Body structure and robot

Abstract

The utility model discloses a kind of fuselage structure and robot, it is related to robot technical field.The fuselage structure includes main body module and auxiliary heat dissipation module, main body module includes framework and cover plate, first installation cavity for accommodating mainboard circuit board is provided on framework, the opening end of cover plate corresponding first installation cavity is located framework, for sealing first installation cavity;Auxiliary heat dissipation module is set in first installation cavity, auxiliary heat dissipation module and mainboard circuit board and first installation cavity inner wall are all attached, auxiliary heat dissipation module is used for conducting the heat of mainboard circuit board to framework.The fuselage structure and robot can balance waterproof performance and heat dissipation effect, guarantee the working stability of robot, prolong its service life.

Description

Technical Field

[0001] This utility model relates to the field of robotics technology, and in particular to a fuselage structure and a robot. Background Technology

[0002] Robot services have been deeply integrated into multiple industries, with industrial quadruped robots, in particular, seeing their applications expand due to their flexible movement and strong environmental adaptability. For example, they accurately identify safety hazards and provide real-time feedback in security patrols; they buy valuable time for rescue operations in emergency rescue scenarios; and they enable point-to-point delivery in logistics and distribution, improving delivery efficiency.

[0003] In existing technologies, quadruped robots generate significant heat during prolonged high-load operation, particularly in their core power components, such as the motor and the drive board used to control it. As operating time increases, this heat accumulates, causing a rapid rise in the temperature of the motor and drive board. When the temperature exceeds their tolerance threshold, it can easily lead to performance degradation, malfunctions, or even direct damage, affecting the robot's operational stability and lifespan. While adding heat dissipation windows to industrial quadruped robots can improve heat dissipation, moisture and dust from the external environment can still enter the robot, impacting component performance. Furthermore, to meet the demands of mobility and operation in complex environments, industrial quadruped robots are typically designed with a compact structure. Specific limitations on size and weight mean that large, complex cooling systems are unsuitable for industrial quadruped robots, further exacerbating the heat accumulation problem in the drive board. Utility Model Content

[0004] The purpose of this invention is to provide a body structure and robot that can balance waterproof performance and heat dissipation, ensuring the robot's working stability and extending its service life.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A fuselage structure, comprising:

[0007] The main module includes a frame and a cover plate. The frame is provided with a first mounting cavity for accommodating a motherboard circuit board. The cover plate is located on the frame at the opening end corresponding to the first mounting cavity to seal the first mounting cavity.

[0008] An auxiliary heat dissipation module is disposed in the first mounting cavity. The auxiliary heat dissipation module is in contact with both the motherboard circuit board and the inner wall of the first mounting cavity. The auxiliary heat dissipation module is used to conduct heat from the motherboard circuit board to the frame.

[0009] As a further technical solution, the auxiliary heat dissipation module includes at least one heat pipe, the first end of which is connected to the inner wall of the first mounting cavity, and the second end which can be attached to the motherboard circuit board. The heat pipe has a lower contact surface corresponding to the motherboard circuit board, and the lower contact surface is set as a horizontal surface.

[0010] As a further technical solution, the auxiliary heat dissipation module also includes an auxiliary plate and a mounting plate. The second end of the heat pipe is fixedly connected to the auxiliary plate, the lower end surface of the auxiliary plate is attached to the main circuit board, and the first end of the heat pipe is connected to the bottom wall of the first mounting cavity through the mounting plate.

[0011] As a further technical solution, the auxiliary heat dissipation module also includes multiple heat dissipation fins, which are spaced apart on the frame corresponding to the opening ends of the first mounting cavity, and are all arranged corresponding to the heat pipe.

[0012] As a further technical solution, the main module also includes a base plate, a first sealing element and / or a second sealing element, and the frame is provided with a second mounting cavity for accommodating the control circuit board, and the base plate covers the opening end of the second mounting cavity;

[0013] The first sealing element abuts against the cover plate and the frame, and the second sealing element abuts against the bottom plate and the frame.

[0014] As a further technical solution, both the first sealing element and the second sealing element are configured as annular sealing rings. The skeleton is provided with a first annular sealing groove for accommodating the first sealing element corresponding to the first mounting cavity, and a second annular sealing groove for accommodating the second sealing element corresponding to the second mounting cavity.

[0015] As a further technical solution, both the first annular sealing groove and the second annular sealing groove are coated with a waterproof layer;

[0016] And / or, the width of the bottom wall of the first annular sealing groove is greater than the width of its opening, and the width of the bottom wall of the second annular sealing groove is greater than the width of its opening.

[0017] As a further technical solution, the skeleton is integrally formed, the bottom wall of the second mounting cavity is provided with at least one wiring channel communicating with the first mounting cavity, and both the second mounting cavity and the first mounting cavity are provided with external interfaces, and waterproof connectors are provided for each external interface.

[0018] As a further technical solution, the main module also includes a battery pack, and the frame is provided with a battery mounting cavity for accommodating the battery pack;

[0019] The bottom wall of the battery mounting cavity is provided with a first waterproof terminal, and the battery pack is provided with a second waterproof terminal that can be inserted into the first waterproof terminal. At least one of the inner wall of the first waterproof terminal and the outer wall of the second waterproof terminal is provided with a third sealing element.

[0020] The robot includes multiple legs and the aforementioned body structure, with the multiple legs rotatably connected to the body structure.

[0021] Compared with the prior art, the technical advantages of the fuselage structure and robot provided by this utility model are as follows:

[0022] Because the auxiliary heat dissipation module is located within the first mounting cavity, it is in close contact with the motherboard circuit board and the inner wall of the first mounting cavity, and the cover plate seals the first mounting cavity. Sealing the first mounting cavity with the cover plate ensures its airtightness, thereby guaranteeing its internal waterproofness and reducing the risk of damage to the motherboard circuit board from external rain, dust, etc. During operation, the auxiliary heat dissipation module only needs to be placed within the first mounting cavity and in close contact with the motherboard circuit board and the inner wall of the first mounting cavity, without the need for additional cooling systems. This maximizes heat dissipation without increasing the overall size of the chassis. When the motherboard circuit board generates heat, the heat accumulates in the first mounting cavity due to the sealing effect of the cover plate. The auxiliary heat dissipation module can absorb the heat accumulated in the first mounting cavity and conduct it to the frame in a timely manner. Due to its large surface area, the frame can dissipate the heat to the surrounding environment as quickly as possible, thereby improving heat dissipation efficiency, ensuring heat dissipation effect, and reducing the risk of heat accumulation in the first mounting cavity. This balances the waterproof performance and heat dissipation effect of the chassis structure, reduces the probability of the motherboard circuit board experiencing performance degradation, failure, or damage due to excessive heat or external moisture, dust, etc., and ensures the performance stability of the chassis structure and extends its service life. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0024] Figure 1 This is a partial structural schematic diagram of the fuselage structure provided in this embodiment of the utility model;

[0025] Figure 2 yes Figure 1 A magnified view of a section at point A in the middle;

[0026] Figure 3 This is a first-view structural schematic diagram of the auxiliary heat dissipation module in the fuselage structure provided in this embodiment of the utility model;

[0027] Figure 4 This is a second-view structural schematic diagram of the auxiliary heat dissipation module in the fuselage structure provided in this embodiment of the utility model;

[0028] Figure 5 This is a first-view structural schematic diagram of the fuselage structure provided in an embodiment of the present invention;

[0029] Figure 6 This is a second-view structural schematic diagram of the fuselage structure provided in this embodiment of the utility model;

[0030] Figure 7 yes Figure 6 A magnified view of a section at point B in the middle;

[0031] Figure 8 yes Figure 6 A magnified view of a section at point C;

[0032] Figure 9 This is a partial structural diagram of the battery pack in the fuselage structure provided in this embodiment of the utility model;

[0033] Figure 10 This is a schematic diagram of the skeleton structure in the fuselage structure provided in this embodiment of the utility model.

[0034] In the picture:

[0035] 10. Mainboard circuit board; 20. Control circuit board;

[0036] 100. Main module; 110. Frame; 111. First mounting cavity; 1101. External interface; 112. Second mounting cavity; 113. First annular sealing groove; 114. Second annular sealing groove; 115. Battery mounting cavity; 116. First waterproof terminal; 120. Cover plate; 130. Base plate; 140. First seal; 150. Second seal; 160. Battery pack; 161. Second waterproof terminal; 162. Third seal;

[0037] 200, Auxiliary heat dissipation module; 210, Heat pipe; 212, Lower bonding surface; 220, Auxiliary plate; 230, Heat dissipation fins; 240, Mounting plate. Detailed Implementation

[0038] Before explaining any implementation of this application in detail, it should be understood that this application is not limited to its application to the structural details and component arrangements set forth in the following description or shown in the above drawings.

[0039] In this application, the terms "comprising," "including," "having," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0040] In this application, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "and / or" relationship.

[0041] In this application, the terms "connection," "combination," "coupling," and "installation" can refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without the need for an intermediary, while an indirect connection refers to two parts or components each being connected to at least one intermediary, with the connection achieved through the intermediary. Furthermore, "connection" and "coupling" are not limited to physical or mechanical connections or couplings, but can also include electrical connections or couplings.

[0042] In this application, those skilled in the art will understand that relative terms (e.g., “about,” “approximately,” “basically,” etc.) used in conjunction with quantities or conditions are to include the values ​​and have the meaning indicated by the context. For example, such relative terms include at least the degree of error associated with the measurement of a particular value, tolerances associated with the particular value due to manufacturing, assembly, use, etc. Such terms should also be considered as disclosing a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​that do not use relative terms should also be disclosed as specific values ​​with tolerances. Furthermore, “basically” when expressing relative angular relationships (e.g., substantially parallel, substantially perpendicular) may refer to a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) added to or subtracted from the indicated angle.

[0043] In this application, those skilled in the art will understand that the function performed by a component can be performed by one component, multiple components, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one component, or a combination of multiple parts.

[0044] In this application, the directional terms "upper," "lower," "left," "right," "front," and "rear" are used to describe the orientation and positional relationships shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should be understood that when an element is mentioned as being connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected through an intermediate element. It should also be understood that directional terms such as upper side, lower side, left side, right side, front side, and rear side not only represent positive orientation but can also be understood as lateral orientation. For example, "below" can include directly below, lower left, lower right, lower front, and lower rear.

[0045] To achieve this objective, the present invention adopts the following technical solution:

[0046] Combination Figures 1 to 10 As shown, this embodiment provides a chassis structure applied to a robot. This chassis structure and the robot can balance waterproof performance and heat dissipation effect, ensuring the robot's working stability and extending its service life. Specifically, the chassis structure includes a main body module 100 and an auxiliary heat dissipation module 200: the main body module 100 includes a frame 110 and a cover plate 120. The frame 110 is provided with a first mounting cavity 111 for accommodating the motherboard circuit board 10. The cover plate 120 is located at the opening end of the first mounting cavity 111 and is used to seal the first mounting cavity 111. The auxiliary heat dissipation module 200 is disposed in the first mounting cavity 111. The auxiliary heat dissipation module 200 is in contact with both the motherboard circuit board 10 and the inner wall of the first mounting cavity 111. The auxiliary heat dissipation module 200 is used to conduct heat from the motherboard circuit board 10 to the frame 110.

[0047] Since the auxiliary heat dissipation module 200 is disposed within the first mounting cavity 111, the auxiliary heat dissipation module 200 is in contact with the motherboard circuit board 10 and the inner wall of the first mounting cavity 111, and the cover plate 120 seals the first mounting cavity 111. By sealing the first mounting cavity 111 with the cover plate 120, the airtightness of the first mounting cavity 111 can be ensured, thereby ensuring the waterproofness inside the first mounting cavity 111 and reducing the risk of damage to the motherboard circuit board 10 due to external rainwater, dust, etc. When the chassis structure is in operation, it is only necessary to place the auxiliary heat dissipation module 200 within the first mounting cavity 111 and ensure that the auxiliary heat dissipation module 200 is in contact with the motherboard circuit board 10 and the inner wall of the first mounting cavity 111, without the need to add other heat dissipation systems, thus maximizing heat dissipation effect without increasing the size of the chassis structure. When the motherboard circuit board 10 generates heat, the heat accumulates in the first mounting cavity 111 under the sealing effect of the cover plate 120. The auxiliary heat dissipation module 200 can absorb the heat accumulated in the first mounting cavity 111 and conduct it to the frame 110 in a timely manner. Due to its large area, the frame 110 can dissipate the heat to the surrounding environment as quickly as possible to improve heat dissipation efficiency, ensure heat dissipation effect, and reduce the risk of heat accumulation in the first mounting cavity 111. This balances the waterproof performance and heat dissipation effect of the chassis structure, reduces the probability of the motherboard circuit board 10 experiencing performance degradation, malfunction, or damage due to excessive heat or external moisture, dust, etc., and ensures the performance stability of the chassis structure and extends its service life.

[0048] Preferably, the auxiliary heat dissipation module 200 includes at least one heat pipe 210. The first end of the heat pipe 210 is connected to the inner wall of the first mounting cavity 111, and the second end can be attached to the motherboard circuit board 10. The heat pipe 210 is provided with a lower contact surface 212 corresponding to the motherboard circuit board 10, and the lower contact surface 212 is set as a horizontal surface.

[0049] Combination Figure 1 , Figure 3 and Figure 4 As shown, when the motherboard circuit board 10 generates heat, the heat accumulated in the first mounting cavity 111 is absorbed by the heat pipe 210. Then, through the synergistic effect of phase change heat transfer and capillary action, the heat pipe 210 rapidly conducts the absorbed energy to the frame 110. The exposed area of ​​the frame 110 dissipates the heat to the surrounding environment as quickly as possible, thereby improving heat dissipation efficiency, ensuring heat dissipation effect, and reducing the risk of heat accumulation in the first mounting cavity 111. Since the lower contact surface 212 of the heat pipe 210 is set as a horizontal plane, the contact area between the heat pipe 210 and the motherboard circuit board 10 is increased to further improve heat dissipation efficiency. Simultaneously, it improves the stability of the second end of the heat pipe 210 when it is attached to the motherboard circuit board 10. To further improve heat dissipation efficiency, in this embodiment, the auxiliary heat dissipation module 200 includes two heat pipes 210 spaced apart. In other embodiments, the number of heat pipes 210 can be increased adaptably, and is not limited to this embodiment.

[0050] In addition, the specific structure and heat dissipation principle of heat pipe 210 refer to existing technology and will not be elaborated here.

[0051] Furthermore, the auxiliary heat dissipation module 200 also includes an auxiliary plate 220 and a mounting plate 240. The second end of the heat pipe 210 is fixedly connected to the auxiliary plate 220, and the lower end surface of the auxiliary plate 220 is in contact with the main board circuit board 10 to improve the stability of the contact between the heat pipe 210 and the main board circuit board 10, while increasing the contact area between the auxiliary heat dissipation module 200 and the main board circuit board 10 to further improve the heat dissipation effect. The first end of the heat pipe 210 is connected to the bottom wall of the first mounting cavity 111 through the mounting plate 240, which improves the connection strength and stability between the heat pipe 210 and the frame 110, while increasing the contact area between the auxiliary heat dissipation module 200 and the frame 110 to improve the heat dissipation effect and efficiency.

[0052] Preferably, the auxiliary heat dissipation module 200 further includes a plurality of heat dissipation fins 230, which are spaced apart on the frame 110 corresponding to the open ends of the first mounting cavity 111, and are all corresponding to the heat pipes 210. Figure 1 and Figure 2 As shown, by setting multiple heat dissipation fins 230, the surface area of ​​the frame 110 is increased, thereby increasing the heat dissipation area to further improve heat dissipation efficiency, ensure heat dissipation effect, and reduce the risk of heat accumulation in the first mounting cavity 111, thus balancing the waterproof performance and heat dissipation effect of the chassis structure. The specific shape and number of heat dissipation fins 230 can be adapted according to actual needs and are not specifically limited here.

[0053] Preferably, the main module 100 further includes a base plate 130, a first sealing member 140, and a second sealing member 150. The frame 110 is provided with a second mounting cavity 112 for accommodating the control circuit board 20, and the base plate 130 covers the opening end of the second mounting cavity 112. The first sealing member 140 seals against the cover plate 120 and the frame 110, and the second sealing member 150 seals against the base plate 130 and the frame 110. In this embodiment, both the first sealing member 140 and the second sealing member 150 are configured as elastic sealing members. Specifically, when the cover plate 120 covers the first mounting cavity 111, the first sealing member 140 is compressed; when the base plate 130 covers the second mounting cavity 112, the second sealing member 150 is compressed. Thus, by setting the first seal 140 and the second seal 150, not only can the sealing gap caused by sealing tolerances be compensated, but the sealing performance of the first mounting cavity 111 and the second mounting cavity 112 can also be improved. This can respectively block the path of external water from entering the interior of the frame 110 through the gaps at the edges of the cover plate 120 or the bottom plate 130; thus avoiding overall waterproofing failure caused by a single sealing failure, thereby improving the waterproof protection level of the main module 100. In addition, the first seal 140 and the second seal 150 are relatively independent. When it is necessary to inspect the interior of the frame 110, only the cover plate 120 or the bottom plate 130 needs to be removed without damaging the overall sealing structure. When reassembling after maintenance, the seals can be directly reset and the double sealing state is restored, ensuring the interior waterproofing of the frame 110 while reducing maintenance difficulty and cost.

[0054] Furthermore, both the first sealing element 140 and the second sealing element 150 are configured as annular sealing rings. The skeleton 110 is provided with a first annular sealing groove 113 for accommodating the first sealing element 140 corresponding to the first mounting cavity 111, and a second annular sealing groove 114 for accommodating the second sealing element 150 corresponding to the second mounting cavity 112.

[0055] Combination Figure 2 and Figure 7 As shown, this design allows the annular sealing groove to physically limit the annular sealing ring, preventing it from shifting during assembly or during use. This avoids sealing gaps caused by misalignment, further improving waterproof reliability. Simultaneously, the annular sealing groove limits the compression of the sealing ring, preventing deformation and failure due to over-compression or sealing gaps due to insufficient compression. Furthermore, the annular sealing groove protects the sealing ring from damage caused by external friction, maintaining its long-term sealing performance and ensuring durable waterproofing.

[0056] Furthermore, both the first annular sealing groove 113 and the second annular sealing groove 114 are coated with a waterproof layer. This waterproof layer fills the tiny gaps between the sealing groove and the sealing ring, thereby preventing water from seeping through the micro-cracks in the sealing ring's mating surface. The combined physical seal of the annular sealing ring forms double protection, avoiding the risk of leakage due to a single seal failure and further enhancing the internal waterproofing level of the skeleton 110. Simultaneously, the waterproof layer isolates the sealing groove substrate from contact with water and moisture, preventing corrosion or aging of the sealing groove and reducing frictional wear between the sealing ring and the inner wall of the sealing groove. This prevents a decrease in sealing fit after long-term use and ensures the long-term stability of waterproofing performance. The waterproof layer can be selected from silicone-based waterproof adhesives, polyurethane-based waterproof adhesives, polytetrafluoroethylene coatings, epoxy resin waterproof coatings, etc., depending on actual needs; this embodiment does not impose specific limitations.

[0057] Alternatively, the width of the bottom wall of the first annular sealing groove 113 is greater than the width of its opening, and the width of the bottom wall of the second annular sealing groove 114 is greater than the width of its opening. With this configuration, the sealing grooves can form an inverted physical constraint on the corresponding annular sealing rings, preventing the sealing rings from detaching from the groove opening during assembly compression or robot movement vibration, ensuring the sealing rings always maintain a sealing effect, avoiding waterproof gaps caused by displacement, and improving sealing stability. Simultaneously, during assembly, the sealing rings can be guided to fill the bottom of the corresponding sealing grooves evenly, avoiding gaps caused by insufficient local compression, further ensuring the waterproof effect. The cross-sectional shape of the first annular sealing groove 113 and the second annular sealing groove 114 along their circumference can be set as a dovetail groove or a trapezoidal shape; this embodiment does not impose a specific limitation.

[0058] To further enhance sealing and thus improve waterproofing, in this embodiment, the frame 110 is integrally formed, and the bottom wall of the second mounting cavity 112 is provided with at least one wiring channel communicating with the first mounting cavity 111. The wiring of the main board circuit board 10 and the control circuit board 20 are routed through this wiring channel, ensuring internal sealing while reducing the risk of wiring entanglement or bending inside the frame 110, and ensuring normal communication between the internal components of the first mounting cavity 111 and the internal components of the second mounting cavity 112. To further enhance sealing, in this embodiment, both the side walls of the second mounting cavity 112 and the first mounting cavity 111 are provided with external interfaces 1101, and waterproof connectors are provided corresponding to the external interfaces 1101, specifically as follows... Figure 8 As shown.

[0059] Preferably, the main module 100 further includes a battery pack 160, and the frame 110 is provided with a battery mounting cavity 115 for accommodating the battery pack 160; the bottom wall of the battery mounting cavity 115 is provided with a first waterproof terminal 116, the battery pack 160 is provided with a second waterproof terminal 161 that can be inserted into the first waterproof terminal 116, and at least one of the inner wall of the first waterproof terminal 116 and the outer wall of the second waterproof terminal 161 is provided with a third sealing member 162.

[0060] Combination Figure 9 and Figure 10 As shown, the cooperation of the first waterproof terminal 116 and the second waterproof terminal 161 improves the sealing between the battery pack 160 and the battery mounting cavity 115, preventing the battery pack 160 from malfunctioning due to external water and moisture, thereby reducing the risk of leakage and failure of the battery pack 160. Furthermore, during the assembly and disassembly of the battery pack 160, the third sealing element 162 can further seal the first waterproof terminal 116 and the second waterproof terminal 161 without requiring repeated adjustments to the waterproof structure. In addition, by setting the third sealing element 162, a certain installation gap can be compensated, allowing the battery pack 160 to be adapted to first waterproof terminals 116 of different precision, ensuring power supply performance while reducing the assembly tolerance requirements between the battery pack 160 and the frame 110.

[0061] This utility model also provides a robot, including multiple legs and the aforementioned body structure, with the multiple legs rotatably connected to the body structure. In this embodiment, four legs are provided, rotatably connected to the body structure at intervals. The swing trajectory and support angle of each leg can be independently adjusted, reducing the risk of overload on a single leg. Simultaneously, it adapts to gait switching in multiple scenarios such as walking, climbing, and obstacle crossing, reducing interference between leg movements and improving the stability of the quadruped robot in complex terrain. Each leg can be independently assembled and disassembled; therefore, when a single leg malfunctions, it can be repaired or replaced without disassembling the entire body structure, shortening the maintenance cycle and reducing operating costs. The specific structure of the legs is not the focus of this embodiment and can be referenced from existing technologies; it will not be elaborated here.

[0062] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A fuselage structure, characterized in that, include: The main module (100) includes a frame (110) and a cover plate (120). The frame (110) is provided with a first mounting cavity (111) for accommodating the motherboard circuit board (10). The cover plate (120) is located on the frame (110) at the opening end corresponding to the first mounting cavity (111) for sealing the first mounting cavity (111). An auxiliary heat dissipation module (200) is disposed in the first mounting cavity (111). The auxiliary heat dissipation module (200) is attached to both the motherboard circuit board (10) and the inner wall of the first mounting cavity (111). The auxiliary heat dissipation module (200) is used to conduct the heat of the motherboard circuit board (10) to the frame (110).

2. The fuselage structure according to claim 1, characterized in that, The auxiliary heat dissipation module (200) includes at least one heat pipe (210). The first end of the heat pipe (210) is connected to the inner wall of the first mounting cavity (111), and the second end can be attached to the motherboard circuit board (10). The heat pipe (210) is provided with a lower contact surface (212) corresponding to the motherboard circuit board (10), and the lower contact surface (212) is set as a horizontal surface.

3. The fuselage structure according to claim 2, characterized in that, The auxiliary heat dissipation module (200) also includes an auxiliary plate (220) and a mounting plate (240). The second end of the heat pipe (210) is fixedly connected to the auxiliary plate (220). The lower end face of the auxiliary plate (220) is attached to the main circuit board (10). The first end of the heat pipe (210) is connected to the bottom wall of the first mounting cavity (111) through the mounting plate (240).

4. The fuselage structure according to claim 2, characterized in that, The auxiliary heat dissipation module (200) also includes a plurality of heat dissipation fins (230), which are spaced apart on the frame (110) corresponding to the opening ends of the first mounting cavity (111), and are all arranged in correspondence with the heat pipe (210).

5. The fuselage structure according to claim 1, characterized in that, The main module (100) further includes a base plate (130), a first seal (140) and / or a second seal (150), and the frame (110) is provided with a second mounting cavity (112) for accommodating the control circuit board (20), and the base plate (130) covers the opening end of the second mounting cavity (112); The first sealing element (140) is sealed and abuts between the cover plate (120) and the frame (110), and the second sealing element (150) is sealed and abuts between the bottom plate (130) and the frame (110).

6. The fuselage structure according to claim 5, characterized in that, Both the first sealing element (140) and the second sealing element (150) are configured as annular sealing rings. The skeleton (110) is provided with a first annular sealing groove (113) for accommodating the first sealing element (140) corresponding to the first mounting cavity (111), and a second annular sealing groove (114) for accommodating the second sealing element (150) corresponding to the second mounting cavity (112).

7. The fuselage structure according to claim 6, characterized in that, Both the first annular sealing groove (113) and the second annular sealing groove (114) are coated with a waterproof layer; And / or, the width of the bottom wall of the first annular sealing groove (113) is greater than the width of its opening, and the width of the bottom wall of the second annular sealing groove (114) is greater than the width of its opening.

8. The fuselage structure according to claim 5, characterized in that, The frame (110) is integrally formed. The bottom wall of the second mounting cavity (112) is provided with at least one wiring channel communicating with the first mounting cavity (111). Both the second mounting cavity (112) and the first mounting cavity (111) are provided with external interfaces (1101), and waterproof connectors are provided for the external interfaces (1101).

9. The fuselage structure according to claim 5, characterized in that, The main module (100) also includes a battery pack (160), and the frame (110) is provided with a battery mounting cavity (115) for accommodating the battery pack (160). The bottom wall of the battery mounting cavity (115) is provided with a first waterproof terminal (116), and the battery pack (160) is provided with a second waterproof terminal (161) that can be inserted into the first waterproof terminal (116). At least one of the inner wall of the first waterproof terminal (116) and the outer wall of the second waterproof terminal (161) is provided with a third sealing element (162).

10. A robot, characterized in that, It includes multiple legs and a fuselage structure as described in any one of claims 1-9, wherein the multiple legs are rotatably connected to the fuselage structure.

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