Wafer polishing solution temperature control device

Abstract

The utility model relates to the field of wafer polishing discloses a wafer polishing liquid temperature control device, including water -cooled machine, cooling pipe, fixed establishment and buffer mechanism. Fixed establishment includes fixed buckle, motion buckle and quick -mounting assembly, quick -mounting assembly includes the support base of fixed connection in motion buckle, the handle of rotation connection through pivot, the protruding block of fixed in handle to the bayonet ring of slidable, handle drive protruding block, make the bayonet ring with the card slot formed on fixed buckle card or separate, realize quick locking. Buffer mechanism includes the shell of fixed in water -cooled machine, the fixed plate of slidable in shell and bear fixed establishment, and the spring of being located between shell and fixed plate. The utility model discloses quick -mounting assembly realizes quick fixing, and the maintenance efficiency has been improved, through buffer mechanism effectively isolates and absorbs the vibration, has protected the pipeline, has improved the polishing accuracy and operating stability.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing, and in particular to a wafer polishing fluid temperature control device. Background Technology

[0002] In wafer polishing processes, coolant temperature control devices are crucial for ensuring processing accuracy and stability. Typically, these devices are connected to cooling pipes via water chillers to provide a constant-temperature cooling medium (polishing fluid) to the polishing equipment.

[0003] However, wafer polishing is a high-precision, micron-level process that requires extremely stable operating environments. Existing coolant temperature control devices, particularly water chillers, generate continuous mechanical vibrations from their internal compressors and water pumps during operation. This vibration is transmitted directly to the precision polishing equipment through rigidly connected cooling pipes, interfering with the stability of the polishing head and consequently affecting the flatness of the wafer surface and the overall processing quality.

[0004] Furthermore, wafer manufacturing, as a highly efficient production environment, places high demands on the ease of equipment maintenance. When it's necessary to inspect or replace cooling pipes, existing equipment often uses traditional methods like bolt fastening or pipe clamping to secure the pipes. This method is cumbersome, requiring specialized tools and time-consuming disassembly and assembly, leading to excessive downtime for equipment maintenance and reducing the overall efficiency of the production line.

[0005] In summary, existing cooling devices, when applied to the specific scenario of wafer polishing, generally suffer from insufficient vibration isolation measures and low efficiency in fixed pipeline operation, making it difficult to simultaneously meet the stability required for high-precision processing and the convenience required for high-efficiency production. Therefore, this utility model proposes a wafer polishing fluid temperature control device to address the shortcomings of existing technologies. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a wafer polishing slurry temperature control device, which aims to improve the problem of cumbersome and time-consuming operation of fixing the cooling pipe in some existing wafer polishing slurry temperature control devices.

[0007] This utility model provides a wafer polishing fluid temperature control device, including a water chiller, a cooling pipe to be fixed, a fixing mechanism for clamping and fixing the cooling pipe, and a buffer mechanism that isolates and connects the fixing mechanism to the water chiller.

[0008] The fixing mechanism includes a fixing buckle and a moving buckle that cooperate to clamp the cooling pipe, and the fixing mechanism also includes a quick-locking component for quickly locking or unlocking the fixing buckle and the moving buckle.

[0009] The quick-fix assembly includes a support base fixedly connected to the motion buckle, a handle rotatably connected to the support base via a pivot, a protrusion fixed to the handle and rotating therewith, and a locking ring slidably fitted onto the outside of the motion buckle; the protrusion is used to drive the locking ring, so that the locking ring engages or disengages with a slot formed on the fixed buckle.

[0010] The buffer mechanism includes a housing fixedly connected to the outside of the water chiller, a fixing plate that can slide up and down inside the housing and is used to support the fixing mechanism, and a spring for absorbing vibration.

[0011] Preferably, the buffer mechanism further includes a top plate fixed inside the housing and an inner column connected to the fixed plate; the inner column passes through the top plate, a spring is sleeved on the outer periphery of the inner column, and the two ends of the spring abut against the top plate and the fixed plate respectively, for compression and reset when the fixed plate slides.

[0012] Preferably, the buffer mechanism further includes an anti-detachment plate disposed on the inner wall of the housing, the anti-detachment plate limiting the sliding stroke of the fixed plate and preventing the fixed plate from tilting during the sliding process.

[0013] Preferably, when the handle is lifted upwards, the handle drives the protrusion to force the latch ring to slide away from the slot, thereby unlocking; when the handle is pressed downwards, after the latch ring resets, the protrusion presses against the latch ring, keeping the latch ring engaged with the slot, thereby locking.

[0014] Preferably, the protrusion is fixedly connected to the bottom of the handle and abuts against the outer wall of the bayonet ring. The circular motion of the protrusion is converted into the linear sliding motion of the bayonet ring by the rotation of the handle.

[0015] Preferably, the spring is a spring assembly comprising a top spring and a bottom spring symmetrically arranged at the top and bottom of the fixed plate; when the fixed plate moves upward, the top spring is compressed and the bottom spring is stretched; when the fixed plate moves downward, the top spring is stretched and the bottom spring is compressed.

[0016] Preferably, the inner walls of both the fixed buckle and the moving buckle are provided with arc-shaped clamping grooves that are adapted to the outer surface of the cooling pipe, in order to increase the contact area and improve the clamping stability.

[0017] Preferably, the bottom of the fixed plate is also connected to a second top plate, and the bottom of the outer shell is also fixed to a second inner column. The springs are symmetrically arranged spring groups, which are respectively connected between the top plate and the second top plate to buffer bidirectional vibration.

[0018] This utility model has the following beneficial effects:

[0019] 1. This utility model solves the problems of cumbersome operation, tool dependence, and long time consumption in the fixing of cooling pipes in the prior art by setting up a quick-fixing component consisting of a handle, a protrusion, a bayonet ring, and a slot. It achieves the technical effect of quickly locking and unlocking the cooling pipe and improving the efficiency of installation and maintenance.

[0020] 2. This utility model, by setting up a buffer mechanism composed of components such as a shell, a fixing plate, a spring, an inner column, and a top plate, isolates the cooling pipe fixing mechanism from the water chiller, solving the problem in the prior art where the working vibration of the water chiller is directly transmitted to the cooling pipe, thus affecting the wafer polishing accuracy and easily causing pipe damage. It achieves the technical effect of effectively isolating and absorbing vibration, protecting the cooling pipe, and improving the operational stability of the device.

[0021] 3. This utility model combines the quick-setting component with the buffer mechanism, and the overall structure is reasonably designed. It solves the comprehensive problems of inconvenience and poor stability of existing cooling devices in the precision operation environment of wafer polishing. It achieves the technical effect of convenient operation and reliable operation, making it more suitable for high-precision and high-efficiency wafer polishing production lines. Attached Figure Description

[0022] Figure 1 This is a three-dimensional schematic diagram of a wafer polishing fluid temperature control device proposed in this utility model.

[0023] Figure 2 This is a schematic diagram of the cooling machine of the wafer polishing fluid temperature control device proposed in this utility model;

[0024] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0025] Figure 4 for Figure 2 Enlarged view of point B in the middle. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Example:

[0028] Reference Figures 1 to 4 This utility model provides a wafer polishing fluid temperature control device, which aims to solve the problems of cumbersome operation of fixing the cooling pipe 2 and the impact of water chiller 1 vibration on polishing accuracy in the prior art.

[0029] like Figure 1 and Figure 2 As shown, it includes a water chiller 1, a cooling pipe 2 to be fixed, a fixing mechanism 3, and a buffer mechanism 4. The fixing mechanism 3 is used to clamp and fix the cooling pipe 2. The buffer mechanism 4 isolates the fixing mechanism 3 from the water chiller 1. The buffer mechanism 4 is fixedly connected to the outside of the water chiller 1. The fixing mechanism 3 is installed on the buffer mechanism 4.

[0030] Reference Figure 4 An anti-detachment plate 42 is also provided on the inner wall of the outer casing 43. The anti-detachment plate 42 limits the sliding stroke of the fixing plate 41 and prevents the fixing plate 41 from tilting during the sliding process.

[0031] Reference Figure 3 The specific operation of the quick-fix component 33 is as follows: When the handle 333 is lifted upward, the handle 333 rotates around the pivot 332 and drives the protrusion 334. The protrusion 334 forces the bayonet ring 335 to slide away from the slot 336, thereby unlocking. When the handle 333 is pressed downward, after the bayonet ring is reset, the handle 333 drives the protrusion 334 to rotate. The protrusion 334 presses against the bayonet ring 335, keeping the bayonet ring 335 engaged with the slot 336, thereby locking. As a specific structural implementation, the protrusion 334 is fixedly connected to the bottom of the handle 333 and abuts against the outer wall of the bayonet ring 335. Through the rotation of the handle 333, the circular motion of the protrusion 334 is converted into the linear sliding motion of the bayonet ring 335.

[0032] Reference Figure 4 The spring 45 is actually a group of springs 45 including a top spring 45 and a bottom spring 45 symmetrically arranged at the top and bottom of the fixed plate 41. When the fixed plate 41 moves upward, the top spring 45 is compressed and the bottom spring 45 is stretched. When the fixed plate 41 moves downward, the top spring 45 is stretched and the bottom spring 45 is compressed.

[0033] Reference Figure 3 The inner walls of both the fixed buckle 31 and the moving buckle 32 are provided with arc-shaped clamping grooves that are adapted to the outer surface of the cooling pipe 2, and the cooling pipe 2 is clamped by the arc-shaped surface.

[0034] Reference Figure 4 The bottom of the fixed plate 41 is also connected to the second top plate 46, and the bottom of the outer shell 43 is also fixed to the second inner column 44. At this time, the springs 45 are symmetrically arranged groups of springs 45, which are respectively connected between the top plate 46 and the second top plate 46.

[0035] The implementation principle of this application embodiment is as follows: When it is necessary to fix the cooling pipe 2, the cooling pipe 2 is placed between the fixed buckle 31 and the moving buckle 32, and then the locking ring 335 is moved to align with the slot 336, and the handle 333 is pressed down; the handle 333 rotates around the pivot 332 fixed on the support base 331, and the protrusion 334 at the bottom of the handle 333 rotates accordingly, and applies pressure to the locking ring 335, so that the locking ring 335 is firmly engaged with the slot 336 on the fixed buckle 31; since the support base 331 is fixedly connected to the moving buckle 32, and the slot 336 is set on the fixed buckle 31, this engaging action realizes the quick locking of the moving buckle 32 and the fixed buckle 31; when it is necessary to loosen, the handle 333 is lifted up, the handle 333 drives the protrusion 334 to rotate in the opposite direction, the protrusion 334 drives the locking ring 335 to slide in a direction away from the slot 336, so that the locking ring 335 disengages from the slot 336, thereby releasing the lock.

[0036] When the water chiller 1 vibrates during operation, the outer casing 43, which is fixedly connected to the water chiller 1, vibrates accordingly. Since the fixing mechanism 3 is installed on the fixing plate 41, and the fixing plate 41 is isolated from the outer casing 43 by the spring 45, when the outer casing 43 moves upward, the fixing plate 41 slides downward relative to the inner casing 43, or due to inertial lag, the fixing plate 41 presses against the top plate 46 and the inner column 44, thereby compressing the spring 45, which absorbs the vibration energy. When the outer casing 43 moves downward, the spring 45 is compressed and then opens, pushing the fixing plate 41 to move in the opposite direction. The continuous compression and release of the spring 45 transforms the violent vibration transmitted by the water chiller 1 into the smooth movement of the fixing plate 41, and restricts its tilting by the anti-detachment plate 42.

Claims

1. A wafer polishing fluid temperature control device, comprising a water chiller, a cooling pipe to be fixed, a fixing mechanism for clamping and fixing the cooling pipe, and a buffer mechanism for isolating and connecting the fixing mechanism to the water chiller. Its features are, The fixing mechanism includes a fixing buckle and a moving buckle that cooperate to clamp the cooling pipe, and the fixing mechanism also includes a quick-locking component for quickly locking or unlocking the fixing buckle and the moving buckle; The quick-fixing assembly includes a support base fixedly connected to the moving buckle, a handle rotatably connected to the support base via a rotating shaft, a protrusion fixed to the handle and rotating with it, and a snap ring slidably sleeved on the outside of the moving buckle. The protrusion is used to drive the snap ring, so that the snap ring engages or disengages with a slot formed on the fixed buckle. The buffer mechanism includes a housing fixedly connected to the outside of the water chiller, a fixing plate that can slide up and down inside the housing and is used to support the fixing mechanism, and a spring for absorbing vibration.

2. The wafer polishing fluid temperature control device according to claim 1, characterized in that, The buffer mechanism further includes a top plate fixed inside the outer shell and an inner column connected to the fixed plate. The inner column passes through the top plate, and the spring is sleeved on the outer periphery of the inner column. The two ends of the spring abut against the top plate and the fixed plate respectively, for compression and reset when the fixed plate slides.

3. The wafer polishing fluid temperature control device according to claim 2, characterized in that, The buffer mechanism also includes an anti-detachment plate disposed on the inner wall of the housing. The anti-detachment plate limits the sliding stroke of the fixed plate and prevents the fixed plate from tilting during the sliding process.

4. The wafer polishing fluid temperature control device according to claim 1, characterized in that, When the handle is lifted upwards, the handle drives the protrusion to force the bayonet ring to slide away from the slot, thereby unlocking. When the handle is pressed downwards, after the bayonet ring resets, the protrusion presses against the bayonet ring, keeping the bayonet ring engaged with the slot, thereby locking.

5. The wafer polishing fluid temperature control device according to claim 1, characterized in that, The protrusion is fixedly connected to the bottom of the handle and abuts against the outer wall of the bayonet ring. The circular motion of the protrusion is converted into the linear sliding motion of the bayonet ring by the rotation of the handle.

6. The wafer polishing fluid temperature control device according to claim 1, characterized in that, The spring is actually a spring assembly comprising a top spring and a bottom spring symmetrically arranged at the top and bottom of the fixed plate. When the fixed plate moves upward, the top spring is compressed and the bottom spring is stretched. When the fixed plate moves downward, the top spring is stretched and the bottom spring is compressed.

7. The wafer polishing fluid temperature control device according to claim 1, characterized in that, The inner walls of both the fixed buckle and the moving buckle are provided with arc-shaped clamping grooves that are adapted to the outer surface of the cooling pipe, so as to increase the contact area and improve the clamping stability.

8. The wafer polishing fluid temperature control device according to claim 2, characterized in that, The bottom of the fixed plate is also connected to a second top plate, and the bottom of the outer shell is also fixed to a second inner column. The spring is a symmetrically arranged spring group, which is respectively connected between the top plate and the second top plate to buffer bidirectional vibration.

Images