Conductor wire polishing precision adjusting device
Patent Information
- Application Number
- CN202522276380.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-28
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-28
AI Technical Summary
[0004]本实用新型的目的在于提供一种导体线材抛光精度调节装置,解决了在现有的导体线材在进行抛光时需要使用不同粗糙度的抛光砂轮,其更换操作复杂,无法精确进行调节的问题
本实用新型在安装板的上部设置有清扫机构且清扫机构的侧面设置有若干组抛光机构,清扫机构先行去除线材表面油污、氧化层等杂质(类似电解抛光预处理要求,为后续抛光提供洁净表面,避免杂质嵌入导致划伤,抛光机构包括设置在安装板内部的滑动槽,在安装板的表面设置有活动座且活动轴的侧面设置有固定座,在固定座的内部设置有轴承座且轴承座的内部设置有滑动连接的驱动轴,在驱动轴的表面设置有抛光辊且抛光辊的内部设置有若干组抛光槽,若干组抛光槽中设置有不同粗糙度的抛光颗粒,在安装板的底部设置有固定板且固定板的侧面设置有调节电机,在固定板之间设置有螺杆且螺杆与调节电机的动力输出端之间固定连接,在螺杆的表面设置有调节板且调节板与活动座之间固定连接,通过调节电机带动螺杆旋转,使与其螺纹连接的调节板带动活动轴在安装板表面移动,使驱动轴在轴承座内伸缩,从而调节抛光辊中抛光槽的位置,可以实现不同抛光精度的调节,同时若干组抛光机构的抛光辊呈上下交错设置,可以使线材的每一面都能够均匀抛光。
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Figure CN224795407U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wire polishing technology, and more specifically to a device for adjusting the polishing precision of conductor wires. Background Technology
[0002] Polishing conductor wires primarily aims to improve their surface quality. After polishing, the surface roughness of the wire is significantly reduced, becoming smooth and flat. This not only enhances the wire's aesthetic appeal, making it more attractive in various applications, but also significantly reduces surface defects such as scratches, burrs, and oxide layers. This reduces current transmission obstacles caused by surface issues, improves the conductor's conductivity, and reduces energy loss. Simultaneously, a smooth surface helps improve the contact quality between the wire and other materials, enhancing the stability and reliability of the connection, playing a crucial role in key areas such as electronic device connections and power transmission.
[0003] Currently, polishing conductor wires requires the use of polishing wheels with different roughnesses, and the replacement process is complex and cannot be precisely adjusted. Therefore, a new technical solution is needed to address this issue. Summary of the Invention
[0004] The purpose of this invention is to provide a device for adjusting the polishing precision of conductor wires, which solves the problem that existing conductor wire polishing requires the use of polishing wheels with different roughnesses, and the replacement operation is complicated and cannot be precisely adjusted.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a conductor wire polishing precision adjustment device, comprising: a mounting plate, a cleaning mechanism on the upper part of the mounting plate and a plurality of polishing mechanisms on the side of the cleaning mechanism, the polishing mechanism including a sliding groove disposed inside the mounting plate, a movable seat disposed on the surface of the mounting plate and a fixed seat disposed on the side of the movable shaft, a bearing seat disposed inside the fixed seat and a drive shaft slidably connected inside the bearing seat, a polishing roller disposed on the surface of the drive shaft and a plurality of polishing grooves disposed inside the polishing roller, polishing particles of different roughness disposed in the plurality of polishing grooves, a driver disposed on the surface of the movable seat and the power output end of the driver being connected to the drive shaft, a fixed plate disposed at the bottom of the mounting plate and an adjusting motor disposed on the side of the fixed plate, a screw disposed between the fixed plates and the screw being fixedly connected to the power output end of the adjusting motor, an adjusting plate disposed on the surface of the screw and the adjusting plate extending into the sliding groove and fixedly connected to the movable seat.
[0006] In a preferred embodiment of this utility model, the cleaning mechanism includes a telescopic column slidably connected to a mounting plate, and a connecting plate is provided at the lower part of the telescopic column. A spring column is provided between the telescopic column and the connecting plate. A bracket is provided at the bottom of the mounting plate, and a drive motor is provided on the inner side of the bracket. An eccentric wheel is provided at the power output end of the drive motor. A movable frame is provided at the upper part of the telescopic column, and a connecting shaft is provided on the inner side of the movable frame. A cleaning roller is provided on the surface of the connecting shaft, and the cleaning roller is rotatably connected to the movable frame through the connecting shaft. A power mechanism is provided at the top of the movable frame, and the output end of the power mechanism is connected to the connecting shaft.
[0007] In a preferred embodiment of the present invention, a connecting block is provided on the side of the movable frame and a sliding rod is provided on the surface of the mounting plate. The connecting block is sleeved on the surface of the sliding rod and slidably connected to it.
[0008] In a preferred embodiment of the present invention, a limiting plate is provided on the surface of the telescopic column, and the limiting plate is fixedly connected to the telescopic column and located on the surface of the mounting plate.
[0009] In a preferred embodiment of this utility model, the surface of the mounting plate is provided with a slide rail and the movable seat is connected to the slide rail.
[0010] In a preferred embodiment of this utility model, the polishing rollers of several polishing mechanisms are arranged in an alternating vertical arrangement.
[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention features a cleaning mechanism on the upper part of a mounting plate, and several polishing mechanisms on the sides of the cleaning mechanism. The cleaning mechanism first removes oil stains, oxide layers, and other impurities from the wire surface (similar to the pretreatment requirements of electrolytic polishing, providing a clean surface for subsequent polishing and preventing impurities from embedding and causing scratches). The polishing mechanism includes a sliding groove inside the mounting plate, a movable seat on the surface of the mounting plate, a fixed seat on the side of the movable shaft, a bearing seat inside the fixed seat, and a slidably connected drive shaft inside the bearing seat. A polishing roller is mounted on the surface of the drive shaft, and several polishing grooves are provided inside the polishing roller. The polishing grooves are equipped with various polishing mechanisms. Polishing particles of the same roughness are used. A fixed plate is set at the bottom of the mounting plate, and an adjusting motor is set on the side of the fixed plate. A screw is set between the fixed plates and is fixedly connected to the power output end of the adjusting motor. An adjusting plate is set on the surface of the screw and is fixedly connected to the movable seat. The adjusting motor drives the screw to rotate, which causes the adjusting plate threaded to it to drive the movable shaft to move on the surface of the mounting plate. This causes the drive shaft to extend and retract within the bearing seat, thereby adjusting the position of the polishing groove in the polishing roller. Different polishing precisions can be adjusted. At the same time, the polishing rollers of several sets of polishing mechanisms are arranged in an alternating pattern to ensure that every side of the wire can be polished evenly. Attached Figure Description
[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the cleaning mechanism of this utility model; Figure 3 This is a side view of the structure of this utility model; Figure 4 This is a schematic diagram of the polishing mechanism of this utility model.
[0013] In the diagram: 1. Mounting plate; 2. Cleaning mechanism; 3. Polishing mechanism; 4. Telescopic column; 5. Spring column; 6. Connecting plate; 7. Limiting plate; 8. Movable frame; 9. Connecting block; 10. Sliding rod; 11. Connecting shaft; 12. Power mechanism; 13. Cleaning roller; 14. Eccentric wheel; 15. Bracket; 16. Drive motor; 17. Sliding groove; 18. Movable seat; 19. Adjusting plate; 20. Fixed plate; 21. Adjusting motor; 22. Screw; 23. Slide rail; 24. Driver; 25. Drive shaft; 26. Polishing roller; 27. Polishing groove; 28. Fixed seat; 29. Bearing seat. Detailed Implementation
[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0015] Please see Figure 1-4This utility model provides a technical solution: a conductor wire polishing precision adjustment device, comprising: a mounting plate 1, a cleaning mechanism 2 disposed on the upper part of the mounting plate 1, and a plurality of polishing mechanisms 3 disposed on the side of the cleaning mechanism 2, the polishing mechanism 3 including a sliding groove 17 disposed inside the mounting plate 1, a movable seat 18 disposed on the surface of the mounting plate 1, and a fixed seat 28 disposed on the side of the movable shaft, a bearing seat 29 disposed inside the fixed seat 28, and a slidably connected drive shaft 25 disposed inside the bearing seat 29, a polishing roller 26 disposed on the surface of the drive shaft 25, and a plurality of polishing grooves 27 disposed inside the polishing roller 26, wherein the plurality of polishing grooves 27 are arranged in the plurality of polishing grooves 27. The mounting plate 1 is equipped with polishing particles of different roughness. A driver 24 is mounted on the surface of the movable seat 18, and the power output end of the driver 24 is connected to the drive shaft 25. A fixed plate 20 is mounted on the bottom of the mounting plate 1, and an adjusting motor 21 is mounted on the side of the fixed plate 20. A screw 22 is mounted between the fixed plates 20, and the screw 22 is fixedly connected to the power output end of the adjusting motor 21. An adjusting plate 19 is mounted on the surface of the screw 22, extending into the sliding groove 17 and fixedly connected to the movable seat 18. A cleaning mechanism 2 is mounted on the upper part of the mounting plate 1, and several sets of polishing mechanisms 3 are mounted on the side of the cleaning mechanism 2. The cleaning mechanism 2 first... To remove impurities such as oil and oxide layers from the wire surface (similar to the requirements of electrolytic polishing pretreatment, providing a clean surface for subsequent polishing and preventing impurities from embedding and causing scratches), the polishing mechanism 3 includes a sliding groove 17 set inside the mounting plate 1. A movable seat 18 is set on the surface of the mounting plate 1, and a fixed seat 28 is set on the side of the movable shaft. A bearing seat 29 is set inside the fixed seat 28, and a drive shaft 25 is slidably connected inside the bearing seat 29. A polishing roller 26 is set on the surface of the drive shaft 25, and several sets of polishing grooves 27 are set inside the polishing roller 26. Polishing particles of different roughness are set in the several sets of polishing grooves 27. A fixed plate 20 is set at the bottom of the mounting plate 1 and fixed... An adjusting motor 21 is provided on the side of the plate 20. A screw 22 is provided between the fixed plates 20 and is fixedly connected to the power output end of the adjusting motor 21. An adjusting plate 19 is provided on the surface of the screw 22 and is fixedly connected to the movable seat 18. The adjusting motor 21 drives the screw 22 to rotate, which causes the adjusting plate 19, which is threaded to it, to move the movable shaft on the surface of the mounting plate 1. This causes the drive shaft 25 to extend and retract within the bearing seat 29, thereby adjusting the position of the polishing groove 27 in the polishing roller 26. This allows for the adjustment of different polishing precisions. At the same time, the polishing rollers 26 of several sets of polishing mechanisms 3 are arranged in an alternating pattern, which can ensure that each side of the wire is polished evenly.
[0016] Further improvements, such as Figure 2As shown: The cleaning mechanism 2 includes a telescopic column 4 slidably connected to the mounting plate 1, and a connecting plate 6 is provided at the lower part of the telescopic column 4. A spring column 5 is provided between the telescopic column 4 and the connecting plate 6. A bracket 15 is provided at the bottom of the mounting plate 1, and a drive motor 16 is provided on the inner side of the bracket 15. An eccentric wheel 14 is provided at the power output end of the drive motor 16. A movable frame 8 is provided at the upper part of the telescopic column 4, and a connecting shaft 11 is provided on the inner side of the movable frame 8. A cleaning roller 13 is provided on the surface of the connecting shaft 11, and the cleaning roller 13 passes through the connecting shaft 1. The telescopic column 4 is rotatably connected to the movable frame 8. The top of the movable frame 8 is provided with a power mechanism 12, and the output end of the power mechanism 12 is connected to the connecting shaft 11. The eccentric wheel 14 is driven to rotate by the drive motor 16. With the elastic action of the spring column 5, the telescopic column 4 moves up and down. The power mechanism 12 drives the cleaning roller 13 of the connecting shaft 11 to rotate. The continuously moving up and down rotating cleaning roller 13 can improve the cleaning effect, remove oil stains, oxide layers and other impurities from the surface of the wire more thoroughly, provide a clean surface for subsequent polishing, and avoid impurities from embedding and causing scratches.
[0017] Further improvements, such as Figure 2 As shown: The movable frame 8 is provided with a connecting block 9 on its side and a sliding rod 10 is provided on the surface of the mounting plate 1. The connecting block 9 is sleeved on the surface of the sliding rod 10 and slidably connected to it. The cooperation between the sliding rod 10 and the connecting block 9 provides a stable sliding track for the movable frame 8, ensuring that the sweeping roller 13 moves smoothly and avoiding the impact of shaking or deviation on the sweeping quality, thereby improving the stability and reliability of the equipment.
[0018] Further improvements, such as Figure 2 As shown: The surface of the telescopic column 4 is provided with a limiting plate 7, and the limiting plate 7 is fixedly connected to the telescopic column 4 and located on the surface of the mounting plate 1. The setting of the limiting plate 7 effectively restricts the vertical movement range of the telescopic column 4, prevents the cleaning roller 13 from damaging the wire surface due to excessive downward pressure, and also avoids collision between the cleaning roller 13 and the mounting plate 1, protecting the equipment from damage and extending the service life of the equipment.
[0019] Further improvements, such as Figure 4 As shown: The surface of the mounting plate 1 is provided with a slide rail 23 and the movable seat 18 is connected to the slide rail 23. The slide rail 23 makes the movable seat 18 more stable and precise during movement, reduces the error caused by friction or shaking, improves the accuracy of polishing precision adjustment, and ensures that each side of the wire can be polished evenly.
[0020] Further improvements, such as Figure 4As shown: The polishing rollers 26 of several polishing mechanisms 3 are arranged in an alternating manner. The alternating arrangement of the polishing rollers 26 can ensure that each side of the wire can fully contact the polishing roller 26 when passing through the polishing area, so as to achieve uniform polishing in all directions, avoid the difference in wire surface quality caused by uneven polishing, and improve the overall polishing effect of the wire.
[0021] Working Principle: The conductor wire to be polished is fed into the equipment through the inlet and first passes through the cleaning mechanism 2. The drive motor 16 in the cleaning mechanism 2 drives the eccentric wheel 14 to rotate. The eccentric wheel 14 acts on the telescopic column 4 through the spring column 5, causing the cleaning roller 13 to move up and down. At the same time, the power mechanism 12 drives the cleaning roller 13 to rotate, performing all-round cleaning of the wire surface. Through the combined action of up-and-down movement and rotation, oil stains, oxide layers and other impurities on the wire surface are effectively removed, providing a clean surface condition for subsequent polishing and avoiding scratches caused by impurities embedding during the polishing process. According to the required polishing precision, the adjusting motor 21 is started. The adjusting motor 21 drives the screw 22 to rotate, and the adjusting plate 19 on the screw 22 moves accordingly, thereby causing the movable seat 18 to slide in the sliding groove 17. The movement of the movable seat 18 causes the drive shaft 25 to extend and retract in the bearing seat 29, thereby adjusting the position of the polishing groove 27 in the polishing roller 26. Because the polishing tank 27 contains polishing particles of varying roughness, the polishing precision can be adjusted by changing its position. This is achieved through motor drive and screw 22 transmission, enabling precise adjustment of the polishing precision without the need to replace polishing wheels of different roughness, simplifying the operation and improving production efficiency. Simultaneously, the use of polishing particles of varying roughness allows the equipment to adapt to different polishing needs, enhancing its flexibility and applicability. The cleaned wire continues to move forward into the polishing area. Several sets of polishing rollers 26 in the polishing mechanism 3 are arranged in a staggered pattern, ensuring that each surface of the wire makes full contact with the polishing rollers 26 as it passes through. The driver 24 drives the polishing rollers 26 to rotate, polishing the wire surface. The staggered arrangement of the polishing rollers 26 ensures uniform polishing of the wire from all directions, avoiding surface quality differences caused by uneven polishing. Simultaneously, the rotating polishing rollers 26 generate sufficient friction to effectively remove minor protrusions and burrs from the wire surface, making the surface smoother and improving the overall polishing effect.
[0022] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0023] Finally, the following points should be noted: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection", and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. "Up", "down", "left", "right", etc., are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may change.
[0024] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A device for adjusting the polishing precision of conductor wires, characterized in that: include: Mounting plate (1), the upper part of which is provided with a cleaning mechanism (2) and the side of which is provided with several sets of polishing mechanisms (3), the polishing mechanism (3) includes a sliding groove (17) provided inside the mounting plate (1), the surface of which is provided with a movable seat (18) and the side of which is provided with a fixed seat (28), the fixed seat (28) is provided with a bearing seat (29) inside the fixed seat (28) and the bearing seat (29) is provided with a slidably connected drive shaft (25), the surface of which is provided with a polishing roller (26) and the polishing roller (26) is provided with several sets of polishing grooves (27), the several sets of polishing grooves (27) are provided inside the polishing roller (26 ... polishing roller (26) is provided with a cleaning mechanism (2) and the side of which is provided with a cleaning mechanism (27), the polishing mechanism (3) includes a sliding groove (17) provided inside the mounting plate (1), the surface of which is provided with a movable seat (18) and the side of which is provided with a fixed seat (28), the fixed seat (28) is provided with a bearing seat (29) and the side of which is provided with a sliding groove (27), the several sets of polishing grooves (28) The polishing groove (27) is provided with polishing particles of different roughness. The surface of the movable seat (18) is provided with a driver (24) and the power output end of the driver (24) is connected to the drive shaft (25). The bottom of the mounting plate (1) is provided with a fixed plate (20) and the side of the fixed plate (20) is provided with an adjusting motor (21). The fixed plates (20) are provided with a screw (22) and the screw (22) is fixedly connected to the power output end of the adjusting motor (21). The surface of the screw (22) is provided with an adjusting plate (19) and the adjusting plate (19) extends into the interior of the sliding groove (17) and is fixedly connected to the movable seat (18).
2. The conductor wire polishing precision adjustment device according to claim 1, characterized in that: The cleaning mechanism (2) includes a telescopic column (4) slidably connected to the mounting plate (1) and a connecting plate (6) is provided at the lower part of the telescopic column (4). A spring column (5) is provided between the telescopic column (4) and the connecting plate (6). A bracket (15) is provided at the bottom of the mounting plate (1) and a drive motor (16) is provided on the inner side of the bracket (15). An eccentric wheel (14) is provided at the power output end of the drive motor (16). A movable frame (8) is provided at the upper part of the telescopic column (4) and a connecting shaft (11) is provided on the inner side of the movable frame (8). A cleaning roller (13) is provided on the surface of the connecting shaft (11) and the cleaning roller (13) is rotatably connected to the movable frame (8) through the connecting shaft (11). A power mechanism (12) is provided at the top of the movable frame (8) and the output end of the power mechanism (12) is connected to the connecting shaft (11).
3. The conductor wire polishing precision adjustment device according to claim 2, characterized in that: The movable frame (8) has a connecting block (9) on its side and a sliding rod (10) on the surface of the mounting plate (1). The connecting block (9) is sleeved on the surface of the sliding rod (10) and slidably connected to it.
4. The conductor wire polishing precision adjustment device according to claim 2, characterized in that: The surface of the telescopic column (4) is provided with a limiting plate (7), and the limiting plate (7) is fixedly connected to the telescopic column (4) and located on the surface of the mounting plate (1).
5. The conductor wire polishing precision adjustment device according to claim 1, characterized in that: The surface of the mounting plate (1) is provided with a slide rail (23), and the movable seat (18) is connected to the slide rail (23).
6. The conductor wire polishing precision adjustment device according to claim 1, characterized in that: The polishing rollers (26) of several polishing mechanisms (3) are arranged in an alternating pattern.