A positioning mechanism for wafer cutting equipment

Abstract

The utility model discloses a positioning mechanism for wafer cutting equipment belongs to wafer processing technical field, including support station, the inside through mobile subassembly of support station is installed with moving platform, the top fixed connection of moving platform has the placement platform, the lateral surface of placement platform is equipped with the spacing slide groove that is circular array distribution, the inside sliding connection of spacing slide groove has the spacing slide block, the utility model, the placement platform middle part positioning subassembly, vacuum pump work produces the negative pressure, through the air suction pipe, the air duct conduction to the air suction hole of circular array, from the uniform adsorption of wafer below to it, with the clamping assembly forms " clamping + adsorption " double positioning, greatly promoted the stability and security of wafer positioning, prevent wafer displacement influence cutting accuracy in the cutting process, the overall structure design is reasonable, and the positioning is accurate and good to wafer protection, can effectively guarantee wafer cutting processing quality and efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of wafer processing technology, and specifically relates to a positioning mechanism for wafer dicing equipment. Background Technology

[0002] In the wafer manufacturing process, all processes, from photolithography and etching to ion implantation, are carried out simultaneously on a whole circular wafer. This method can maximize the use of wafer area, improve production efficiency, and reduce the cost per chip. However, after all the front-end processes are completed, the hundreds or even thousands of chips that are closely arranged on the wafer are still connected as one, and cannot be directly used for subsequent packaging, testing, and assembly of end products. Therefore, it is necessary to use a dicing process to separate them one by one along the dicing channels reserved between the chips, laying the foundation for each chip to enter the subsequent stages and eventually become the core component of electronic devices.

[0003] Chinese utility model patent CN217346123U discloses a positioning device for a wafer dicing machine, including a processing box and a positioning seat. The processing box has movable slots on both sides, and a first threaded rod is rotatably connected within each slot. A first servo motor is fixedly installed on one side of the processing box, and its output end is connected to the first threaded rod. Movable blocks are fixedly installed on both sides of the positioning seat, and the two movable blocks are threadedly connected to the first threaded rod. Clamping mechanisms are provided on both sides of the positioning seat. An installation slot is provided within the positioning seat, and a second servo motor is fixedly installed within it. The output end of the second servo motor is connected to a placement tray via a coupling. This positioning device for a wafer dicing machine features high precision, fully automatic operation, and convenient wafer clamping.

[0004] Although existing devices achieve clamping and positioning through clamping blocks and baffles, they do not have a structure for auxiliary fixation from below the wafer. They rely solely on clamping force from one side, which can easily lead to displacement during the cutting process due to external forces or the characteristics of the wafer itself, making it difficult to guarantee long-term cutting accuracy. Utility Model Content

[0005] The purpose of this invention is to provide a positioning mechanism for wafer dicing equipment to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a positioning mechanism for a wafer dicing equipment, comprising a support platform, a movable platform mounted inside the support platform via a movable component, a placement platform fixedly connected to the top of the movable platform, a limiting groove distributed in a circumferential array on the side surface of the placement platform, a limiting slider slidably connected inside the limiting groove, a clamping block fixedly connected to the side of the limiting slider, a clamping component for driving the limiting slider to move inside the placement platform, a positioning component in the middle of the placement platform, the positioning component including a gas guide pipe fixedly installed in the middle of the placement platform, a plurality of suction holes distributed in a circumferential array on the upper part of the gas guide pipe, a suction pipe fixedly connected to the lower part of the gas guide pipe, a vacuum pump fixedly connected to the other end of the suction pipe, and the vacuum pump fixedly installed on the right side of the movable platform.

[0007] In a preferred embodiment, the clamping assembly includes a connecting block fixedly connected to the bottom of the limiting slider, a connecting rod fixedly connected to the side of the connecting block, and an inclined block fixedly connected to the end of the connecting rod away from the connecting block.

[0008] In a preferred embodiment, a square block is slidably connected to the outer side of the inclined block, and the side of the square block is provided with an inclined groove adapted to the inclined block. A cylinder is fixedly connected to the bottom of the square block, and the cylinder is located inside the moving platform.

[0009] In a preferred embodiment, the moving component includes a moving slide groove with an interior of a support platform, a lead screw rotatably connected inside the moving slide groove, a servo motor fixedly mounted at the front end of the support platform, the transmission end of the servo motor being driven and connected to the lead screw, and a threaded hole being formed inside the bottom of the moving platform, through which the moving platform is threadedly connected to the lead screw.

[0010] In a preferred embodiment, the connecting rod includes a sleeve rod fixedly connected to the limiting slider and a telescopic rod connected to the inclined block, wherein the end of the sleeve rod away from the limiting slider is provided with a telescopic groove.

[0011] In a preferred embodiment, the end of the telescopic rod away from the inclined block is slidably connected inside the telescopic groove, and a tension sensor is fixedly connected between the telescopic rod and the sleeve rod.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This invention, driven by the clamping assembly, enables the clamping block to precisely center the wafer. The rubber clamping block increases friction with the wafer, preventing slippage during clamping, and effectively avoids scratches, pressure damage, and other injuries caused by rigid contact, providing excellent protection. Simultaneously, in the positioning assembly in the center of the stage, the vacuum pump generates negative pressure, which is transmitted through the suction pipe and guide pipe to the suction holes in the circumferential array, uniformly adsorbing the wafer from below. This, combined with the clamping assembly, forms a dual positioning system of "clamping + adsorption," significantly improving the stability and safety of wafer positioning. It prevents wafer displacement during cutting from affecting cutting accuracy. The overall structure is rationally designed, providing accurate positioning and good wafer protection, effectively ensuring the quality and efficiency of wafer cutting.

[0013] In this utility model, the telescopic groove of the sleeve provides sliding space for the telescopic rod. When the clamping block clamps the wafer, the telescopic rod moves within the telescopic groove. The tension sensor detects the change in tension between the sleeve and the telescopic rod in real time, thereby reflecting the clamping force of the clamping block on the wafer. Through the installation of the tension sensor, this utility model can accurately monitor the clamping force, making it easy for operators to adjust the clamping force according to the wafer material and thickness, avoiding wafer damage due to excessive clamping or unstable positioning due to excessive clamping. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model; Figure 2 This is a three-dimensional structural diagram of the mobile platform and placement platform components of this utility model; Figure 3 This is a schematic diagram of the internal three-dimensional structure of the placement platform of this utility model; Figure 4 This is a three-dimensional structural diagram of the placement platform of this utility model viewed from below; Figure 5 This is a three-dimensional cross-sectional view of the connecting rod of this utility model.

[0015] In the diagram: 1. Support platform; 2. Moving platform; 3. Placement platform; 4. Limiting slide groove; 5. Limiting slider; 6. Clamping block; 101. Moving slide groove; 102. Lead screw; 103. Servo motor; 104. Threaded hole; 301. Air guide pipe; 302. Air intake hole; 303. Air intake pipe; 304. Vacuum pump; 501. Connecting block; 502. Connecting rod; 503. Inclined block; 504. Square block; 505. Inclined groove; 506. Cylinder; 5021. Sleeve rod; 5022. Telescopic groove; 5023. Telescopic rod; 5024. Tension sensor. Detailed Implementation

[0016] The present invention will be further described below with reference to the embodiments.

[0017] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0018] Please see Figure 1-5 This utility model provides a positioning mechanism for a wafer dicing machine, including a support platform 1. A movable platform 2 is installed inside the support platform 1 via a movable component, which can move a placement platform 3 and the wafer placed on top of it, thereby adjusting the position of the wafer. The placement platform 3 is fixedly connected to the top of the movable platform 2 for supporting the wafer. A circumferentially arrayed limiting groove 4 is formed on the side surface of the placement platform 3. A limiting slider 5 is slidably connected inside the limiting groove 4. Driven by a clamping component, the limiting slider 5 can drive a clamping block 6 to center the wafer. The clamping block 6, made of rubber, is fixedly connected to the side of the limiting slider 5, increasing friction with the wafer and providing a gripping effect. The wafer serves a protective function. The placement stage 3 is equipped with a clamping assembly that drives the movement of the limiting slider 5. A positioning assembly is located in the middle of the placement stage 3. The positioning assembly includes a gas guide pipe 301 fixedly installed in the middle of the placement stage 3. Several suction holes 302 are arranged in a circular array on the upper part of the gas guide pipe 301. The suction holes 302 can adsorb the lower part of the wafer, thereby improving the safety and stability of wafer positioning. The lower part of the gas guide pipe 301 is fixedly connected to a suction pipe 303. The other end of the suction pipe 303 is fixedly connected to a vacuum pump 304. The vacuum pump 304 generates negative pressure when it works, thereby enabling the suction holes 302 to generate suction. The vacuum pump 304 is fixedly installed on the right side of the moving stage 2.

[0019] In the process of using this utility model, the wafer is first placed on the top of the placement stage 3. Then, the clamping assembly drives the limiting slider 5, which in turn drives the clamping block 6 to center and clamp the wafer. After that, the vacuum pump 304 is started to generate negative pressure, thereby achieving vacuum adsorption of the wafer through the suction pipe 303, the guide pipe 301 and the suction hole 302, thus further positioning the wafer.

[0020] Specifically, such as Figure 4 and Figure 5As shown, the clamping assembly includes a connecting block 501 fixedly connected to the bottom of the limiting slider 5. A connecting rod 502 is fixedly connected to the side of the connecting block 501. An inclined block 503 is fixedly connected to the end of the connecting rod 502 away from the connecting block 501. A square block 504 is slidably connected to the outside of the inclined block 503. An inclined groove 505 adapted to the inclined block 503 is opened on the side of the square block 504. A cylinder 506 is fixedly connected to the bottom of the square block 504. The cylinder 506 is also located inside the moving platform 2.

[0021] When the clamping assembly of this utility model is working, the cylinder 506 drives the square block 504 to move up and down. The inclined groove 505 on the side of the square block 504 slides with the inclined block 503. When the square block 504 moves, the inclined groove 505 squeezes the inclined block 503, causing the inclined block 503 to drive the limiting slider 5 to slide in the limiting groove 4 through the connecting rod 502 and the connecting block 501. This causes the clamping block 6 to move closer to the center or open outward, thereby achieving the clamping or releasing of the wafer.

[0022] Specifically, such as Figure 1 and Figure 3 As shown, the moving component includes a moving slide 101 with a support platform 1 inside, a moving platform 2 slidably connected inside the moving slide 101, a lead screw 102 rotatably connected inside the moving slide 101, a servo motor 103 fixedly installed at the front end of the support platform 1, the transmission end of the servo motor 103 being drivenly connected to the lead screw 102, and a threaded hole 104 is opened inside the bottom of the moving platform 2, through which the moving platform 2 is threadedly connected to the lead screw 102.

[0023] In this utility model, after the servo motor 103 starts, it drives the lead screw 102 to rotate in the moving slide 101. Since the moving platform 2 is threadedly connected to the lead screw 102 through the threaded hole 104 at the bottom, the rotational motion of the lead screw 102 is converted into the linear motion of the moving platform 2 along the moving slide 101, thereby driving the placement platform 3 and the structure above to move synchronously.

[0024] Specifically, such as Figure 5 As shown, the connecting rod 502 includes a sleeve rod 5021 fixedly connected to the limiting slider 5 and a telescopic rod 5023 connected to the inclined block 503. The sleeve rod 5021 has a telescopic groove 5022 at one end away from the limiting slider 5. The telescopic rod 5023 is slidably connected to the inside of the telescopic groove 5022 at one end away from the inclined block 503. A tension sensor 5024 is fixedly connected between the telescopic rod 5023 and the sleeve rod 5021.

[0025] In the connecting rod 502 of this utility model, the telescopic groove 5022 of the sleeve rod 5021 provides sliding space for the telescopic rod 5023. When the clamping block 6 clamps the wafer, the telescopic rod 5023 moves within the telescopic groove 5022. The tension sensor 5024 detects the change in tension between the sleeve rod 5021 and the telescopic rod 5023 in real time, thereby reflecting the clamping force of the clamping block 6 on the wafer. Through the installation of the tension sensor 5024, this utility model can accurately monitor the clamping force, making it convenient for operators to adjust the clamping force according to the wafer material and thickness, avoiding wafer damage due to excessive clamping or unstable positioning due to excessive clamping.

[0026] Working principle and usage process of this utility model: When operating the mechanism, the operator first places the wafer to be cut on the placement stage 3 to complete the initial loading of the wafer. Then, the cylinder 506 is activated, and the telescopic end of the cylinder 506 drives the square block 504 to move up and down. The inclined groove 505 on the side of the square block 504 is adapted to the inclined block 503 and slides with the inclined block 503. During the movement of the square block 504, the inclined groove 505 squeezes the inclined block 503, causing the inclined block 503 to drive the limiting slider 5 to slide in the limiting groove 4 through the connecting rod 502 and the connecting block 501, thereby allowing the limiting slider to slide. The rubber clamping block 6 fixed on the side of block 5 moves towards the center to achieve center positioning and clamping of the wafer. During this process, the telescopic groove 5022 inside the sleeve 5021 of the connecting rod 502 provides sliding space for the telescopic rod 5023. The tension sensor 5024 between the telescopic rod 5023 and the sleeve 5021 detects the change in tension between them in real time. The operator can judge the clamping force of the clamping block 6 on the wafer based on the change in tension, and adjust the driving force of the cylinder 506 in combination with the wafer material and thickness to avoid clamping too tightly or too loosely. Then, the vacuum pump 304 fixed on the right side of the moving stage 2 is started. The vacuum pump 304 generates negative pressure, which is conducted through the suction pipe 303 to the air guide pipe 301 fixed in the middle of the placement stage 3. This causes the suction holes 302 arranged in a circular array on the upper part of the air guide pipe 301 to generate suction force, adsorbing the wafer from below and further enhancing the stability of wafer positioning. If the wafer dicing position needs to be adjusted, the operator starts the servo motor 103 at the front end of the support platform 1. The transmission end of the servo motor 103 drives the lead screw 102 to rotate. Since the moving platform 2 is threadedly connected to the lead screw 102 through the bottom threaded hole 104, the rotational motion of the lead screw 102 is converted into the linear motion of the moving platform 2 along the moving slide 101, which drives the placement platform 3 and the wafer positioned above to move synchronously until the wafer is adjusted to the required dicing position, thus completing the entire positioning and position adjustment process.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning mechanism for a wafer dicing machine, comprising a support platform (1), characterized in that: The support platform (1) is equipped with a moving platform (2) inside by a moving component. The top of the moving platform (2) is fixedly connected to a placement platform (3). The side surface of the placement platform (3) is provided with a limiting slide groove (4) arranged in a circular array. The limiting slide groove (4) is slidably connected to a limiting slider (5). The side of the limiting slider (5) is fixedly connected to a clamping block (6). The placement platform (3) is provided with a clamping component that drives the limiting slider (5) to move. The middle of the placement platform (3) is provided with a positioning component. The positioning component includes an air guide pipe (301) fixedly installed in the middle of the placement platform (3). The upper part of the air guide pipe (301) is provided with a number of suction holes (302) arranged in a circular array. The lower part of the air guide pipe (301) is fixedly connected to a suction pipe (303). The other end of the suction pipe (303) is fixedly connected to a vacuum pump (304). The vacuum pump (304) is fixedly installed on the right side of the moving platform (2).

2. The positioning mechanism for a wafer dicing equipment according to claim 1, characterized in that: The clamping assembly includes a connecting block (501) fixedly connected to the bottom of the limiting slider (5), a connecting rod (502) fixedly connected to the side of the connecting block (501), and an inclined block (503) fixedly connected to the end of the connecting rod (502) away from the connecting block (501).

3. The positioning mechanism for a wafer dicing equipment according to claim 2, characterized in that: A square block (504) is slidably connected to the outside of the inclined block (503). The side of the square block (504) is provided with an inclined groove (505) adapted to the inclined block (503). A cylinder (506) is fixedly connected to the bottom of the square block (504). The cylinder (506) is located inside the moving platform (2).

4. The positioning mechanism for a wafer dicing equipment according to claim 1, characterized in that: The moving component includes a moving slide (101) with a support platform (1) inside, a lead screw (102) is rotatably connected inside the moving slide (101), a servo motor (103) is fixedly installed at the front end of the support platform (1), the transmission end of the servo motor (103) is drivenly connected to the lead screw (102), and a threaded hole (104) is opened inside the bottom of the moving platform (2), and the moving platform (2) is threadedly connected to the lead screw (102) through the threaded hole (104).

5. A positioning mechanism for a wafer dicing equipment according to claim 2, characterized in that: The connecting rod (502) includes a sleeve rod (5021) fixedly connected to the limiting slider (5) and a telescopic rod (5023) connected to the inclined block (503). The sleeve rod (5021) has a telescopic groove (5022) at one end away from the limiting slider (5).

6. The positioning mechanism for a wafer dicing equipment according to claim 5, characterized in that: The end of the telescopic rod (5023) away from the inclined block (503) is slidably connected inside the telescopic groove (5022), and a tension sensor (5024) is fixedly connected between the telescopic rod (5023) and the sleeve rod (5021).

Images