A polyimide film attaching apparatus

Abstract

The utility model discloses a kind of polyimide film pasting equipment, specifically related to film pasting equipment technical field, including mounting bracket, vertical installation is equipped with first lifting cylinder on the mounting bracket, the drive end of first lifting cylinder is fixedly installed with dredging device, mounting longitudinal frame is fixedly installed in mounting bracket bottom end one side, second lifting cylinder is fixedly installed on mounting longitudinal frame, the drive end of second lifting cylinder is fixedly installed with pressure cutting device;The dredging device includes device cross frame, and device cross frame is fixedly installed in the drive end of first lifting cylinder, this pasting equipment can limit the PI film and carry out dredging transmission, and PI film can be automatically pasted to the position that entire circuit board needs to be pasted PI film, prevent PI film from appearing position deviation, bubble, wrinkle, to improve the quality of product, and PI film surface can be prevented from being polluted when pasting manually, affect subsequent process reliability.

Description

Technical Field

[0001] This utility model relates to the field of film application equipment technology, specifically a polyimide film application device. Background Technology

[0002] Polyimide film, as a polymer material with excellent high temperature resistance, insulation, mechanical strength and chemical stability, has been widely used in high-end manufacturing fields such as electronic information, aerospace and new energy. For example, it is used as an insulating protective layer in circuit board production, and its bonding quality directly affects the performance and reliability of the end product.

[0003] Traditional PI film application relies primarily on manual labor. Rolls of PI film are manually cut to the specified size and then aligned with the desired position on the circuit board. This method is not only labor-intensive and inefficient, but also susceptible to hand tremors and visual biases, leading to issues such as misalignment, bubbles, and wrinkles. Consequently, product yield is difficult to control consistently. Furthermore, manual contact with the film can cause surface contamination, affecting the reliability of subsequent processes. Therefore, we propose a polyimide film application device to address these problems. Utility Model Content

[0004] The purpose of this invention is to provide a polyimide film application device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a polyimide film application device, comprising a mounting bracket, a first lifting cylinder vertically mounted on the mounting bracket, a guiding device fixedly mounted on the driving end of the first lifting cylinder, a mounting longitudinal frame fixedly mounted on one side of the bottom end of the mounting bracket, a second lifting cylinder fixedly mounted on the mounting longitudinal frame, and a pressure cutting device fixedly mounted on the driving end of the second lifting cylinder; The guiding device includes a horizontal frame, which is fixedly installed on the drive end of the first lifting cylinder. A first vertical frame is vertically installed on one side of the bottom of the horizontal frame, and a material placement component is provided at the bottom of the first vertical frame. A second vertical frame is fixedly installed on the other side of the bottom of the horizontal frame, and an inclined support is fixedly installed at the bottom of the second vertical frame. A guiding component is provided on the side of the inclined support close to the material placement component, and a limiting component is provided on the side of the inclined support away from the material placement component. An auxiliary cutting component corresponding to the pressure cutting device is provided at the bottom of the limiting component.

[0006] Preferably, the material placement component includes a material placement roller, which is rotatably mounted on the bottom of the first longitudinal frame via a bearing. A limit plate is fixedly installed on the outer side of the material placement roller, and a positioning nut is threaded onto the end of the material placement roller away from the first longitudinal frame.

[0007] Preferably, the guiding component includes a guiding roller, which is rotatably mounted on the side of the inclined bracket near the material placement component via a bearing. A limit ring is fixedly installed on the outer side of the guiding roller, and a positioning screw ring is threaded onto the end of the guiding roller away from the inclined bracket.

[0008] Preferably, the limiting component includes a mounting bracket, which is fixedly installed on the side of the inclined bracket away from the material placement component. A limiting base plate is vertically installed at the bottom end of the mounting bracket, and a limiting top plate is fixedly installed at the top end of the limiting base plate by screws. Positioning strips are fixedly installed on opposite sides of the limiting base plate and the limiting top plate.

[0009] Preferably, the pressure cutting device includes an L-shaped support, which is fixedly installed on the drive end of the second lifting cylinder. A pressure roller is rotatably installed on the bottom of the L-shaped support. A longitudinal slide seat is slidably mounted on one side of the L-shaped support. A mounting cross seat is vertically mounted on one end of the longitudinal slide seat. A cutting top blade is fixedly mounted on the bottom end of the mounting cross seat by bolts. A first telescopic cylinder is fixedly mounted on the side of the L-shaped support near the longitudinal slide seat. The drive end of the first telescopic cylinder is fixedly installed on the top end of the longitudinal slide seat.

[0010] Preferably, the auxiliary cutting component includes two guide bottom frames, which are fixedly installed at the bottom end of the limiting base plate. A guide horizontal shaft is vertically installed on the guide bottom frame, and a cutting bottom knife is movably installed on the outer side of the guide horizontal shaft. A second telescopic cylinder is vertically installed on the guide bottom frame, and the drive end of the second telescopic cylinder and the cutting bottom knife are fixedly installed.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. This bonding equipment can limit and guide the transmission of PI film, and can automatically bond the PI film to the entire circuit board where the PI film needs to be bonded, preventing the PI film from being misaligned, having bubbles, or wrinkles, thereby improving product quality. It can also prevent the PI film surface from being contaminated during manual bonding, which would affect the reliability of subsequent processes.

[0012] 2. This bonding equipment can adapt to PI films of different widths and sizes by adjusting the distance between the positioning screw ring and the limiting ring, thus increasing the flexibility of the entire bonding equipment. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the structure of this utility model.

[0015] Figure 2 This is a schematic diagram of the drainage device in this utility model.

[0016] Figure 3 This is a schematic diagram of the limiting component and auxiliary cutting component in this utility model.

[0017] Figure 4 This is a schematic diagram of the pressure cutting device in this utility model.

[0018] In the diagram: 1. Mounting bracket; 11. First lifting cylinder; 12. Mounting longitudinal frame; 13. Second lifting cylinder; 2. Guiding device; 21. Device cross frame; 211. First longitudinal frame; 22. Feeding roller; 221. Limiting plate; 222. Positioning nut; 212. Second longitudinal frame; 23. Inclined bracket; 24. Guiding roller; 241. Limiting ring; 242. Positioning screw ring; 25. Limiting component; 251. Mounting frame; 252. Limiting base plate; 253. Limiting top plate; 254. Positioning strip; 26. Guide bottom frame; 261. Guide horizontal shaft; 262. Cutting bottom knife; 263. Second telescopic cylinder; 3. Pressing and cutting device; 31. L-shaped support; 32. Overlapping pressure roller; 33. Longitudinal slide seat; 331. First telescopic cylinder; 34. Mounting cross seat; 35. Cutting top knife. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: Figure 1-4 As shown, this utility model provides a polyimide film pasting device, including a mounting bracket 1. A first lifting cylinder 11 is vertically mounted on the mounting bracket 1. A guiding device 2 is fixedly mounted on the driving end of the first lifting cylinder 11. The guiding device 2 is driven to slide vertically by opening the first lifting cylinder 11. A mounting frame 12 is fixedly mounted on one side of the bottom end of the mounting bracket 1. A second lifting cylinder 13 is fixedly mounted on the mounting frame 12. A cutting device 3 is fixedly mounted on the driving end of the second lifting cylinder 13. The cutting device 3 is driven to slide vertically at an angle by opening the second lifting cylinder 13. The guiding device 2 includes a device cross frame 21, which is fixedly installed on the drive end of the first lifting cylinder 11. A first longitudinal frame 211 is vertically installed on one side of the bottom end of the device cross frame 21. A material placement component is provided at the bottom of the first longitudinal frame 211. The material placement component includes a material placement roller 22, which is rotatably installed on the bottom of the first longitudinal frame 211 through a bearing. A limit plate 221 is fixedly installed on the outer side of the material placement roller 22. A positioning nut 222 is threadedly installed on the end of the material placement roller 22 away from the first longitudinal frame 211. A roll of PI film is installed on the material placement roller 22 and positioned using the positioning nut 222. A second longitudinal frame 212 is fixedly installed on the other side of the bottom of the cross frame 21 of the device. An inclined support 23 is fixedly installed on the bottom of the second longitudinal frame 212. A guide component is provided on the side of the inclined support 23 near the material placement component. The guide component includes a guide roller 24. The guide roller 24 is rotatably installed on the side of the inclined support 23 near the material placement component through a bearing. A limit ring 241 is fixedly installed on the outer side of the guide roller 24. A positioning screw ring 242 is threadedly installed on the end of the guide roller 24 away from the inclined support 23. The PI film is placed on the outer side of the guide roller 24 and limited by the limit ring 241 and the positioning screw ring 242. In this way, the PI film can be limited and guided by the guide roller 24, thereby improving the transmission stability of the PI film. The distance between the positioning screw ring 242 and the limit ring 241 can be adjusted to accommodate PI films of different widths and sizes, increasing the flexibility of the entire lamination equipment. The inclined support 23 has a limiting member 25 on the side away from the material placement part, and the bottom end of the limiting member 25 has an auxiliary cutting part corresponding to the pressure cutting device 3.

[0021] The limiting component 25 includes a mounting bracket 251, which is fixedly installed on the side of the inclined bracket 23 away from the material placement component. A limiting base plate 252 is vertically installed at the bottom end of the mounting bracket 251, and a limiting top plate 253 is fixedly installed at the top end of the limiting base plate 252 by screws. Positioning strips 254 are fixedly installed on opposite sides of the limiting base plate 252 and the limiting top plate 253 to limit the PI film, prevent the end of the PI film from sinking significantly, and extend the end of the PI film a short distance beyond the limiting base plate 252 and the limiting top plate 253.

[0022] The pressure cutting device 3 includes an L-shaped support 31, which is fixedly installed on the drive end of the second lifting cylinder 13. A pressure roller 32 is rotatably installed on the bottom of the L-shaped support 31. The circuit board that needs to be PI film coated is automatically transported by external transport equipment to the bottom of the guiding device 2, so that the initial position of the circuit board where the PI film needs to be coated is vertically aligned with the end of the PI film that extends a short distance from the limiting bottom plate 252 and the limiting top plate 253. Then, the entire guiding device 2 is lowered, at which point the end of the PI film contacts the circuit board that needs to be coated. The PI film is initially positioned, and then the second lifting cylinder 13 is activated to drive the covering roller 32 to descend. The covering roller 32 presses on the end of the PI film, so that the end of the PI film is automatically attached to the circuit board. Then, the circuit board continues to be transported, and in conjunction with the covering roller 32, the roll of PI film is continuously unwound until the PI film is automatically attached to the entire position of the circuit board where the PI film needs to be pasted. This prevents the PI film from being misaligned, having bubbles, or wrinkles, thereby improving the quality of the product. It can also prevent the PI film surface from being contaminated during manual application, which would affect the reliability of subsequent processes. A longitudinal slide seat 33 is slidably mounted on one side of the L-shaped support 31. A mounting cross seat 34 is vertically mounted on one end of the longitudinal slide seat 33. A cutting top knife 35 is fixedly mounted on the bottom end of the mounting cross seat 34 by bolts. A first telescopic cylinder 331 is fixedly mounted on the side of the L-shaped support 31 near the longitudinal slide seat 33. The drive end of the first telescopic cylinder 331 is fixedly mounted to the top end of the longitudinal slide seat 33. After the PI film is automatically applied to the entire circuit board where the PI film needs to be pasted, the first telescopic cylinder 331 is activated to drive the cutting top knife 35 to descend. The auxiliary cutting component includes two guide bottom frames 26, which are fixedly installed at the bottom end of the limiting base plate 252. A guide horizontal shaft 261 is vertically installed on the guide bottom frame 26, and a cutting bottom blade 262 is movably installed on the outer side of the guide horizontal shaft 261. A second telescopic cylinder 263 is vertically installed on the guide bottom frame 26. The driving end of the second telescopic cylinder 263 is fixedly installed with the cutting bottom blade 262. When the second telescopic cylinder 263 is activated, it drives the cutting bottom blade 262 to move towards the side closer to the cutting top blade 35, so that the cutting bottom blade 262 and the cutting top blade 35 come into contact and automatically cut the PI film. At the same time, the end of the cut PI film still extends a short distance beyond the limiting base plate 252 and the limiting top plate 253.

[0023] Working principle: When in use, the roll of PI film is installed on the feeding roller 22 and positioned using the positioning nut 222. The PI film is placed on the outside of the guide roller 24 and limited by the limiting ring 241 and the positioning screw ring 242. In this way, the PI film can be limited and guided by the guide roller 24. The PI film is placed between the limiting bottom plate 252 and the limiting top plate 253 to limit it, preventing the end of the PI film from sinking significantly, and the end of the PI film extends a short distance beyond the limiting bottom plate 252 and the limiting top plate 253. The circuit board requiring PI film application is automatically transported by external transport equipment. The circuit board is automatically transported to the bottom of the guide device 2, so that the initial position of the circuit board where the PI film needs to be applied is vertically aligned with the end of the PI film extending a short distance from the limiting bottom plate 252 and the limiting top plate 253. Then, the entire guide device 2 is controlled to descend. At this time, the end of the PI film contacts the initial position of the circuit board where the PI film needs to be applied. Then, the second lifting cylinder 13 is activated to drive the covering roller 32 to descend. The covering roller 32 presses on the end of the PI film, so that the end of the PI film is automatically applied to the circuit board. Then, the circuit board continues to be transported. With the covering roller 32 pressing, the roll of PI film is continuously unwound until the PI film is automatically applied to the entire position of the circuit board where the PI film needs to be applied. This prevents the PI film from being misaligned, having bubbles, or wrinkles, thereby improving the quality of the product. It can also prevent the PI film surface from being contaminated during manual application, which would affect the reliability of subsequent processes. After the PI film is automatically applied to all the positions on the circuit board where the PI film needs to be pasted, the first telescopic cylinder 331 is activated to drive the cutting top blade 35 to descend, and at the same time the second telescopic cylinder 263 is activated to drive the cutting bottom blade 262 to move closer to the cutting top blade 35, so that the cutting bottom blade 262 and the cutting top blade 35 come into contact and automatically cut the PI film. At the same time, the end of the cut PI film still extends a short distance beyond the limiting bottom plate 252 and the limiting top plate 253.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A polyimide film application device, comprising a mounting bracket (1), characterized in that: A first lifting cylinder (11) is vertically mounted on the mounting bracket (1). A guide device (2) is fixedly mounted on the drive end of the first lifting cylinder (11). A mounting frame (12) is fixedly mounted on one side of the bottom end of the mounting bracket (1). A second lifting cylinder (13) is fixedly mounted on the mounting frame (12). A pressure cutting device (3) is fixedly mounted on the drive end of the second lifting cylinder (13). The guiding device (2) includes a device cross frame (21), which is fixedly installed on the drive end of the first lifting cylinder (11). A first longitudinal frame (211) is vertically installed on one side of the bottom end of the device cross frame (21). A material placement component is provided at the bottom of the first longitudinal frame (211). A second longitudinal frame (212) is fixedly installed on the other side of the bottom end of the device cross frame (21). An inclined bracket (23) is fixedly installed at the bottom end of the second longitudinal frame (212). A guiding component is provided on the side of the inclined bracket (23) close to the material placement component. A limiting component (25) is provided on the side of the inclined bracket (23) away from the material placement component. An auxiliary cutting component corresponding to the pressure cutting device (3) is provided at the bottom end of the limiting component (25).

2. The polyimide film bonding device according to claim 1, characterized in that: The material placement component includes a material placement roller (22), which is rotatably mounted on the bottom of the first longitudinal frame (211) via a bearing. A limit plate (221) is fixedly installed on the outer side of the material placement roller (22), and a positioning nut (222) is threaded onto the end of the material placement roller (22) away from the first longitudinal frame (211).

3. The polyimide film bonding device according to claim 1, characterized in that: The guiding component includes a guiding roller (24), which is rotatably mounted on the side of the inclined bracket (23) near the material placement component via a bearing. A limit ring (241) is fixedly installed on the outer side of the guiding roller (24), and a positioning screw ring (242) is threadedly installed on the end of the guiding roller (24) away from the inclined bracket (23).

4. The polyimide film bonding device according to claim 1, characterized in that: The limiting component (25) includes a mounting bracket (251), which is fixedly installed on the side of the inclined bracket (23) away from the material placement component. A limiting base plate (252) is vertically installed at the bottom end of the mounting bracket (251), and a limiting top plate (253) is fixedly installed at the top end of the limiting base plate (252) by screws. Positioning strips (254) are fixedly installed on the opposite sides of the limiting base plate (252) and the limiting top plate (253).

5. The polyimide film bonding device according to claim 1, characterized in that: The pressure cutting device (3) includes an L-shaped support (31), which is fixedly installed on the drive end of the second lifting cylinder (13). A pressure roller (32) is rotatably installed on the bottom of the L-shaped support (31). A longitudinal slide seat (33) is slidably mounted on one side of the L-shaped support (31). A mounting cross seat (34) is vertically mounted on one end of the longitudinal slide seat (33). A cutting top knife (35) is fixedly mounted on the bottom end of the mounting cross seat (34) by bolts. A first telescopic cylinder (331) is fixedly mounted on the side of the L-shaped support (31) near the longitudinal slide seat (33). The drive end of the first telescopic cylinder (331) and the top end of the longitudinal slide seat (33) are fixedly installed.

6. The polyimide film bonding device according to claim 1, characterized in that: The auxiliary cutting component includes two guide bottom frames (26), which are fixedly installed at the bottom end of the limiting base plate (252). A guide horizontal shaft (261) is vertically installed on the guide bottom frame (26), and a cutting bottom knife (262) is movably installed on the outer side of the guide horizontal shaft (261). A second telescopic cylinder (263) is vertically installed on the guide bottom frame (26), and the driving end of the second telescopic cylinder (263) and the cutting bottom knife (262) are fixedly installed.

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