A piezoelectric printing chip, packaging structure and control board

Abstract

The utility model discloses a piezoelectric printing chip, packaging structure and control board, piezoelectric film, runner structure and chip electrode are located the same side of substrate, main ink cavity penetrates substrate, runner structure is located piezoelectric film side away from substrate, and vibration cavity is located the other side of piezoelectric film, the orthographic projection of piezoelectric film on the plane of substrate and vibration cavity exist the overlap, and circuit connection pad and piezoelectric film are electrically connected, the orthographic projection of spray orifice structure on the plane of substrate and vibration cavity and piezoelectric film overlap, and the orthographic projection of runner structure on the plane of substrate and spray orifice structure and piezoelectric film exist the overlap, and vibration cavity includes first vibration cavity and second vibration cavity, and first vibration cavity and second vibration cavity surround main ink cavity and set alternately, and the interval of first vibration cavity and main ink cavity is less than the interval of second vibration cavity and main ink cavity. The space utilization of piezoelectric printing chip has been improved, and printing precision can be improved.

Description

Technical Field

[0001] This utility model relates to the field of piezoelectric printing chip technology, and more particularly to a piezoelectric printing chip, packaging structure and control board. Background Technology

[0002] A piezoelectric printed chip consists of a substrate, an insulating layer, a piezoelectric thin film, an ink cavity, a liquid channel, and nozzles.

[0003] In commonly used piezoelectric printing chips, the nozzle layer, ink cavity, substrate, insulating layer and piezoelectric film are stacked sequentially from bottom to top. To ensure that the piezoelectric film can move up and down, a release cavity needs to be set in the substrate area corresponding to the piezoelectric film.

[0004] Because the release chamber occupies a certain volume, the nozzle spacing is relatively large, resulting in low printing accuracy. Utility Model Content

[0005] This invention provides a piezoelectric printing chip, a packaging structure, and a control board, which improves the space utilization of the piezoelectric printing chip and enhances printing accuracy.

[0006] In a first aspect, this utility model provides a piezoelectric printed chip, comprising: a substrate, a piezoelectric structure, a flow channel structure, a nozzle structure, and chip electrodes;

[0007] The piezoelectric structure includes a predetermined number of piezoelectric thin films and a vibration cavity of the same number as the piezoelectric thin films; the piezoelectric thin films, the flow channel structure, and the chip electrodes are located on the same side of the substrate; the substrate includes a main ink cavity that penetrates the substrate, the flow channel structure is located on the side of the piezoelectric thin films away from the substrate, and the vibration cavity is located on the other side of the piezoelectric thin films; the chip electrodes include circuit connection pads of the same number as the vibration cavities, the orthographic projection of the piezoelectric thin films on the plane of the substrate overlaps with the vibration cavities, and the circuit connection pads are electrically connected to the piezoelectric thin films; the nozzle structure includes nozzles of the same number as the vibration cavities, the orthographic projection of the nozzle structure on the plane of the substrate overlaps with the vibration cavities and the piezoelectric thin films; the orthographic projection of the flow channel structure on the plane of the substrate overlaps with the nozzle structure and the piezoelectric thin films;

[0008] The vibration chamber includes a first vibration chamber and a second vibration chamber, which are alternately arranged around the main ink chamber. The distance between the first vibration chamber and the main ink chamber is smaller than the distance between the second vibration chamber and the main ink chamber.

[0009] Optionally, the flow channel structure includes a liquid inlet, a connecting flow channel, and a secondary ink cavity. The liquid inlet is located at the first end of the connecting flow channel near the main ink cavity. The second end of the connecting flow channel connects to the secondary ink cavity. The orthographic projection of the secondary ink cavity on the plane of the substrate overlaps with the piezoelectric film. The orthographic projections of the secondary ink cavity and the piezoelectric film on the plane of the substrate both cover the orthographic projection of the vibration cavity on the plane of the substrate.

[0010] Optionally, the vibration cavity is hexahedral in shape;

[0011] The liquid inlet includes a first liquid inlet and a second liquid inlet; the connecting channel includes a first connecting channel and a second connecting channel; the opening width of the second liquid inlet is greater than the opening width of the first liquid inlet, and the width of the second connecting channel is greater than the width of the first connecting channel.

[0012] Optionally, the vibrating cavity is rectangular in shape, and the side of the rectangular prism is parallel to the surface of the main ink cavity near the liquid inlet.

[0013] Optionally, the liquid inlet includes a first liquid inlet and a second liquid inlet; the connecting channel includes a first connecting channel and a second connecting channel; the opening width of the second liquid inlet is greater than the opening width of the first liquid inlet, and the width of the second connecting channel is greater than the width of the first connecting channel.

[0014] Secondly, this utility model embodiment also provides a packaging structure for a piezoelectric printing chip, including the piezoelectric printing chip described in the first aspect;

[0015] Anisotropic conductive adhesive is located on the surface of the piezoelectric printed chip on the side of the chip electrode away from the substrate; the anisotropic conductive adhesive covers the chip electrode;

[0016] A printed circuit board is located on the side of the anisotropic conductive adhesive away from the piezoelectric printed chip; the printed circuit board includes at least one circuit terminal, and each chip electrode is electrically connected to the circuit terminal through the anisotropic conductive adhesive; wherein the anisotropic conductive adhesive is conductive along a first direction and non-conductive along a second direction; the first direction is the direction from the printed circuit board to the piezoelectric printed chip, and the second direction is perpendicular to the first direction.

[0017] Thirdly, this utility model embodiment also provides a control board for a piezoelectric printing chip, including a power supply, an FPGA chip, a switch array chip, an analog signal generator chip, and the packaging structure of the piezoelectric printing chip described in the second aspect;

[0018] The FPGA chip and the analog signal generator chip are both electrically connected to the power supply. The switch array chip is electrically connected to the packaging structure of both the FPGA chip and the piezoelectric printing chip. The analog signal generator chip is also electrically connected to the packaging structure of the piezoelectric printing chip.

[0019] The technical solution of this utility model embodiment, based on the alternating arrangement of the first vibration cavity and the second vibration cavity around the main ink cavity, by setting the distance between the first vibration cavity and the main ink cavity to be smaller than the distance between the second vibration cavity and the main ink cavity, can compress the distance between the nozzles above the first vibration cavity and the second vibration cavity as much as possible. Thus, more nozzles can be set without changing the original size of the piezoelectric printing chip, improving the space utilization of the piezoelectric printing chip and improving printing accuracy.

[0020] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this utility model, nor is it intended to limit the scope of this utility model. Other features of this utility model will become readily apparent from the following description. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is an overall appearance diagram of a piezoelectric printed chip based on existing technology;

[0023] Figure 2 This is a partially enlarged schematic diagram of a piezoelectric printed chip based on existing technology;

[0024] Figure 3 This is a partial perspective view of a piezoelectric printing chip provided in an embodiment of this utility model;

[0025] Figure 4 This is provided by the embodiment of the present utility model. Figure 3 A partial perspective view of the piezoelectric printed chip in the image;

[0026] Figure 5 This is a cross-sectional view of a piezoelectric thin film provided in an embodiment of this utility model;

[0027] Figure 6 This is a partial perspective view of a piezoelectric printing chip provided in an embodiment of this utility model;

[0028] Figure 7 This is provided by the embodiment of the present utility model. Figure 6 A partial perspective view of the piezoelectric printed chip in the image;

[0029] Figure 8 This is a schematic diagram of the packaging structure of a piezoelectric printing chip provided in an embodiment of this utility model;

[0030] Figure 9 This is a schematic diagram of the structure of a control board for a piezoelectric printing chip provided in an embodiment of this utility model;

[0031] Figure 10 This is a flowchart of a method for fabricating a piezoelectric printed chip according to an embodiment of the present invention;

[0032] Figure 11 This is a flowchart of another method for fabricating a piezoelectric printed chip provided in this embodiment of the present invention;

[0033] Figure 12 This is a flowchart illustrating a method for fabricating a piezoelectric printed chip packaging structure according to an embodiment of the present invention. Detailed Implementation

[0034] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0035] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0036] Figure 1 This is an overall appearance diagram of a piezoelectric printed chip based on existing technology. Figure 2 This is a partially enlarged schematic diagram of a piezoelectric printed chip based on existing technology. (Reference) Figure 1 and Figure 2In the existing piezoelectric printing chip 100, the nozzle structure 140 is arranged around the main ink cavity 111, and the distance between adjacent nozzles in the nozzle structure 140 and the main ink cavity 111 is the same. Because the piezoelectric printing chip 100 contains a vibration cavity, the vibration cavity occupies a large chip volume, resulting in a large nozzle spacing and low printing accuracy.

[0037] To improve the printing accuracy of the piezoelectric printing chip 100, this utility model embodiment provides a piezoelectric printing chip, a packaging structure, a control board, and a manufacturing method. Figure 3 This is a partial perspective view of a piezoelectric printing chip provided in an embodiment of this utility model. Figure 4 This is provided by the embodiment of the present utility model. Figure 3 A partial perspective view of the piezoelectric printed chip in the image. Figure 5 This is a cross-sectional view of a piezoelectric thin film provided in an embodiment of this utility model, for reference. Figures 3-5 The piezoelectric printed chip 100 includes: a substrate 110, a piezoelectric structure 120, a flow channel structure 130, an nozzle structure 140, and a chip electrode 150; the piezoelectric structure 120 includes a predetermined number of piezoelectric thin films 121 and a vibration cavity 122 of the same number as the piezoelectric thin films 121; the piezoelectric thin films 121, the flow channel structure 130, and the chip electrode 150 are located on the same side of the substrate 110; the substrate 110 includes a main ink cavity 111 (not in the...). Figure 3 and Figure 4 (As shown in the diagram), the main ink cavity 111 penetrates the substrate 110, the flow channel structure 130 is located on the side of the piezoelectric thin film 121 away from the substrate, and the vibration cavity 122 is located on the other side of the piezoelectric thin film 121; the chip electrode 150 includes the same number of circuit connection pads 151 as the vibration cavity 122, the orthographic projection of the piezoelectric thin film 121 on the plane of the substrate 110 overlaps with the vibration cavity 122, and the circuit connection pads 151 are electrically connected to the piezoelectric thin film 121; the nozzle structure 140 includes the same number of nozzles as the vibration cavity 122, and the nozzle structure 140... The orthographic projection of the flow channel structure 130 on the plane of the substrate 110 overlaps with the vibration cavity 122 and the piezoelectric film 121; the orthographic projection of the flow channel structure 130 on the plane of the substrate 110 overlaps with the nozzle structure 140 and the piezoelectric film 121; the vibration cavity 122 includes a first vibration cavity 1221 and a second vibration cavity 1222, which are alternately arranged around the main ink cavity 111, and the distance between the first vibration cavity 1221 and the main ink cavity 111 is smaller than the distance between the second vibration cavity 1222 and the main ink cavity 111.

[0038] It is understood that, based on the alternating arrangement of the first vibration cavity 1221 and the second vibration cavity 1222 around the main ink cavity 111, the distance between the first vibration cavity 1221 and the main ink cavity 111 is set to be smaller than the distance between the second vibration cavity 1222 and the main ink cavity 111. This can compress the distance between the nozzles above the first vibration cavity 1221 and the second vibration cavity 1222 as much as possible. Thus, more nozzles can be set without changing the original size of the piezoelectric printing chip, improving the space utilization of the piezoelectric printing chip and improving printing accuracy.

[0039] Optionally, based on the above embodiments, continue to refer to... Figure 3 and Figure 4 The flow channel structure 130 includes a liquid inlet 131, a connecting flow channel 132, and a secondary ink cavity 133. The liquid inlet 131 is located at the first end of the connecting flow channel 132 near the main ink cavity 111 (the main ink cavity 111 is not located at the first end of the connecting flow channel 132). Figure 3 and Figure 4 As shown in the figure, the second end of the connecting channel 132 is connected to the secondary ink cavity 133. The orthographic projection of the secondary ink cavity 133 on the plane of the substrate 110 overlaps with the piezoelectric film 121. The orthographic projections of the secondary ink cavity 133 and the piezoelectric film 121 on the plane of the substrate 110 both cover the orthographic projection of the vibration cavity 122 on the plane of the substrate 110.

[0040] Specifically, the shapes of the orthographic projections of the secondary ink cavity 133, the piezoelectric thin film 121, and the vibration cavity 122 on the plane of the substrate 110 are the same, and the area of ​​the orthographic projections of the secondary ink cavity 133 and the piezoelectric thin film 121 on the plane of the substrate 110 is greater than the area of ​​the orthographic projection of the vibration cavity 122 on the plane of the substrate 110.

[0041] Optionally, based on the above embodiments, continue to refer to... Figure 3 and Figure 4 The vibration chamber 122 is hexahedral in shape; the liquid inlet 131 includes a first liquid inlet 1311 and a second liquid inlet 1312; the connecting channel 132 includes a first connecting channel 1321 and a second connecting channel 1322; the opening width of the second liquid opening is greater than the opening width of the first liquid inlet 1311, and the width of the second connecting channel 1322 is greater than the width of the first connecting channel 1321.

[0042] When the shape of the vibration cavity 122 is hexahedral, the shapes of the sub-ink cavity 133, the piezoelectric film 121, and the orthographic projection of the vibration cavity 122 onto the plane of the substrate 110 are all hexagonal.

[0043] It is understandable that by setting the opening width of the second liquid opening to be greater than the opening width of the first liquid inlet 1311, and the width of the second connecting channel 1322 to be greater than the width of the first connecting channel 1321, the flow speed of the liquid can be adjusted so that the ink ejection time of the corresponding nozzles is basically the same.

[0044] Figure 6 This is a partial perspective view of a piezoelectric printing chip provided in an embodiment of this utility model. Figure 7 This is provided by the embodiment of the present utility model. Figure 6 A partial perspective view of the piezoelectric printed chip in the image; optionally, based on the above embodiment, refer to... Figure 6 and Figure 7 The vibrating cavity 122 is rectangular in shape, and the side of the rectangular prism is parallel to the surface of the main ink cavity 111 near the liquid inlet 131.

[0045] When the shape of the vibration cavity 122 is a cuboid, the shapes of the sub-ink cavity 133, the piezoelectric film 121, and the orthographic projection of the vibration cavity 122 onto the plane of the substrate 110 are all rectangular.

[0046] It should be noted that the length of the piezoelectric film 121 is fixed. In order to increase the driving force of the liquid, the flow channel structure 130 needs to be designed. The lengthening of the flow channel structure 130 is to increase the volume of the piezoelectric film 121 in the piezoelectric structure 120. The shape of the vibration cavity 112 is set as a cuboid, and the shape of the corresponding connecting flow channel 132 can also be designed to be longer and thinner, which can further increase the density of the nozzles, thereby improving the printing accuracy of the piezoelectric printing chip.

[0047] Optionally, based on the above embodiments, continue to refer to... Figure 6 and Figure 7 The liquid inlet 131 includes a first liquid inlet 1311 and a second liquid inlet 1312; the connecting channel 132 includes a first connecting channel 1321 and a second connecting channel 1322; the opening width of the second liquid inlet is greater than the opening width of the first liquid inlet 1311, and the width of the second connecting channel 1322 is greater than the width of the first connecting channel 1321.

[0048] It is understandable that by setting the opening width of the second liquid opening to be greater than the opening width of the first liquid inlet 1311, and the width of the second connecting channel 1322 to be greater than the width of the first connecting channel 1321, the flow speed of the liquid can be adjusted so that the ink ejection time of the corresponding nozzles is basically the same.

[0049] In summary, this embodiment of the invention, based on the alternating arrangement of the first vibration cavity 1221 and the second vibration cavity 1222 around the main ink cavity 111, sets the distance between the first vibration cavity 1221 and the main ink cavity 111 to be smaller than the distance between the second vibration cavity 1222 and the main ink cavity 111. This minimizes the spacing between the nozzles above the first and second vibration cavities 1221 and 1222, allowing for more nozzles to be set without changing the original size of the piezoelectric printing chip. This improves the space utilization of the piezoelectric printing chip and enhances printing accuracy. By setting the opening width of the second liquid opening to be greater than the opening width of the first liquid inlet 1311, and the width of the second connecting channel 1322 to be greater than the width of the first connecting channel 1321, the liquid flow speed can be adjusted, ensuring that the ink ejection time of the corresponding nozzles is essentially consistent. By setting the shape of the vibration cavity 112 as a cuboid, the shape of the corresponding connecting channel 132 can also be designed to be longer and thinner, further increasing the nozzle density and thus improving the printing accuracy of the piezoelectric printing chip.

[0050] Figure 8 This is a schematic diagram of the packaging structure of a piezoelectric printing chip provided in an embodiment of this utility model. (Refer to...) Figure 8 The packaging structure 800 includes the piezoelectric printed chip 100 provided in the above embodiment; anisotropic conductive adhesive 200, which is located on the surface of the chip electrode 150 of the piezoelectric printed chip 100 away from the substrate 110; the anisotropic conductive adhesive covers the chip electrode 150; and a printed circuit board 300, which is located on the side of the anisotropic conductive adhesive away from the piezoelectric printed chip 100; the printed circuit board 300 includes at least one circuit terminal, and each chip electrode 150 is electrically connected to the circuit terminal through the anisotropic conductive adhesive 200; wherein the anisotropic conductive adhesive 200 is conductive along a first direction X and not conductive along a second direction Y; the first direction X is the direction from which the printed circuit board 300 points to the piezoelectric printed chip 100, and the second direction Y is perpendicular to the first direction X.

[0051] The printed circuit board 300 can be a flexible printed circuit board (FPC); flexible circuit boards have good flexibility and insulation properties; copper foil is a key component for realizing the circuit's conductivity; the cover film is used to protect the circuit and enhance its flexibility; and the adhesive is used for bonding the layers together. The printed circuit board 30 is made of polyimide, a mature material with simple manufacturing processes.

[0052] The piezoelectric printing chip provided in this embodiment of the invention can avoid 300-degree bending of the printed circuit board, reducing packaging difficulty and cost.

[0053] Figure 9 This is a schematic diagram of the control board for a piezoelectric printing chip provided in an embodiment of this utility model. (Refer to...) Figure 9The control board 900 of the piezoelectric printing chip 100 includes a power supply 910, an FPGA chip 920, a switch array chip 930, an analog signal generator chip 940, and a packaging structure 800 of the piezoelectric printing chip 100 provided in the above embodiment. The FPGA chip 920 and the analog signal generator chip 940 are both electrically connected to the power supply 910. The switch array chip 930 is electrically connected to both the FPGA chip 920 and the packaging structure 800 of the piezoelectric printing chip 100. The analog signal generator chip 940 is also electrically connected to the packaging structure 800 of the piezoelectric printing chip 100.

[0054] The power supply 910 can supply power to the FPGA chip 920 and the analog signal generator chip 940. The FPGA chip 920 provides a switching signal to the piezoelectric printing chip 100 in the package structure 800, and the analog signal generator chip 940 provides an analog signal to the piezoelectric printing chip 100 in the package structure 800, enabling the piezoelectric printing chip 100 to complete inkjet printing on demand.

[0055] Figure 10 This is a flowchart illustrating a method for fabricating a piezoelectric printed chip according to an embodiment of the present invention, used to fabricate the piezoelectric printed chip provided in the above embodiment; (Refer to...) Figure 10 The fabrication methods for piezoelectric printed chips include:

[0056] S1010, Prepare the substrate.

[0057] Among them, considering that the substrate needs to be resistant to the piezoelectric film preparation process, that is, the substrate needs to withstand a temperature higher than 450 degrees Celsius, the substrate can be prepared by deposition of high temperature resistant materials such as silicon, ceramics, glass and quartz.

[0058] S1020: Prepare a piezoelectric thin film, flow channel structure, nozzle structure, and chip electrode on one side of the substrate.

[0059] Among them, continue to refer to Figure 5 The piezoelectric thin film includes a first insulating layer 1211, a first conductive layer 1212, a piezoelectric film layer 1213, a second conductive layer 1214, and a second insulating layer 1215 sequentially disposed along a direction away from the substrate. The first insulating layer 1211 is made of silicon dioxide and silicon nitride; the first conductive layer 1212 is made of platinum, gold, and indium tin oxide; the piezoelectric film layer 1213 is made of lead zirconate titanate; the second conductive layer 1214 is made of platinum, gold, and indium tin oxide; and the second insulating layer 1215 is made of silicon dioxide and silicon nitride. Each layer of the piezoelectric thin film can be fabricated using standard semiconductor processes such as sputtering-photolithography-etching. The flow channel structure and nozzle structure can be fabricated using dry film and photolithography processes.

[0060] S1030. A vibration cavity and a main ink cavity are prepared in a substrate; wherein the vibration cavity includes a first vibration cavity and a second vibration cavity, the first vibration cavity and the second vibration cavity are alternately arranged around the main ink cavity, and the distance between the first vibration cavity and the main ink cavity is smaller than the distance between the second vibration cavity and the main ink cavity.

[0061] Figure 11 This is a flowchart of another method for fabricating a piezoelectric printed chip according to an embodiment of the present invention. Optionally, based on the above embodiments, refer to... Figure 11 The piezoelectric thin film, flow channel structure, nozzle structure, and chip electrode are fabricated on one side of the substrate, including:

[0062] S1110, Prepare the substrate.

[0063] S1121. Prepare a piezoelectric thin film and chip electrode on one side of the substrate.

[0064] S1122, Provides flow channel structure.

[0065] S1123, Patterned flow channel structure, forming liquid inlet, connecting flow channel, secondary ink cavity and nozzle structure.

[0066] S1124. Fix the flow channel structure on the side of the piezoelectric film away from the substrate.

[0067] Optionally, step S1120 in the above embodiment may include steps S1121 to S1124.

[0068] S1130. A vibration cavity and a main ink cavity are prepared in a substrate; wherein the vibration cavity includes a first vibration cavity and a second vibration cavity, the first vibration cavity and the second vibration cavity are alternately arranged around the main ink cavity, and the distance between the first vibration cavity and the main ink cavity is smaller than the distance between the second vibration cavity and the main ink cavity.

[0069] The method for preparing a piezoelectric printed chip provided in this embodiment of the present invention is used to prepare any of the piezoelectric printed chips provided in the above embodiments, and therefore has the same beneficial effects. For the contents not described in detail in this embodiment of the present invention, please refer to the piezoelectric printed chips provided in the above embodiments.

[0070] Figure 12 This is a flowchart illustrating a method for fabricating a piezoelectric printed chip packaging structure according to an embodiment of the present invention. This method is used to fabricate the packaging structure of the piezoelectric printed chip provided in the above embodiment. (Refer to...) Figure 12 The fabrication methods for the packaging structure of piezoelectric printed chips include:

[0071] S1210. Fix the piezoelectric printing chip to one side of the fixture; the piezoelectric printing chip includes chip electrodes.

[0072] S1220. Anisotropic conductive adhesive is formed on one side of the piezoelectric printed chip; the anisotropic conductive adhesive covers the chip electrodes.

[0073] S1230. A printed circuit board is formed on the side of the anisotropic conductive adhesive away from the piezoelectric printed chip. The printed circuit board includes at least one circuit terminal, and the chip electrode is electrically connected to the circuit terminal through the anisotropic conductive adhesive. The anisotropic conductive adhesive is conductive in a first direction and not conductive in a second direction. The first direction is the direction in which the printed circuit board points to the piezoelectric printed chip, and the second direction is perpendicular to the first direction.

[0074] S1240, Remove fixture.

[0075] It should be noted that after removing the fixture, the packaging structure needs to be attached to the ink cartridge.

[0076] The method for preparing a piezoelectric printed chip provided in this embodiment of the present invention is used to prepare any of the piezoelectric printed chips provided in the above embodiments, and therefore has the same beneficial effects. For the contents not described in detail in this embodiment of the present invention, please refer to the piezoelectric printed chips provided in the above embodiments.

[0077] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A piezoelectric printing chip, characterized in that, include: Substrate, piezoelectric structure, flow channel structure, nozzle structure, and chip electrode; The piezoelectric structure includes a predetermined number of piezoelectric films and a vibration cavity with the same number of piezoelectric films; The piezoelectric thin film, the flow channel structure, and the chip electrode are located on the same side of the substrate; the substrate includes a main ink cavity that penetrates the substrate, the flow channel structure is located on the side of the piezoelectric thin film away from the substrate, and the vibration cavity is located on the other side of the piezoelectric thin film; the chip electrode includes circuit connection pads of the same number as the vibration cavity, the orthographic projection of the piezoelectric thin film on the plane of the substrate overlaps with the vibration cavity, and the circuit connection pads are electrically connected to the piezoelectric thin film; the nozzle structure includes nozzles of the same number as the vibration cavity, and the orthographic projection of the nozzle structure on the plane of the substrate overlaps with the vibration cavity and the piezoelectric thin film; The orthographic projection of the flow channel structure onto the plane of the substrate overlaps with the nozzle structure and the piezoelectric thin film. The vibration chamber includes a first vibration chamber and a second vibration chamber, which are alternately arranged around the main ink chamber. The distance between the first vibration chamber and the main ink chamber is smaller than the distance between the second vibration chamber and the main ink chamber.

2. The piezoelectric printing chip according to claim 1, characterized in that, The flow channel structure includes a liquid inlet, a connecting flow channel, and a secondary ink cavity. The liquid inlet is located at the first end of the connecting flow channel near the main ink cavity. The second end of the connecting flow channel connects to the secondary ink cavity. The orthographic projection of the secondary ink cavity on the plane of the substrate overlaps with the piezoelectric film. The orthographic projections of the secondary ink cavity and the piezoelectric film on the plane of the substrate both cover the orthographic projection of the vibration cavity on the plane of the substrate.

3. The piezoelectric printing chip according to claim 2, characterized in that, The vibration cavity is hexahedral in shape; The liquid inlet includes a first liquid inlet and a second liquid inlet; the connecting channel includes a first connecting channel and a second connecting channel; the opening width of the second liquid inlet is greater than the opening width of the first liquid inlet, and the width of the second connecting channel is greater than the width of the first connecting channel.

4. The piezoelectric printing chip according to claim 2, characterized in that, The vibrating cavity is rectangular in shape, and the side of the rectangular prism is parallel to the surface of the main ink cavity near the liquid inlet.

5. The piezoelectric printing chip according to claim 4, characterized in that, The liquid inlet includes a first liquid inlet and a second liquid inlet; the connecting channel includes a first connecting channel and a second connecting channel; the opening width of the second liquid inlet is greater than the opening width of the first liquid inlet, and the width of the second connecting channel is greater than the width of the first connecting channel.

6. A packaging structure for a piezoelectric printed chip, characterized in that, Includes the piezoelectric printing chip according to any one of claims 1 to 5; Anisotropic conductive adhesive, wherein the anisotropic conductive adhesive is located on the surface of the chip electrode of the piezoelectric printed chip away from the substrate; The anisotropic conductive adhesive covers the chip electrodes; A printed circuit board is located on the side of the anisotropic conductive adhesive away from the piezoelectric printed chip; the printed circuit board includes at least one circuit terminal, and each chip electrode is electrically connected to the circuit terminal through the anisotropic conductive adhesive; wherein the anisotropic conductive adhesive is conductive along a first direction and non-conductive along a second direction; the first direction is the direction from the printed circuit board to the piezoelectric printed chip, and the second direction is perpendicular to the first direction.

7. A control board for a piezoelectric printing chip, characterized in that, The package structure includes a power supply, an FPGA chip, a switch array chip, an analog signal generator chip, and the piezoelectric printing chip as described in claim 6. The FPGA chip and the analog signal generator chip are both electrically connected to the power supply. The switch array chip is electrically connected to the packaging structure of both the FPGA chip and the piezoelectric printing chip. The analog signal generator chip is also electrically connected to the packaging structure of the piezoelectric printing chip.

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