A uniform spreading device for a heat-dissipating adhesive for semiconductor packaging

Abstract

The utility model discloses a kind of heat dissipation glue uniform smearing devices for semiconductor packaging, it is related to glue smearing technical field, and it includes: hard glue storage box, its inside glue storage space is consistent along the height direction of itself level section;Glue outlet, fixedly connected in one end of hard glue storage box;Roller, rotationally connected in one end of hard glue storage box, and the circumferential side of roller contacts with one end of glue outlet away from hard glue storage box.The device of the utility model passes through "the linkage mechanism of roller rolling-connecting rope winding- extrusion plate advancing", the rolling speed of roller is directly converted into the advancing speed of extrusion plate-roller rolls faster, the efficiency of annular winding groove winding connecting rope is higher, extrusion plate advancing strength is greater, glue output is synchronous increase;Conversely, when smearing speed slows down, glue output is reduced accordingly;This dynamic matching mechanism fundamentally avoids "broken glue" "accumulation glue" problem, and ensures that glue layer thickness is uniform and consistent.

Description

Technical Field

[0001] This utility model relates to the field of adhesive application technology, specifically to a device for uniformly applying thermal adhesive for semiconductor packaging. Background Technology

[0002] In the semiconductor packaging manufacturing process, heat dissipation performance is one of the core indicators determining the operational stability and lifespan of semiconductor devices. As semiconductor chips become increasingly integrated and miniaturized, the heat generated per unit area during operation increases significantly. If this heat cannot be conducted and dissipated in time, it will lead to excessively high chip temperatures, resulting in performance degradation, logic errors, and even hardware damage. Therefore, in the semiconductor packaging process, thermal adhesive is applied between the chip and the heat dissipation structure. The high thermal conductivity of the adhesive creates an efficient heat conduction path, enabling rapid heat transfer.

[0003] Existing devices generally lack the ability to dynamically control the thermal adhesive application process: for example, when the amount of thermal adhesive in the rigid adhesive storage box decreases, the extrusion plate pushing pressure drops, which can easily lead to unstable adhesive dispensing pressure and further aggravate the fluctuation of adhesive layer thickness. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a device for uniformly applying thermal adhesive for semiconductor packaging.

[0005] To achieve the above objectives, the technical solution of this utility model is as follows:

[0006] A device for uniformly applying thermal adhesive for semiconductor packaging, comprising:

[0007] A rigid glue storage box, the internal glue storage space of which has a consistent horizontal cross section along its height;

[0008] The glue dispensing head is fixedly connected to one end of the rigid glue storage box;

[0009] The roller is rotatably connected to one end of the rigid glue storage box, and the end of the glue dispensing head away from the rigid glue storage box contacts the peripheral side of the roller.

[0010] The roller has a groove along its length, which is provided around the roller's periphery.

[0011] An annular winding groove with rollers on its circumference;

[0012] The connecting rope has one end wound in the annular winding groove and the other end extending through the rigid plastic storage box into the interior of the rigid plastic storage box.

[0013] An extrusion plate is slidably connected to the inside of a rigid glue storage box, and the end of the connecting rope located inside the rigid glue storage box can pull the extrusion plate to slide.

[0014] in:

[0015] As the roller rolls on the semiconductor, it drives the connecting rope to wind up through the annular winding groove. The connecting rope pulls the extrusion plate to squeeze the heat dissipation adhesive inside the rigid adhesive storage box onto the surface of the roller through the dispensing head.

[0016] Preferably, an elastic airbag is placed inside the strip groove. When the heat dissipation adhesive is squeezed into the elastic airbag, the elastic airbag contracts inward. When the heat dissipation adhesive is detached from the elastic airbag, the elastic airbag protrudes outward until the heat dissipation adhesive protrudes from the surface of the roller.

[0017] Preferably, the extrusion plate has a relief cavity on the side near the dispensing head, and a rubber sheet that can seal the relief cavity is fixed on the surface of the extrusion plate.

[0018] Preferably, one end of the connecting rope inside the rigid glue storage box passes through the extrusion plate, and the other end passing through the extrusion plate is fixed with a guide frame, the bottom surface of which is always in contact with the upper surface of the extrusion plate.

[0019] Preferably, the depth of the groove is between 2mm and 3mm.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] The device of this invention uses a linkage mechanism of "roller rolling - connecting rope winding - extrusion plate advancement" to directly convert the rolling speed of the roller into the advancing speed of the extrusion plate. The faster the roller rolls, the higher the efficiency of the annular winding groove in winding the connecting rope, the greater the advancing force of the extrusion plate, and the greater the amount of adhesive dispensed. Conversely, when the application speed slows down, the amount of adhesive dispensed decreases accordingly. This dynamic matching mechanism fundamentally avoids the problems of "adhesive breakage" and "adhesive accumulation," ensuring that the adhesive layer thickness is uniform and consistent. Attached Figure Description

[0022] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0023] Figure 1 This is a schematic diagram of the structure of a semiconductor packaging thermal adhesive uniform application device according to the present invention;

[0024] Figure 2 This is a partial sectional view of the present invention;

[0025] Figure 3 This is an enlarged view of part A of this utility model;

[0026] Figure 4 This is an enlarged view of Part B of this utility model.

[0027] The diagram shows the following labels: 1. Rigid glue storage box; 11. Glue dispensing head; 2. Roller; 21. Strip groove; 22. Annular winding groove; 3. Connecting rope; 31. Guide frame; 4. Extrusion plate; 41. Relief cavity; 42. Rubber sheet. Detailed Implementation

[0028] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0029] Example

[0030] like Figure 1-4 As shown, a device for uniformly applying thermal adhesive for semiconductor packaging includes:

[0031] The rigid glue storage box 1 has a consistent horizontal cross-section of its internal glue storage space along its height direction;

[0032] The glue dispensing head 11 is fixedly connected to one end of the rigid glue storage box 1;

[0033] Roller 2 is rotatably connected to one end of rigid glue storage box 1, and the end of glue dispensing head 11 away from rigid glue storage box 1 contacts the peripheral side of roller 2;

[0034] A strip groove 21 is formed along the length of the roller 2 on the periphery of the roller 2, and the depth of the strip groove 21 is between 2mm and 3mm.

[0035] The annular winding groove 22 has a circumferential opening on the side of the roller 2;

[0036] The connecting rope 3 has one end wound in the annular winding groove 22 and the other end extending through the rigid plastic storage box 1 into the interior of the rigid plastic storage box 1.

[0037] The extrusion plate 4 is slidably connected to the inside of the rigid glue storage box 1, and the end of the connecting rope 3 located inside the rigid glue storage box 1 can pull the extrusion plate 4 to slide.

[0038] in:

[0039] When the roller 2 rolls on the semiconductor, the roller 2 drives the connecting rope 3 to wind up through the annular winding groove 22. The connecting rope 3 pulls the extrusion plate 4 to extrude the heat dissipation adhesive inside the rigid adhesive storage box 1 through the dispensing head 11 onto the surface of the roller 2.

[0040] Specifically, in this invention, the roller 2 rolls on the semiconductor. The rolling of the roller 2 can drive the connecting rope 3 to rewind, thereby pulling the extrusion plate 4 to squeeze the heat dissipation adhesive inside the rigid adhesive storage box 1 onto the surface of the roller 2. Since the roller 2 is rolling, the heat dissipation adhesive on the roller 2 will be evenly applied to the semiconductor during the rolling process.

[0041] Furthermore, an elastic airbag is placed inside the strip groove 21. When the heat dissipation adhesive is squeezed into the elastic airbag, the elastic airbag contracts inward. When the heat dissipation adhesive is removed from the elastic airbag, the elastic airbag protrudes outward until the heat dissipation adhesive protrudes from the surface of the roller 2.

[0042] Specifically, the elastic airbag placed inside the strip groove 21 is the core auxiliary structure for achieving uniform and stable application of thermal adhesive. Through the dynamic action of "contraction and temporary storage - rebound and release", it is precisely coordinated with the rolling rhythm of the roller 2 and the dispensing process of the dispensing head 11. Its specific functions can be described as follows: When the dispensing head 11 squeezes the thermal adhesive in the rigid adhesive storage box 1 onto the surface of the roller 2, the thermal adhesive will preferentially enter the elastic airbag in the strip groove 21. At this time, the elastic airbag contracts inward under the pressure of the adhesive, forming a temporary storage space that matches the volume of the adhesive. This can completely contain the adhesive extruded by the dispensing head, preventing the adhesive from sliding directly off the roller surface or overflowing prematurely in non-coating areas. This ensures that every portion of adhesive can be used for coating the semiconductor surface, reducing raw material waste, while keeping the roller surface clean and preventing adhesive accumulation from affecting the subsequent coating accuracy.

[0043] Furthermore, a relief cavity 41 is provided on the side of the extrusion plate 4 near the dispensing head 11, and a rubber sheet 42 that can seal the relief cavity 41 is fixed on the surface of the extrusion plate 4.

[0044] Specifically, in this invention, the relief cavity 41 and the rubber sheet 42 fixed to the surface of the extrusion plate 4 near the dispensing head 11 are key structures for ensuring stable dispensing of the heat-dissipating adhesive, reducing adhesive residue, and optimizing the practicality of the device. When the device is in the adhesive application state, the roller 2 rolls, causing the connecting rope 3 to wind up, which in turn pulls the extrusion plate 4 towards the dispensing head 11, squeezing the heat-dissipating adhesive inside the rigid adhesive storage box 1. At this time, the heat-dissipating adhesive in the storage box generates pressure due to the compression, which acts on the rubber sheet 42 on the surface of the extrusion plate 4, causing the rubber sheet 42 to tightly fit the opening of the relief cavity 41, completely sealing the relief cavity 41. This sealing structure ensures that when the extrusion plate 4 is pushed forward, the heat-dissipating adhesive in the storage box cannot flow back through the relief cavity 41, but can only flow towards the dispensing head 11, forming a stable dispensing pressure. Even if the viscosity of the thermal adhesive changes slightly due to ambient temperature, or the amount of adhesive in the storage box gradually decreases, stable pressure can still ensure uniform adhesive dispensing, avoiding "adhesive interruption" due to insufficient pressure or "adhesive overflow" due to sudden pressure increase, thus structurally ensuring the continuity and consistency of the adhesive application process.

[0045] Furthermore, one end of the connecting rope 3 inside the rigid glue storage box 1 passes through the extrusion plate 4, and a guide frame 31 is fixed at the other end passing through the extrusion plate 4. The bottom surface of the guide frame 31 is always in contact with the upper surface of the extrusion plate 4.

[0046] Specifically, in the "uniform application device for thermal adhesive in semiconductor packaging", the connecting rope 3, which passes through the extrusion plate 4 and is fixed to the guide frame 31, and its design of "always adhering to the upper surface of the extrusion plate 4", are key structures for ensuring the stability of the device's linkage, extending the life of components, and optimizing the adhesive application accuracy. The core linkage logic of the device is "roller rolling → annular winding groove winding the connecting rope → connecting rope pulling the extrusion plate forward". The extrusion plate 4 needs to slide smoothly in the horizontal direction within the rigid adhesive storage box 1 to ensure that the adhesive is uniformly compressed. If the connecting rope is directly connected to the extrusion plate at a single point, the extrusion plate is prone to tilting due to the concentration of force points when pulled, such as excessive force on one side and insufficient force on the other side, resulting in the problem of "excessive or insufficient extrusion of adhesive on one side", ultimately leading to uneven adhesive output and deviation in adhesive layer thickness. The guide frame 31 is designed to replace point contact with surface contact—the bottom surface of the guide frame is in contact with the upper surface of the extrusion plate, distributing the tension of the connecting rope throughout the entire contact area of ​​the guide frame, and then evenly transferring it to the extrusion plate 4. This ensures that the force direction of the extrusion plate is always along the horizontal axis of the glue storage box, eliminating the risk of tilting or deviation. Even if the connecting rope experiences slight tension fluctuations due to the rotation of the rollers, the guide frame can balance the force difference through its own rigidity, ensuring a smooth extrusion plate advancement process and fundamentally avoiding glue application errors caused by extrusion deviation.

[0047] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A device for uniformly applying thermal adhesive for semiconductor packaging, characterized in that: include: The rigid glue storage box (1) has a consistent horizontal cross-section of its internal glue storage space along its height direction; The glue dispensing head (11) is fixedly connected to one end of the rigid glue storage box (1); The roller (2) is rotatably connected to one end of the rigid glue storage box (1), and the end of the glue dispensing head (11) away from the rigid glue storage box (1) contacts the peripheral side of the roller (2); A strip groove (21) is provided along the length of the roller (2) and the circumference of the roller (2); The annular winding groove (22) has a roller (2) on its periphery; The connecting rope (3) has one end wound in the annular winding groove (22) and the other end extending through the rigid plastic storage box (1) into the interior of the rigid plastic storage box (1); The extrusion plate (4) is slidably connected to the inside of the rigid glue storage box (1), and the end of the connecting rope (3) located inside the rigid glue storage box (1) can pull the extrusion plate (4) to slide. in: When the roller (2) rolls on the semiconductor, the roller (2) drives the connecting rope (3) to wind up through the annular winding groove (22). The connecting rope (3) pulls the extrusion plate (4) to extrude the heat dissipation adhesive inside the hard adhesive storage box (1) onto the surface of the roller (2) through the dispensing head (11).

2. The device for uniformly applying thermal adhesive for semiconductor packaging according to claim 1, characterized in that: The inside of the strip groove (21) is an elastic airbag. When the heat dissipation adhesive is squeezed into the elastic airbag, the elastic airbag contracts inward. When the heat dissipation adhesive is removed from the elastic airbag, the elastic airbag protrudes outward until the heat dissipation adhesive protrudes from the surface of the roller (2).

3. The device for uniformly applying thermal adhesive for semiconductor packaging according to claim 2, characterized in that: The extrusion plate (4) has a relief cavity (41) on the side near the dispensing head (11), and a rubber sheet (42) that can seal the relief cavity (41) is fixed on the surface of the extrusion plate (4).

4. The device for uniformly applying thermal adhesive for semiconductor packaging according to claim 3, characterized in that: The connecting rope (3) has one end inside the rigid glue storage box (1) that passes through the extrusion plate (4), and the other end that passes through the extrusion plate (4) is fixed with a guide frame (31). The bottom surface of the guide frame (31) is always in contact with the upper surface of the extrusion plate (4).

5. The device for uniformly applying thermal adhesive for semiconductor packaging according to claim 4, characterized in that: The depth of the groove (21) is between 2mm and 3mm.

Images