A ball planting device

CN224794793UActive Publication Date: 2026-09-25SHANGHAI TECHSENSE CO LTD
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Patent Information

Application Number
CN202522408510.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-13
Publication Date
2026-09-25
Estimated Expiration
2035-11-13

AI Technical Summary

Technical Problem

钢网植球、针转印植球能快速进行大批量生产,但是需要针对不同产品焊盘设计不同的治具,成本高昂,而激光喷射植球则灵活度更高

Benefits of technology

[0007]本实用新型中,由于转轴被上下限位结构轴向约束固定在通孔中,故分球盘的高度自然也被固定,并且,在上基座和下基座之间设置了第一垫片,使分球盘至少与下基座具有上下间隙,分球盘工作时与下基座不会产生摩擦,减少了分球盘和下基座的磨损,延长了寿命。

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Abstract

The utility model discloses a kind of semiconductor packaging technical field's spray ball mounting equipment, the device includes upper base, lower base, ball separating disc, servo motor, pivot, upper and lower limit structure and first gasket;Ball separating disc is connected with servo motor by pivot and rotates horizontally between upper base and lower base, pivot is fixed in the upper base center through hole by being axially constrained by upper and lower limit structure;First gasket is clamped between upper base and lower base and located at the radial outer side of ball separating disc, so that ball separating disc has at least upper and lower clearance with lower base.The utility model fixes the height of ball separating disc by upper and lower limit structure, and utilizes first gasket to form clearance, avoid the friction of ball separating disc and lower base, reduce abrasion, effectively prolong the service life of device.
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Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging equipment technology, and in particular relates to a jet ball-planting device. Background Technology

[0002] In semiconductor packaging, ball placement is a crucial step in achieving high-precision electrical connections between the chip and the packaging substrate. Mainstream ball placement processes include stencil ball placement, pin transfer ball placement, and laser jet ball placement. Stencil ball placement and pin transfer ball placement can be performed quickly for mass production, but they require different fixtures designed for different product pads, resulting in high costs. Laser jet ball placement, on the other hand, offers greater flexibility.

[0003] Existing spray ball planting equipment can be roughly divided into two types: flat plate type and rotary plate type. In traditional rotary plate type spray ball planting equipment, the ball distribution plate is closely fitted with the upper and lower bases, resulting in a large amount of friction, which aggravates wear and reduces service life. Utility Model Content

[0004] Based on this, and to address the aforementioned technical problems, a spray ball-planting device is provided.

[0005] The technical solution adopted in this utility model is as follows:

[0006] A ball-planting device includes a ball-distributing disk that rotates horizontally between an upper base and a lower base under the drive of a servo motor. The upper base has a through hole at its center through which a rotating shaft passes vertically. A bearing rotatably connected to the rotating shaft is provided in the through hole. The distance between the upper surface of the lower base and the lower surface of the upper base is greater than or equal to the diameter of one solder ball and less than the diameter of two solder balls. The center of the ball-distributing disk is connected to the servo motor via the rotating shaft. The device is characterized by further including upper and lower limiting structures and a first gasket. The rotating shaft is axially constrained and fixed in the through hole by the upper and lower limiting structures. The first gasket is sandwiched between the upper base and the lower base and is located radially outside the ball-distributing disk. The ball-distributing disk has at least a vertical clearance with the lower base.

[0007] In this invention, since the rotating shaft is axially constrained and fixed in the through hole by the upper and lower limiting structures, the height of the ball-distributing plate is naturally fixed as well. Furthermore, a first gasket is provided between the upper base and the lower base, so that the ball-distributing plate has at least an upper and lower gap with the lower base. When the ball-distributing plate is working, it will not rub against the lower base, thereby reducing the wear of the ball-distributing plate and the lower base and extending their service life. Attached Figure Description

[0008] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0009] Figure 1 A schematic diagram of a spray ball-planting device provided in an embodiment of this utility model;

[0010] Figure 2 This is a vertical sectional view of an embodiment of the present utility model;

[0011] Figure 3 This is a top view of the upper base structure according to an embodiment of the present utility model;

[0012] Figure 4 This is a cross-sectional view of the ball supply cylinder according to an embodiment of the present utility model;

[0013] Figure 5 This is a bottom view of the ball supply cylinder according to an embodiment of the present utility model.

[0014] Figure 6 This is a schematic diagram of the connection structure between the rotating shaft and the ball-distributing plate in an embodiment of this utility model. Figure 1 ;

[0015] Figure 7 This is a schematic diagram of the connection structure between the rotating shaft and the ball-distributing plate in an embodiment of this utility model. Figure 2 ;

[0016] Figure 8 This is a schematic diagram of the structure of the rotating shaft according to an embodiment of the present utility model;

[0017] Figure 9 This is a schematic diagram of the ball-distributing plate according to an embodiment of the present utility model;

[0018] Figure 10 This is a bottom view of the lower base structure according to an embodiment of the present utility model;

[0019] Figure 11 This is a top view of the lower base structure according to an embodiment of the present utility model;

[0020] Figure 12 This is a schematic diagram of the structure of the first gasket in an embodiment of the present utility model. Detailed Implementation

[0021] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0022] like Figure 1 and Figure 2As shown, this utility model embodiment provides a spray ball planting device, including a fixed frame 1100, an upper base 1200, a ball supply cylinder 1300, a servo motor 1400, a rotating shaft 1500, a ball distribution plate 1600, a lower base 1700, a through-beam fiber optic sensor 1800, and a spray nozzle 1900.

[0023] The upper surface of the upper base 1200 has a mounting part 1210, which is fixed to the fixing frame 1100 by bolts.

[0024] The upper base 1200 has a through hole 1220 at its center, through which the rotating shaft 1500 passes. The upper opening of the through hole 1220 extends upward above the upper surface of the upper base 1200. The through hole 1220 has an annular support step 1221. A bearing 1222 is fixed on the support step 1221. A nut 1223 is provided on the upper end face of the bearing 1222. An end cap 1224 is provided on the upper opening of the through hole 1220. A sealing structure is provided between the end cap 1224 and the bearing 1222. The end cap 1224 and the sealing structure prevent air, dust, etc. from entering the interior, which could cause oxidation of the solder balls, contamination of the solder balls and the ball distribution plate, and reduced ball placement accuracy. In this embodiment, the sealing structure includes a sealing ring 1225 and a first sealing ring 1226, both of which are located radially outside the nut 1223.

[0025] The inner hole of nut 1223 forms an inner shoulder 1223a.

[0026] like Figure 1 and Figure 3 As shown, the upper base 1200 also has a vertical air blowing hole 1230, an upper detection hole 1240 and a residual ball clearing hole 1250. The upper opening of the air blowing hole 1230 is provided with a first air connector 1231, and the upper opening of the residual ball clearing hole 1250 is provided with a plug 1251.

[0027] like Figure 1 As shown, the ball feeding cylinder 1300 includes a feed pipe 1310 and a hopper 1320. The feed pipe 1310 is integrally connected and fixed to the top of the hopper 1320, and its upper opening is provided with a rubber cap 1311. The hopper 1320 is fixed to the upper surface of the upper base 1200 by bolts. Figure 4 As shown, the inner cavity of the hopper 1320 is connected to the lower opening of the feed pipe 1310 and is shaped like an inverted trumpet. The bottom of the hopper 1320 forms a feed end 1330 that extends downward through the upper base 1200, and a second sealing ring 1340 is provided at the point through which it passes (see...). Figure 3 The feeding end 1330 has a vertical ball supply channel 1331 inside. The upper opening of the ball supply channel 1331 is connected to the inner cavity of the hopper 1320. The ball supply channel 1331 is stepped, as shown in the figure. Figure 5As shown, its cross-section is arc-shaped and can simultaneously correspond to multiple consecutive ball drop holes on the ball distribution plate 1600, allowing for simultaneous ball supply to multiple consecutive ball drop holes.

[0028] like Figure 1 and Figure 4 As shown, the side of the hopper 1320 is also provided with an air hole 1321 that communicates with the inner cavity of the hopper 1320, and the inlet of the air hole 1321 is provided with a second air connector 1321a.

[0029] The servo motor 1400 is fixed to the bracket 1100 via flange 1410, and its output shaft is vertically downward.

[0030] The rotating shaft 1500 passes upward through the through hole 1220 and the bearing 1222, and its upper end is connected to the output shaft of the servo motor via a coupling 1422. (See figure) Figure 6 .

[0031] like Figure 8 As shown, the shaft 1500 has an upper section 1510 and a lower section 1520. The upper section 1510 is composed of a thick part 1511 and a thin part 1512 distributed from bottom to top, forming an upper step 1513. The circumferential surface of the thick part 1511 forms an external thread 1511a. The lower part of the lower section 1520 forms a lower step 1521.

[0032] The upper section 1510 is threadedly locked by the nut 1223 and suspended on the bearing 1222. The upper step 1513 is pressed by the inner shoulder 1223a of the nut 1223. The lower step 1521 abuts against the lower end face of the bearing 1222. The nut 1223 and the lower step 1521 form an upper and lower limiting structure, so that the rotating shaft 1500 is axially constrained and fixed in the through hole 1220.

[0033] The center of the ball-distributing plate 1600 is fixed to the rotating shaft 1500, thereby connecting it to the servo motor 1400. In this embodiment, as shown... Figure 7 As shown, the ball distribution plate 1600 is locked onto the flange 1660 at the lower end of the rotating shaft 1500 by hand-tightening bolts 1610 and fixing screws 1620 through the pad 1630 and washer 1640.

[0034] Since the axial position of the rotating shaft 1500 has been fixed, the height of the ball-distributing disk 1600 is also fixed. In this embodiment, the ball-distributing disk 1600 is in contact with the lower surface of the upper base 1200.

[0035] like Figure 9 As shown, the ball distribution plate 1600 has multiple ball dropping holes 1650, which are evenly distributed on the same horizontal circumference concentric with the ball distribution plate, and each ball dropping hole 1650 can only hold a single solder ball.

[0036] The lower base 1700 is located below the upper base 1200, and the two are fixed together by screws.

[0037] like Figure 2 , Figure 10 and Figure 11 As shown, the lower base 1700 has an inclined first ball-dropping channel 1710 and a vertical lower detection hole 1720, a first residual ball suction channel 1730, and a second residual ball suction channel 1740. The upper opening of the first ball-dropping channel 1710 is directly opposite the lower opening of the air blowing hole 1230. The lower detection hole 1720 is directly opposite the upper detection hole 1240. The residual ball clearing hole 1250 corresponds to the upper opening of the second residual ball suction channel 1740. The lower opening of the ball supply channel 1331, the air blowing hole 1230, the first residual ball suction channel 1730, the upper detection hole 1240, and the residual ball clearing hole 1250 are arranged sequentially from back to front along the rotation direction of the ball-distributing plate. In this embodiment, the rotation direction of the ball-distributing plate is counterclockwise.

[0038] Among them, such as Figure 10 As shown, the lower opening of the first residual ball suction channel 1730 is provided with a third air connector 1731, and the lower opening of the second residual ball suction channel 1740 is provided with a fourth air connector 1741.

[0039] The upper surface of the lower base 1700 has an annular groove located radially outward of the ball-distributing disk 1600. A first annular washer 1750 is secured within the annular groove by a pin. (See also...) Figure 2 .

[0040] The upper surface of the first washer 1750 is higher than the upper surface of the lower base 1700, so that it is sandwiched between the upper base 1200 and the lower base 1700. Since the height of the ball separator 1600 is fixed, the distance between the first washer 1750 and the lower base 1700 forms the vertical gap between the ball separator 1600 and the lower base 1700. During operation, the ball separator 1600 and the lower base 1700 will not generate friction. At the same time, the distance between the upper surface of the lower base 1700 and the lower surface of the upper base 1200 is greater than or equal to the diameter of one solder ball and less than the diameter of two solder balls. In actual scenarios, the distance between the lower base 1700 and the upper base 1200 will be much smaller than the diameter of two solder balls to avoid damaging the solder balls.

[0041] In this embodiment, as Figure 12 As shown, the first gasket 1750 includes a thick gasket 1751 and a thin gasket 1752. The thick gasket 1751 and the thin gasket 1752 are stacked one on top of the other. The thickness of the thin gasket 1752 is the size of the gap between the ball-distributing plate 1600 and the lower base 1700. Of course, there can be multiple thin gaskets 1752. The size of the gap between the ball-distributing plate 1600 and the lower base 1700 is determined by the total thickness of the multiple thin gaskets 1752.

[0042] The above structure facilitates the adjustment of the gap between the ball-distributing plate 1600 and the lower base 1700. Of course, the above-mentioned annular groove can also be eliminated, and the first gasket 1750 is directly fixed to the upper surface of the lower base 1700.

[0043] Understandably, a second gasket can also be installed between the ball distribution plate 1600 and the flange at the lower end of the rotating shaft 1500, so that there is also an upper and lower gap between the ball distribution plate 1600 and the upper base 1200.

[0044] In this embodiment, both the first gasket and the second gasket are made of stainless steel, and no additional rust prevention treatment is required on the surface. They are relatively soft and easy to make into thin sheets.

[0045] The through-beam fiber optic sensor 1800 has a transmitter and a receiver, which are respectively located at the upper opening of the upper detection hole 1240 and the lower opening of the lower detection hole 1720. A protective cover 1810 is also provided at the lower opening of the lower detection hole 1720. (See also...) Figure 10 .

[0046] like Figure 2 As shown, the ball nozzle 1900 includes a mounting base 1910 and a nozzle portion 1920. The mounting base 1910 is fixed to the lower surface of the lower base 1700 by bolts. The nozzle portion 1920 is threadedly connected to the mounting base 1910. It has a vertical ball spraying channel 1921 and an inclined second ball drop channel 1922 inside. The upper opening of the second ball drop channel 1922 is connected to the lower opening of the first ball drop channel 1710, and the lower opening of the second ball drop channel 1922 is connected to the ball spraying channel 1921.

[0047] Based on the above structure, the working process of the spray ball-planting device in this embodiment of the utility model is as follows:

[0048] 1. Open the cap 1311, pour an appropriate amount of solder balls into the ball supply tube 1300, and then close the cap 1311.

[0049] 2. Nitrogen gas is injected into the ball supply cylinder 1300 through the second gas connector 1321a, so that the solder balls move in the cavity of the ball supply cylinder 1300 and fall more easily into the ball drop hole 1650 on the ball distribution plate 1600.

[0050] 3. The servo motor 1400 drives the ball-distributing plate 1600 to rotate horizontally between the upper base 1200 and the lower base 1700. Repeating step 2 can transport the solder balls to different ball-dropping holes 1650 of the ball-distributing plate 1600.

[0051] When the through-beam fiber optic sensor 1800 detects that the ball-distributing disk 1600 has rotated past a hole, it sends a signal to stop the servo motor 1400. At this time, the air blowing hole 1230 of the upper base 1200, a ball-dropping hole 1650 of the ball-distributing disk 1600, and the first ball-dropping channel 1710 of the lower base 1700 are directly aligned vertically. Nitrogen gas is blown into the air blowing hole 1230 through the first air connector 1231. The solder ball in the ball-dropping hole 1650 is ejected along the first ball-dropping channel 1710, the second ball-dropping channel 1922, and the ball-spraying channel 1921.

[0052] 4. After a brief pause in the ball spraying, the servo motor 1400 continues to drive the ball distribution plate 1600 to rotate, causing the solder ball in the next ball drop hole 1650 to be sprayed out from the ball spray nozzle 1900.

[0053] When the ball drop hole 1650 rotates with the ball distribution plate 1600 to above the first residual ball suction channel 1730, a vacuum is drawn through the third air connector 1731. If the solder ball in the ball drop hole 1650 did not fall successfully in the previous position, the residual solder ball can be removed by vacuuming.

[0054] Since the upper detection hole 1240 is arranged in front of the first residual ball suction channel 1730 along the rotation direction of the ball distribution plate, when there are still solder balls in the ball drop hole 1650 after passing through the first residual ball suction channel 1730, it can be detected by the through-beam fiber optic sensor 1800. At this time, when the ball drop hole 1650 continues to move between the residual ball clearing hole 1250 and the second residual ball suction channel 1740, the plug 1251 on the residual ball clearing hole 1250 is removed, and the ball is manually pushed down with a needle. At the same time, a vacuum is drawn through the fourth air connector 1741 to remove the residual solder balls.

[0055] It is understandable that residual balls can be removed without vacuuming; for example, air can be blown above the residual ball channel to remove residual balls.

[0056] As can be seen from the above, the dispensing machine provided by this utility model embodiment has the following beneficial effects:

[0057] 1. Since the rotating shaft is axially constrained and fixed in the through hole by the upper and lower limiting structures, the height of the ball-distributing plate is naturally fixed as well. In addition, a first shim is set between the upper base and the lower base so that the ball-distributing plate has at least an upper and lower gap with the lower base. When the ball-distributing plate is working, it will not rub against the lower base, which reduces the wear of the ball-distributing plate and the lower base and extends the service life.

[0058] 2. Because the through-beam fiber optic sensor 1800 has high detection accuracy and can distinguish between the ball drop hole and the solder ball inside the ball drop hole, this embodiment of the utility model uses the through-beam fiber optic sensor 1800 to detect the rotation of the ball distribution plate 1600, eliminating the indexing hole on the traditional ball distribution plate (directly using the ball drop hole as the indexing hole). The ball distribution plate is simple to process, avoiding angular errors between the indexing hole and the ball drop hole, reducing processing difficulty and cost while improving ball placement accuracy. In contrast, the traditional ball distribution plate usually uses a photoelectric sensor to detect the rotation of the ball distribution plate hole by detecting the indexing hole (the photoelectric sensor cannot distinguish between the ball drop hole and the solder ball inside the ball drop hole), which requires ensuring that the positions of the ball drop hole and the indexing hole correspond, resulting in high processing costs. Furthermore, if the angular deviation between the ball drop hole and the indexing hole is too large, it will also affect the ball placement accuracy.

[0059] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A ball-planting device, comprising a ball-distributing disk that rotates horizontally between an upper base and a lower base under the drive of a servo motor, wherein the upper base has a through hole at its center through which a rotating shaft passes vertically, a bearing rotatably connected to the rotating shaft is provided in the through hole, the distance between the upper surface of the lower base and the lower surface of the upper base is greater than or equal to the diameter of one solder ball and less than the diameter of two solder balls, and the center of the ball-distributing disk is connected to the servo motor via the rotating shaft, characterized in that... It also includes upper and lower limiting structures and a first gasket. The rotating shaft is axially constrained and fixed in the through hole by the upper and lower limiting structures. The first gasket is sandwiched between the upper base and the lower base and is located on the radially outer side of the ball-distributing disk. The ball-distributing disk has at least an upper and lower gap with the lower base.

2. The spray ball-planting device according to claim 1, characterized in that, The upper and lower limiting structure includes a nut and a lower step formed on the rotating shaft. The upper section of the rotating shaft that extends upward through the bearing is threadedly locked by the nut and suspended on the bearing. The lower step is located in the lower section of the rotating shaft and abuts against the lower end face of the bearing.

3. The spray ball-planting device according to claim 2, characterized in that, The upper section of the shaft is composed of a thick part and a thin part distributed from bottom to top to form an upper step. The circumferential surface of the thick part forms an external thread that mates with the nut, and the inner hole of the nut forms an inner shoulder that presses against the upper step.

4. The spray ball-planting device according to claim 2, characterized in that, The upper opening of the through hole is provided with an end cap, and a sealing structure is provided between the end cap and the bearing.

5. The spray ball-planting device according to claim 1, characterized in that, The upper surface of the ball-distributing plate is in contact with the lower surface of the upper base.

6. The spray ball-planting device according to claim 5, characterized in that, The upper surface of the lower base has an annular groove located radially outside the ball-distributing disk, and the first gasket is annular and fixed to the annular groove.

7. The spray ball-planting device according to claim 6, characterized in that, The first gasket includes a thick gasket and at least one thin gasket, which are stacked one on top of the other. The total thickness of the at least one thin gasket is equal to the gap between the ball-distributing plate and the lower base.

8. The spray ball-planting device according to claim 1, characterized in that, It also includes a ball supply cylinder and a through-beam fiber optic sensor. The upper base has a vertical air blowing hole and an upper detection hole. The lower base has a first ball dropping channel and a vertical lower detection hole. The upper opening of the first ball dropping channel is vertically aligned with the lower opening of the air blowing hole. The lower detection hole is vertically aligned with the upper detection hole. A ball spray nozzle is provided on the lower surface of the lower base, and the ball spray nozzle communicates with the lower opening of the first ball dropping channel. The ball supply cylinder includes a feed pipe and a hopper. The feed pipe is fixed to the top of the hopper, and its upper opening is provided with a cap. The hopper is fixed to the upper surface of the upper base, and the inner cavity of the hopper is connected to the lower opening of the feed pipe. The material hopper is connected and shaped like an inverted trumpet. The bottom of the hopper forms a feeding end that extends downward through the upper base. The feeding end has a ball feeding channel inside, and the upper opening of the ball feeding channel is connected to the material hopper. The ball distribution plate has multiple ball dropping holes that are evenly distributed on the same horizontal circumference concentric with the ball distribution plate and can only accommodate a single solder ball. The transmitting part and receiving part of the through-beam fiber optic sensor are respectively located at the upper opening of the upper detection hole and the lower opening of the lower detection hole. The air blowing hole, the upper detection hole, the lower detection hole, the lower opening of the ball feeding channel, and the upper opening of the first ball dropping channel are all directly aligned with the horizontal circumference.

9. A spray ball-planting device according to claim 8, characterized in that, The ball supply channel has an arc-shaped cross-section, which can simultaneously correspond to multiple consecutive ball drop holes.

10. A spray ball-planting device according to claim 8, characterized in that, The lower base also has a first residual ball suction channel and a second residual ball suction channel, and the upper base also has a vertical residual ball clearing hole. The residual ball clearing hole corresponds vertically to the upper opening of the second residual ball suction channel. The lower opening of the ball supply channel, the air blowing hole, the first residual ball suction channel, the upper detection hole, and the residual ball clearing hole are arranged sequentially from back to front along the rotation direction of the ball distribution plate.