Thermo-compression bonding nozzle and thermo-compression bonding apparatus

Abstract

The application discloses a hot-press welding suction nozzle and a hot-press welding device, and relates to the technical field of semiconductor devices. The hot-press welding suction nozzle comprises a suction nozzle body and a cleaning device connected with the suction nozzle body, the suction nozzle body is used for adsorbing a chip, the cleaning device is provided with an air inlet hole and an air outlet hole which are communicated with each other, cleaning gas is introduced into the inside of the cleaning device through the air inlet hole, and the cleaning gas is guided to the bottom of the chip through the air outlet hole so as to clean the bottom of the chip. The hot-press welding suction nozzle can solve the problem that water washing residues exist in the bottom of a flip chip after drying treatment in the prior art.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a thermoforming nozzle and thermoforming equipment. Background Technology

[0002] Flip chip packaging technology has gained widespread application in the microelectronics packaging field due to its high-density interconnect characteristics and high performance. However, bottom cleaning after flip chip packaging remains a highly challenging technical problem in this field. Current technologies typically employ a water washing process combined with soap-based chemical cleaning agents. This method effectively removes flux residues, ensuring good contact and filling between the chip and the substrate. However, the water washing process has the following drawbacks: the product needs to be dried after cleaning, a process that can easily lead to water residue remaining on the bottom of the chip. Utility Model Content

[0003] The purpose of this application is to provide a hot press welding nozzle and hot press welding equipment, which can solve the problem of water washing residue on the bottom of flip chips after drying in the existing water washing process.

[0004] The embodiments of this application are implemented as follows: A first aspect of this application provides a thermoforming nozzle, including a nozzle body and a cleaning device connected to the nozzle body. The nozzle body is used to adsorb a chip. The cleaning device has an inlet and an outlet that communicate with each other. Cleaning gas is introduced into the interior of the cleaning device through the inlet and guided to the bottom of the chip through the outlet to clean the bottom of the chip. This thermoforming nozzle can solve the problem of water washing residue remaining on the bottom of flip-chips after drying in the prior art water washing process.

[0005] In one possible implementation, the nozzle body has an adsorption hole, and the nozzle body is connected to a vacuum device to adsorb the chip through the adsorption hole.

[0006] In one possible implementation, the nozzle body includes a connecting part and an adsorption part that are connected to each other. The connecting part is connected to the vacuum device, and the adsorption hole is located on the adsorption part. The vacuum device, the connecting part, and the adsorption hole are connected in sequence.

[0007] In one possible implementation, an adsorption groove is provided at the end of the adsorption part away from the connecting part, the adsorption hole is connected to the bottom of the adsorption groove, the chip is housed in the adsorption groove, and adsorption is achieved through the vacuum device and the adsorption hole.

[0008] In one possible implementation, the height of the end of the cleaning device away from the nozzle body is greater than the height of the end of the cleaning device close to the nozzle body, so as to form an inclined surface at the bottom of the cleaning device, and the air outlet is located on the inclined surface.

[0009] In one possible implementation, the air inlet is located at the top of the cleaning device, and the interior of the cleaning device has a storage chamber for storing the cleaning gas. The air inlet and the air outlet are interconnected through the storage chamber.

[0010] In one possible implementation, the number of air inlets is at least one, and the air inlets are perpendicular to the top of the cleaning device; and / or, the number of air outlets is multiple, and the multiple air outlets are evenly distributed on the inclined surface.

[0011] As one possible implementation, the number of cleaning devices is at least one; when the number of cleaning devices is multiple, the multiple cleaning devices are evenly distributed along the circumference of the nozzle body.

[0012] As one possible implementation, the cleaning gas is formic acid, nitrogen, carbon dioxide, or argon.

[0013] A second aspect of this application provides a thermocompression welding apparatus, including the aforementioned thermocompression welding nozzle. This thermocompression welding nozzle can solve the problem of water washing residue remaining on the bottom of the flip chip after drying in the prior art water washing process.

[0014] The beneficial effects of the embodiments of this application include: This thermocompression welding nozzle includes a nozzle body and a cleaning device connected to the nozzle body. The nozzle body is used to pick up the chip, and the cleaning device has an inlet and an outlet that are interconnected. Cleaning gas is introduced into the interior of the cleaning device through the inlet and guided to the bottom of the chip through the outlet to clean the bottom of the chip. The thermocompression welding nozzle provided in this application integrates the cleaning device on the side wall of the nozzle body, without occupying additional space. It uses cleaning gas to clean the bottom of the chip. Since dry cleaning leaves no liquid or cleaning agent residue, it can ensure that the bottom of the chip is in a dry state, eliminating the need for drying again after cleaning, thus saving cleaning time. At the same time, it can also blow away flux residue, dust, etc. with the cleaning gas to ensure good contact and filling effect between the chip and the substrate. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is one of the structural schematic diagrams of the thermoforming nozzle provided in the embodiments of this application; Figure 2 This is a second schematic diagram of the structure of the thermoforming nozzle provided in the embodiments of this application; Figure 3 This is the third schematic diagram of the structure of the thermoforming nozzle provided in the embodiments of this application; Figure 4 The fourth schematic diagram of the thermoforming nozzle provided in the embodiments of this application.

[0017] Icons: 100-Thermo-press welding nozzle; 10-Nose body; 11-Connecting part; 12-Adsorption part; 121-Adsorption hole; 122-Adsorption tank; 20-Cleaning device; 21-Air inlet; 22-Air outlet; 200-Chip; 300-Substrate. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0019] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0020] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] Please refer to the reference. Figures 1 to 4 This application provides a thermoforming nozzle 100, including a nozzle body 10 and a cleaning device 20 connected to the nozzle body 10. The nozzle body 10 is used to adsorb a chip 200. The cleaning device 20 has an inlet 21 and an outlet 22 that are interconnected. Cleaning gas is introduced into the interior of the cleaning device 20 through the inlet 21 and guided to the bottom of the chip 200 through the outlet 22 to clean the bottom of the chip 200. This thermoforming nozzle 100 can solve the problem of water washing residue remaining on the bottom of the flip chip 200 after drying in the prior art water washing process.

[0022] It should be noted that the thermocompression welding nozzle 100 includes a nozzle body 10 and a cleaning device 20. The nozzle body 10 can be a high-temperature resistant metal component (such as tungsten alloy or ceramic composite material) to ensure that it can withstand the high temperature during thermocompression welding and uniformly transfer the temperature to the bumps of the chip 200. The end of the nozzle body 10 used to adsorb the chip 200 can be flat or tapered to match the size of the chip 200. The cleaning device 20 can be integrally formed with the nozzle body 10 or manufactured separately and then assembled. The cleaning device 20 has an air inlet 21 and an internal air passage. The air inlet 21 and the air outlet 22 are used to connect to a clean air source (such as an inert gas cylinder or a clean compressed air system). The gas flow rate can be precisely adjusted by a valve on the pipeline. The internal air passage refers to the hollow channel located inside the nozzle body and connected to the air inlet 21 and the air outlet 22 to ensure that the clean gas can flow from the air inlet 21 to the air outlet 22. The air outlet 22 can be set towards the bottom of the chip 200, so that the clean gas is guided to the bottom of the chip 200 to clean the flux residue remaining on the bottom of the chip 200.

[0023] Taking the post-thermopress cleaning of a flip chip 200 (which has bumps and pads on its bottom, making it prone to flux residue and dust) as an example, the cleaning process is as follows: First, the chip 200 is adsorbed by the nozzle body 10 and moved onto the substrate 300 for welding by heating and pressurization; second, cleaning gas is introduced through the air inlet 21 and flows to the air outlet 22 under the guidance of the internal air passage. The specific gas flow rate can be designed according to actual needs; third, the cleaning gas is ejected through the air outlet 22 and guided to the bottom of the chip 200, blowing away flux residue, environmental dust, and other contaminants left on the bottom of the chip 200. The specific number of blows and the time for each blow can be designed according to actual needs. It is worth noting that, in addition to post-thermopress cleaning, the bottom of the chip 200 can also be pre-cleaned using the thermopressing nozzle 100 provided in this application before thermopressing to avoid the thermopressing process being affected by dust and impurities.

[0024] Compared to existing technologies that use water washing combined with soap-based chemical cleaning agents, this method effectively removes flux residues and ensures good contact and filling between the chip 200 and the substrate 300. However, it has the following drawbacks: after cleaning, the product needs to be dried, which can easily leave water residues on the bottom of the chip 200, potentially affecting the electrical connection between the chip 200 and the substrate 300. The thermoforming nozzle 100 provided in this application integrates a cleaning device 20 on the side wall of the nozzle body 10, without occupying additional space. It uses cleaning gas to clean the bottom of the chip 200. Since dry cleaning leaves no liquid or cleaning agent residue, it ensures that the bottom of the chip 200 is dry, eliminating the need for drying after cleaning and saving cleaning time. Simultaneously, it blows away flux residues and dust with the cleaning gas, ensuring good contact and filling between the chip 200 and the substrate 300.

[0025] As one possible implementation method, such as Figures 1 to 4 As shown, the nozzle body 10 has an adsorption hole 121. The nozzle body 10 is connected to a vacuum device to adsorb the chip 200 through the adsorption hole 121.

[0026] It should be noted that the nozzle body 10 has an adsorption hole 121, which is a through hole opened on the adsorption surface of the nozzle body 10. The shape of the adsorption hole 121 can be circular, and its diameter and number can be matched according to the size and weight of the chip 200. The nozzle body 10 is connected to a vacuum device, and the nozzle body 10 has a vacuum channel inside, so that the vacuum device and the adsorption hole 121 are connected through the vacuum channel. Under the negative pressure provided by the vacuum device, the nozzle body 10 adsorbs the chip 200 through the adsorption hole 121, which can ensure that the chip 200 is stably adsorbed during the transfer and hot pressing process, and the chip 200 will not fall off the nozzle body 10, nor will it cause damage to the chip 200.

[0027] For example, when the chip 200 is small in size and light in weight, there can be one adsorption hole 121. The geometric center of the adsorption hole 121 is coaxial with the geometric center of the vacuum channel to avoid the chip 200 shifting during adsorption. When the chip 200 is large in size and heavy in weight, there can be multiple adsorption holes 121. The multiple adsorption holes 121 can be distributed in a ring around the circumference of the geometric center of the vacuum channel, or there can be an adsorption hole 121 at the geometric center of the vacuum channel to make the adsorption force of the adsorption hole 121 evenly distributed.

[0028] As one possible implementation method, such as Figures 1 to 4As shown, the nozzle body 10 includes a connecting part 11 and an adsorption part 12 that are connected to each other. The connecting part 11 is connected to a vacuum device, and the adsorption hole 121 is located on the adsorption part 12. The vacuum device, the connecting part 11 and the adsorption hole 121 are connected in sequence.

[0029] It should be noted that the nozzle body 10 includes a connecting part 11 and an adsorption part 12 connected to each other. The connecting part can be a hollow columnar structure, with one end connected to a vacuum device (such as a vacuum pipe or vacuum pump) and the other end fixed to the adsorption part 12 (such as integral molding or detachable connection). The connecting part 11 has a vacuum channel inside, which serves as the main channel for vacuum conduction, connecting the vacuum device and the adsorption hole 121. The adsorption part 12 can be flat to increase the contact area with the chip 200. The adsorption hole 121 is opened on the adsorption part 12 to serve as a branch channel for vacuum conduction, forming a complete vacuum path of "vacuum device - main air channel - branch air channel - chip 200", so that the vacuum negative pressure provided by the vacuum device is applied to the top of the chip 200, thereby making the bottom of the chip 200 precisely aligned with the pads of the substrate 300, so as to achieve precise positioning for subsequent hot-press welding.

[0030] As one possible implementation method, such as Figures 1 to 4 As shown, an adsorption groove 122 is provided at the end of the adsorption part 12 away from the connecting part 11. The adsorption hole 121 is connected to the bottom of the adsorption groove 122. The chip 200 is housed in the adsorption groove 122 and adsorbed through a vacuum device and the adsorption hole 121.

[0031] It should be noted that an adsorption groove 122 is provided at the end of the adsorption part 12 away from the connecting part 11. The adsorption groove 122 can be a rectangular or circular groove formed on the end face of the adsorption part 12. It is only necessary to make the shape of the adsorption groove 122 match the shape of the chip 200. The length or diameter of the adsorption groove 122 should be greater than the length or diameter of the chip 200 to ensure that the chip 200 can be smoothly placed into the adsorption groove 122 without significant shaking. The depth of the adsorption groove 122 can be equal to the thickness of the chip 200 so that after the chip 200 is placed into the adsorption groove 122, only the protrusion at the bottom of the chip 200 is exposed, thereby reducing the distance between the cleaning device 20 and the bottom of the chip 200, and thus improving the cleaning effect of the cleaning device 20. The adsorption holes 121 are connected to the bottom of the adsorption tank 122. The actual number and arrangement of the adsorption holes 121 can be designed according to actual needs. The chip 200 is placed in the adsorption tank 122 so that the adsorption tank 122 can be used to position and limit the chip 200. When the vacuum equipment is started, the negative pressure is transmitted to the adsorption holes 121 through the vacuum passage to achieve the adsorption of the chip 200.

[0032] As one possible implementation method, such as Figure 1 and Figure 3As shown, the height of the end of the cleaning device 20 away from the nozzle body 10 is greater than the height of the end of the cleaning device 20 close to the nozzle body 10, so as to form a slope at the bottom of the cleaning device 20, and the air outlet 22 is located on the slope.

[0033] It should be noted that the cleaning device 20 is a block structure arranged in a ring or symmetrical distribution around the adsorption part 12. The height of the end of the cleaning device 20 away from the nozzle body 10 is greater than the height of the end of the cleaning device 20 near the nozzle body 10, so that an inclined surface is formed at the bottom of the cleaning device 20. The angle between the formed inclined surface and the end face of the adsorption part 12 (i.e., the plane where the adsorption groove 122 is located) can be 30° to 60°, for example, the angle can be 45°, to take into account both the purging depth and the gas diffusion range. The air outlet 22 is located on the inclined surface. When there are multiple air outlets 22, the multiple air outlets 22 are evenly distributed on the inclined surface. The axis of each air outlet 22 is perpendicular to the inclined surface, so that the angle between the plane where the air outlet 22 is located and the end face of the adsorption part 12 is equal to the angle between the inclined surface and the end face of the adsorption part 12. In this way, the cleaning gas jet direction can have the characteristic of "oblique cutting in", directly entering the gap between the bottom of the chip 200 and the top of the substrate 300, and blowing the flux residue and dust in the gap towards the edge of the substrate 300. Compared with vertical gas output, oblique gas output can improve gas utilization, thereby improving the cleaning effect.

[0034] As one possible implementation method, such as Figures 1 to 3 As shown, the air inlet 21 is located at the top of the cleaning device 20. The interior of the cleaning device 20 has an air storage chamber for storing cleaning gas. The air inlet 21 and the air outlet 22 are interconnected through the air storage chamber.

[0035] It should be noted that, in addition to the air inlet 21, internal air passage, and air outlet 22, the cleaning device 20 also has an air storage chamber for storing cleaning gas. The air inlet 21 is located at the top of the cleaning device 20 to facilitate connection with the cleaning gas source and avoid interference between the chip 200 and the substrate 300. The air outlet 22 is located at the bottom of the cleaning device 20 to guide the cleaning gas into the gap between the bottom of the chip 200 and the top of the substrate 300. The air inlet 21 and the air outlet 22 are interconnected through the internal air passage and the air storage chamber. The air storage chamber can be a hollow cavity inside the cleaning device 20. That is, in addition to connecting the air inlet 21 and the air outlet 22 through the internal air passage, the cleaning gas introduced through the air inlet 21 is also stored in the air storage chamber to increase the air pressure of the cleaning gas ejected through the air outlet 22, thereby further improving the cleaning effect.

[0036] As one possible implementation method, such as Figures 1 to 3As shown, there is at least one air inlet 21, which is perpendicular to the top of the cleaning device 20 to facilitate connection with the cleaning gas source pipeline. For example, in this embodiment, there is one air inlet 21, which is located in the central area of ​​the top of the cleaning device 20 to introduce the cleaning gas into the gas storage chamber through a single channel and finally spray it out through the air outlet 22. Of course, in other embodiments, there can be multiple air inlets 21 to increase the flow rate of the cleaning gas while avoiding excessive flow rate of a single air inlet 21, which could cause large fluctuations in the pressure inside the gas storage chamber.

[0037] As one possible implementation method, such as Figures 1 to 4 As shown, the number of cleaning devices 20 is at least one; when the number of cleaning devices 20 is multiple, the multiple cleaning devices 20 are evenly distributed along the circumference of the nozzle body 10.

[0038] It should be noted that the number of cleaning devices 20 is at least one; when the number of cleaning devices 20 is one, the single cleaning device 20 is a ring or semi-ring structure, arranged around the circumference of the adsorption part 12, and the whole is coaxial with the adsorption part 12, which is suitable for small-sized chips 200; when the number of cleaning devices 20 is multiple, the multiple cleaning devices 20 are evenly distributed along the circumference of the nozzle body 10, and the airflow pressure is balanced by spatial symmetry to avoid the chip 200 being shifted by force during the cleaning process, while eliminating cleaning dead corners. For example, the adsorption part 12 is a rectangular structure, and the number of cleaning devices 20 is two or four. Two cleaning devices 20 are symmetrically arranged on both sides of the nozzle body 10, and four cleaning devices 20 are respectively arranged along the four sides of the adsorption part 12, which is suitable for large-sized chips 200.

[0039] As one possible implementation method, the cleaning gas is formic acid, nitrogen, carbon dioxide, or argon. Those skilled in the art can select the cleaning gas based on the type of residue on the bottom of the chip 200 (such as flux, dust, oxides), the material of the chip 200 (such as metal bumps, silicon substrate 300), and the thermoforming process environment (high temperature, cleanliness). Different gases can achieve residue-free cleaning through mechanisms such as physical purging, chemical decomposition, or inert protection, while avoiding any impact on the chip 200.

[0040] This application also provides a thermocompression welding apparatus, including the aforementioned thermocompression welding nozzle 100. Since the structure and beneficial effects of the thermocompression welding nozzle 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0041] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0042] It should also be noted that the various specific technical features described in the above embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A thermoforming nozzle, characterized in that, The device includes a suction nozzle body and a cleaning device connected to the suction nozzle body. The suction nozzle body is used to adsorb a chip. The cleaning device has an air inlet and an air outlet that are interconnected. Cleaning gas is introduced into the interior of the cleaning device through the air inlet and guided to the bottom of the chip through the air outlet to clean the bottom of the chip.

2. The thermoforming nozzle according to claim 1, characterized in that, The nozzle body has an adsorption hole, and the nozzle body is connected to a vacuum device to adsorb the chip through the adsorption hole.

3. The thermoforming nozzle according to claim 2, characterized in that, The nozzle body includes a connecting part and an adsorption part that are connected to each other. The connecting part is connected to the vacuum device, and the adsorption hole is located on the adsorption part. The vacuum device, the connecting part, and the adsorption hole are connected in sequence.

4. The thermoforming nozzle according to claim 3, characterized in that, An adsorption groove is provided at the end of the adsorption part away from the connecting part. The adsorption hole is connected to the bottom of the adsorption groove. The chip is housed in the adsorption groove and is adsorbed through the vacuum device and the adsorption hole.

5. The thermoforming nozzle according to claim 1, characterized in that, The height of the end of the cleaning device away from the nozzle body is greater than the height of the end of the cleaning device close to the nozzle body, so as to form a slope at the bottom of the cleaning device, and the air outlet is located on the slope.

6. The thermoforming nozzle according to claim 5, characterized in that, The air inlet is located at the top of the cleaning device, and the interior of the cleaning device has a storage chamber for storing the cleaning gas. The air inlet and the air outlet are interconnected through the storage chamber.

7. The thermoforming nozzle according to claim 6, characterized in that, The number of air inlets is at least one, and the air inlets are perpendicular to the top of the cleaning device; and / or, the number of air outlets is multiple, and the multiple air outlets are evenly distributed on the inclined surface.

8. The thermoforming nozzle according to any one of claims 1 to 7, characterized in that, The number of cleaning devices is at least one; when the number of cleaning devices is multiple, the multiple cleaning devices are evenly distributed along the circumference of the nozzle body.

9. The thermoforming nozzle according to any one of claims 1 to 7, characterized in that, The cleaning gas is formic acid, nitrogen, carbon dioxide, or argon.

10. A hot press welding device, characterized in that, Includes the thermocompression welding nozzle as described in any one of claims 1 to 9.

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