force. Utility Model Content

[0005] The purpose of this invention is to provide a chip packaging adhesive application device, which solves the problem that in the existing threaded connection structure, the filler adhesive easily seeps into the thread gaps and solidifies during long-term use, causing the needle to stick to the adhesive outlet. Operators need to use tools to turn the needle, which not only increases the difficulty of replacement, but may also damage the adhesive outlet threads due to improper force.

[0006] To achieve the above objectives, this utility model provides a chip packaging adhesive coating device, including a glue tube, on the surface of which a coating mechanism is provided, and a limiting mechanism is provided at one end of the glue tube. The limiting mechanism includes a limiting groove and a limiting block. The limiting groove is formed at one end of the glue tube, and the limiting block is installed at one end of the glue tube. The limiting block and the limiting groove are interference-fitted.

[0007] The hose has a high-pressure pipe fixedly installed at one end, a discharge port fixedly installed at the other end, and an installation pipe fixedly installed on its surface.

[0008] The inner wall of the mounting tube is fixedly installed with electric heating wire tubes at both ends, and there are multiple electric heating wire tubes.

[0009] The adhesive coating mechanism also includes a sleeve, which is slidably connected to the surface of the discharge port, and a needle is fixedly installed at one end of the sleeve.

[0010] The hose has an installation block fixedly installed at one end, and a limiting groove is formed on one side of the installation block. There are two installation blocks and two limiting grooves.

[0011] The limiting mechanism further includes a connecting block, which is fixedly installed on the surface of the sleeve. A sliding rod is slidably connected to one side of the connecting block, and the limiting block is fixedly installed at one end of the sliding rod.

[0012] A spring is fixedly installed on one side of the limiting block, and the other end of the spring is fixedly connected to one side of the inner wall of the connecting block. A pull plate is fixedly installed on the other end of the slide rod.

[0013] 1. In this utility model, the combination structure of the limiting mechanism connecting block, slide rod, limiting block and spring allows for the fixing and separation of the sleeve and tubing without the need for tools. When the needle needs to be replaced, the operator only needs to pull the pull plate, which drives the slide rod to compress the spring and cause the limiting block to disengage from the limiting groove, so that the old sleeve assembly can be pulled out; when installing the new sleeve, after releasing the pull plate, the spring returns to its original position and pushes the limiting block into the limiting groove to complete the fixing. The entire replacement process does not require disassembling the threads, which solves the replacement problem caused by thread adhesion in the prior art, greatly shortens the needle replacement time, and can significantly reduce equipment downtime and improve production efficiency, especially in mass production scenarios.

[0014] 2. In this invention, multiple electric heating wires are installed on the inner wall of the mounting tube in the adhesive coating mechanism. These wires are evenly distributed along the inner wall of the mounting tube. When energized, they generate stable heat and transfer it to the adhesive tube, continuously and evenly heating and maintaining the temperature of the underfill adhesive inside. This design effectively avoids the problem of reduced fluidity of the underfill adhesive due to temperature drop, reduces defects such as adhesive breakage and uneven adhesive application during the coating process, and ensures that the circuitry in the chip bonding area is completely covered by the underfill adhesive, thereby improving the protection effect and quality stability of the chip packaging. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0016] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the present utility model.

[0017] Figure 2This is a schematic diagram of the structure of the hose according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram of the internal structure of the mounting tube according to an embodiment of the present invention.

[0019] Figure 4 This is a schematic diagram of the sleeve structure according to an embodiment of the present utility model.

[0020] Figure 5 This is a schematic diagram of the limiting mechanism according to an embodiment of the present utility model.

[0021] In the diagram: 1. Adhesive hose; 2. Adhesive application mechanism; 201. High-pressure air hose; 202. Discharge port; 203. Mounting tube; 204. Electric heating wire tube; 205. Sleeve; 206. Needle; 3. Limiting mechanism; 301. Mounting block; 302. Connecting block; 303. Limiting groove; 304. Slide rod; 305. Pull plate; 306. Limiting block; 307. Spring. Detailed Implementation

[0022] The embodiments of the present invention are described in detail below. Examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0023] Please see Figure 1-5As shown, the chip packaging adhesive coating device includes a glue tube 1, with an adhesive coating mechanism 2 on its surface. A limiting mechanism 3 is located at one end of the glue tube 1. The limiting mechanism 3 includes a limiting groove 303 and a limiting block 306. The limiting groove 303 is located at one end of the glue tube 1, and the limiting block 306 is installed at one end of the glue tube 1, with an interference fit between the limiting block 306 and the limiting groove 303. This chip packaging adhesive coating device uses the glue tube 1 as the core for glue filling, storage, and delivery. The adhesive coating mechanism 2 on its surface enables precise glue dispensing, and the limiting mechanism 3 at one end completes the key connection through the interference fit between the limiting groove 303 and the limiting block 306. When the sleeve 205 containing the needle 206 is connected to the tubing 1, the limiting block 306 is embedded in the limiting groove 303 under the force of the subsequent spring 307. The interference fit ensures that the two are fixed without gaps, avoiding the vibration caused by the high-pressure gas pushing the underfill during glue application, which could lead to loosening of the connection. During disassembly, the limiting block 306 can be disengaged from the limiting groove 303 by pulling the slide rod 304 with external force, and the components can be separated without tools. This design structurally solves the adhesion problem caused by the underfill seeping into the gap and solidifying in traditional threaded connections, eliminates the risk of thread wear, and takes into account both connection stability and ease of disassembly. It clarifies the integration relationship of the tubing 1, the glue application mechanism 2, and the limiting mechanism 3, ensuring the overall function of the device is closed-loop and meeting the basic operation requirements of chip packaging glue application. A high-pressure pipe 201 is fixedly installed at one end of the tubing 1, and a discharge port 202 is fixedly installed at the other end of the tubing 1. An installation tube 203 is fixedly installed on the surface of the tubing 1. One end of the tubing 1 has a high-pressure tube 201 connected to an external high-pressure air source. The pressure difference drives the bottom filler in the tubing 1 to flow to the other end. The bottom filler enters the sleeve 205 through the outlet 202 at the end of the tubing 1, and is finally extruded from the needle 206 to complete the coating. The mounting tube 203 on the surface of the tubing 1 is made of high-temperature resistant material and forms a double-layer protective structure around the outside of the tubing 1. The high-pressure tube 201 can adjust the bottom filler delivery rate through controllable air pressure, adapting to the coating amount requirements of different chip packaging scenarios and avoiding uneven coating caused by manual extrusion. The outlet 202 serves as a transition interface, with a smooth inner wall reducing the flow resistance of the bottom filler and preventing the material from stagnating and drying. The mounting tube 203 not only provides a mounting carrier for subsequent heating components, reducing heat exchange between the tubing 1 and the external environment to maintain a stable bottom filler temperature, but also provides structural support for the core components of the device, improving overall rigidity and preventing deformation of the tubing 1 during high-pressure operation from affecting coating accuracy. Multiple electric heating wire tubes 204 are fixedly installed at both ends of the inner wall of the mounting tube 203. These electric heating wire tubes 204 are evenly distributed at both ends of the inner wall of the mounting tube 203. When energized, the heating element transfers heat to the wall of the mounting tube 203, and then evenly heats the rubber tube 1 through heat conduction. The electric heating wire tubes 204 are arranged in a zoned pattern, densely packed at both ends and evenly distributed in the middle. This effectively compensates for heat loss at both ends of the rubber tube 1 due to its connection with the high-pressure pipe 201 and the outlet 202, ensuring that the rubber filling inside the rubber tube 1 is within a preset temperature range, which is adjusted according to the type of rubber compound.This design effectively solves the problem of reduced flowability of underfill adhesive due to temperature fluctuations, avoiding defects such as adhesive breaks, adhesive splashing, or insufficient adhesive application. The multi-electrode heating element 204 design achieves uniform temperature control, preventing local overheating of the adhesive tube 1 that could cause the underfill adhesive to fail to cure, or local low temperatures that could cause the adhesive to solidify and clog the needle 206. Compared to traditional single heating elements, multi-element heating allows for precise temperature control by adjusting the power of each individual heating element 204, adapting to the temperature requirements of different types of underfill adhesives. The adhesive application mechanism 2 also includes a sleeve 205, which is slidably connected to the surface of the outlet 202, with a needle 206 fixedly installed at one end of the sleeve 205. The sleeve 205 is made of elastic materials such as adhesive-resistant plastic. Its inner wall fits tightly against the outer wall of the outlet 202. It slides onto the surface of the outlet 202 to form a quick-detachable connection structure. The needle 206 at one end is designed with different specifications according to chip packaging requirements. After the underfill adhesive enters the sleeve 205 through the outlet 202, it is precisely dripped from the tip of the needle 206 onto the surface of the circuit in the chip bonding area under high pressure to achieve local coverage. The sleeve 205 serves as a connecting transition between the needle 206 and the tube 1, avoiding damage caused by a direct rigid connection between the needle 206 and the tube 1, thus extending the service life of the core components. Different specifications of needle 206 can be quickly adapted by replacing the sleeve 205 without adjusting the main structure of the tube 1, improving the compatibility of the device with diverse packaging requirements. In addition, the inner wall of the sleeve 205 is treated with an anti-stick coating to reduce underfill adhesive residue, facilitate cleaning and maintenance, and reduce adhesive waste.

[0024] Please see Figure 1-5As shown, an installation block 301 is fixedly installed at one end of the tubing 1, and a limiting groove 303 is formed on one side of the installation block 301. There are two installation blocks 301 and two limiting grooves 303. Two installation blocks 301 are symmetrically installed at one end of the tubing 1. Each installation block 301 has a limiting groove 303 on one side that matches the limiting block 306, forming a symmetrical limiting reference. When the sleeve 205 is connected to the outlet 202, the two limiting blocks 306 are respectively embedded in the corresponding limiting grooves 303. The symmetrical force ensures the coaxiality of the sleeve 205 and the tubing 1, avoids the sleeve 205 from shifting due to unilateral limiting, and thus prevents the needle 206 from deviating from the dispensing position. The dual mounting blocks 301 and dual limiting grooves 303 form a bidirectional positioning system, improving the connection accuracy between the sleeve 205 and the adhesive tube 1, and ensuring that the needle 206 is always aligned with the chip bonding area during adhesive application. The symmetrical structure ensures that the limiting blocks 306 are subjected to uniform force, avoiding wear of the limiting grooves 303 caused by excessive force on one side, and extending the service life of the limiting mechanism 3. The mounting blocks 301 also provide stable structural support for the limiting grooves 303, preventing deformation of the limiting grooves 303 due to long-term force, and ensuring the continuous and reliable operation of the limiting mechanism 3. The limiting mechanism 3 also includes a connecting block 302, which is fixedly mounted on the surface of the sleeve 205. A sliding rod 304 is slidably connected to one side of the connecting block 302, and a limiting block 306 is fixedly mounted on one end of the sliding rod 304. The connecting block 302 of the limiting mechanism 3 is fixed to the surface of the sleeve 205, providing sliding support for the slide rod 304. One end of the slide rod 304 is fixed to the limiting block 306, and the other end extends to the outside of the connecting block 302. When the operator pulls the outer end of the slide rod 304, the slide rod 304 can move along the sliding channel on one side of the connecting block 302, causing the limiting block 306 to move closer to or away from the limiting groove 303. The connecting block 302 serves as the carrier of the limiting mechanism 3, stably connecting the limiting component to the sleeve 205, ensuring that the movement trajectory of the limiting block 306 is precisely aligned with the limiting groove 303, and avoiding limiting failure due to component misalignment. The slide rod 304 is made of smooth metal material, reducing frictional resistance when sliding in contact with the connecting block 302, allowing the operator to complete the disassembly action with less effort and improving operational convenience. At the same time, the integrated design of the slide rod 304 and the limiting block 306 enhances structural strength, prevents breakage during long-term use, and ensures the service life of the limiting mechanism 3. A spring 307 is fixedly installed on one side of the limiting block 306, and the other end of the spring 307 is fixedly connected to one side of the inner wall of the connecting block 302. A pull plate 305 is fixedly installed on the other end of the slide rod 304. The pull plate 305 fixed on the other end of the spring 307 fixed on one side of the limiting block 306 is fixedly connected to one side of the inner wall of the connecting block 302, and the pull plate 305 fixed on the other end of the slide rod 304 facilitates the operator to apply force. When it is necessary to remove the sleeve 205, pulling the pull plate 305 will drive the slide rod 304 to move away from the limiting groove 303. The slide rod 304 will simultaneously compress the spring 307 to make it elastically deformed. After releasing the pull plate 305, the spring 307 will release its elastic potential energy to push the limiting block 306 to reset and embed into the limiting groove 303 to complete the fixation of the sleeve 205 and the hose 1.Spring 307 provides a continuous and stable preload, ensuring that the limit block 306 and the limit groove 303 fit tightly together, preventing the connection from loosening due to vibration during the gluing operation; pull plate 305 increases the contact area with the hand, reduces hand pressure during operation, improves user comfort, and prevents the slide bar 304 from coming off the connecting block 302 due to excessive force, ensuring operational safety; this elastic reset structure eliminates the need for additional locking components, simplifies operation steps, further shortens the needle 206 replacement time, and improves equipment utilization in mass production scenarios.

[0025] Working principle: First, select a needle 206 with an appropriate aperture and length and a corresponding sleeve 205 assembly according to the specifications of the chip to be packaged; inject the underfill into the tube 1 and close the inlet of the tube 1; connect the high-pressure tube 201 to an external high-pressure air source, set the heating temperature of the electric heating wire tube 204 through the temperature controller, and start the electric heating wire tube 204 to heat and keep the underfill in the tube 1 warm. Then pull the pull plate 305, which drives the slide rod 304 to compress the spring 307, causing the limiting block 306 to retract into the connecting block 302; align the sleeve 205 with the outlet 202 and slide the sleeve 205 along the axial direction of the outlet 202 until the sleeve 205 is fully connected with the outlet 202; release the pull plate 305, the spring 307 returns to its original position and pushes the limiting block 306 into the limiting groove 303 on the mounting block 301, completing the fixation of the sleeve 205. At this time, the needle 206 is in the state of waiting to be coated with adhesive. The external high-pressure air source is activated, and high-pressure gas enters the tube 1 through the high-pressure pipe 201, pushing the underfill adhesive from the outlet 202 into the sleeve 205, and finally extruding it from the needle 206 to complete the underfill adhesive coating. During the coating process, the electric heating wire tube 204 continuously heats the tube to maintain the fluidity of the underfill adhesive, ensuring uniform coating without any gaps. When the needle 206 needs to be replaced to adapt to different chips, or when the needle 206 is worn or clogged, the operator only needs to pull the pull plate 305 to disengage the limit block 306 from the limit groove 303, and pull out the old sleeve 205 assembly axially along the outlet 202; then take a new matching sleeve 205 assembly and repeat the above steps to complete the needle 206 replacement. The entire process does not require tools, is simple and quick to operate, and can significantly shorten equipment downtime and improve production efficiency.

[0026] The above-disclosed embodiments are merely one or more preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments and equivalent changes made in accordance with the claims of this application still fall within the scope of this application.

Claims

1. A chip encapsulation adhesive coating apparatus, comprising an adhesive tube, characterized in that: The surface of the hose is provided with a glue-applying mechanism, and one end of the hose is provided with a limiting mechanism. The limiting mechanism includes a limiting groove and a limiting block. The limiting groove is formed at one end of the hose, and the limiting block is installed at one end of the hose. The limiting block and the limiting groove are interference-fitted.

2. The chip packaging coating apparatus according to claim 1, characterized in that: A high-pressure air pipe is fixedly installed at one end of the hose, and a discharge port is fixedly installed at the other end of the hose. An installation tube is fixedly installed on the surface of the hose.

3. The chip packaging coating apparatus according to claim 2, characterized in that: Electric heating wire tubes are fixedly installed at both ends of the inner wall of the mounting tube, and there are multiple electric heating wire tubes.

4. The chip packaging coating apparatus according to claim 2, characterized in that: The adhesive coating mechanism also includes a sleeve, which is slidably connected to the surface of the discharge port, and a needle is fixedly installed at one end of the sleeve.

5. The chip packaging coating apparatus according to claim 4, characterized in that: An installation block is fixedly installed at one end of the hose, and a limiting groove is formed on one side of the installation block. There are two installation blocks and two limiting grooves.

6. The chip packaging coating apparatus according to claim 5, characterized in that: The limiting mechanism also includes a connecting block, which is fixedly installed on the surface of the sleeve. A sliding rod is slidably connected to one side of the connecting block, and the limiting block is fixedly installed at one end of the sliding rod.

7. The chip encapsulation coating apparatus according to claim 6, characterized in that: A spring is fixedly installed on one side of the limiting block, and the other end of the spring is fixedly connected to one side of the inner wall of the connecting block. A pull plate is fixedly installed on the other end of the slide rod.

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