A printable film product of a peelable substrate layer

Abstract

The utility model discloses a purpose at providing a kind of peelable substrate layer's printing film product, can realize when the functional structure layer of printing film product is fixedly attached in local structure surface, substrate structure layer is separated from the separable connecting structure layer boundary relative to functional structure layer quickly and efficiently, not only reduce the thickness of printing film product actual participation work to optimize electronic product internal space layout, but also can improve the working heat dissipation effect of attachment place. It contains the separable connecting structure layer in middle, substrate structure layer is provided in one side of the separable connecting structure layer, functional structure layer is provided in the other side of the separable connecting structure layer;The substrate structure layer and the separable connecting structure layer can be collectively separated by peeling relative to the functional structure layer and retain the functional structure layer on the surface of electronic product;The thickness of the substrate structure layer in it is set to 10-250 μ.

Description

Technical Field

[0001] This utility model relates to the field of internal printed film products for electronic products, specifically a printed film product with a peelable substrate layer. Background Technology

[0002] Printed film products used inside electronic devices mainly include polyester film (PET film), polyimide film (PI film), PEN film, PC film, and PBT film. Common products in practical applications include flexible printed circuit boards (FPC), optically transparent films, and electromagnetic shielding films. Flexible printed circuit boards use PI film as the substrate, printing circuits with conductive ink to connect electronic components, achieving thinness and flexibility. Optically transparent films are mainly used in LCD / LED displays, serving functions such as reflection, brightness enhancement, or anti-glare. Electromagnetic shielding films are used to prevent electromagnetic interference and protect the stable operation of internal components in electronic devices. These film products cover functions such as insulation, conductivity, electromagnetic wave shielding, optical control, and protection of electronic components. Their structure typically consists of a substrate layer, a functional coating or printed layer, and a protective layer. Currently, the development of printed film products is characterized by market growth, technological advancements, expanded application areas, and accelerated domestic substitution. With the rapid development of consumer electronics, new energy, and other industries, the demand for high-performance film materials is constantly increasing. The maturity of printed electronics technology, such as the application of roll-to-roll printing technology, has improved production efficiency, and breakthroughs have been achieved in the research and development of new conductive inks and high-performance thin film materials. In addition to traditional fields, printed film products are gradually expanding into emerging fields such as flexible electronics, wearable devices, and medical electronics.

[0003] As mentioned above, although these printed film products used inside various electronic products usually have various functional structural layers or surface coatings, because these material layers are relatively thin and precise, it is inevitable that some material layers with strong and tough structural properties need to be set as substrate layers during the manufacturing process. On the one hand, this can serve as the basis for setting or coating other structural layers, and on the other hand, it can also effectively protect the functional layers during the actual bonding and setting of these printed film products.

[0004] For example, Chinese invention patent application CN202410726986.4 discloses a light-shielding black electronic printing film, which includes a light-shielding layer, a substrate, an optical adhesive layer, and a release layer. The light-shielding layer is obtained by uniformly coating a light-shielding coating on the side of the substrate away from the optical adhesive layer and then curing it under AM1.5 light. The light-shielding coating includes, according to its raw material composition, a carboxyl acrylate copolymer resin epoxy resin, a polyurethane acrylic resin, a composite black pigment, a photoinitiator, a defoamer, a leveling agent, deionized water, (E)4-nitrophenyl 3-(4-nitrophenyl) acrylate, a wetting agent, and a sodium borohydride solution. The composite black pigment is a mixture of carbon black, polyacrylic acid, and black dendritic silicon-carbon hybrid mesoporous spheres loaded with gold nanoparticles. The light-shielding black electronic printing film given in this scheme has high hardness, good wear resistance, good impact resistance, and good structural properties. For example, Chinese utility model patent application CN201721852942.8 discloses a printable antistatic protective film, comprising a film substrate, with an antistatic printable coating and an antistatic coating respectively coated on both sides of the film substrate. A pressure-sensitive adhesive layer and a release layer are sequentially laminated on the side of the antistatic coating facing away from the film substrate. In practical applications, this type of film product, due to the antistatic treatment on both sides of the film substrate, can effectively release static electricity, preventing static damage to electronic products and avoiding the adsorption of impurities and dust. Simultaneously, the antistatic printable coating can be printed, allowing text or labels to be printed on the coating, achieving the dual function of a label and a protective film, thus offering greater versatility in use.

[0005] After analyzing and comparing a large number of printed film products with functional layers on their surfaces that are similar to the aforementioned reference solutions, the inventors found that although these printed film products inevitably have a substrate layer in their structure during manufacturing to enhance their structural strength and provide protection while facilitating the coating of other structural layers, when the printed film product is actually bonded to a local surface of the internal structure of an electronic product that requires coverage and bonding, the substrate layer is not needed to support or protect the printed film product. In this case, the continued presence of the substrate layer will instead occupy the already extremely dense and crowded internal space of the electronic product, and will also affect the heat dissipation performance of the local product module during operation.

[0006] To address the aforementioned issues, this invention provides a printable film product with a peelable substrate layer. This product enables the substrate layer to be quickly and efficiently separated from the functional layer at the boundary of the separable connecting layer after the functional structural layer of the printable film product is fixedly attached to the surface of a local structure. This not only reduces the thickness of the printable film product during actual operation to optimize the internal space layout of electronic products, but also improves the heat dissipation effect at the bonding point. Utility Model Content

[0007] This invention provides a printable film product with a peelable substrate layer, which enables the substrate layer to be quickly and efficiently separated from the functional layer at the boundary of the separable connecting layer after the functional structural layer of the printable film product is fixedly attached to the surface of a local structure. This not only reduces the thickness of the printable film product when it is actually used to optimize the internal space layout of electronic products, but also improves the heat dissipation effect at the bonding point.

[0008] The above-mentioned technical objective of this utility model is achieved through the following technical solution: A printable film product with a peelable substrate layer includes a separable connecting structure layer in the middle. A substrate structure layer is disposed on one side of the separable connecting structure layer to support the overall structure of the printable film. A functional structure layer is disposed on the other side of the separable connecting structure layer. The functional structure layer can be adhered and fixed to the surface of an electronic product and meet the functional requirements when the printable film is attached to the product surface. The substrate structure layer and the separable connecting structure layer can be peeled off relative to the functional structure layer, leaving the functional structure layer on the surface of the electronic product. The thickness of the substrate structure layer is set to 10-250 μm.

[0009] As a preferred embodiment of the present invention, an adjustment structure layer for controlling the surface structure state of the functional structure layer is further provided between the substrate structure layer and the separable connection structure layer.

[0010] As a preferred embodiment of the present invention, a second light-shielding structural layer is further provided on the outer surface of the functional structural layer.

[0011] As a preferred embodiment of the present invention, the thickness of the separable connecting structure layer is 0.1-1 μm.

[0012] As a preferred embodiment of the present invention, the thickness of the adjustment structure layer is 1-10 μm.

[0013] As a preferred embodiment of the present invention, the thickness of the light-shielding structure layer is 1-10 μm.

[0014] As a preferred embodiment of the present invention, the substrate structural layer contains PET, BOPP, or PI material.

[0015] In summary, this utility model can achieve the following beneficial effects: The peelable substrate layer printed film product provided in this utility model allows for the removal of the substrate layer and the separable connecting layer, which are unrelated to the application of the printed film, from the surface of the functional structural layer after the functional structural layer has been adhered to the interior or surface of the electronic product. This structure provides stable and reliable support for other structural layers during the manufacturing process, ensuring sufficient strength to prevent deformation or damage to the film. Furthermore, after the printed film is adhered and fixed to the working area of ​​the component or product, all other structural layers above the functional structural layer can be completely removed, significantly reducing the actual thickness of the printed film during operation. This provides designers with further optimization and improvement opportunities for the complex and precise spatial layout of electronic products, better meeting the miniaturization and lightweighting requirements of the electronics industry. Simultaneously, because the substrate layer can be removed during application, it also enhances the local heat dissipation capacity of the electronic product. Of course, when such printed film products are made of transparent materials and applied in the field of optical displays, the overall thickness of the film is reduced because the substrate structural layer is removed during operation. This results in a clearer and brighter display area, greatly improving the external appearance of the image. Furthermore, due to the detachable structure, the removed substrate structural layer and its associated detachable connecting structural layer can be recycled and reused, reducing the consumption of substrate materials and the generation of waste. This makes the printed film products more suitable for green and environmentally friendly production processes.

[0016] The peelable substrate layer printed film product provided in this utility model covers the actual application surface of the functional structural layer with a high-strength substrate layer, thus providing excellent protection and preventing damage to the thin and fragile functional structural layer during transfer or lamination. Simultaneously, because the high-strength substrate layer is quickly separated and removed after the rapid printing film product is applied to the target location, even when the printed film product is initially applied to uneven or bent areas of electronic products, the internal stress at these locations can be significantly reduced by peeling off the substrate layer, allowing the functional structural layer to adhere more stably, reliably, and firmly to the working area surface. Furthermore, since the outer application surface of the functional structural layer is only exposed after peeling, the surface smoothness of the functional structural layer when applied to specific areas of the electronic product is further ensured, making it more suitable for subsequent precision processing and improving product quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram showing the arrangement of the structural layers in a printable film product with a peelable substrate layer. Figure 2 A schematic diagram illustrating the principle that a functional structural layer in a printable film product with a peelable substrate layer is attached to the product surface and then separated from other structural layers. Figure 3 This refers to a structural arrangement in a printed film product with a peelable substrate layer, where an adjustment structure layer and a light-shielding structure layer are added. Detailed Implementation

[0018] The following specific embodiments are merely illustrative of the present invention and are not intended to limit the invention. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but such modifications are protected by patent law as long as they fall within the scope of the claims of the present invention.

[0019] This solution is achieved through the following technical means: Example: This example provides a printable film product with a peelable substrate layer, the structural layout of which can be referred to the accompanying drawings. The printable film product mainly includes a detachable connecting structural layer in the middle. A substrate structural layer is provided on one side of the detachable connecting structural layer to support the overall structure of the printable film. A functional structural layer is provided on the other side of the detachable connecting structural layer. The functional structural layer can be adhered and fixed to the surface of the electronic product and meets the functional requirements when the printable film is attached to the product surface. The substrate structural layer and the detachable connecting structural layer can be peeled off relative to the functional structural layer, leaving the functional structural layer on the surface of the electronic product.

[0020] Specifically, the substrate structural layer can be made of materials such as PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), which possess good structural strength, chemical stability, and high-temperature resistance. The functional structural layer typically needs to be selected and designed according to different practical application scenarios. Various resin systems and material types can be rationally combined based on actual requirements and product specifications. In the solution presented in this embodiment, for ease of subsequent explanation, a single-component thermosetting acrylic resin material is specifically selected as the main component of the functional structural layer.

[0021] The specific selection of the separable connecting structural layer disposed between the aforementioned substrate structural layer and functional structural layer can be mainly set as follows: ① Organosilicon system Main components: Polydimethylsiloxane (PDMS), hydrogen-containing silicone oil, hydroxyl silicone oil; ② Non-silicone release agent system Main components: polyvinyl alcohol (water-soluble polymer), water, crosslinking agents (such as glyoxal, boric acid); ③. Fatty acid and derivative system Main components: fatty acids (stearic acid, oleic acid); fatty acid esters (glyceryl stearate, ethyl palmitate); metallic soaps (zinc stearate, calcium stearate); ④. Polyolefin systems Main components: polyethylene (PE) wax, polypropylene (PP) wax; mineral oil, paraffin wax; ⑤ Fluorocarbon modified system Main components: Fluorine-modified acrylic resin, fluorine surfactants (such as ammonium perfluorooctyl sulfonate); ⑥ Fluoro-based release agent system Main ingredients: 1. Fluorocarbon polymers (polytetrafluoroethylene (PTFE), perfluoropolyether (PFPE); fluoropolymer emulsions (such as PTFE aqueous dispersions)) 2. Solvents (Fluorinated solvents (perfluoroheptane, fluoroether solvents): dissolve fluororesins, environmentally friendly (VOC-free)) 3. Additives (coupling agents (fluorosilanes): enhance the adhesion between the coating and the substrate); ⑦ Light-cured release agent Main components: silicone oil containing double bonds (such as vinyl silicone oil) and photoinitiator (such as Irgacure 184).

[0022] In the above-described scheme, as a preferred material type, polyvinyl alcohol adhesive is selected as the main component of the separable bonding structural layer in this embodiment. When polyvinyl alcohol adhesive is used as the main component of the separable bonding structural layer, it enables stable bonding with structural layers primarily composed of PET (polyethylene terephthalate), BOPP (biaxially oriented polypropylene), and PI (polyimide), while also allowing for quick and easy separation compared to structural layers primarily composed of single-component thermosetting acrylic resin materials.

[0023] The main reasons are as follows: The reason for its stable bonding with PET, BOPP and PI is that— Polarity and Wettability: Polyvinyl alcohol (PVA) adhesives possess a certain degree of polarity. The hydroxyl groups on its molecular chains can form hydrogen bonds and other interactions with the polar groups on the surfaces of PET, BOPP, and PI, thereby enhancing adhesion to these materials. Simultaneously, PVA adhesives exhibit good wettability, effectively wetting the surfaces of PET, BOPP, and PI, ensuring close contact between the adhesive and the substrate, and providing a solid foundation for bonding.

[0024] Entanglement and penetration of molecular chains: Polyvinyl alcohol molecular chains are flexible and can entangle and penetrate to a certain extent with the molecular chains on the surfaces of PET, BOPP and PI during the adhesive coating process, forming a structure similar to mechanical interlocking, thereby improving the bonding strength and enabling them to be stably bonded together.

[0025] Curing characteristics: The curing process of polyvinyl alcohol adhesive mainly depends on the evaporation of water and the cross-linking reaction between molecules. The adhesive layer formed after curing has a certain strength and toughness, which can effectively bond structural layers such as PET, BOPP and PI to adjacent layers. Under normal use conditions, this bonding performance is relatively stable and is not easily affected by environmental factors and will fail.

[0026] The principle of "like dissolves like": From a chemical perspective, polyvinyl alcohol (PVA) shares certain structural similarities with materials such as PET, BOPP, and PI, all of which have relatively long carbon chain structures. According to the principle of "like dissolves like," they have good compatibility. This compatibility is beneficial for the spread and adhesion of adhesives on the substrate surface, thereby achieving a stable bonding connection.

[0027] The reason why the structural layers of single-component thermosetting acrylic resin materials can be quickly and easily separated is that— Differences in intermolecular forces: The three-dimensional network structure formed after curing of single-component thermosetting acrylic resin results in strong intermolecular forces between it and the substrate, which are difficult to break. In contrast, polyvinyl alcohol adhesive relies mainly on hydrogen bonds and some weaker intermolecular forces to bond with the substrate. These forces are relatively easy to overcome when subjected to external forces, thus achieving rapid separation.

[0028] The degree of curing reaction differs: Single-component thermosetting acrylic resins undergo a cross-linking reaction during curing, forming a highly cross-linked network structure. This structure makes its adhesion to the substrate very strong and difficult to separate. In contrast, the curing of polyvinyl alcohol adhesives is mainly a physical process. Although some degree of cross-linking also occurs, the cross-linking density is relatively low, and the cohesive strength of the adhesive layer is relatively small. Therefore, less force is required for separation, making it easier to achieve quick and convenient separation.

[0029] Impact on substrate surface energy: Single-component thermosetting acrylic resins have high requirements for substrate surface energy. Once a good bond is formed with the substrate, it will adhere tightly to the substrate surface and be difficult to separate. Polyvinyl alcohol adhesives, on the other hand, have a wider range of substrate surface energy adaptability. After curing, the surface energy of the adhesive layer is relatively low, and the adhesion between it and the substrate is relatively weak. This makes it easier to peel off from the substrate surface when separation is required without damaging the substrate.

[0030] Differences in temperature sensitivity: Single-component thermosetting acrylic resins have better heat resistance and can maintain good bonding performance even at higher temperatures. Polyvinyl alcohol (PVA) adhesives, on the other hand, have relatively poor heat resistance. When the temperature rises, the strength and adhesion of the adhesive layer decrease significantly, and the mobility of the molecular chain segments increases. This makes the bond between PVA adhesives and the substrate more easily broken under high-temperature conditions, thus enabling rapid and convenient separation.

[0031] Furthermore, the inventors will also provide other optional system categories as main components for the aforementioned non-silicone release agent system— Acrylic systems: Amino-modified acrylic resin, used as the base resin, forms a release layer through a cross-linking reaction, suitable for ultra-light release applications (such as in the electronic die-cutting industry). Hydroxyl-containing acrylic resin is combined with isocyanate curing agents to adjust the release force range.

[0032] Fluorocarbon systems: Fluoride coatings (such as CF series fluorinated release films) utilize low surface energy fluoropolymers to achieve release, making them suitable for processing silicon-sensitive electronic materials.

[0033] Polyolefin systems: High-density polyethylene (HDPE), linear low-density polyethylene (LLDPE), and low-density polyethylene (LDPE) blended coatings are used for substrate treatment. Waterborne polyolefin dispersions are used as primers or release layers, offering environmental friendliness and excellent adhesion.

[0034] Polyurethane systems: Polyurethane release agents (PU release agents) are used for demolding polyurethane products. They achieve peeling by forming a uniform release film and are suitable for self-skinning, rigid foam, and other processes. Silicone-hybrid polyurethane systems combined with acrylate end caps improve compatibility and residual adhesion.

[0035] Polyether systems: Long-chain alkyl polyethers, as the main component of non-silicone release agents, form a stable release layer through cross-linking reactions, making them suitable for release requirements in high-temperature environments.

[0036] Polyimide system: Polyimide, as a substrate or release layer, has high temperature resistance and chemical stability, and is used in release films for high-temperature environments.

[0037] Non-reactive, non-silicone release agent: The novel release agent avoids reaction with silicone formulations, and by adjusting the release force formulation, it meets different application requirements and solves the silicone transfer problem. For separable connection structure layers made using the above-mentioned material system types, the thickness of the separable connection structure layer can be set to 0.1-1μm, preferably 0.2-0.4μm, during the coating or lamination process of actual film product production.

[0038] The inventors also considered that in many cases, the printed films inside electronic products require a light-shielding layer to cover the outer side of functional structural layers. For example: preventing light interference, such as protecting photosensitive elements from external light affecting their performance, or reducing screen reflection to improve display quality; concealing internal structures to protect intellectual property and product design, avoiding exposure of circuit layout details, and enhancing the product's aesthetics; preventing static electricity accumulation, reducing damage to electronic components and dust adsorption; and meeting special functional requirements, such as achieving specific optical effects or assisting in electromagnetic shielding. In these application scenarios, light-shielding treatment of localized areas inside electronic products not only helps ensure the performance, stability, and lifespan of the electronic products but also adapts to different usage environments and functional requirements.

[0039] Therefore, as a preferred structure, the printable film product with a peelable substrate layer provided in this embodiment also has a light-shielding structural layer covering the outer surface of the functional structural layer. Specifically, the second light-shielding layer structure here uses nano black pigment with a particle size <1μm or ordinary black pigment for coloring treatment, and the thickness of the light-shielding structural layer is set to 1-10μm, preferably 2-5μm. Of course, similar to the aforementioned structure, other light-shielding structural layers can be further provided on the outer surface of the functional structural layer or substrate structural layer given above by coating or covering according to actual working scenarios or usage requirements, which will not be elaborated here.

[0040] Furthermore, the inventors also considered that, depending on the actual working scenarios of various functional structural layers, it is necessary to adjust and control their surface structure. However, since the functional structure itself is relatively thin and precise, if its surface roughness, texture, or local unevenness is to be controlled through independent process steps, it will greatly increase the processing difficulty and easily increase the product defect rate.

[0041] Therefore, in this embodiment, as a preferred structural form, an adjustment structural layer is provided between the aforementioned substrate structural layer and the separable connection structural layer, which can control the surface structural state of the functional structural layer when it is finally exposed.

[0042] For example, the adjustment structure layer here uses a combination of hydroxyl resin, isocyanate and matting agent, the processing temperature is between 70-150°C, microgravure or gravure printing is used, the roughness is generally between 0.2-1.4, preferably 0.3-0.6, and the thickness of the adjustment structure layer can be set to 1-10μ, preferably 3-5μ.

[0043] The adjustment structure layer formed in the above manner possesses higher strength and a greater ability to maintain its surface structure morphology compared to other structure layers. Furthermore, because this adjustment structure layer employs micro-recessed or gravure printing, it can effectively maintain its pre-formed roughness and uneven structure that meets practical requirements. Since the thickness of the aforementioned separable connecting structure layer is significantly less than other structure layers, and its overall thickness is uniform with good ductility and deformation capacity, when this separable connecting structure layer is adhered to the surface of the adjustment structure layer, the surface structure of the adjustment structure layer can be transmitted downwards through the separable connecting structure layer. That is, the separable connecting structure layer exhibits a controllable structural state similar to or the same as the surface of the adjustment structure layer. Therefore, in this structural state, when the functional structure layer is further adhered to the surface of the separable connecting structure layer, only a certain relative compressive force needs to be applied to the two separated parts during the adhesion process. The surface structure of the adjustment structure layer will then deform due to the downward compressive force applied by the separable connecting structure layer. This processing method enables precise control over the surface roughness and unevenness of the aforementioned functional structural layer, while not affecting the connection or separation effect of the separable connecting structural layer and the functional structural layer in different application scenarios.

[0044] Furthermore, in this embodiment, the inventors also provide a process method for manufacturing the aforementioned printable film product with a peelable substrate layer, as follows: s1. Set the substrate structural layer; s2. An adjustment structure layer is provided on the surface of the substrate structure layer; s3. A separable connecting structure layer is provided on the surface of the adjustment structure layer; s4. A functional structural layer is provided on the surface of the separable connecting structural layer; s5. A light-shielding structural layer is provided on the surface of the functional structural layer.

[0045] Furthermore, considering that the polyvinyl alcohol adhesive applied to the surface of the adjusting structural layer as a separable connecting structural layer is extremely thin, and to improve the flatness and coverage of this structural layer during application, and to prevent the adjusting structural layer from being deformed due to compression or collision when the functional structural layer above it is applied, thus causing the separable structural layer to shift or break, affecting subsequent bonding consistency and ease of peeling, the adjusting structural layer can be cured before applying the separable connecting structural layer. The curing method here can vary depending on the type of material used as the adjusting structural layer, and can include various forms such as light curing or heat curing, which will not be elaborated here.

[0046] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A printable film product with a peelable substrate layer, characterized in that: The device includes a detachable connecting structural layer in the middle. A substrate structural layer is provided on one side of the detachable connecting structural layer to support the overall structure of the printed film. A functional structural layer is provided on the other side of the detachable connecting structural layer. The functional structural layer can be adhered and fixed to the surface of the electronic product and meet the functional requirements when the printed film is attached to the product surface. The substrate structural layer and the detachable connecting structural layer can be peeled off relative to the functional structural layer, leaving the functional structural layer on the surface of the electronic product. The thickness of the substrate structural layer is set to 10-250μm.

2. The printed film product with a peelable substrate layer according to claim 1, characterized in that: An adjustment structure layer for controlling the surface structure state of the functional structure layer is further provided between the substrate structure layer and the separable connection structure layer.

3. The printed film product with a peelable substrate layer according to claim 1, characterized in that: A light-shielding structural layer is also provided on the outer surface of the functional structural layer.

4. The printed film product with a peelable substrate layer according to claim 3, characterized in that: The thickness of the separable connecting structure layer is 0.1-1 μm.

5. The printed film product with a peelable substrate layer according to claim 2, characterized in that: The thickness of the adjustment structure layer is 1-10 μm.

6. The printed film product with a peelable substrate layer according to claim 3, characterized in that: The thickness of the light-shielding structure layer is 1-10 μm.

7. The printed film product with a peelable substrate layer according to claim 1, characterized in that: The substrate structural layer contains PET, BOPP, or PI materials.

Images