Finger assembly and robot hand

Abstract

A finger assembly and a robot, wherein the finger assembly comprises a finger body provided with a relief gap and a plurality of positioning structures arranged on the finger body and located at the periphery of the relief gap, the plurality of positioning structures comprising sequentially arranged first positioning structures, second positioning structures and third positioning structures, the second positioning structures sharing a first circumference with the first positioning structures, the third positioning structures sharing a second circumference with the first positioning structures, the first positioning structures being used for adsorbing a workpiece, the second positioning structures being used for supporting and limiting the workpiece from slipping, and the third positioning structures being used for adsorbing the workpiece or for supporting and limiting the workpiece from slipping. Based on the relative position relationship among the plurality of positioning structures, the finger assembly can load workpieces of different sizes by the edges of the workpieces, thereby improving the compatibility of the finger assembly. Meanwhile, by cooperating the different positioning structures to adsorb and limit the workpiece from slipping, the anti-slipping ability of the finger assembly can be effectively improved, and the stability of the finger assembly in loading the workpiece can be enhanced.

Description

Technical Field

[0001] This application relates to the field of semiconductor process equipment technology, specifically to a finger assembly and a robotic hand. Background Technology

[0002] In semiconductor manufacturing processes, semiconductor workpieces such as wafers are typically automated and transferred between different system devices using robotic arms. For example, wafers can be carried by the finger components of a wafer transport robot, which can transfer wafers between the wafer loading system and the wafer pre-aligner, and between the wafer pre-aligner and the process equipment.

[0003] Among them, the finger assembly is a key component for the interaction between the robotic arm and semiconductor workpieces such as wafers. In actual use, because different types or sizes of wafers need to be processed, the robotic arm often needs to be equipped with different finger assemblies to adapt to the type or size of the wafer. For example, frame wafers and normal wafers have significant differences in shape and size, and different types of finger assemblies are usually used to support the two types of wafers respectively. Utility Model Content

[0004] The main technical problem addressed by this application is to provide a finger assembly and a robotic hand using the finger assembly, thereby improving the compatibility of the finger assembly to meet the usage requirements of different types of semiconductor workpieces.

[0005] According to a first aspect, one embodiment provides a finger assembly, comprising:

[0006] The finger itself has a clearance notch;

[0007] Multiple positioning structures are disposed on the finger body and located around the clearance notch. The multiple positioning structures include a first positioning structure, a second positioning structure, and a third positioning structure arranged sequentially along the length of the finger body. The second positioning structure and the first positioning structure share a first circumference, and the third positioning structure and the first positioning structure share a second circumference. The first positioning structure and the second positioning structure cooperate to fix a first workpiece of a first size to the finger body in a manner that covers the clearance notch. The first positioning structure, the second positioning structure, and the third positioning structure cooperate to fix a second workpiece of a second size to the finger body in a manner that covers the clearance notch.

[0008] Wherein, the first size is smaller than the second size, the first positioning structure is used to adsorb the first workpiece or the second workpiece, the second positioning structure is used to support and restrict the sliding of the first workpiece or the second workpiece relative to the finger body, and the third positioning structure is used to adsorb the second workpiece or to support and restrict the sliding of the second workpiece relative to the finger body.

[0009] In one embodiment, the finger body has a support portion, the support portion including a proximal end and a distal end relative to each other along the length direction, the avoidance notch is disposed on the support portion, and the opening of the avoidance notch faces the distal end side of the support portion; the positioning structure is disposed on the support portion, wherein the first positioning structure is disposed at the distal end of the support portion, and the third positioning structure is disposed at the proximal end of the support portion.

[0010] In one embodiment, the number of the first positioning structure, the second positioning structure, and the third positioning structure is set to two, and each of the two first positioning structures, the two second positioning structures, and the two third positioning structures is symmetrical about the centerline of the avoidance gap in the length direction;

[0011] The first positioning structure, the second positioning structure, and the third positioning structure, located on the same side of the clearance gap in the width direction, are arranged in a straight line, and the width direction is perpendicular to the length direction.

[0012] In one embodiment, in the length direction, the clearance notch extends from the middle position of the support portion toward the far end of the support portion, and the second positioning structure is located between the third positioning structure and the clearance notch.

[0013] In one embodiment, the second workpiece includes a frame wafer, the frame wafer including a wafer portion, a film portion surrounding the wafer portion, and a frame portion surrounding the film portion; in the length direction, the distance between the third positioning structure and the second positioning structure is greater than the width of the film portion, so that the third positioning structure corresponds to the frame portion and the second positioning structure corresponds to the wafer portion.

[0014] In one embodiment, the finger body further has a connecting portion connected to the proximal end of the support portion; the upper surface of the connecting portion is higher than the upper surface of the support portion to form a limiting step between the connecting portion and the support portion; the limiting step is used to abut against the side of the second workpiece to limit the position of the second workpiece on the support portion.

[0015] In one embodiment, the first positioning structure includes a vacuum suction cup, and the second and third positioning structures both include anti-slip pads; wherein the vacuum suction cup protrudes from the upper surface of the finger body to adsorb the first workpiece or the second workpiece; and the anti-slip pad protrudes from the upper surface of the finger body to support the first workpiece or the second workpiece.

[0016] Alternatively, both the first positioning structure and the third positioning structure may include a vacuum suction cup, and the second positioning structure may include the anti-slip pad; wherein, the vacuum suction cup protrudes from the upper surface of the finger body and is used to adsorb the first workpiece or the second workpiece; the anti-slip pad protrudes from the upper surface of the finger body and is used to support the first workpiece or the second workpiece; and the air path connected to the vacuum suction cup of the first positioning structure is independent of the air path connected to the vacuum suction cup of the third positioning structure.

[0017] In one embodiment, the finger assembly further includes an air passage cover plate, which covers and connects to the finger body, and a vacuum passage communicating with the vacuum suction cup is formed between the air passage cover plate and the finger body; in the length direction, the vacuum passage extends from the position corresponding to the vacuum suction cup to the end of the finger body away from the avoidance notch.

[0018] In one embodiment, the lower surface of the finger body is provided with an air passage groove; the air passage cover plate covers the air passage groove and is connected to the finger body to form the vacuum passage; the end of the air passage cover plate away from the clearance notch in the length direction is provided with a first vent hole that connects to the vacuum passage.

[0019] In one embodiment, the vacuum suction cup includes a suction cup body, a suction cup pressure plate and a fastening screw located within the suction cup body, the fastening screw passing through the suction cup pressure plate and the suction cup body and connected to the finger body, the fastening screw having a second vent hole that connects the internal space of the suction cup body with the air passage corresponding to the vacuum suction cup.

[0020] According to a second aspect, one embodiment provides a robotic hand, including a robotic arm and a finger assembly as described in the first aspect, wherein the finger body is connected to the robotic arm.

[0021] According to the above embodiment, the finger assembly includes a finger body with an avoidance notch and a plurality of positioning structures disposed on the finger body and located outside the avoidance notch. The plurality of positioning structures include a first positioning structure, a second positioning structure and a third positioning structure arranged sequentially in the length direction of the finger body. The second positioning structure and the first positioning structure are arranged together in a first circumference, and the third positioning structure and the first positioning structure are arranged together in a second circumference. The first positioning structure is used to adsorb the workpiece, the second positioning structure is used to support and restrict the slippage of the workpiece, and the third positioning structure is used to adsorb the workpiece or to support and restrict the slippage of the workpiece.

[0022] Firstly, by cooperating with the first positioning structure and the second positioning structure, the first workpiece with the first size is fixed, and by cooperating with the first positioning structure, the second positioning structure and the third positioning structure, the second workpiece with the second size is fixed; this effectively improves the compatibility of the finger assembly with workpieces of different sizes, and can meet the carrying and conveying needs of workpieces of different sizes or types without replacing the finger assembly during application.

[0023] Secondly, based on multiple positioning structures with different functions or roles, the workpiece is fixed and supported by a combination of vacuum adsorption and anti-slip, which not only enhances the stability of the finger assembly in supporting the workpiece, but also effectively improves the anti-slip capability of the finger assembly.

[0024] Thirdly, based on the positional relationship between the second positioning structure and the first positioning structure arranged in a cocircumference, and the third positioning structure and the first positioning structure arranged in a cocircumference, with the cooperation of the avoidance gap, the finger assembly can achieve the overall support of the workpiece by carrying the edge of the workpiece. This helps to reduce the contact area between the workpiece and the finger assembly, and reduce the probability of the finger assembly causing contamination or damage to the workpiece. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the planar structure of a common standard wafer.

[0026] Figure 2 This is a schematic diagram of the planar structure of a common framework wafer.

[0027] Figure 3 This is a schematic diagram showing the relative positional relationship between the standard wafer and the frame wafer on some existing finger components.

[0028] Figure 4 This is a schematic diagram showing the relative positional relationship between positioning structures in a finger assembly according to one embodiment.

[0029] Figure 5 This is a schematic diagram of the structure of a finger assembly according to one embodiment.

[0030] Figure 6This is a schematic diagram (a) of the structure of a finger assembly in the state of carrying a first workpiece, according to one embodiment.

[0031] Figure 7 This is a schematic diagram (a) of the structure of a finger assembly in the state of carrying a second workpiece, according to one embodiment.

[0032] Figure 8 This is a schematic diagram (II) of the structure of a finger assembly in the state of carrying a first workpiece, according to one embodiment.

[0033] Figure 9 This is a schematic diagram (II) of the structure of a finger assembly in the state of carrying a second workpiece, according to one embodiment.

[0034] Figure 10 This is an exploded view of the structure of a finger assembly according to one embodiment.

[0035] Figure 11 This is an exploded view of the structure of the vacuum suction cup in a finger assembly according to one embodiment.

[0036] In the picture:

[0037] 100. Finger assembly; 110. Finger body; 111. Clearance notch; 112. Supporting part; 113. Connecting part; 114. Limiting step; 115. Air passage groove; 120. First positioning structure; 121. Suction cup body; 122. Suction cup pressure plate; 123. Fastening screw; 130. Second positioning structure; 140. Third positioning structure; 150. First vacuum passage; 160. Second vacuum passage; 170. Air passage cover; 171. First vent; C1. First circumference; C2. Second circumference; L1. Centerline;

[0038] 200, First workpiece; 300, Second workpiece; 400, Standard wafer; 500, Frame wafer; 510, Wafer section; 520, Film section; 530, Frame section. Detailed Implementation

[0039] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0040] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0041] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the objects being described and have no sequential or technical meaning. Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections (linkages).

[0042] Common wafer types include standard wafers and frame wafers; for more information, please refer to [link to relevant documentation]. Figure 1 A standard 400 wafer is a thin circular wafer, typically ranging from 300 to 1500 micrometers in thickness, with common diameters of 150 mm (6 inches), 200 mm (8 inches), and 300 mm (12 inches). Please refer to [link / reference]. Figure 2 The frame wafer 500 includes a wafer, a blue film, and an iron ring surrounding the wafer. The back side of the wafer and the back side of the iron ring are respectively bonded and fixed to the front side of the blue film, thereby forming a frame wafer 500 having a wafer portion 510, an adhesive film portion 520 surrounding the wafer portion 510, and a frame portion 530 surrounding the adhesive film portion 520. In the frame wafer 500, the thickness of the iron ring is typically 1.2mm, 1.5mm, etc., and the outer diameter of the iron ring is typically 400mm (corresponding to a 12-inch wafer), 300mm (corresponding to an 8-inch or 6-inch wafer), etc. Figure 1 and Figure 2 As can be seen, there are significant differences in shape and size between the standard wafer 400 and the frame wafer 500.

[0043] In related technologies, wafer transport robots are typically equipped with different types of finger assemblies to carry and transport different types of wafers. For example, some self-friction finger assemblies with high-friction coefficient friction pads can carry standard wafer 400 well, but when used to carry frame wafer 500, the risk of the frame wafer 500 falling off is relatively high. As another example, gripper-type finger assemblies can stably carry frame wafer 500, but when used to carry standard wafer 400, they are prone to cracking the standard wafer 400. Furthermore, the common linear vacuum adsorption finger assembly can stably carry standard wafer 400, but it cannot be used in scenarios where adsorption is not allowed in the blue film area of ​​the frame wafer 500.

[0044] For example, considering that the standard wafer 400 can be adsorbed at any position within its diameter range, while the blue film area (or adhesive film portion 520) of certain frame wafers 500 is not allowed to be adsorbed, only the iron ring sheet (or frame portion 530) can be selected as the adsorption area; therefore, the vacuum adsorption point of some vacuum adsorption finger assemblies will be set in the adsorption overlap area of ​​the standard wafer 400 and the frame wafer 500, and they will share a vacuum path in order to be compatible with both the standard wafer 400 and the frame wafer 500; specifically, Figure 3 The diagram illustrates the relative positions of a standard wafer 400 and a frame wafer 500, each with compatible dimensions, on a vacuum-adhesive finger assembly. They are arranged tangent to each other at their upper outer circumferences and are symmetrically positioned at their left and right centers. Figure 3 As can be seen, the overlap area between the standard wafer 400 and the frame wafer 500 is only a small region corresponding to a small section of the iron ring plate at the top. Figure 3 (As shown in the shaded area), this significantly reduces the adsorption area of ​​the finger assembly on the wafer, and the vacuum adsorption point is also relatively off-center, which seriously reduces the stability of the finger assembly in adsorbing and bearing standard wafer 400 and frame wafer 500, resulting in a higher risk of wafer drop. Therefore, this type of compatible vacuum adsorption finger assembly has poor practicality.

[0045] In summary, existing robotic arm finger assemblies either only support the transport of specific types of wafers or have weak stability in this transport. Therefore, to meet the transport and transfer needs of different types of wafers, relevant process equipment typically requires different types of wafer transport robots or different types of finger assemblies for the robots. This undoubtedly increases the configuration and operating costs of the equipment, and reduces equipment utilization and production efficiency.

[0046] In view of this, the present application provides a robotic arm that utilizes multiple positioning structures with different functions on the finger assembly to achieve the bearing and fixation of semiconductor workpieces such as wafers through a combination of vacuum adsorption and anti-slip methods. This not only effectively enhances the stability of the workpiece being supported, but also effectively improves the compatibility of the robotic arm or finger assembly, meeting the bearing and conveying requirements of workpieces of different sizes or types, thereby providing support for reducing equipment costs, improving equipment utilization and production efficiency.

[0047] Please see Figure 4 and Figure 5This application provides a robotic arm that can carry and transfer semiconductor workpieces such as wafers between different system devices to support the process flow of semiconductor workpieces. The robotic arm includes a robotic arm and a finger assembly 100 connected to the robotic arm. The finger assembly 100 is used to carry semiconductor workpieces such as wafers, and the robotic arm is used to drive the finger assembly 100 to move the semiconductor workpieces it carries between different system devices to transfer the semiconductor workpieces to the target device. In addition to the finger assembly 100, the robotic arm and other functional components that exist as needed can refer to the prior art. The finger assembly 100 is mainly described below.

[0048] Please see Figure 4 and Figure 5 The finger assembly 100 includes a finger body 110 and multiple positioning structures; wherein, the finger body 110 is directly or indirectly connected to the robotic arm, for example, through power coupling connection with the power output end of the robotic arm; the outline shape of the finger body 110 can be a plate-like structure or other suitable geometric shape, and the finger body 110 is provided with an avoidance notch 111.

[0049] For example, please refer to Figure 5 The finger body 110 is generally a strip-shaped plate structure with a preset length, having a support portion 112 and a connecting portion 113 connected sequentially along the length of the finger body 110. The support portion 112 can be understood as a structural area in the finger body 110 for allowing the placement of a workpiece, or a structural area that the workpiece needs to occupy when placed in the finger body 110. For ease of distinction and description, the two opposite ends of the support portion 112 along the length direction are defined as the proximal end and the distal end of the support portion 112, respectively. An avoidance opening 111 is provided in the support portion 112, and the opening of the avoidance opening 111 faces the distal end of the support portion 112. It can also be understood that, due to the existence of the avoidance opening 111, at least a part of the support portion 112 presents a C-shaped or U-shaped plate structure with a distal opening. The connecting portion 113 is connected to the proximal end of the support portion 112. The connecting portion 113 can be understood as a structural part of the finger body 110 used to connect to other components such as a robotic arm.

[0050] Please see Figure 4 and Figure 5 Multiple positioning structures are spaced apart on the finger body 110 and located around the clearance notch 111; at least a portion of the multiple positioning structures cooperate with each other to constrain and restrict the workpiece on the finger body 110, thereby achieving fixation and bearing of the workpiece; for ease of distinction and description, the side of the finger body 110 facing the workpiece is defined as the upper surface of the finger body 110, and the other side opposite to the upper surface of the finger body 110 is defined as the lower surface of the finger body 110.

[0051] In some embodiments, please refer to Figure 4 and Figure 5 The multiple positioning structures include a first positioning structure 120, a second positioning structure 130, and a third positioning structure 140 that are exposed or protrude from the upper surface of the finger body 110. The first positioning structure 120, the second positioning structure 130, and the third positioning structure 140 are arranged sequentially along the length of the finger body 110. For example, please refer to... Figure 5 The first positioning structure 120 is disposed at the distal end of the bearing portion 112, the third positioning structure 140 is disposed at the proximal end of the bearing portion 112, and the second positioning structure 130 is located between the first positioning structure 120 and the third positioning structure 140 in the length direction of the finger body 110.

[0052] Please see Figure 4 The first positioning structure 120 and the second positioning structure 130 are arranged together on a first circumference C1, and the first positioning structure 120 and the third positioning structure are arranged together on a second circumference C2. It can be understood that, based on the sequential arrangement of the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140, the diameter of the first circumference C1 is smaller than the diameter of the second circumference C2, and the first positioning structure 120 is located at the intersection of the first circumference C1 and the second circumference C2.

[0053] The first positioning structure 120 is mainly used to adsorb the workpiece, the second positioning structure 130 is mainly used to support and restrict the workpiece from sliding relative to the finger body 110, and the third positioning structure 140 can be used to adsorb the workpiece or to support and restrict the workpiece from sliding relative to the finger body 110.

[0054] For example, please refer to Figures 4 to 7 The first positioning structure 120 adopts a vacuum adsorption structure, which includes a vacuum suction cup protruding from the upper surface of the finger body 110. The vacuum suction cup can be a suction cup structure made of rubber material to ensure that the vacuum suction cup is in close contact with the workpiece when adsorbing it. Of course, the vacuum suction cup can also be a suction cup structure made of other suitable materials. The second positioning structure 130 and the third positioning structure 140 both adopt anti-slip structures, each including an anti-slip pad protruding from the upper surface of the finger body 110. The anti-slip pad can be made of a material with a high coefficient of friction, such as rubber. The coefficient of friction between the anti-slip pad and the workpiece is set to be greater than the coefficient of friction between the finger body 110 and the workpiece, so that when the anti-slip pad supports and supports the workpiece, it ensures that the workpiece will not slide relative to the finger body 110.

[0055] For example, please refer to Figure 8 and Figure 9Both the first positioning structure 120 and the third positioning structure 140 adopt a vacuum adsorption structure, for example, each of them includes a vacuum suction cup protruding from the upper surface of the finger body 110; while the second positioning structure 130 adopts an anti-slip structure, for example, the second positioning structure 130 includes an anti-slip pad protruding from the upper surface of the finger body 110.

[0056] Thus, based on the relative positional relationship of the first positioning structure 120 and the second positioning structure 130 sharing the same first circumference C1, a first workpiece 200 with a first size can be accommodated. Through the cooperation of the first positioning structure 120 and the second positioning structure 130, the first workpiece 200 is fixed to the finger body 110 in a manner that covers and avoids the notch 111 (see [link]). Figure 6 and Figure 8 Based on the relative positional relationship of the first positioning structure 120 and the third positioning structure 140 sharing the second circumference C2, a second workpiece 300 with a second size can be adapted to fix the second workpiece 300 to the finger body 110 in a manner that covers and avoids the notch 111 through the cooperation of the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140 (see [link]). Figure 7 and Figure 9 ); where the first dimension is smaller than the second dimension. For example, the first workpiece 200 can be a 6-inch or 8-inch standard wafer 400, the second workpiece 300 can be a 12-inch standard wafer 400, or the second workpiece 300 can be a frame wafer 500 with an 8-inch or 6-inch wafer.

[0057] Firstly, the first workpiece 200 of the first size is fixed by the cooperation of the first positioning structure 120 and the second positioning structure 130, and the second workpiece 300 of the second size is fixed by the cooperation of the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140. This effectively improves the compatibility of the finger assembly 100 with workpieces of different sizes, enabling the finger assembly 100 to carry workpieces of different sizes or types. In this way, different workpieces can be carried and transferred without replacing the finger assembly 100, which helps to reduce the configuration and use costs of the robot or related process equipment, and also supports the improvement of equipment utilization and production efficiency.

[0058] Secondly, based on the functional differences and relative positional relationships among the first positioning structure 120, the second positioning structure 130, and the third positioning structure 140, the first workpiece 200 and the second workpiece 300 each have corresponding vacuum adsorption points and anti-slip action points on the finger body 110. Through the vacuum adsorption effect generated by the corresponding positioning structures, the corresponding workpieces are reliably and stably adsorbed and fixed on the finger body 110. Simultaneously, the high coefficient of friction of the corresponding positioning structures supports the workpieces and prevents them from translating or sliding relative to the finger body 110 in the horizontal direction. In other words, the combination of vacuum adsorption and anti-slip not only enhances the stability of the finger assembly 100 in supporting the first workpiece 200 or the second workpiece 300, but also effectively improves the anti-slip capability of the finger assembly 100, thereby achieving stable support of the workpieces and reducing the risk of chip detachment.

[0059] Thirdly, based on the circumferential positional relationship between the first positioning structure 120 and the second positioning structure 130, and the circumferential positional relationship between the first positioning structure 120 and the third positioning structure 140, the overall load-bearing and fixing of the workpiece can be achieved by contacting the edge positions of the first workpiece 200 and the second workpiece 300; at the same time, with the cooperation of the avoidance notch 111, the finger assembly 100 can avoid the main body of the workpiece, which can not only effectively reduce the contact area between the finger assembly 100 and the workpiece and reduce the probability of the finger assembly 100 causing contamination or damage to the workpiece, but also help to reduce the load on the finger assembly 100 itself and simplify the structure of the finger assembly 100.

[0060] Fourth, in the length direction of the finger body 110, the second positioning structure 130, located between the first positioning structure 120 and the third positioning structure 140, adopts an anti-slip structure (such as an anti-slip pad), which can adapt to the characteristics of friction structure or anti-slip structure being more friendly to the bearing capacity of wafer. Whether it is the frame wafer 500 or the standard wafer 400, it can ensure that the wafer part has an anti-slip structure to effectively enhance the anti-slip ability of the workpiece; at the same time, through the cooperation of the first positioning structure 120 (or together with the third positioning structure 140), the stable adsorption of the workpiece is achieved.

[0061] It should be noted that the descriptions of "first circumference" and "second circumference" in this article are only for the purpose of more clearly defining the relative positional relationship between the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140. "First circumference" and "second circumference" can be understood as custom technical terms.

[0062] In some embodiments, please refer to Figures 4 to 9The number of the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140 is set to two. The two first positioning structures 120, the two second positioning structures 130 and the two third positioning structures 140 are symmetrical about the center line L1 of the avoidance notch 111 in the length direction. The first positioning structures 120, the second positioning structures 130 and the third positioning structures 140 located on the same side of the avoidance notch 111 in the width direction of the finger body 110 are arranged in a straight line. The width direction of the finger body 110 refers to the direction perpendicular to the length direction.

[0063] For example, please refer to Figure 5 Two first positioning structures 120 are disposed at the far end of the bearing portion 112 and located on opposite sides of the opening of the clearance notch 111 in the width direction; two third positioning structures 140 are symmetrically disposed at the near end of the bearing portion 112 about the center line L1 of the clearance notch 111, and a second positioning structure 130 is disposed between the first positioning structure 120 and the third positioning structure 140 on the same side of the clearance notch 111 in the width direction.

[0064] On the one hand, by symmetrically arranging the positioning structures on both sides of the clearance notch 111 in the width direction, and with each positioning structure on the same side arranged in a straight line, it is possible not only to achieve multi-point positioning or constraint of the workpiece and ensure the balance of the force on the workpiece, thereby ensuring that the workpiece can be stably supported by the finger body 110; but also to reduce the size of the finger body 110 in the width direction, thereby providing support for reducing the volume or space occupied by the finger assembly 100 and realizing the miniaturization and lightweight design of the finger assembly 100.

[0065] On the other hand, a first positioning structure 120 employing an adsorption structure is disposed at the distal end of the bearing portion 112, and a second positioning structure 130 employing an anti-slip structure is arranged between the first positioning structure 120 and the third positioning structure 140. (See also...) Figure 6 and Figure 8 When carrying a first workpiece 200 (e.g., a standard wafer 400) with a first size, the edge of the first workpiece 200 can be adsorbed and fixed by the first positioning structure 120, and the edge of the first workpiece 200 can be supported by the second positioning structure 140. This can not only achieve a stable fixation of the first workpiece 200, but also effectively prevent the first workpiece 200 from slipping relative to the finger body 110.

[0066] Please see Figure 7 and Figure 9When the second workpiece 300 is a frame wafer 500, the first positioning structure 120 can be used to adsorb and fix the frame portion 530, and the third positioning structure 140 can be used to adsorb and fix the frame portion 530 or support the frame portion 530. Thus, the frame wafer 500 is fixed in the edge area (i.e., the frame portion 530) of the frame wafer 500 by the first positioning structure 120 and the third positioning structure 140. By supporting the wafer portion 510 by the second positioning structure 130, the frame wafer 500 can be further prevented from slipping relative to the finger body 110, thereby firmly fixing the frame wafer 500 to the finger body 110.

[0067] Please combine Figure 7 and Figure 9 When the second workpiece 300 is a standard wafer 400 with a second size, based on the cooperation of the first positioning structure 120 and the third positioning structure 140, the standard wafer 400 can be fixed from the edge of the standard wafer 400, and the second positioning structure 130 can be used to fix it from the main body of the standard wafer 400. In this way, the standard wafer 400 can also be effectively and firmly fixed to the finger body 110.

[0068] In other embodiments, based on the overall outline shape of the finger body 110 or the size of the workpiece, the number of the first positioning structure 120, the second positioning structure 130 and the third positioning structure 140 can also be set to other numbers, such as one, three, four or more, and each positioning structure 140 can also be arranged in a non-linear manner.

[0069] The arrangement of the first positioning structure 120, the second positioning structure 130, and the third positioning structure 140 along the length direction is sufficient, with the first positioning structure 120 and the second positioning structure 130 sharing a first circumference C1, and the first positioning structure 120 and the third positioning structure 140 sharing a second circumference C2. Alternatively, the goal can be to ensure that different types of workpieces each have corresponding vacuum adsorption points and anti-slip action points. Further details are omitted here.

[0070] In some embodiments, please refer to Figures 5 to 9 Along the length of the finger body 110, the clearance notch 111 extends from the middle position of the support portion 112 toward the distal end of the support portion 112; wherein, the second positioning structure 130 is located between the third positioning structure 140 and the clearance notch 110 in the length direction.

[0071] By setting the second positioning structure 130 at a position that avoids the clearance notch 110 in the length direction, on the one hand, while meeting the load-bearing requirements of different types or sizes of workpieces, it is beneficial to increase the area ratio of the clearance notch 110 on the finger body 110 (specifically, the load-bearing part 112), reduce the contact area between the finger body 110 and the workpiece, thereby helping to reduce the probability of the finger assembly 100 causing contamination or damage to the workpiece.

[0072] On the other hand, structural interference between the second positioning structure 130 and the first positioning structure 120 can be avoided. For example, please refer to... Figures 6 to 9 When the first positioning structure 120 adopts a vacuum suction cup, a vacuum passage connecting the vacuum suction cup can be provided on the parts of the bearing part 111 located on opposite sides of the clearance notch 111 in the width direction; at this time, by setting the second positioning structure 130 between the clearance notch 110 and the third positioning structure 140, the second positioning structure 130 can avoid the vacuum passage, and it is also beneficial to ensure that the far end of the bearing part 112 has sufficient structural strength.

[0073] In some embodiments, please refer to Figure 7 and Figure 9 In the longitudinal direction of the finger body 110, the distance between the third positioning structure 140 and the second positioning structure 130 can be set to be greater than the width of the adhesive film portion 520 of the frame wafer 500. When the frame wafer 500 is placed on the finger body 110 as the second workpiece 300, it can be ensured that the third positioning structure 140 and the first positioning structure 120 correspond to the frame portion 530 of the frame wafer 500, respectively, while the second positioning structure 130 corresponds to the wafer portion 510 of the frame wafer 500.

[0074] In this way, the positioning structure can avoid the adhesive film portion 520 that is not allowed to be adsorbed or supported, and the frame wafer 500 is fixed to the finger body 110 by adsorbing and fixing the frame portion 530. By supporting and restricting the wafer portion 510 (or together with the frame portion 530) from sliding relative to the finger body 110, the frame wafer 500 is prevented from sliding as a whole, thereby achieving stable support for the frame wafer 500.

[0075] As described above, the finger body 110 may have a support portion 112 and a connecting portion 113 connected to the proximal end of the support portion 112. Please refer to... Figure 5 , Figure 7 and Figure 9 In some embodiments, the upper surface of the connecting portion 113 is configured to be higher than the upper surface of the supporting portion 112, so as to form a limiting step 114 between the connecting portion 113 and the supporting portion 112.

[0076] When the finger assembly 100 carries the second workpiece 300, the limiting step 114 can abut against the side of the second workpiece 300 to limit the position of the second workpiece 300 on the support portion 112, thereby facilitating the quick and accurate placement of the second workpiece 300 on the support portion 112, so that different parts of the second workpiece 300 correspond to the positions of the corresponding positioning structures. For example, please refer to Figure 7 and Figure 9 When the second workpiece 300 is a frame wafer 500, the limiting step 114 abuts against the side of the frame portion 530, which can ensure that the first positioning structure 120 and the third positioning structure 140 correspond to the frame portion 530, while the second positioning structure 130 corresponds to the wafer portion 510, thereby achieving precise positioning of the frame wafer 500.

[0077] As mentioned above, the first positioning structure 120 and the third positioning structure 140 can employ vacuum adsorption structures, such as each including a vacuum suction cup; the second positioning structure 130 employs an anti-slip structure, such as the second positioning structure 130 including an anti-slip pad. Please refer to [link / reference]. Figure 8 and Figure 9 In some embodiments, the air passage (which can be defined as the first vacuum passage 150) connected to the vacuum suction cup of the first positioning structure 120 is independently set with the air passage (which can be defined as the second vacuum passage 160) connected to the vacuum suction cup of the third positioning structure 140.

[0078] By independently controlling the on / off state of the first vacuum path 150 and the second vacuum path 160, the finger assembly 100 can adapt to the size or type of the workpiece it carries, ensuring effective adsorption and fixation of the workpiece.

[0079] For example, please see Figure 8 When carrying the first workpiece 200, only the first vacuum path 150 can be opened to ensure that the first adsorption structure 120 can generate a sufficiently large vacuum adsorption force on the first workpiece 200 to stably adsorb and fix the first workpiece 200, and the second positioning structure 130 can support the first workpiece 200 and prevent the first workpiece 200 from slipping.

[0080] For example, please refer to Figure 9 When carrying the second workpiece 300, the first vacuum passage 150 and the second vacuum passage 160 can be opened simultaneously to firmly adsorb and fix the second workpiece 300 from the edge of the second workpiece 300 through the first positioning structure 120 and the third positioning structure 140, while the second positioning structure 130 can support and prevent the second workpiece 300 from slipping.

[0081] In some embodiments, please refer to Figure 10 and combined Figures 6 to 9The finger assembly 100 also includes an air passage cover 170 that covers and connects with the finger body 110. The air passage cover 170 is disposed on the lower surface side of the finger body 110. A vacuum passage communicating with a vacuum suction cup is formed between the air passage cover 170 and the finger body 110. In the length direction of the finger body 110, the vacuum passage extends from the position corresponding to the vacuum suction cup to the end of the finger body 110 away from the avoidance notch 111.

[0082] For example, please refer to Figures 6 to 9 The vacuum path includes a first vacuum path 150, which extends from the location of the vacuum chuck of the first positioning structure 120 (i.e., the distal end of the support portion 112) to the connecting portion 113; see also Figure 8 and Figure 9 The vacuum path may further include a second vacuum path 160, which extends from the position of the vacuum chuck of the third positioning structure 140 (i.e., the proximal end of the support portion 112) to the connecting portion 113. By providing a gas path connection structure at the connecting portion 113 to connect the vacuum path to the vacuum source, the opening and closing control of the vacuum suction force generated by the vacuum chuck can be realized.

[0083] In this way, by using the cooperation between the finger body 110 and the air passage cover 170, a vacuum passage connecting the vacuum suction cup is formed inside the finger assembly 100. This not only makes full use of the structural space of the finger assembly 100 and enhances the overall compactness of the finger assembly 100, but also reduces the space occupied by the finger assembly 100 and avoids structural interference of the pipeline components connected to the vacuum suction cup to the workpiece, thus providing support for the stable support of the workpiece.

[0084] In other embodiments, depending on the application scenario of the finger assembly 100 or the robotic hand, the air passage cover 170 may be omitted, and a vacuum tube externally placed on the finger body 110 may be used to establish an air passage connection between the vacuum suction cup and the vacuum source. Further details are omitted here.

[0085] In some embodiments, please refer to Figure 10The lower surface of the finger body 110 is provided with an air passage groove 115, and the air passage cover plate 170 is connected to the finger body 110 in the form of covering the air passage groove 115, thereby forming a corresponding vacuum passage. For example, after the lower surface of the finger body 110 is processed to form the air passage groove 115, the air passage cover plate 170 can be stacked and sealed to the lower surface of the finger body 110 by welding, bonding or other methods to ensure that the air passage groove 115 does not leak air and forms a vacuum passage. At the same time, the end of the air passage cover plate 170 away from the avoidance notch 111 in the length direction (for example, the part corresponding to the connecting part 113) is provided with a first vent hole 171 that connects to the vacuum passage (or air passage groove 115), and the air passage connection relationship between the vacuum passage and the vacuum source is established by means of the first vent hole 171.

[0086] By distributing the first vent 171 and the air channel groove 115 on the air channel cover 171 and the finger body 110, the processing difficulty of the air channel cover 170 and the finger body 110 is reduced, thereby reducing the structural complexity of the finger assembly 100. At the same time, the first vent 171 is located on the side of the finger body 110 facing away from the workpiece and is located at the proximal end of the finger body 110. This can avoid the corresponding vacuum pipeline from causing structural interference to the workpiece, and ensure the integrity of the outline of the structural part of the finger assembly 100 used to support the workpiece, so as to provide support for the stable support and fixation of the workpiece.

[0087] In other embodiments, the airway groove 115 may also be provided on the airway cover plate 170, or simultaneously on the airway cover plate 170 and the finger body 110.

[0088] It should be noted that in the embodiment where the finger assembly 100 is configured with the first vacuum path 150 and the second vacuum path 160, please refer to... Figure 8 and Figure 9 The first vent 171 can be configured to be multiple, such that the first vacuum passage 150 and the second vacuum passage 160 are respectively connected to the first vent 171, so as to facilitate independent on / off control of the first vacuum passage 150 and the second vacuum passage 160.

[0089] As described above, the first positioning structure 120 (or together with the third positioning structure 140) may include a vacuum suction cup. Please refer to [link / reference]. Figure 11In some embodiments, the vacuum suction cup includes a suction cup body 121, a suction cup pressure plate 122, and a fastening screw 123. The suction cup body 121 is mainly used to support and adsorb the workpiece, and the suction cup pressure plate 122 and the fastening screw 123 are located inside the suction cup body 121. The fastening screw 123 passes through the suction cup pressure plate 122 and the suction cup body 121 and is connected to the finger body 110 to clamp and fix the suction cup body 121 between the suction cup pressure plate 122 and the finger body 110. At the same time, the fastening screw 123 also has a second vent hole, which connects the internal space of the suction cup body 121 with the air passage corresponding to the vacuum suction cup. Specifically, the vacuum passage formed between the finger body 110 and the air passage cover plate 170 is connected to the internal space of the suction cup body 121 through the second vent hole.

[0090] Therefore, based on the air passage connection established between the suction cup body 121 and the vacuum passage by the fastening screw 123 (i.e. the second vent hole), the suction cup body 121 can be evacuated to fix the workpiece by drawing a vacuum in the internal space of the suction cup body 121. At the same time, with the cooperation of the fastening screw 123 and the suction cup pressure plate 122, the suction cup body 121 is fixed to the finger body 110, which can also effectively enhance the compactness of the structural connection between the vacuum suction cup and the finger body 110, and realize the full utilization of related components or structures.

[0091] Of course, other suitable suction cup structures can also be used for vacuum suction cups, which will not be elaborated here.

[0092] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A finger assembly, characterized in that, include: The finger itself has a clearance notch; Multiple positioning structures are disposed on the finger body and located around the clearance notch. The multiple positioning structures include a first positioning structure, a second positioning structure, and a third positioning structure arranged sequentially along the length direction of the finger body. The second positioning structure and the first positioning structure are arranged together on a first circumference, and the third positioning structure and the first positioning structure are arranged together on a second circumference. The first positioning structure and the second positioning structure cooperate to fix a first workpiece with a first size to the finger body in a manner that covers the clearance notch. The first positioning structure, the second positioning structure, and the third positioning structure cooperate to fix the second workpiece with the second size to the finger body in a manner that covers the avoidance notch; Wherein, the first size is smaller than the second size, the first positioning structure is used to adsorb the first workpiece or the second workpiece, the second positioning structure is used to support and restrict the sliding of the first workpiece or the second workpiece relative to the finger body, and the third positioning structure is used to adsorb the second workpiece or to support and restrict the sliding of the second workpiece relative to the finger body.

2. The finger assembly as claimed in claim 1, characterized in that, The finger body has a support portion, the support portion including a proximal end and a distal end relative to each other along the length direction, the avoidance notch is provided on the support portion, and the opening of the avoidance notch faces the distal end of the support portion; the positioning structure is provided on the support portion, wherein the first positioning structure is provided on the distal end of the support portion, and the third positioning structure is provided on the proximal end of the support portion.

3. The finger assembly as described in claim 2, characterized in that, The number of the first positioning structure, the second positioning structure, and the third positioning structure is set to two, and each of the two first positioning structures, the two second positioning structures, and the two third positioning structures is symmetrical about the center line of the avoidance gap in the length direction; The first positioning structure, the second positioning structure, and the third positioning structure, located on the same side of the clearance gap in the width direction, are arranged in a straight line, and the width direction is perpendicular to the length direction.

4. The finger assembly as claimed in claim 2, characterized in that, In the length direction, the clearance notch extends from the middle position of the bearing portion toward the far end of the bearing portion, and the second positioning structure is located between the third positioning structure and the clearance notch.

5. The finger assembly as claimed in claim 4, characterized in that, The second workpiece includes a frame wafer, the frame wafer including a wafer portion, an adhesive film portion surrounding the wafer portion, and a frame portion surrounding the adhesive film portion; in the length direction, the distance between the third positioning structure and the second positioning structure is greater than the width of the adhesive film portion, so that the third positioning structure corresponds to the frame portion and the second positioning structure corresponds to the wafer portion.

6. The finger assembly as claimed in claim 2, characterized in that, The finger body also has a connecting portion connected to the proximal end of the bearing portion; the upper surface of the connecting portion is higher than the upper surface of the bearing portion to form a limiting step between the connecting portion and the bearing portion; the limiting step is used to abut against the side of the second workpiece to limit the position of the second workpiece on the bearing portion.

7. The finger assembly as claimed in any one of claims 1-6, characterized in that, The first positioning structure includes a vacuum suction cup, and the second and third positioning structures both include anti-slip pads; wherein, the vacuum suction cup protrudes from the upper surface of the finger body and is used to adsorb the first workpiece or the second workpiece; the anti-slip pad protrudes from the upper surface of the finger body and is used to support the first workpiece or the second workpiece; Alternatively, both the first positioning structure and the third positioning structure may include a vacuum suction cup, and the second positioning structure may include the anti-slip pad; wherein, the vacuum suction cup protrudes from the upper surface of the finger body and is used to adsorb the first workpiece or the second workpiece; the anti-slip pad protrudes from the upper surface of the finger body and is used to support the first workpiece or the second workpiece; and the air path connected to the vacuum suction cup of the first positioning structure is independent of the air path connected to the vacuum suction cup of the third positioning structure.

8. The finger assembly as claimed in claim 7, characterized in that, The finger assembly also includes an air passage cover plate, which covers and connects to the finger body, and a vacuum passage is formed between the air passage cover plate and the finger body, communicating with the vacuum suction cup; in the length direction, the vacuum passage extends from the position corresponding to the vacuum suction cup to the end of the finger body away from the avoidance notch.

9. The finger assembly as claimed in claim 8, characterized in that, The lower surface of the finger body is provided with an air passage groove; the air passage cover plate covers the air passage groove and is connected to the finger body to form the vacuum passage; the end of the air passage cover plate away from the clearance notch in the length direction is provided with a first vent hole that connects to the vacuum passage.

10. The finger assembly as claimed in claim 7, characterized in that, The vacuum suction cup includes a suction cup body, a suction cup pressure plate and a fastening screw located inside the suction cup body. The fastening screw passes through the suction cup pressure plate and the suction cup body and is connected to the finger body. The fastening screw has a second vent hole that connects the internal space of the suction cup body with the air passage corresponding to the vacuum suction cup.

11. A robotic arm, characterized in that, It includes a robotic arm and a finger assembly according to any one of claims 1-10, wherein the finger body is connected to the robotic arm.

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