A semiconductor package repair spud
Patent Information
- Application Number
- CN202522307785.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-31
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-31
AI Technical Summary
[0005]为了弥补以上不足,本实用新型提供了一种半导体封装维修铲刀,旨在改善现有技术中刀头出现磨损、刃口钝化,不可以进行单独更换刀头,需整体替换整个铲刀的问题
1、本实用新型中,在对刀头拆卸更换时,按动按动钮带动固定柱移动,使弹簧压缩;随后连接组件作用,滑动柱带动连接柱移动,挤压两侧固定球并使其移入安装柱内。此时连接组件脱离连接块固定,刀柄随之与连接块分离,即可完成刀头拆卸更换,该过程能让维修人员在刀头磨损、沾染异物或需适配不同维修场景时,迅速完成刀头更换,大幅缩短单次维修耗时,显著提升单位时间维修产能,为半导体原厂以及维修企业节省生产时间,有效降低人力成本投入。
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Figure CN224794068U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor packaging repair scraper. Background Technology
[0002] In the process of semiconductor device production and maintenance, the packaging process is a key step to protect the chip and achieve electrical connection. However, if problems such as poor soldering of pins, glue overflow, or damage to the packaging layer occur after packaging, the device needs to be repaired to restore its function. Traditional repair tools, due to their fixed blade shape, insufficient hardness, or low operating precision, are prone to scratching the chip body and damaging the pins during repair. This not only makes it difficult to complete effective repairs but also causes the device to be scrapped, increasing production costs. A semiconductor packaging repair scraper has emerged to address this need.
[0003] When semiconductor repair equipment is in operation, the repair scraper helps to clean excess adhesive or residual solder from the chip packaging area, ensuring the cleanliness of the chip packaging structure and laying the foundation for subsequent repair steps. At the same time, when it is necessary to remove failed components inside the package or adjust the pin position, the repair scraper can be precisely applied to the target area, avoiding damage to the chip body and substrate, while maintaining the integrity of the chip and related components, thus improving the repair success rate and stability of the repair equipment.
[0004] In existing technologies, some repair scrapers have worn and dulled blades, making it impossible to replace the blades individually. The entire scraper must be replaced, resulting in the waste of the undamaged handle and significantly increasing tool replacement costs. Furthermore, during violent disassembly, irreversible damage can be caused to the handle grip and connection points, further shortening the overall lifespan of the scraper and exacerbating tool wear. Therefore, a semiconductor-packaged repair scraper is proposed to solve the above problems. Utility Model Content
[0005] To overcome the above shortcomings, this utility model provides a semiconductor packaging repair scraper, which aims to improve the problem in the prior art where the blade head wears and the cutting edge becomes dull, making it impossible to replace the blade head individually and requiring the entire scraper to be replaced.
[0006] To achieve the above objectives, the present invention adopts the following technical solution: A semiconductor packaging repair scraper includes a blade head, a blade shank fixedly connected to the outside of the blade head, a connecting block fixedly connected to the outside of the blade shank, a handle detachably connected to the outside of the connecting block, and a disassembly mechanism installed inside the handle. The disassembly mechanism includes a push button, a fixing post is fixedly connected to the outside of the push button, a spring is sleeved on the outside of the fixing post, and a connecting component is provided inside the fixing post; As a further description of the above technical solution: The connecting component includes a mounting column, a sliding column is slidably connected inside the mounting column, a connecting column is fixedly connected to the bottom of the sliding column, and two sliding grooves are opened inside the mounting column, with fixed balls slidably connected inside each of the two sliding grooves. As a further description of the above technical solution: The connecting block is detachably connected to the outside of the knife handle, and the push button is slidably connected to the inside of the knife handle. As a further description of the above technical solution: The fixed post is externally slidably connected to the inside of the tool holder, and the connecting assembly is externally detachably connected to the inside of the connecting block; As a further description of the above technical solution: The mounting post is externally fixedly connected to the inside of the fixed post, and the spring is externally sleeved on the outside of the mounting post; As a further description of the above technical solution: The fixed ball is externally slidably connected to the inside of the mounting column, and the fixed ball is externally slidably connected to the inside of the connecting block.
[0007] This utility model has the following beneficial effects: 1. In this utility model, when disassembling and replacing the cutter head, pressing the button moves the fixing post, compressing the spring; subsequently, the connecting component acts, the sliding post moves the connecting post, squeezing the fixing balls on both sides and moving them into the mounting post. At this time, the connecting component disengages from the connecting block, and the cutter handle separates from the connecting block, thus completing the cutter head disassembly and replacement. This process allows maintenance personnel to quickly replace the cutter head when it is worn, contaminated with foreign matter, or needs to be adapted to different maintenance scenarios, significantly shortening the time spent on a single maintenance, significantly increasing maintenance capacity per unit time, saving production time for semiconductor manufacturers and maintenance companies, and effectively reducing labor costs. Attached Figure Description
[0008] Figure 1 This is a perspective view of a semiconductor packaging repair shovel proposed in this utility model; Figure 2 This is a schematic diagram of the connecting block of a semiconductor packaging repair shovel proposed in this utility model; Figure 3 This is a schematic diagram of the blade holder of a semiconductor packaging repair shovel proposed in this utility model; Figure 4 for Figure 3 Enlarged view of point A in the middle.
[0009] Legend: 1. Cutter head; 2. Cutter shank; 3. Connecting block; 4. Cutter handle; 5. Disassembly mechanism; 51. Push button; 52. Fixing post; 53. Spring; 54. Connecting assembly; 541. Mounting post; 542. Sliding post; 543. Connecting post; 544. Sliding groove; 545. Fixing ball. Detailed Implementation
[0010] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0011] Reference Figure 1 and Figure 2 This utility model provides an embodiment of a semiconductor packaging repair scraper, including a blade head 1. The blade head 1 directly contacts the semiconductor package to complete repair operations such as peeling and cleaning. A blade shank 2 is fixedly connected to the outside of the blade head 1. The blade shank 2 connects the blade head 1 and a connecting block 3 to transmit force. A connecting block 3 is fixedly connected to the outside of the blade shank 2. The connecting block 3 cooperates with a handle 4 to achieve a detachable connection between the blade head 1 and the handle 4. The handle 4 is detachably connected to the outside of the connecting block 3. The handle 4 provides a gripping part for easy operation. A disassembly mechanism 5 is installed inside the handle 4. The disassembly mechanism 5 separates the connecting block 3 from the handle 4 by pressing to facilitate the replacement of the blade head 1.
[0012] The disassembly mechanism 5 includes a push button 51, which serves as a trigger for the disassembly operation. The operator initiates the disassembly process by pressing the button. A fixing post 52 is fixedly connected to the outside of the push button 51. When the push button 51 moves, it causes the fixing post 52 to move synchronously. A spring 53 is sleeved on the outside of the fixing post 52. The spring 53 stores elastic force through compression to facilitate subsequent component reset. A connecting component 54 is installed inside the fixing post 52. The connecting component 54 engages with the connecting block 3 via a fixing ball 545 to fix the tool holder 4 to the connecting block 3. The connecting block 3 is detachably connected to the outside of the tool holder 4, allowing the connecting block 3 to detach from the tool holder 4 under the action of the disassembly mechanism 5. The push button 51 is slidably connected to the inside of the tool holder 4, ensuring that the push button 51 can only move in a limited direction inside the tool holder 4 to avoid deviation. The fixing post 52 is slidably connected to the inside of the tool holder 4, ensuring that the fixing post 52 is stable and does not shake when it moves. The connecting component 54 is detachably connected to the inside of the connecting block 3, and the tool head 1 can be disassembled and replaced by engaging and disengaging the connecting component 54 and the connecting block 3.
[0013] Reference Figure 3 and Figure 4The connecting component 54 includes a mounting post 541, which provides installation space and a movement track for the sliding post 542 and the fixed ball 545. The sliding post 542 is slidably connected inside the mounting post 541. When the fixed post 52 moves, it drives the mounting post 541, which in turn causes the sliding post 542 to move. The bottom of the sliding post 542 is fixedly connected to a connecting post 543. When the sliding post 542 moves, it drives the connecting post 543 to move synchronously and squeeze the fixed ball 545. The mounting post 541 has two sliding grooves 544 inside. The sliding grooves 544 limit the movement direction of the fixed ball 545 to ensure that it can only slide inward and outward. The fixed ball 545 is slidably connected inside both sliding grooves 544. When the fixed ball 545 extends, it is locked into the connecting block 3 to achieve fixation. When it retracts, it is released from fixation.
[0014] The mounting post 541 is externally fixedly connected to the inside of the fixing post 52, so that the fixing post 52 and the mounting post 541 move synchronously to transmit power. The spring 53 is externally sleeved on the outside of the mounting post 541 to prevent the spring 53 from deviating and ensure that it can only be compressed along the axial direction of the mounting post 541. The fixing ball 545 is externally slidably connected to the inside of the mounting post 541, so that the fixing ball 545 can slide smoothly in the mounting post 541 without jamming. The fixing ball 545 is externally slidably connected to the inside of the connecting block 3. The tool holder 4 is fixed to the connecting block 3 by the engagement of the fixing ball 545 and the connecting block 3. When separated, the fixing ball 545 slides into the inside of the mounting post 541 to release the fixation.
[0015] Working principle: When disassembling and replacing the cutter head 1, firstly, press the button 51 to move it. The movement of the button 51 moves the fixing post 52, and the spring 53 is compressed according to its own elasticity. At this time, the connecting component 54 is activated, and the sliding post 542 moves. The movement of the sliding post 542 drives the connecting post 543 to move. At this time, the fixing balls 545 on both sides are squeezed and move. When the fixing balls 545 move into the mounting post 541, the connecting component 54 is completely detached from the fixing of the connecting block 3, thereby causing the cutter handle 4 to completely detach from the fixing of the connecting block 3. Moving the cutter handle 4 completes the disassembly and replacement of the cutter head 1. This allows maintenance personnel to quickly replace the cutter head 1 when it is worn, contaminated with foreign objects, or needs to be adapted to different maintenance scenarios, greatly shortening the time spent on a single maintenance, significantly increasing the maintenance capacity per unit time, saving more production time for semiconductor manufacturers and maintenance service companies, and effectively reducing labor costs.
[0016] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A semiconductor packaging repair tool, comprising a blade (1), characterized in that: The blade head (1) is fixedly connected to the outside of the blade rod (2), the blade rod (2) is fixedly connected to the outside of the connecting block (3), the connecting block (3) is detachably connected to the outside of the blade handle (4), and the blade handle (4) is equipped with a disassembly mechanism (5). The disassembly mechanism (5) includes a push button (51), a fixing post (52) is fixedly connected to the outside of the push button (51), a spring (53) is sleeved on the outside of the fixing post (52), and a connecting component (54) is provided inside the fixing post (52).
2. The semiconductor packaging repair scraper according to claim 1, characterized in that: The connecting component (54) includes a mounting post (541), a sliding post (542) is slidably connected inside the mounting post (541), a connecting post (543) is fixedly connected to the bottom of the sliding post (542), and two sliding grooves (544) are opened inside the mounting post (541), and a fixed ball (545) is slidably connected inside the two sliding grooves (544).
3. The semiconductor packaging repair scraper according to claim 1, characterized in that: The external of the connecting block (3) is detachably connected to the outside of the handle (4), and the external of the push button (51) is slidably connected to the inside of the handle (4).
4. A semiconductor packaging repair scraper according to claim 1, characterized in that: The fixed post (52) is externally slidably connected to the inside of the handle (4), and the connecting assembly (54) is externally detachably connected to the inside of the connecting block (3).
5. A semiconductor packaging repair scraper according to claim 2, characterized in that: The mounting post (541) is externally fixedly connected to the inside of the fixing post (52), and the spring (53) is externally sleeved on the outside of the mounting post (541).
6. A semiconductor packaging repair scraper according to claim 2, characterized in that: The fixed ball (545) is externally slidably connected to the inside of the mounting post (541), and the fixed ball (545) is externally slidably connected to the inside of the connecting block (3).