Wafer detection, classification and inkjet marking all-in-one machine

Abstract

The application belongs to the technical field of wafer marking equipment manufacturing, and particularly relates to a wafer detection, classification and ink jet marking all-in-one machine, which comprises a visual detection mechanism, an ink jet marking mechanism, a rack, a shell, a PC software industrial computer and a product loading and moving device. The shell is arranged on the rack, the visual detection mechanism and the ink jet marking mechanism are arranged in the shell on the rack, the visual detection mechanism is signal-connected with the PC software industrial computer, the PC software industrial computer is signal-connected with the ink jet marking mechanism and the product loading and moving device, an FFU communicating with the shell is arranged on the top of the shell, the moving path of the product loading and moving device at least partially intersects with the detection range of the visual detection mechanism, and the moving path of the product loading and moving device at least partially intersects with the marking stroke range of the ink jet marking mechanism. The application solves the problem that the current wafer marking machine does not have the identification and screening functions.

Description

Technical Field

[0001] This application belongs to the field of wafer marking equipment manufacturing technology, specifically a wafer inspection and classification inkjet marking integrated machine. Background Technology

[0002] In the semiconductor manufacturing process, it is necessary to inspect and record information about the wafer surface. This inspection typically includes information on whether there is damage, chipping, dust, or scratches. This information is used to scientifically and effectively mark, screen, and classify wafers, thereby improving production quality, enabling accurate traceability, accelerating production speed, and reducing costs. However, ordinary wafer marking machines lack identification and screening capabilities, so a machine capable of automatically screening and marking wafers needs to be designed. Utility Model Content

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a wafer inspection and classification inkjet marking all-in-one machine that combines PC software industrial control computer with a vision inspection mechanism and a product loading and moving device. This machine can screen and classify products based on the inspection results of the vision inspection mechanism, and then mark them with codes, thus solving the problem that current wafer inspection equipment does not have defect classification and defect marking capabilities.

[0004] The above-mentioned technical objective of this application is achieved through the following technical solution: A wafer inspection and classification inkjet marking integrated machine includes a vision inspection mechanism, an inkjet marking mechanism, a frame, a housing, a PC software industrial control computer, and a product loading and moving device. The housing is mounted on the frame, and the vision inspection mechanism and the inkjet marking mechanism are disposed within the housing on the frame. The vision inspection mechanism is signal-connected to the PC software industrial control computer, and the PC software industrial control computer is signal-connected to the inkjet marking mechanism and the product loading and moving device. An FFU (Fan Filter Unit) communicating with the housing is disposed on the top of the housing. The moving path of the product loading and moving device at least partially intersects with the detection range of the vision inspection mechanism, and the moving path of the product loading and moving device is within the marking stroke range of the inkjet marking mechanism.

[0005] Preferably, the vision inspection mechanism includes a first industrial camera with its shooting direction downwards, the product loading and moving device being located below the first industrial camera, the first industrial camera being signal-connected to the PC software industrial control computer, and the output terminal of the PC software industrial control computer being signal-connected to the product loading and moving device.

[0006] Preferably, the product loading mover includes an X-axis moving device and a Y-axis moving device. The moving path of the X-axis moving device is parallel to the upper surface of the frame, and the moving path of the Y-axis moving device is parallel to the upper surface of the frame. The X-axis moving device is fixedly mounted on the execution end of the Y-axis moving device, and the Y-axis moving device is fixedly mounted on the frame. A product placement platform is provided on the execution end of the X-axis moving device.

[0007] Preferably, the product placement platform is equipped with a negative pressure hole.

[0008] Preferably, the inkjet marking mechanism includes a second industrial camera, an inkjet module, and a lifting device. The lifting device is fixedly mounted on the frame and located above the product loading and moving device. The second industrial camera and the inkjet module are both located at the execution end of the lifting device, and both the lifting device and the inkjet module are signal-connected to the PC software industrial control computer.

[0009] Preferably, an ink cleaner is provided on the execution end of the X-axis moving device next to the product placement table. The ink cleaner includes a mounting table, a waste ink cup, a negative pressure ink cleaning device, and an adsorption nozzle. The negative pressure ink cleaning device and the waste ink cup are provided on the mounting table. The negative pressure ink cleaning device is provided with an adsorption nozzle that cooperates with the inkjet nozzle of the inkjet module.

[0010] The beneficial effects of this application are: This application designs a wafer inspection and classification inkjet marking all-in-one machine by setting up a PC software industrial control computer in conjunction with a vision inspection mechanism and a product loading and moving device. It can screen products according to the inspection results of the vision inspection mechanism and then mark them, thus solving the problem that current wafer inspection equipment does not have defect classification and defect marking capabilities. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a schematic diagram of the structure after the shell has been removed from this application; Figure 3 This is a schematic diagram of the inkjet marking mechanism in this application; Figure 4 This is a schematic diagram of the ink cleaner in this application.

[0012] The components include: 1. Frame; 2. Housing; 3. First industrial camera; 4. X-axis moving device; 5. Y-axis moving device; 6. Product placement platform; 7. Negative pressure hole; 8. Second industrial camera; 9. Inkjet nozzle; 10. Solenoid valve; 11. Lifting device; 12. Mounting platform; 13. Waste ink cup; 14. Negative pressure ink cleaning device; 15. Suction nozzle; 16. FFU. Detailed Implementation

[0013] like Figure 1-4 As shown, a wafer inspection and classification inkjet marking integrated machine includes a vision inspection mechanism, an inkjet marking mechanism, a frame 1, a housing 2, a PC software industrial control computer, and a product loading and moving device. The housing 2 is mounted on the frame 1. The vision inspection mechanism and the inkjet marking mechanism are disposed on the frame 1 within the housing 2. The vision inspection mechanism is signal-connected to the PC software industrial control computer, and the PC software industrial control computer is signal-connected to the inkjet marking mechanism and the product loading and moving device. An FFU16 communicating with the interior of the housing 2 is provided on the top of the housing 2. The moving distance of the product loading and moving device intersects at least partially with the detection range of the vision inspection mechanism and at least partially with the marking travel range of the inkjet marking mechanism.

[0014] In this embodiment, during use, the worker opens the switch door on housing 2, places the wafer on the product loading and moving device, and then closes the switch door on housing 2. During the loading and unloading process, FFU16 continuously filters particulate matter in the air inside housing 2, ensuring that the air quality inside housing 2 remains clean. The product loading and moving device moves the wafer to the vision inspection mechanism, which detects defects such as dust, uneven edges, and scratches on the wafer. The inspection results are then sent to a PC software industrial control computer, which sends instructions to the inkjet marking mechanism based on the inspection results. This marks and classifies wafers with dust, uneven edges, or scratches. The vision inspection mechanism can also identify the wafer's QR code ID. The PC software industrial control computer establishes a unique "quality file" for each wafer. Defect information (type, location, quantity) can be associated with production time, batch, and process parameters to achieve accurate data traceability, providing key data support for upstream process improvement and shifting from "post-event remediation" to "pre-event prevention." Therefore, this application solves the problem that current wafer inspection equipment lacks defect classification and defect marking capabilities.

[0015] In a preferred embodiment, the vision inspection mechanism includes a first industrial camera 3, which faces downwards. The product loading and moving device is located below the first industrial camera 3. The first industrial camera 3 is signal-connected to the PC software industrial control computer, and the output of the PC software industrial control computer is signal-connected to the product loading and moving device. With this configuration, the surface information of the wafer captured by the first industrial camera 3 is transmitted to the PC software industrial control computer. The first industrial camera 3 employs a 20-megapixel configuration.

[0016] In a preferred embodiment, the product loading mover includes an X-axis moving device 4 and a Y-axis moving device 5. The moving path of the X-axis moving device 4 is parallel to the upper surface of the rack 1, and the moving path of the Y-axis moving device 5 is parallel to the upper surface of the rack 1. The X-axis moving device 4 is fixedly mounted on the execution end of the Y-axis moving device 5, and the Y-axis moving device 5 is fixedly mounted on the rack 1. A product placement stage 6 is provided on the execution end of the X-axis moving device 4. With this configuration, the X-axis moving device 4 corresponds to the X-axis in the spatial coordinate system, and the Y-axis moving device 5 corresponds to the Y-axis in the spatial coordinate system. Thus, the position of the wafer on a plane parallel to the upper surface of the rack 1 can be adjusted by using the X-axis moving device 4 and the Y-axis moving device 5. Both the X-axis moving device 4 and the Y-axis moving device 5 can be enclosed lead screws and linear guides.

[0017] As a preferred embodiment, the product placement stage 6 is provided with negative pressure holes 7. By providing negative pressure holes 7, the wafers are adhered to the product placement stage 6, preventing them from falling off.

[0018] In a preferred embodiment, the inkjet marking mechanism includes a second industrial camera 8, an inkjet module, and a lifting device 11. The lifting device 11 is fixedly mounted on the frame 1 and located above the product loading and moving device. The second industrial camera 8 and the inkjet module are both located at the execution end of the lifting device 11, and both the lifting device 11 and the inkjet module are signal-connected to the PC software industrial control computer. By setting the second industrial camera 8, wafers with dust, uneven edges, or scratches can be identified. In use, if the wafer to be marked has not moved below the inkjet module, the PC software industrial control computer controls the product loading and moving device to continue moving, that is, controls the X-axis moving device 4 and the Y-axis moving device 5 to adjust the position of the wafer on a plane parallel to the upper surface of the frame 1.

[0019] In a preferred embodiment, the inkjet module includes an ink reservoir tube and an inkjet valve 10. The ink reservoir tube is located at the actuating end of the lifting device 11, and its lower end is connected to the inlet of the inkjet valve 10. An inkjet nozzle 9 is located at the outlet of the inkjet valve 10, and the PC software industrial control computer is connected to the inkjet valve 10 via signal transmission. With this configuration, the PC software industrial control computer controls the inkjet valve 10 to determine whether ink is being ejected.

[0020] As a preferred embodiment, an ink cleaner is installed on the actuator end of the X-axis moving device 4 next to the product placement platform 6. The ink cleaner includes a mounting platform 12, a waste ink cup 13, a negative pressure ink cleaning device 14, and a suction nozzle 15. The mounting platform 12 is equipped with the negative pressure ink cleaning device 14 and the waste ink cup 13. The negative pressure ink cleaning device 14 is equipped with a suction nozzle 15 that cooperates with the inkjet nozzle 9 of the inkjet module. If the ink dries out and clogs the inkjet nozzle 9, the PC software industrial control computer controls the product loading mover to move so that the inkjet nozzle 9 is positioned at the suction nozzle 15. Then, the lifting device 11 descends so that the inkjet nozzle 9 is aligned with the suction nozzle 15, and then the negative pressure generated by the negative pressure ink cleaning device 14 clears the inkjet nozzle 9. Of course, if there is still ink left after the work is completed, the PC software industrial control computer controls the product loading and moving device to move the suction nozzle 15 directly above the waste ink cup 13, and then lowers it through the lifting device 11 to spray the remaining ink from the inkjet nozzle 9 into the waste ink cup 13, preventing the remaining ink from solidifying in the inkjet marking mechanism.

Claims

1. A wafer inspection, sorting, and marking inkjet integrated machine, characterized in that, The device includes a vision inspection mechanism, an inkjet marking mechanism, a frame (1), a housing (2), a PC software industrial control computer, and a product loading and moving device. The housing (2) is mounted on the frame (1). The vision inspection mechanism and the inkjet marking mechanism are mounted on the frame (1) and installed inside the housing (2). The vision inspection mechanism is signal-connected to the PC software industrial control computer, and the PC software industrial control computer is signal-connected to the inkjet marking mechanism and the product loading and moving device. An FFU (16) is provided on the top of the housing (2) and communicates with the inside of the housing (2). The moving distance of the product loading and moving device intersects at least partially with the detection range of the vision inspection mechanism. The moving distance of the product loading and moving device is within the marking stroke range of the inkjet marking mechanism.

2. The wafer inspection, sorting, and marking integrated machine according to claim 1, characterized in that: The visual inspection mechanism includes a first industrial camera (3) with the shooting direction of the first industrial camera (3) pointing downwards. The product loading and moving device is located below the first industrial camera (3). The first industrial camera (3) is connected to the PC software industrial control computer, and the output terminal of the PC software industrial control computer is connected to the product loading and moving device.

3. The wafer inspection, sorting, and marking integrated machine according to claim 1, characterized in that: The product loading mover includes an X-axis moving device (4) and a Y-axis moving device (5). The moving path of the X-axis moving device (4) is parallel to the upper surface of the frame (1), and the moving path of the Y-axis moving device (5) is parallel to the upper surface of the frame (1). The X-axis moving device (4) is fixedly mounted on the execution end of the Y-axis moving device (5), and the Y-axis moving device (5) is fixedly mounted on the frame (1). A product placement platform (6) is provided on the execution end of the X-axis moving device (4).

4. The wafer inspection, sorting, and marking integrated machine according to claim 1, characterized in that: The product placement platform (6) is equipped with a negative pressure hole (7).

5. The wafer inspection and classification inkjet marking integrated machine according to claim 3, characterized in that: The inkjet marking mechanism includes a second industrial camera (8), an inkjet module, and a lifting device (11). The lifting device (11) is fixedly mounted on the frame (1) and is located above the product loading and moving device. The second industrial camera (8) and the inkjet module are both located at the execution end of the lifting device (11). The lifting device (11) and the inkjet module are both signal-connected to the PC software industrial control computer.

6. The wafer inspection, sorting, and marking integrated machine according to claim 5, characterized in that: The inkjet module includes an ink reservoir tube and an inkjet valve (10). The ink reservoir tube is located at the execution end of the lifting device (11). The lower end of the ink reservoir tube is connected to the inlet of the inkjet valve (10). The outlet of the inkjet valve (10) is provided with an inkjet nozzle (9). The PC software industrial control computer signal is connected to the inkjet valve controller to control the inkjet valve (10) inkjet operation.

7. The wafer inspection, sorting, and marking integrated machine according to claim 5, characterized in that: An ink cleaner is provided on the execution end of the X-axis moving device (4) next to the product placement platform (6). The ink cleaner includes a mounting platform (12), a waste ink cup (13), a negative pressure ink cleaning device (14), and an adsorption nozzle (15). The mounting platform (12) is provided with a negative pressure ink cleaning device (14) and a waste ink cup (13). The negative pressure ink cleaning device (14) is provided with an adsorption nozzle (15) that cooperates with the inkjet nozzle of the inkjet module.

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