Vehicle-mounted charger and vehicle

Abstract

The application provides a vehicle-mounted charger and a vehicle. The vehicle-mounted charger comprises a shell, a heat dissipation device and at least one power board. The shell forms a cavity. The shell comprises an upper shell and a lower shell. The upper shell comprises a top wall and at least one upper side wall. The lower shell comprises a bottom wall and at least one lower side wall. The upper side wall abuts on the bottom wall and is detachably connected with the bottom wall. The lower side wall abuts on the top wall and is detachably connected with the top wall. The heat dissipation device comprises a heat dissipation main body extending from the bottom wall to the cavity. A liquid cooling flow channel is formed in the heat dissipation main body. At least one heat dissipation side wall is formed on the surface of the heat dissipation main body. The power board is detachably arranged on the heat dissipation side wall corresponding to the upper side wall. At least one side of the power board is provided with a power switch or the power switch is embedded in the power board. The application is beneficial to reducing the difficulty of installing the power board into the shell and improving the assembly efficiency.

Description

Technical Field

[0001] This application relates to on-board charger manufacturing technology, and more particularly to an on-board charger and a vehicle. Background Technology

[0002] The on-board charger (OBC) is a crucial component in electric vehicles. Its core function is to convert external alternating current (AC) into direct current (DC) to safely and efficiently charge the vehicle's battery pack.

[0003] When an on-board charger is working, it needs to use a large number of power switches to convert energy, and the power switches will generate a lot of heat during the conversion process. In order to ensure the normal operation of the on-board charger, a heat dissipation device is also installed inside the charger. This device can quickly dissipate heat from the power switches, ensuring that the on-board charger operates within a suitable temperature range.

[0004] However, power switches are usually integrated on a power board, which is then mounted near the heat sink. Due to the limitations of the housing structure, the installation of the power board may interfere with the housing, making installation difficult and affecting assembly efficiency. Utility Model Content

[0005] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide an on-board charger and vehicle. This application is beneficial to reducing the difficulty of installing the power board into the housing and improving assembly efficiency.

[0006] On one hand, this application provides an on-board charger, which includes: a housing, the housing having a cavity, the housing comprising:

[0007] Upper housing, the upper housing including a top wall and at least one upper side wall; and

[0008] The lower housing includes a bottom wall and at least one lower side wall, wherein the upper side wall abuts against the bottom wall and is detachably connected to the bottom wall; the lower side wall abuts against the top wall and is detachably connected to the top wall.

[0009] A heat dissipation device, comprising a heat dissipation body extending from the bottom wall into the cavity, wherein a liquid cooling channel is formed within the heat dissipation body, and at least one heat dissipation sidewall is formed on the surface of the heat dissipation body; and

[0010] At least one power board is provided, which is detachably mounted on the heat dissipation sidewall corresponding to the upper sidewall. At least one side of the power board is provided with a power switch or the power switch is embedded inside the power board.

[0011] In one possible implementation, the heat dissipation sidewall is provided with a plurality of fixing posts, and the fixing posts are provided with fixing holes; the power board is provided with a plurality of through holes, and the plurality of through holes correspond one-to-one with the plurality of fixing holes, and the first fastener passes through the through hole and is fixedly connected to the corresponding fixing hole.

[0012] In one possible implementation, the upper sidewall includes a first upper sidewall and / or a second upper sidewall, the heat dissipation sidewall includes opposing first and second heat dissipation sidewalls, and the power board includes a first power board and / or a second power board; wherein the first upper sidewall is correspondingly disposed to the first heat dissipation sidewall; and / or, the second upper sidewall is correspondingly disposed to the second heat dissipation sidewall; the first power board is detachably connected to the first heat dissipation sidewall; and / or, the second power board is detachably connected to the second heat dissipation sidewall.

[0013] In one possible implementation, a boss is provided on the first heat dissipation sidewall and / or the second heat dissipation sidewall, and a thermally conductive adhesive layer is provided on the surface of the boss, with the thermally conductive adhesive layer facing the power switch of the power board.

[0014] In one possible implementation, the heat dissipation device further includes a liquid inlet and a liquid outlet, and the heat dissipation body includes a first section, a second section and a third section, wherein the liquid inlet is connected to the first section, the liquid outlet is connected to the third section, the first section and the third section are both located on the same side of the second section, and the two ends of the second section are respectively connected to the first section and the third section.

[0015] The heat dissipation sidewall includes a first heat dissipation sidewall and a second heat dissipation sidewall opposite to each other. The first heat dissipation sidewall is located on the side of the first segment away from the third segment, and the second heat dissipation sidewall is located on the side of the third segment away from the first segment.

[0016] In one possible implementation, the heat dissipation device further includes a heat dissipation baffle, and the heat dissipation sidewall further includes a third heat dissipation sidewall, a fourth heat dissipation sidewall, and a fifth heat dissipation sidewall; wherein the third heat dissipation sidewall is located on the side of the first segment facing the third segment, the fourth heat dissipation sidewall is located on the side of the second segment facing the liquid inlet and the liquid outlet, and the fifth heat dissipation sidewall is located on the side of the third segment facing the first segment, the heat dissipation baffle and the fourth heat dissipation sidewall are arranged opposite to each other, and a magnetic element is disposed in the accommodating space formed by the heat dissipation baffle, the third heat dissipation sidewall, the fourth heat dissipation sidewall, and the fifth heat dissipation sidewall.

[0017] In one possible implementation, the lower housing includes a first lower sidewall, with an inlet and an outlet penetrating through the first lower sidewall. The first lower sidewall also includes an input connector and an output connector; or...

[0018] The lower housing includes a first lower sidewall and a second lower sidewall disposed opposite to each other, wherein a liquid inlet and a liquid outlet are disposed through the second lower sidewall, and the first lower sidewall is further provided with an input connector and an output connector; or

[0019] The lower housing includes a first lower sidewall, and the upper housing includes a third upper sidewall. The first lower sidewall and the third upper sidewall are disposed opposite to each other. The third upper sidewall is provided with a clearance hole. A liquid inlet and a liquid outlet pass through the clearance hole and communicate with the liquid cooling channel. The first lower sidewall is also provided with an input connector and an output connector.

[0020] In one possible implementation, the heat dissipation body is integrally formed with the lower housing;

[0021] The bottom wall is provided with a planar flow channel that communicates with and corresponds to the liquid cooling flow channel. The heat dissipation device also includes a flow channel cover plate, which is welded to the bottom wall to form the planar flow channel.

[0022] In one possible implementation, an inlet and an outlet are disposed on the bottom wall, the inlet and the outlet passing through the flow channel cover and communicating with the planar flow channel.

[0023] In one possible implementation, the housing also includes a motherboard located above the heat dissipation device. The motherboard has multiple connector slots, and the power board has multiple connector protrusions. The connector protrusions are inserted into the connector slots respectively, and the connector protrusions are soldered to the corresponding connector slots.

[0024] In one possible implementation, the outer wall surface of at least one upper sidewall of the upper housing is further provided with an outer edge, and the outer edge is provided with a plurality of mounting holes; the bottom wall is further provided with a plurality of mounting posts, and each mounting post is provided with an assembly hole, the plurality of mounting holes corresponding one-to-one with the plurality of assembly holes, and the second fastener passes through the mounting hole and is fixedly connected to the corresponding assembly hole, the assembly hole being a through hole or a blind hole.

[0025] In one possible implementation, the contact surface between the outer edge and the mounting post is provided with a sealant layer.

[0026] In one possible implementation, the outer wall surface of the upper sidewall is further provided with multiple external connectors, or the bottom wall is provided with multiple external connectors, and the on-board charger is fixedly connected to an external device through the external connectors.

[0027] In one possible implementation, the bottom wall includes a flat plate portion and at least one first protrusion perpendicular to the flat plate portion, wherein the upper sidewall abuts against the first protrusion, and the height of the first protrusion is less than the height of the fixing hole in the direction perpendicular to the flat plate portion.

[0028] In one possible implementation, the bottom wall is further provided with a second protrusion, the second protrusion having a recessed groove, and one end of the power board is disposed in the recessed groove.

[0029] In one possible implementation, the housing further includes a motherboard and a digital signal processing board, an AC filter board, a high-voltage DC filter board, a low-voltage DC filter board, a main magnetic component board, and an auxiliary power magnetic component board located on the same side as the motherboard. The motherboard is positioned above the heat dissipation device. The auxiliary power magnetic component board and the main magnetic component board are disposed within the accommodating space formed by the heat dissipation body. The digital signal processing board, the AC filter board, the low-voltage DC filter board, and the high-voltage DC filter board are disposed outside the accommodating space formed by the heat dissipation body. The auxiliary power magnetic component board, the main magnetic component board, and the AC filter board are arranged parallel to the motherboard, while the low-voltage DC filter board, the digital signal processing board, and the high-voltage DC filter board are arranged perpendicular to the motherboard. The AC filter board and the digital signal processing board are disposed on one side of the heat dissipation body, and the high-voltage DC filter board is disposed on the other side of the heat dissipation body.

[0030] In one possible implementation, the power switch is disposed on the side of the power board away from the heat dissipation sidewall, and the power board has a plurality of heat conduction holes, with the power switch disposed opposite to the plurality of heat dissipation holes.

[0031] In one possible implementation, the power board is bonded to one side of a ceramic plate by a thermally conductive adhesive layer, and the other side of the ceramic plate is bonded to a boss on the heat dissipation sidewall.

[0032] In one possible implementation, the power board is attached to the heat dissipation sidewall via a heat dissipation medium.

[0033] On the other hand, this application provides a vehicle including an on-board charger as described in any of the above.

[0034] This application divides the housing into an upper housing and a lower housing. The upper housing includes a top wall and at least one upper side wall, and the lower housing includes a bottom wall and at least one lower side wall. A heat dissipation device is disposed on the bottom wall, and a power board is mounted on the heat dissipation side wall corresponding to the upper side wall. During assembly, the power board can be first installed onto the heat dissipation side wall of the heat dissipation device. Since the lower housing does not have a side wall on the side where the power board is installed, it is convenient to install the power board onto the heat dissipation side wall without interference with the lower housing, thereby reducing installation difficulty and improving assembly efficiency. After the power board is installed, the upper housing and lower housing are assembled, so that the upper side wall of the upper housing abuts against the bottom wall of the lower housing, and the lower side wall of the lower housing abuts against the top wall of the upper housing, thus forming a complete outer shell structure. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A simplified structural diagram of an on-board charger provided in one embodiment of this application;

[0037] Figure 2 for Figure 1 Simplified structural diagram with the upper shell removed;

[0038] Figure 3 for Figure 2 AA section view;

[0039] Figure 4 A simplified structural diagram of the upper shell provided in one embodiment of this application;

[0040] Figure 5 A simplified structural diagram of the lower housing and heat dissipation device provided in an embodiment of this application from one perspective;

[0041] Figure 6 An exploded view of the lower housing and heat dissipation device provided in one embodiment of this application from another perspective;

[0042] Figure 7 A simplified diagram of the connection structure between the power board and the heat dissipation device provided in an embodiment of this application;

[0043] Figure 8 A partial structural diagram of a motherboard provided in an embodiment of this application;

[0044] Figure 9 A simplified structural diagram of a first power board provided in an embodiment of this application from a first viewing angle;

[0045] Figure 10 A simplified structural diagram of a first power board provided in an embodiment of this application from a second perspective;

[0046] Figure 11 A simplified structural diagram of a second power board provided in an embodiment of this application from a first perspective;

[0047] Figure 12 A simplified structural diagram of the second power board provided in an embodiment of this application from a second perspective;

[0048] Figure 13 An exploded view of an on-board charger provided in another embodiment of this application;

[0049] Figure 14 for Figure 13 Simplified structural diagram of the lower and middle casing and heat dissipation device;

[0050] Figure 15 A simplified structural diagram of the lower housing and heat dissipation device provided in another embodiment of this application;

[0051] Figure 16 A simplified structural diagram of the lower housing and heat dissipation device provided in another embodiment of this application;

[0052] Figure 17 An exploded view of an on-board charger provided in yet another embodiment of this application;

[0053] Figure 18 A partial view of an on-board charger provided for yet another embodiment of this application;

[0054] Figure 19 A partial cross-sectional view of an on-board charger provided in yet another embodiment of this application;

[0055] Figure 20 A partial view of the connection structure between the power board and the heat dissipation device provided in another embodiment of this application;

[0056] Figure 21 A cross-sectional view of a power board provided in yet another embodiment of this application;

[0057] Figure 22 An exploded view of an on-board charger provided in yet another embodiment of this application.

[0058] Figure label:

[0059] 100 - Outer shell;

[0060] 110 - Upper housing; 111 - Top wall; 112 - First upper side wall; 113 - Second upper side wall; 114 - Third upper side wall; 115 - Outer edge; 1151 - Mounting hole;

[0061] 120 - Lower housing; 121 - Bottom wall; 1211 - Flat plate; 1212 - First protrusion; 1213 - Second protrusion; 1214 - Recessed groove; 122 - First lower sidewall; 1221 - Input connector; 1222 - Output connector; 123 - Second lower sidewall; 124 - Planar flow channel; 125 - Mounting post; 1251 - Assembly hole; 126 - External connector;

[0062] 200 - Heat dissipation device; 210 - Heat dissipation body; 2101 - First section; 2102 - Second section; 2103 - Third section; 211 - First heat dissipation sidewall; 212 - Second heat dissipation sidewall; 213 - Third heat dissipation sidewall; 214 - Fourth heat dissipation sidewall; 215 - Fifth heat dissipation sidewall; 216 - Heat dissipation baffle; 220 - Liquid cooling channel; 230 - Fixing column; 231 - Fixing hole; 240 - Liquid inlet; 250 - Liquid outlet; 260 - Thermally conductive adhesive layer; 270 - Channel cover plate; 280 - Ceramic plate;

[0063] 300 - Power board; 301 - Through hole; 302 - Connector protrusion; 303 - Power switch; 304 - Heat conduction hole; 310 - First power board; 320 - Second power board;

[0064] 400 - Motherboard; 410 - Connector slot;

[0065] 500-AC filter board;

[0066] 600-High Voltage DC Filter Board;

[0067] 700-Low Voltage DC Filter Board;

[0068] 800-Auxiliary power magnetic board;

[0069] 900-Digital Signal Processing Board;

[0070] 1000-Main magnetic component board. Detailed Implementation

[0071] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0072] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0073] As described in the background section, the on-board charger in the relevant technology suffers from low assembly efficiency. The main reason for this problem is related to the structure of the on-board charger's housing.

[0074] Specifically, in related technologies, the casing of the on-board charger includes a base and an end cover. The base includes a bottom wall and multiple continuously arranged side walls. The end cover is located on the side of the side walls opposite to the bottom wall, and the heat dissipation device is located inside the base. Generally, the power board can be installed into the base before installing the end cover. When installing the power board, it needs to be inserted through the opening at the top of the base and then fixed to the heat dissipation device and other parts inside the base. Due to the influence of the surrounding side walls, the above-mentioned process of installing the power board is relatively complex and difficult, affecting the overall assembly efficiency.

[0075] In view of this, the embodiments of this application aim to provide an on-board charger and a vehicle, by dividing the housing into an upper housing and a lower housing, wherein the upper housing includes a top wall and at least one upper side wall, and the lower housing includes a bottom wall and at least one lower side wall, a heat dissipation device is disposed on the bottom wall, and a power board is mounted on the heat dissipation side wall corresponding to the upper side wall. During assembly, the power board can be first installed on the heat dissipation side wall of the heat dissipation device. At this time, since the lower housing does not have a side wall on the side where the power board is installed, it is convenient to install the power board onto the heat dissipation side wall, and the installation process will not interfere with the lower housing, thereby reducing the installation difficulty and improving the assembly efficiency. After the power board is installed, the upper housing and the lower housing are then assembled, so that the upper side wall of the upper housing abuts against the bottom wall of the lower housing, and the lower side wall of the lower housing abuts against the top wall of the upper housing, thereby forming a complete outer shell structure.

[0076] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the contents of this application.

[0077] Please refer to Figures 1-22 This embodiment provides an on-board charger, including:

[0078] The housing 100 has a cavity formed within it. The shape of the housing 100 can be configured as needed, for example, it can be cylindrical or prismatic. For example, as shown... Figure 1 As shown, the outer shell 100 of this embodiment is generally rectangular.

[0079] Please refer to Figure 4 , Figure 5 and Figure 6 The outer casing 100 in this embodiment includes:

[0080] The upper housing 110 includes a top wall 111 and at least one upper side wall. It is understood that the upper housing 110 may have one upper side wall, or two, three or four upper side walls, and the number of upper side walls can be flexibly set based on actual needs and the shape of the housing.

[0081] The lower housing 120 includes a bottom wall 121 and at least one lower sidewall. It is understood that the lower housing 120 may have one, two, or three lower sidewalls, the number of which can be determined based on the number of upper sidewalls, the shape of the housing, and actual needs. Taking the rectangular housing 100 as an example, its total number of sidewalls is four, therefore the sum of the number of upper and lower sidewalls is also four.

[0082] The upper sidewall abuts against the bottom wall 121 and is detachably connected to the bottom wall 121. The lower sidewall abuts against the top wall 111 and is detachably connected to the top wall 111, thereby facilitating the connection and disassembly of the upper housing 110 and the lower housing 120.

[0083] The heat dissipation device 200 includes a heat dissipation body 210 extending from the bottom wall 121 into the cavity. For example... Figure 3 As shown, a liquid cooling channel 220 is formed inside the heat dissipation body 210, and a liquid coolant (such as water) can flow inside the liquid cooling channel 220. At least one heat dissipation sidewall is formed on the surface of the heat dissipation body 210. The specific number of heat dissipation sidewalls can be determined based on the shape of the heat dissipation body 210, etc. When the liquid coolant flows inside the liquid cooling channel 220, it can carry away the heat on the heat dissipation sidewall, thereby achieving rapid heat dissipation.

[0084] Please continue to refer to Figure 7 This embodiment also includes at least one power board 300, which is detachably mounted on a heat dissipation sidewall corresponding to the upper sidewall. At least one side of the power board 300 is provided with a power switch 303. The power switch 303 may be disposed on the surface of the power board 300; or, the power switch 303 may be embedded inside the power board 300.

[0085] Exemplarily, in one possible implementation, the power board 300 of this embodiment may include a first power board 310 and a second power board 320. Please continue to refer to Figures 9-12 Power switches 303 are provided on two opposing surfaces of the first power board 310, and power switches 303 are provided on two opposing surfaces of the second power board 320. In another possible embodiment, such as Figure 20As shown, the power board 300 may also have the power switch 303 only on the surface away from the heat dissipation sidewall. Of course, the power board 300 may also have the power switch only on the surface facing the heat dissipation sidewall; this application does not impose any limitations. In yet another possible embodiment, as... Figure 21 As shown, the power switch 303 is embedded inside the power board 300.

[0086] In this embodiment, the housing is divided into an upper housing 110 and a lower housing 120. The upper housing 110 includes a top wall 111 and at least one upper sidewall. A heat dissipation device 200 is disposed on the bottom wall 121, and a power board 300 is mounted on the heat dissipation sidewall corresponding to the upper sidewall. During assembly, the power board 300 can be first installed onto the heat dissipation sidewall of the heat dissipation device 200. Since the lower housing 120 does not have a sidewall on the side where the power board 300 is installed, it is easy to install the power board 300 onto the heat dissipation sidewall. The installation process will not interfere with the lower housing 120, thereby reducing the installation difficulty and improving the assembly efficiency. After the power board 300 is installed, the upper housing 110 and the lower housing 120 are assembled, so that the upper sidewall of the upper housing 110 abuts against the bottom wall 121 of the lower housing 120, and the lower sidewall of the lower housing 120 abuts against the top wall 111 of the upper housing 110, thereby forming a complete outer shell 100 structure.

[0087] Please continue to refer to Figure 5 , Figure 7 , Figure 9 , Figure 10 , Figure 11 and Figure 12 In this embodiment, the heat dissipation sidewall is provided with multiple fixing posts 230, and each fixing post 230 has a fixing hole 231. The power board 300 is provided with multiple through holes 301, each corresponding to a fixing hole 231, so that a first fastener passes through the through hole 301 and is fixedly connected to the corresponding fixing hole 231. For example, the fixing hole 231 can be a threaded hole, and the first fastener can be a screw or bolt. The first fastener passes through the through hole 301 and is threadedly connected to the corresponding fixing hole 231, thereby fixing the power board 300 to the corresponding heat dissipation sidewall. Furthermore, since there is a height difference between the fixing posts 230 and the heat dissipation sidewall, there is a certain gap between the power board 300 and the heat dissipation sidewall after fixing. This allows power switches 303 to be provided on both the side of the power board 300 facing the heat dissipation sidewall and the side of the power board 300 away from the heat dissipation sidewall, which helps to improve the power density of the on-board charger.

[0088] In one possible implementation, please continue to combine Figure 4The upper sidewall includes a first upper sidewall 112 and / or a second upper sidewall 113. The heat dissipation sidewall includes a first heat dissipation sidewall 211 and a second heat dissipation sidewall 212, which are opposite to each other. The power board 300 includes a first power board 310 and / or a second power board 320. The first upper sidewall 112 is correspondingly disposed with the first heat dissipation sidewall 211. The second upper sidewall 113 is correspondingly disposed with the second heat dissipation sidewall 212. The first power board 310 is detachably connected to the first heat dissipation sidewall 211, and the second power board 320 is detachably connected to the second heat dissipation sidewall 212.

[0089] With the above structure, a first power board 310 and a second power board 320 can be respectively mounted on two opposing first heat dissipation sidewalls 211 and 212 on the heat dissipation body 210, thereby improving the power density of the on-board charger. By integrating the first upper sidewall 112 and the second upper sidewall 113 onto the upper housing 110, the installation of the first power board 310 and the second power board 320 is facilitated, which helps to improve assembly efficiency.

[0090] Please continue to refer to Figure 5 In this embodiment, a boss is provided on the first heat dissipation sidewall 211 and / or the second heat dissipation sidewall 212. A thermally conductive adhesive layer 260 is provided on the surface of the boss, and the thermally conductive adhesive layer 260 is positioned directly opposite the power switch 303 of the power board 300. The power switch 303 can transfer heat to the first heat dissipation sidewall 211 and / or the second heat dissipation sidewall 212 through the thermally conductive adhesive layer 260, thereby improving heat dissipation efficiency.

[0091] In another possible implementation, the power board 300 can also be directly attached to the heat dissipation sidewall using a heat dissipation medium such as a thermally conductive adhesive layer, thereby eliminating the need for a locking step and improving assembly efficiency.

[0092] For example, such as Figure 18 and Figure 19 As shown, the example of attaching the power board 300 to the first heat dissipation sidewall 211 is explained. A boss can be provided on the first heat dissipation sidewall 211, and a thermally conductive adhesive layer 260 is provided on the surface of the boss. The surface of the power switch 303 of the power board 300 is also provided with a thermally conductive adhesive layer 260. The thermally conductive adhesive layer 260 on the surface of the boss and the thermally conductive adhesive layer 260 on the surface of the power switch 303 are respectively bonded to both sides of the ceramic plate 280.

[0093] Please continue to refer to Figure 20In another possible implementation, the power board 300 may have a power switch 303 only on the side facing away from the heat dissipation sidewall. The surface where the power switch 303 connects to the power board 300 is a heat dissipation surface. Multiple heat-conducting holes 304 may be provided within the power board 300, corresponding to the power switch 303. In a specific embodiment, the power board 300 is bonded to one side of the ceramic sheet 280 via a thermally conductive adhesive layer 260, and the other side of the ceramic sheet 280 is bonded to a protrusion on the first heat dissipation sidewall 211. The heat from the power switch 303 can be conducted to the first heat dissipation sidewall 211 through the heat-conducting holes 304 inside the power board 300, thereby achieving rapid heat dissipation.

[0094] Please continue to refer to Figure 5 The heat dissipation device 200 in this embodiment also includes a liquid inlet 240 and a liquid outlet 250. Both the liquid inlet 240 and the liquid outlet 250 are connected to the liquid cooling channel 220. The liquid coolant can enter the liquid cooling channel 220 from the liquid inlet 240 and flow out from the liquid outlet 250.

[0095] The heat dissipation body 210 includes a first segment 2101, a second segment 2102, and a third segment 2103. An inlet 240 is connected to the first segment 2101, and an outlet 250 is connected to the third segment 2103. The first segment 2101 and the third segment 2103 are both located on the same side of the second segment 2102. The two ends of the second segment 2102 are connected to the first segment 2101 and the third segment 2103, respectively. The first segment 2101, the second segment 2102, and the third segment 2103 together form a generally U-shaped heat dissipation body 210. In one possible embodiment, the first segment 2101, the second segment 2102, and the third segment 2103 are a single piece. In another possible embodiment, the first segment 2101, the second segment 2102, and the third segment 2103 are separate pieces, assembled to form the heat dissipation body 210.

[0096] The first heat dissipation sidewall 211 and the second heat dissipation sidewall 212 are both outer sidewalls of the heat dissipation body 210. Specifically, the first heat dissipation sidewall 211 is located on the side of the first segment 2101 that is away from the third segment 2103, and the second heat dissipation sidewall 212 is located on the side of the third segment 2103 that is away from the first segment 2101.

[0097] Furthermore, the heat dissipation device 200 also includes a heat dissipation baffle 216, and the heat dissipation sidewalls further include a third heat dissipation sidewall 213, a fourth heat dissipation sidewall 214, and a fifth heat dissipation sidewall 215. The third heat dissipation sidewall 213 is located on the side of the first segment 2101 facing the third segment 2103; the fourth heat dissipation sidewall 214 is located on the side of the second segment 2102 facing the liquid inlet 240 and the liquid outlet 250; and the fifth heat dissipation sidewall 215 is located on the side of the third segment 2103 facing the first segment 2101. The heat dissipation baffle 216 is positioned opposite to the fourth heat dissipation sidewall 214. In other words, the heat dissipation baffle 216 forms another inner sidewall of the heat dissipation body 210, with the third heat dissipation sidewall 213, the fourth heat dissipation sidewall 214, and the fifth heat dissipation sidewall 215 being the three inner sidewalls of the heat dissipation body 210. A magnetic element is located in the accommodating space formed by the heat dissipation baffle 216, the third heat dissipation sidewall 213, the fourth heat dissipation sidewall 214, and the fifth heat dissipation sidewall 215. The magnetic element can be, for example, a transformer. The magnetic element can dissipate heat through contact with the third heat dissipation sidewall 213, the fourth heat dissipation sidewall 214, and the fifth heat dissipation sidewall 215, thereby fully utilizing the heat dissipation device 200 and improving heat dissipation efficiency. In one embodiment, the accommodating space may be filled with thermal adhesive.

[0098] The heat dissipation body 210 has a first power board 310 and a second power board 320 respectively installed on two opposing first heat dissipation sidewalls 211 and second heat dissipation sidewalls 212. It can be understood that other power boards can be installed on the outer sidewall of the second section 2102 away from the heat dissipation baffle 216 to make full use of the heat dissipation device 200 and improve heat dissipation efficiency.

[0099] In one possible implementation, such as Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, the lower sidewall of this embodiment includes a first lower sidewall 122, with an inlet 240 and an outlet 250 penetrating through the first lower sidewall 122. The first lower sidewall 122 is also provided with an input connector 1221, an output connector 1222, and a signal connector 1223.

[0100] In another possible implementation, such as Figure 13 and Figure 14 As shown, the liquid inlet 240 and the liquid outlet 250 can also be located on opposite sides of the first lower sidewall 122. The third upper sidewall 114 of the upper housing 110 is provided with corresponding clearance holes. The liquid inlet 240 and the liquid outlet 250 pass through the clearance holes and are connected to the liquid cooling channel 220. The first lower sidewall 122 is provided with an input connector and an output connector.

[0101] In another possible implementation, such as Figure 15As shown, the inlet 240 and outlet 250 can also be provided on the bottom wall 121. The inlet 240 and outlet 250 pass through the flow channel cover plate 270 and are connected to the planar flow channel.

[0102] In yet another possible implementation, such as Figure 16 As shown, the lower sidewall of this embodiment may further include a first lower sidewall 122 and a second lower sidewall 123 disposed opposite to each other, with the second lower sidewall 123 disposed near the heat dissipation baffle 216. The liquid inlet 240 and the liquid outlet 250 penetrate the second lower sidewall 123, and the first lower sidewall 122 is provided with an input connector 1221 and an output connector 1222.

[0103] In this embodiment, the heat dissipation body 210 can be integrally formed with the lower housing 120, for example, by casting.

[0104] Please continue to refer to Figure 6 In this embodiment, the bottom wall 121 is provided with a planar flow channel 124 that communicates with and corresponds to the liquid cooling flow channel 220. The heat dissipation device 200 also includes a flow channel cover plate 270, which is welded to the bottom wall 121 to form the planar flow channel 124. The flow channel cover plate 270 can be welded to the bottom wall 121 by means of friction stir welding, for example, to ensure sealing performance.

[0105] Please continue to refer to Figure 2 and Figure 3 In this embodiment, a motherboard 400 is also provided inside the outer casing 100, and the motherboard 400 is located above the heat dissipation device 200. For example... Figures 8-10 As shown, the motherboard 400 has multiple connector slots 410, and the power board 300 has multiple connector protrusions 302. The multiple connector protrusions 302 are respectively inserted into the multiple connector slots 410, and the connector protrusions 302 are soldered to the corresponding connector slots 410, thereby realizing the power connection and signal connection between the power board 300 and the motherboard 400.

[0106] Please continue to refer to Figure 4 , Figure 5 and Figure 17 In this embodiment, at least one upper sidewall of the upper housing 110 is provided with an outer edge 115. The outer edge 115 is located at one end of the upper sidewall near the lower housing 120. The outer edge 115 is provided with a plurality of mounting holes 1151, which can be through holes.

[0107] The bottom wall 121 is also provided with a plurality of mounting posts 125, each with a mounting hole 1251. A plurality of mounting holes 1151 correspond one-to-one with a plurality of mounting holes 1251. A second fastener passes through the mounting hole 1151 and is fixedly connected to the corresponding mounting hole 1251. For example, the mounting hole 1251 is a through hole 301 or a blind hole, and has an internal thread. The second fastener can be, for example, a bolt or screw. After passing through the mounting hole 1151, the second fastener is threadedly connected to the corresponding mounting hole 1251, thereby assembling the upper housing 110 and the lower housing 120 into a single unit.

[0108] To improve sealing, a sealing adhesive layer may also be provided on the contact surface between the outer edge 115 and the mounting post 125 in this embodiment.

[0109] In one possible implementation, please continue to refer to Figure 5 and Figure 14 In this embodiment, the bottom wall 121 is provided with a plurality of external connectors 126. The external connectors 126 may have connection holes, and the on-board charger is fixedly connected to an external device through the external connectors 126. For example, the connection holes may be through holes, and the external device may have structures such as threaded holes. The external connectors 126 can be fastened to the external device by fasteners such as bolts and screws, thereby realizing the installation and fixation of the on-board charger.

[0110] In another possible implementation, such as Figure 17 As shown, multiple external connectors 126 can also be disposed on the outer wall surface of the upper sidewall. It is understood that the multiple external connectors 126 are located at the end of the upper sidewall near the lower housing 120, thereby facilitating subsequent connection and fixation.

[0111] Please continue to refer to Figure 5 In this embodiment, the bottom wall 121 includes a flat plate portion 1211 and at least one first protrusion 1212 perpendicular to the flat plate portion 1211, wherein the upper sidewall abuts against the first protrusion 1212. For example, this embodiment provides three first protrusions 1212, which abut against the first upper sidewall 112, the second upper sidewall 113, and the third upper sidewall 114, respectively.

[0112] In the direction perpendicular to the flat plate portion 1211, the height of the first protrusion 1212 is less than the height of the fixing hole 231, thereby avoiding interference with the installation of the power board 300.

[0113] Furthermore, the bottom wall 121 of this embodiment is also provided with a second protrusion 1213, and a concave groove 1214 is provided in the second protrusion 1213. One end of the power board 300 can be disposed in the concave groove 1214, thereby using the concave groove 1214 to snap and fix the power board 300, reducing the probability of the low power board 300 shaking.

[0114] Please continue to refer to Figure 5 , Figure 7 and Figure 22 In this embodiment, the housing 100 also includes a motherboard 400 and a digital signal processing (DSP) board 900, an alternating current electromagnetic interference (AC EMI) board 500, a direct current electromagnetic interference (DC EMI) board 600, a low voltage electromagnetic interference (LV EMI) board 700, a main magnetic component board 1000, and an auxiliary power module (APM) board 800 located on the same side as the motherboard 400. The motherboard 400 is located above the heat dissipation device 200. The auxiliary power magnetic board 800 and the main magnetic board 1000 are disposed inside the accommodating space formed by the heat dissipation body 210. The digital signal processing board 900, the AC filter board 500, the low-voltage DC filter board 700 and the high-voltage DC filter board 600 are disposed outside the accommodating space formed by the heat dissipation body 210. The auxiliary power magnetic board 800, the main magnetic board 1000 and the AC filter board 500 are disposed parallel to the motherboard 400. The low-voltage DC filter board 700, the digital signal processing board 900 and the high-voltage DC filter board 600 are disposed perpendicular to the motherboard 400. The AC filter board 500 and the digital signal processing board 900 are disposed on one side of the heat dissipation body 210 and the high-voltage DC filter board 600 is disposed on the other side of the heat dissipation body 210.

[0115] In this embodiment, the first power board 310 can be the primary circuit board of the high voltage DC-DC converter, and the second power board 320 can be the secondary circuit board of the high voltage DC-DC converter.

[0116] This embodiment also provides a vehicle including the above-described on-board charger.

[0117] It is understood that, since the vehicle in this embodiment uses the above-mentioned on-board charger, the difficulty of installing the power board into the housing can be reduced and the assembly efficiency can be improved.

[0118] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0119] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0120] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0121] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0122] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An on-board charger, characterized in that, include: A housing having a cavity, the housing comprising: Upper housing, the upper housing including a top wall and at least one upper side wall; and The lower housing includes a bottom wall and at least one lower side wall, wherein the upper side wall abuts against the bottom wall and is detachably connected to the bottom wall; the lower side wall abuts against the top wall and is detachably connected to the top wall. A heat dissipation device, comprising a heat dissipation body extending from the bottom wall into the cavity, wherein a liquid cooling channel is formed within the heat dissipation body, and at least one heat dissipation sidewall is formed on the surface of the heat dissipation body; and At least one power board is provided, which is detachably mounted on the heat dissipation sidewall corresponding to the upper sidewall. At least one side of the power board is provided with a power switch or the power switch is embedded inside the power board.

2. The on-board charger according to claim 1, characterized in that, The heat dissipation sidewall is provided with multiple fixing posts, and each fixing post is provided with a fixing hole; the power board is provided with multiple through holes, and each of the multiple through holes corresponds to one of the multiple fixing holes. The first fastener passes through the through hole and is fixedly connected to the corresponding fixing hole.

3. The on-board charger according to claim 1, characterized in that, The upper sidewall includes a first upper sidewall and / or a second upper sidewall, the heat dissipation sidewall includes a first heat dissipation sidewall and a second heat dissipation sidewall opposite to each other, and the power board includes a first power board and / or a second power board; wherein, the first upper sidewall is correspondingly disposed to the first heat dissipation sidewall; and / or, the second upper sidewall is correspondingly disposed to the second heat dissipation sidewall; the first power board is detachably connected to the first heat dissipation sidewall; and / or, the second power board is detachably connected to the second heat dissipation sidewall.

4. The on-board charger according to claim 3, characterized in that, The first heat dissipation sidewall and / or the second heat dissipation sidewall are provided with a boss, and the surface of the boss is provided with a thermally conductive adhesive layer, which is positioned directly opposite the power switch of the power board.

5. The on-board charger according to claim 1, characterized in that, The heat dissipation device further includes a liquid inlet and a liquid outlet. The heat dissipation body includes a first section, a second section, and a third section, wherein the liquid inlet is connected to the first section, the liquid outlet is connected to the third section, the first section and the third section are both located on the same side of the second section, and the two ends of the second section are respectively connected to the first section and the third section. The heat dissipation sidewall includes a first heat dissipation sidewall and a second heat dissipation sidewall opposite to each other. The first heat dissipation sidewall is located on the side of the first segment away from the third segment, and the second heat dissipation sidewall is located on the side of the third segment away from the first segment.

6. The on-board charger according to claim 5, characterized in that, The heat dissipation device further includes a heat dissipation baffle wall, and the heat dissipation sidewall further includes a third heat dissipation sidewall, a fourth heat dissipation sidewall, and a fifth heat dissipation sidewall; wherein the third heat dissipation sidewall is located on the side of the first segment facing the third segment, the fourth heat dissipation sidewall is located on the side of the second segment facing the liquid inlet and the liquid outlet, and the fifth heat dissipation sidewall is located on the side of the third segment facing the first segment. The heat dissipation baffle wall and the fourth heat dissipation sidewall are arranged opposite to each other, and a magnetic element is disposed in the accommodating space formed by the heat dissipation baffle wall, the third heat dissipation sidewall, the fourth heat dissipation sidewall, and the fifth heat dissipation sidewall.

7. The on-board charger according to claim 1, characterized in that, The lower housing includes a first lower sidewall, with an inlet and an outlet penetrating through the first lower sidewall. The first lower sidewall also includes an input connector and an output connector; or... The lower housing includes a first lower sidewall and a second lower sidewall disposed opposite to each other, wherein a liquid inlet and a liquid outlet are disposed through the second lower sidewall, and the first lower sidewall is further provided with an input connector and an output connector; or The lower housing includes a first lower sidewall, and the upper housing includes a third upper sidewall. The first lower sidewall and the third upper sidewall are disposed opposite to each other. The third upper sidewall is provided with a clearance hole. A liquid inlet and a liquid outlet pass through the clearance hole and communicate with the liquid cooling channel. The first lower sidewall is also provided with an input connector and an output connector.

8. The on-board charger according to claim 1, characterized in that, The heat dissipation body is integrally formed with the lower shell; The bottom wall is provided with a planar flow channel that communicates with and corresponds to the liquid cooling flow channel. The heat dissipation device also includes a flow channel cover plate, which is welded to the bottom wall to form the planar flow channel.

9. The on-board charger according to claim 8, characterized in that, An inlet and an outlet are provided on the bottom wall. The inlet and outlet penetrate the flow channel cover and are connected to the planar flow channel.

10. The on-board charger according to claim 1, characterized in that, The housing also contains a motherboard located above the heat dissipation device. The motherboard has multiple connector slots, and the power board has multiple connector protrusions. The connector protrusions are inserted into the connector slots respectively, and the connector protrusions are soldered to the corresponding connector slots.

11. The on-board charger according to claim 1, characterized in that, The outer wall surface of at least one upper sidewall of the upper housing is further provided with an outer edge, and the outer edge is provided with a plurality of mounting holes; the bottom wall is further provided with a plurality of mounting posts, and the mounting posts are provided with assembly holes, and the plurality of mounting holes correspond one-to-one with the plurality of assembly holes. After the second fastener passes through the mounting hole, it is fixedly connected to the corresponding assembly hole. The assembly hole is a through hole or a blind hole.

12. The on-board charger according to claim 11, characterized in that, A sealant layer is provided on the contact surface between the outer edge and the mounting post.

13. The on-board charger according to claim 1, characterized in that, The outer wall surface of the upper sidewall is also provided with multiple external connectors, or the bottom wall is provided with multiple external connectors, and the on-board charger is fixedly connected to an external device through the external connectors.

14. The on-board charger according to claim 2, characterized in that, The bottom wall includes a flat plate portion and at least one first protrusion perpendicular to the flat plate portion, wherein the upper sidewall abuts against the first protrusion portion, and the height of the first protrusion portion is less than the height of the fixing hole in the direction perpendicular to the flat plate portion.

15. The on-board charger according to claim 1, characterized in that, The bottom wall is also provided with a second protrusion, and the second protrusion has a concave groove, with one end of the power board disposed in the concave groove.

16. The on-board charger according to claim 1, characterized in that, The housing also includes a motherboard and a digital signal processing board, an AC filter board, a high-voltage DC filter board, a low-voltage DC filter board, a main magnetic component board, and an auxiliary power magnetic component board located on the same side as the motherboard. The motherboard is located above the heat dissipation device. The auxiliary power magnetic component board and the main magnetic component board are disposed inside the accommodating space formed by the heat dissipation body. The digital signal processing board, the AC filter board, the low-voltage DC filter board, and the high-voltage DC filter board are disposed outside the accommodating space formed by the heat dissipation body. The auxiliary power magnetic component board, the main magnetic component board, and the AC filter board are arranged parallel to the motherboard. The low-voltage DC filter board, the digital signal processing board, and the high-voltage DC filter board are arranged perpendicular to the motherboard. The AC filter board and the digital signal processing board are disposed on one side of the heat dissipation body, and the high-voltage DC filter board is disposed on the other side of the heat dissipation body.

17. The on-board charger according to claim 1, characterized in that, The power switch is located on the side of the power board away from the heat dissipation sidewall. The power board has multiple heat conduction holes, and the power switch is arranged opposite to the multiple heat dissipation holes.

18. The on-board charger according to claim 4 or 16, characterized in that, The power board is bonded to one side of a ceramic plate by a thermally conductive adhesive layer, and the other side of the ceramic plate is bonded to a protrusion on the heat dissipation sidewall.

19. The on-board charger according to claim 1, characterized in that, The power board is attached to the heat dissipation sidewall using a heat dissipation medium.

20. A vehicle, characterized in that, Includes the on-board charger as described in any one of claims 1-19.

Images