Wafer marking device

Abstract

The utility model belongs to the field of semiconductor processing technology, specifically is a kind of wafer marking device, including first base, be provided with shift platform, upper laser assembly and upper identification component on first base, and upper laser assembly includes laser generator, and the exit end of laser generator is connected with galvanometer, and the below of galvanometer is connected with field lens, and field lens is towards shift platform, and upper identification component includes movable read code component and laser sensor, and read code component and laser sensor are towards shift platform. Wafer edge finding operation is carried out using laser sensor, compared with visual edge finding, positioning accuracy is higher, can ensure the accuracy and consistency of marking position;Edge finding speed can usually reach millisecond level, can adapt to the requirement of high-speed production line, improve production efficiency;It also has strong anti-interference ability, can adapt to different illumination conditions and environmental noise, and can also work stably in complex industrial environment.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor processing technology, specifically a wafer marking device. Background Technology

[0002] In today's rapidly developing semiconductor industry, wafers, as the core carrier of integrated circuit manufacturing, undergo complex and precise production processes. The accuracy and stability of each step directly affect the performance and yield of the final chip. As chip integration continues to increase and wafer size continues to grow, the number of chips that can be manufactured on a single wafer has increased significantly. At the same time, the demands for quality control, traceability management, and information transmission during the production process are becoming increasingly stringent. Against this industrial backdrop, wafer marking technology has become an indispensable key process in semiconductor manufacturing. To improve wafer utilization, markings are typically applied to the edge of the wafer.

[0003] Marking at the edge of a wafer first requires identifying the wafer edge. Conventional methods use visual edge detection, but irregularities or damage at the wafer edge can lead to low accuracy in this method. Therefore, a wafer marking device is proposed to address this issue. Summary of the Invention

[0004] In order to overcome the shortcomings of the prior art and solve at least one of the technical problems mentioned in the background art, this utility model proposes a wafer marking device.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: The wafer marking device of this utility model includes a first base, on which a transfer stage, an upper laser component and an upper identification component are arranged. The upper laser component includes a laser generator, and the output end of the laser generator is connected to a galvanometer. A field lens is connected below the galvanometer and faces the transfer stage. The upper identification component includes a movable code reading component and a laser sensor, and the code reading component and the laser sensor face the transfer stage.

[0006] Preferably, the upper laser assembly further includes a lifting platform assembly fixedly mounted on the first base, the laser generator can slide up and down along the lifting platform assembly, a laser mounting plate is slidably connected to the lifting platform assembly, the laser mounting plate is fixedly connected to the laser generator, and a sensing baffle is provided on the laser mounting plate.

[0007] Preferably, the lifting platform assembly is equipped with a lifting motor for driving the laser mounting plate to move.

[0008] Preferably, the lifting platform assembly is provided with multiple photoelectric sensors along the sliding direction of the laser mounting plate. The photoelectric sensors are slot-shaped sensors, and the multiple photoelectric sensors are a limit sensor A, a positioning sensor and a limit sensor B arranged sequentially from bottom to top.

[0009] Preferably, the upper identification component includes a fixed rod fixedly connected to the first base, a cylinder fixing plate fixedly installed on the fixed rod, a slide cylinder fixedly installed on the cylinder fixing plate, a cylinder follower plate installed on the slide cylinder, a fixing plate fixedly installed on the cylinder follower plate, and the code reading component and the laser sensor are installed on the fixing plate.

[0010] Preferably, the fixing plate is also provided with an arc-shaped groove, through which the reading direction of the code reading component can be adjusted, and the laser sensor can be adjusted up and down along the fixing plate.

[0011] Preferably, a second base is provided below the first base, and a lower laser component is provided on the second base. The optical axis of the emitted light from the lower laser component coincides with that of the upper laser component. A through hole is provided on the first base, located below the upper laser component and above the lower laser component. A lower identification component is also provided on the first base.

[0012] Preferably, the transfer stage includes a transfer stage surface and a movable adsorption stage surface. The transfer stage surface has an elongated through hole, and the adsorption stage surface can drive the wafer to reciprocate along the elongated through hole surface.

[0013] Preferably, the first base is further provided with an anti-static component and a dust collection component. The dust collection component includes a mounting plate fixed on the first base and a dust collection pipe fixed on the mounting plate. The opening of the dust collection pipe corresponds to the edge of the wafer.

[0014] The beneficial effects of this utility model are: This invention provides a wafer marking device that uses a laser sensor for wafer edge finding. Compared with visual edge finding, it has higher positioning accuracy and can ensure the accuracy and consistency of the marking position. The edge finding speed can usually reach the millisecond level, which can meet the requirements of high-speed production lines and improve production efficiency. At the same time, it has strong anti-interference ability, can adapt to different lighting conditions and environmental noise, and can work stably in complex industrial environments. By combining laser sensors with slide cylinders, laser sensors can be adapted to edge finding on wafers of different sizes. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0016] In the attached diagram: Figure 1 This is a schematic diagram of the structure of the first base in this utility model; Figure 2 This is a schematic diagram of the structure of the lower identification component in this utility model; Figure 3 This is a structural schematic diagram of the lifting platform assembly in this utility model; Figure 4 This is a schematic diagram of the structure of the fixing rod in this utility model; Figure 5 This is a schematic diagram of the transfer stage in this utility model; Figure 6 This is a schematic diagram of the vacuum tube in this utility model.

[0017] Legend: 1. First base; 2. Transfer stage; 3. Upper laser assembly; 4. Upper recognition assembly; 5. Second base; 6. Lower laser assembly; 7. Lower recognition assembly; 8. Antistatic assembly; 9. Dust collection assembly; 10. Mounting plate; 11. Dust collection pipe; 12. Lifting platform assembly; 13. Laser generator; 14. Galvanometer; 15. Field lens; 16. Laser mounting plate; 17. Limit sensor A; 18. Positioning sensor; 19. Limit sensor B; 20. Fixing rod; 21. Cylinder fixing plate; 22. Slide cylinder; 23. Cylinder follower plate; 24. Fixing plate; 25. Code reading assembly; 26. Laser sensor; 27. Transfer platform; 28. Adsorption platform; 29. ​​Induction baffle; 30. Lifting motor. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0019] Specific implementation examples are given below.

[0020] Please see Figures 1-6This utility model provides a wafer marking device, including a first base 1, on which a transfer stage 2, an upper laser component 3, an upper identification component 4 and a lower identification component 7 are sequentially arranged. A second base 5 is arranged below the first base 1, on which a lower laser component 6 is arranged. An antistatic component 8 and a dust collection component 9 are also arranged on the first base 1. The dust collection component 9 includes a mounting plate 10 fixed on the first base 1 and a dust collection pipe 11 fixed on the mounting plate 10. One end of the dust collection pipe 11 corresponds to the edge of the wafer, and the other end is connected to a dust collection device. The upper laser component 3 and the lower laser component 6 have the same structure. The transfer stage 2 includes a transfer stage surface 27 and a movable adsorption stage surface 28. The lower laser component 6 and the lower recognition component 7 can mark both the upper and lower sides of the wafer. The lower laser component 6 is located on the second base 5. The optical axis of the emitted light from the lower laser component 6 coincides with that of the upper laser component 3. Furthermore, the first base 1 has through holes located below the upper laser component 3 and above the lower laser component 6 to facilitate the operation of the lower laser component 6. An antistatic component 8 and a dust collection component 9 are also provided on the first base 1. The antistatic component 8 uses an ion fan with the air outlet facing the wafer position on the transfer stage 2 to eliminate static electricity on the wafer surface; the dust collection component 9 includes a mounting plate 10 fixed on the first base 1 and a dust collection pipe 11 fixed on the mounting plate 10. One end of the dust collection pipe 11 faces the edge of the wafer, and the other end is connected to a dust collection device. The dust collection device is a mature existing technology and will not be described in detail in this paper.

[0021] Furthermore, the upper laser assembly 3 includes a lifting platform assembly 12 fixedly mounted on the first base 1. A laser generator 13 is mounted on the lifting platform assembly 12. A galvanometer 14 is connected to the output end of the laser generator 13. A field lens 15 is connected below the galvanometer 14 and faces the transfer stage 2. The laser generator 13 can slide up and down along the lifting platform assembly 12. A laser mounting plate 16 is slidably connected to the lifting platform assembly 12 and is fixedly connected to the laser generator 13. The upper laser assembly 3 includes a laser generator 13, a galvanometer 14, and a field lens 15. The laser generator 13 is fixedly mounted on the lifting platform assembly 12 on the first base 1 and can slide up and down along the lifting platform assembly 12. The output end of the laser generator 13 is connected to the galvanometer 14, and the field lens 15 is connected below the galvanometer 14, with the field lens 15 facing downward.

[0022] The laser generator 13 is mounted on the laser mounting plate 16, which is slidably connected to the lifting platform assembly 12. A photoelectric sensor assembly is provided on the lifting platform assembly 12 along the sliding direction of the laser mounting plate 16, and a corresponding sensing baffle 29 is mounted on the laser mounting plate 16. The photoelectric sensors are slot-shaped sensors, consisting of a limit sensor A17, a positioning sensor 18, and a limit sensor B19, arranged from bottom to top. Limit sensors A17 and B19 serve as extreme limit switches. When either limit sensor A17 or B19 detects the sensing baffle 29, the lifting motor 30 stops operating. The positioning sensor 18 represents the zero position of the lifting motor 30, providing a reference for precise positioning of the lifting motor 30 and ensuring accurate vertical movement of the laser generator 13.

[0023] The structure of the lower laser assembly 6 is the same as that of the upper laser assembly 3, and the field mirror of the lower laser assembly 6 faces upward toward the transfer stage 2.

[0024] Furthermore, the lifting platform assembly 12 is provided with multiple photoelectric sensors along the sliding direction of the laser mounting plate 16. The photoelectric sensors are slot-shaped sensors, and the multiple photoelectric sensors are limit sensor A17, positioning sensor 18 and limit sensor B19 arranged sequentially from bottom to top.

[0025] Furthermore, the upper identification component 4 includes a fixing rod 20 fixedly connected to the first base 1. A cylinder fixing plate 21 is fixedly mounted on the fixing rod 20. A slide cylinder 22 is fixedly mounted on the cylinder fixing plate 21. A cylinder follower plate 23 is mounted on the slide cylinder 22. A fixing plate 24 is fixedly mounted on the cylinder follower plate 23. A code reading component 25 and a laser sensor 26 are sequentially mounted on the fixing plate 24. The code reading component 25 is used to read wafer surface or edge marking information, and the laser sensor 26 is used to detect the wafer edge position. The lower identification component 7, excluding the laser sensor 26, has the same structure as the upper identification component 4.

[0026] Furthermore, the fixing plate 24 is also provided with an arc-shaped groove, through which the reading direction of the code reading component 25 can be adjusted, and the laser sensor 26 can be adjusted up and down along the fixing plate 24. The upper identification component 4 includes a movable code reading component 25 and a laser sensor 26. The code reading component 25 is used to read wafer surface or edge marking information, and the laser sensor 26 is used to detect the wafer edge position. The code reading component 25 and the laser sensor 26 are mounted on the cylinder follower plate 23 of the slide cylinder 22. The code reading component 25 is connected to the cylinder follower plate 23 through a fixing plate 24. The fixing plate 24 also has an arc-shaped groove to adjust the code reading direction of the code reading component 25. The laser sensor 26 is connected to the fixing plate 24 and can also be adjusted in height. The slide cylinder 22 is fixedly mounted on two fixing rods 20 through a cylinder fixing plate 21. The fixing rods 20 are fixedly connected to the first base 1.

[0027] The lower recognition component 7 is basically the same as the upper recognition component 4 except that it does not have the laser sensor 26.

[0028] Furthermore, the transfer stage 27 has an elongated through hole, and the adsorption stage 28 can drive the wafer to move back and forth along the elongated through hole. The transfer stage 2 includes a transfer stage 27 and a movable adsorption stage 28. The transfer stage 27 has an elongated through-hole, and the adsorption stage 28 can drive the wafer to move back and forth along the elongated through-hole.

[0029] Workflow: Adjust the position of laser sensor 26 according to the wafer size; The wafer is placed on the adsorption platform 28 of the transfer stage 2 and fixed by adsorption; The adsorption platform 28 drives the wafer to move upward in the direction of the identification component 4; When the laser sensor 26 detects the wafer, the adsorption platform 28 stops moving. The code reader component 25 reads the marking information on the wafer surface; The upper laser assembly 3 and / or the lower laser assembly 6 mark the edge of the wafer.

[0030] In summary, using laser sensor 26 for wafer edge finding offers higher positioning accuracy compared to vision-based edge finding, ensuring the accuracy and consistency of marking positions. The edge finding speed can typically reach the millisecond level, meeting the requirements of high-speed production lines and improving production efficiency. It also has strong anti-interference capabilities, adapting to different lighting conditions and environmental noise, and can work stably in complex industrial environments. By using the laser sensor 26 in conjunction with the slide cylinder 22, the laser sensor 26 can be adapted to edge finding of wafers of different sizes.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A wafer marking device, comprising a first base (1), characterized in that: The first base (1) is provided with a transfer stage (2), an upper laser assembly (3) and an upper recognition assembly (4). The upper laser assembly (3) includes a laser generator (13). The output end of the laser generator (13) is connected to a galvanometer (14). A field lens (15) is connected below the galvanometer (14). The field lens (15) faces the transfer stage (2). The upper recognition assembly (4) includes a movable code reading assembly (25) and a laser sensor (26). The code reading assembly (25) and the laser sensor (26) face the transfer stage (2).

2. The wafer marking device according to claim 1, characterized in that: The upper laser assembly (3) also includes a lifting platform assembly (12) fixedly mounted on the first base (1). The laser generator (13) can slide up and down along the lifting platform assembly (12). A laser mounting plate (16) is slidably connected to the lifting platform assembly (12). The laser mounting plate (16) is fixedly connected to the laser generator (13). A sensing baffle (29) is provided on the laser mounting plate (16).

3. The wafer marking device according to claim 2, characterized in that: The lifting platform assembly (12) is provided with a lifting motor (30) for driving the laser mounting plate (16) to move.

4. The wafer marking device according to claim 2, characterized in that: The lifting platform assembly (12) is provided with multiple photoelectric sensors along the sliding direction of the laser mounting plate (16). The photoelectric sensors are slot-shaped sensors, and the multiple photoelectric sensors are limit sensor A (17), positioning sensor (18) and limit sensor B (19) arranged sequentially from bottom to top.

5. The wafer marking device according to claim 1, characterized in that: The upper identification component (4) includes a fixed rod (20) fixedly connected to the first base (1), a cylinder fixing plate (21) fixedly installed on the fixed rod (20), a slide cylinder (22) fixedly installed on the cylinder fixing plate (21), a cylinder follower plate (23) installed on the slide cylinder (22), a fixing plate (24) fixedly installed on the cylinder follower plate (23), and the code reading component (25) and the laser sensor (26) are installed on the fixing plate (24).

6. A wafer marking apparatus according to claim 5, characterized in that: The fixing plate (24) is also provided with an arc-shaped groove, through which the reading direction of the code reading component (25) can be adjusted, and the laser sensor (26) can be adjusted up and down along the fixing plate (24).

7. The wafer marking apparatus according to claim 1, characterized in that: A second base (5) is provided below the first base (1), and a lower laser component (6) is provided on the second base (5). The optical axis of the emitted light from the lower laser component (6) coincides with that of the upper laser component (3). A through hole is provided on the first base (1) below the upper laser component (3) and above the lower laser component (6). A lower identification component (7) is also provided on the first base (1).

8. A wafer marking apparatus according to any one of claims 1-7, characterized in that: The transfer stage (2) includes a transfer stage (27) and a movable adsorption stage (28). The transfer stage (27) has an elongated through hole, and the adsorption stage (28) can drive the wafer to move back and forth along the elongated through hole.

9. A wafer marking apparatus according to claim 8, characterized in that: The first base (1) is also provided with an antistatic component (8) and a dust collection component (9). The dust collection component (9) includes a mounting plate (10) fixed on the first base (1) and a dust collection pipe (11) fixed on the mounting plate (10). The opening of the dust collection pipe (11) corresponds to the edge of the wafer.

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