An automatic sheet loading machine for lead-tin solder

CN224797323UActive Publication Date: 2026-09-25LISSEN SEMICONDUCTOR (CHANGZHOU) CO LTD
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Patent Information

Application Number
CN202521910462.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-05
Publication Date
2026-09-25
Estimated Expiration
2035-09-05

AI Technical Summary

Technical Problem

人工上料时,工人需手动将散装的铅锡焊料逐个放置到指定位置,这一过程不仅劳动强度大、效率低下,而且由于人工操作的随意性和不稳定性,极易导致焊料在上料过程中出现位置偏差、排列杂乱等问题,进而影响后续装填和包装的准确性

Benefits of technology

[0011]本实用新型的铅锡焊料自动装片机实现了从焊料储存、上料、输送、装填到包装的全自动化操作,大大提高了生产效率,减少了人工干预,降低了劳动强度。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model belongs to the welding piece packing technical field, concretely relates to a lead tin solder automatic piece loader, including frame, the upper side of frame is equipped with filling mechanism, the lower side of frame is equipped with packing mechanism, and filling mechanism includes the conveyer belt that is located in the middle part of frame, and the right -hand member of conveyer belt is installed with guide blanking shell, and frame rotatory installation has filled tray, and filled tray side wall is installed with a plurality of blanking tubes, and packing mechanism is located filled tray below, frame is provided with the feeding assembly that is located in the front and back of conveyer belt, and feeding assembly includes machine table, and the upper end of machine table is provided with vibration dish, and machine table is installed with the conveyer table that is located in the vibration dish discharge port place, and conveyer table is provided with blanking tube, and conveyer belt is installed with the temporary storage box that is matched with blanking tube position, lead tin solder automatic piece loader has realized from the full automation operation of solder storage, feeding, conveying, filling to packing, has improved production efficiency greatly, has reduced manual intervention, has reduced labor intensity.
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Description

Technical Field

[0001] This utility model belongs to the field of solder sheet packaging technology, specifically relating to an automatic lead-tin solder sheet loading machine. Background Technology

[0002] Lead-tin solder, as an important welding material, has wide and indispensable applications in many fields such as electronics, electrical engineering, and machinery manufacturing. Its quality and packaging standards directly affect the stability of subsequent welding processes and the reliability of the final product.

[0003] In the traditional lead-tin solder production and packaging process, a large amount of manual labor is required to complete the feeding, filling, and packaging processes. During manual feeding, workers must manually place the bulk lead-tin solder pieces one by one into designated positions. This process is not only labor-intensive and inefficient, but also prone to problems such as positional deviations and disordered arrangement of solder due to the randomness and instability of manual operation, which in turn affects the accuracy of subsequent filling and packaging. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic lead-tin solder loading machine to solve the problems mentioned in the background art.

[0005] To achieve the above technical objectives, the technical solution adopted by this utility model is as follows: An automatic lead-tin solder loading machine includes a frame, a loading mechanism on the upper side of the frame, and a packaging mechanism on the lower side of the frame. The loading mechanism includes a conveyor belt located in the middle of the frame, a guide shell for feeding is installed at the right end of the conveyor belt, a loading disc is rotatably mounted on the frame, a plurality of feeding pipes are installed on the side wall of the loading disc, and the packaging mechanism is located below the loading disc. The frame is equipped with feeding components located on the front and rear sides of the conveyor belt. The feeding components include a machine base, a vibrating plate is provided at the upper end of the machine base, a conveying platform is installed on the machine base at the discharge port of the vibrating plate, the conveying platform is provided with a discharge pipe, and a temporary storage box matching the position of the discharge pipe is installed on the conveyor belt.

[0006] An inclined platform is provided at the right end of the storage box.

[0007] A conveyor belt for conveying solder is provided on the upper side of the conveyor platform.

[0008] An infrared sensor is installed inside the feed pipe.

[0009] A first support frame is installed on the upper side of the machine platform. The first support frame is equipped with a storage tray located above the vibrating plate. A discharge port is provided at the bottom of the storage tray. An electrically controlled valve is provided at the discharge port. A guide rail is installed at the bottom of the storage tray on the first support frame.

[0010] A second support frame is installed on the upper side of the machine platform. The second support frame is equipped with two sets of ultraviolet disinfection lamps, which are located above the conveyor table and the vibratory plate, respectively.

[0011] The automatic lead-tin solder loading machine of this invention realizes fully automated operation from solder storage, feeding, conveying, filling to packaging, which greatly improves production efficiency, reduces manual intervention, and reduces labor intensity.

[0012] This invention, by setting up a temporary storage box, a feeding pipe, and an infrared sensor, can precisely control the amount of solder fed and filled, ensuring the accuracy and consistency of the solder assembly. The temporary storage box can prevent the solder from shifting position during the conveying process.

[0013] The ultraviolet disinfection lamp installed in this invention can disinfect the solder in real time, effectively kill bacteria on the surface of the solder, ensure that the produced lead-tin solder meets hygiene standards, and improve the quality and safety of the product. Attached Figure Description

[0014] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings.

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the automatic lead-tin solder loading machine of this utility model. Figure 1 ; Figure 2 for Figure 1 Enlarged structural diagram at point A; Figure 3 This is a schematic diagram of the structure of an embodiment of the automatic lead-tin solder loading machine of this utility model. Figure 2 .

[0016] The symbols for the main components are explained below: Frame 1, conveyor belt 11, guide unloading shell 12, filling tray 13, unloading pipe 14, machine base 2, vibrating plate 201, conveyor table 21, conveyor belt 211, unloading pipe 22, temporary storage box 23, first support frame 3, storage tray 31, guide rail 32, second support frame 33, ultraviolet disinfection lamp tube 34. Detailed Implementation

[0017] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] like Figure 1-3 As shown, the present invention provides an automatic lead-tin solder loading machine, which includes a frame 1, a loading mechanism on the upper side of the frame 1, and a packaging mechanism on the lower side of the frame 1. The filling mechanism includes a conveyor belt 11 located in the middle of the frame 1, which is used to transport lead-tin solder. A guide shell 12 is installed at the right end of the conveyor belt 11, which guides the solder to be accurately discharged. A filling tray 13 is rotatably mounted on the frame 1. The filling tray 13 can rotate around its own axis. Several discharge pipes 14 are installed on the side wall of the filling tray 13. The discharge pipes 14 are used to fill the solder into the packaging mechanism. The packaging mechanism is located below the filling tray 13 to receive the solder falling from the discharge pipes 14.

[0019] The frame 1 is equipped with feeding components located on both sides of the conveyor belt 11. The feeding components include a machine base 2, on the upper end of which is a vibratory feeder 201. The vibratory feeder 201 vibrates to arrange the lead-tin solder in an orderly manner and conveys it to the discharge port. The machine base 2 is equipped with a conveyor platform 21 located at the discharge port of the vibratory feeder 201. The conveyor platform 21 is equipped with a discharge pipe 22. The conveyor belt 11 is equipped with a temporary storage box 23 that matches the position of the discharge pipe 22. The temporary storage box 23 is used to temporarily store the solder falling from the discharge pipe 22. The next operation is carried out after the conveyor belt 11 conveys the temporary storage box 23 to a suitable position. The temporary storage box 23 prevents the position of the solder from shifting during the conveying process.

[0020] An inclined platform is provided at the right end of the storage box 23, which facilitates the smooth sliding of solder from the temporary storage box 23 to the guide shell 12.

[0021] A conveyor belt 211 for conveying solder is provided on the upper side of the conveyor table 21. The conveyor belt 211 can improve the conveying efficiency of solder on the conveyor table 21.

[0022] An infrared sensor is installed inside the feeding tube 22. The infrared sensor is used to detect whether there is solder passing through the feeding tube 22, so as to keep track of the feeding situation in time and ensure the continuity and accuracy of feeding.

[0023] A first support frame 3 is installed on the upper side of the machine base 2. A storage tray 31 is mounted on the first support frame 3 above the vibratory feeder 201. The storage tray 31 is used to store a large amount of lead-tin solder. A discharge port is provided at the bottom of the storage tray 31, and an electrically controlled valve is installed at the discharge port. By controlling the opening and closing of the electrically controlled valve, the amount of solder entering the vibratory feeder 201 from the storage tray 31 can be precisely controlled. A guide rail 32 is installed at the bottom of the storage tray 31 on the first support frame 3. The guide rail 32 is used to guide the solder falling from the discharge port of the storage tray 31 accurately into the vibratory feeder 201.

[0024] A second support frame 33 is installed on the upper side of the machine base 2. The second support frame 33 is equipped with two sets of ultraviolet disinfection lamps 34, which are located above the conveyor table 21 and the vibratory feeder 201, respectively. The ultraviolet disinfection lamps 34 can disinfect the lead-tin solder on the vibratory feeder 201 and the conveyor table 21 with ultraviolet light, effectively killing bacteria and viruses on the surface of the solder and ensuring hygiene and safety in the production process.

[0025] When using, place a large amount of lead-tin solder into the storage tray 31, and close the electric control valve at the discharge port of the storage tray 31 to ensure that the solder does not fall out randomly.

[0026] Check whether the moving parts such as the vibratory feeder 201, conveyor belt 11, and transmission belt 211 are in good working order, and ensure that each part can operate flexibly.

[0027] Turn on the ultraviolet disinfection lamp 34 to pre-disinfect the vibratory plate 201 and the conveyor 21. The disinfection time is set according to the actual situation, generally 10-30 minutes.

[0028] Open the electrically controlled valve at the discharge port of the storage tray 31 to allow the lead-tin solder in the storage tray 31 to enter the vibratory feeder 201 through the guide rail 32. The vibratory feeder 201 starts to vibrate, arranging the solder in an orderly manner and conveying it to the discharge port.

[0029] Solder enters the conveyor table 21 from the discharge port of the vibratory feeder 201. Under the action of the conveyor belt 211, the solder is transported to the discharge pipe 22. An infrared sensor inside the discharge pipe 22 detects the passage of the solder in real time and feeds the signal back to the control system.

[0030] After the solder falls into the temporary storage box 23 through the discharge pipe 22, the conveyor belt 11 starts to operate, transporting the temporary storage box 23 containing the solder to the designated position. The inclined platform at the right end of the temporary storage box 23 allows the solder to slide smoothly onto the conveyor belt 11 and continue to be transported to the filling mechanism.

[0031] The conveyor belt 11 transports the solder to the area below the guide shell 12, and the guide shell 12 guides the solder to the discharge pipe 14 on the side wall of the filling pan 13.

[0032] The filling tray 13 rotates around its own axis under the action of the drive device. When the feed tube 14 rotates to align with the guide feed shell 12, the solder falls into the packaging mechanism below through the feed tube 14, completing the filling process.

[0033] The packaging unit receives the solder falling from the feed pipe 14, packages it according to the preset packaging specifications and methods, and finally obtains the finished lead-tin solder package.

[0034] During equipment operation, operators can monitor the operating status of each component in real time through the control system, such as the speed of the conveyor belt 11, the vibration frequency of the vibratory plate 201, and the feedback signal of the infrared sensor.

[0035] Regular maintenance of the equipment is required, including cleaning components such as the vibratory feeder 201, conveyor belt 11, and conveyor table 21, checking the tightness of all connections, and replacing worn parts to ensure that the equipment is always in good operating condition.

[0036] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An automatic lead-tin solder loading machine, comprising a frame, a loading mechanism on the upper side of the frame, and a packaging mechanism on the lower side of the frame, characterized in that: The filling mechanism includes a conveyor belt located in the middle of the frame, a guide shell installed at the right end of the conveyor belt, a filling disc rotatably mounted on the frame, a plurality of discharge pipes installed on the side wall of the filling disc, and a packaging mechanism located below the filling disc. The frame is equipped with feeding components located on the front and rear sides of the conveyor belt. The feeding components include a machine base, a vibrating plate is provided at the upper end of the machine base, a conveying platform is installed on the machine base at the discharge port of the vibrating plate, the conveying platform is provided with a discharge pipe, and a temporary storage box matching the position of the discharge pipe is installed on the conveyor belt.

2. The automatic lead-tin solder loading machine according to claim 1, characterized in that: An inclined platform is provided at the right end of the storage box.

3. The automatic lead-tin solder loading machine according to claim 1, characterized in that: A conveyor belt for conveying solder is provided on the upper side of the conveyor platform.

4. The automatic lead-tin solder loading machine according to claim 1, characterized in that: An infrared sensor is installed inside the feed pipe.

5. The automatic lead-tin solder loading machine according to claim 1, characterized in that: A first support frame is installed on the upper side of the machine platform. The first support frame is equipped with a storage tray located above the vibrating plate. A discharge port is provided at the bottom of the storage tray. An electrically controlled valve is provided at the discharge port. A guide rail is installed at the bottom of the storage tray on the first support frame.

6. The automatic lead-tin solder loading machine according to claim 1, characterized in that: A second support frame is installed on the upper side of the machine platform, and the second support frame is equipped with two sets of ultraviolet disinfection lamps. The two sets of ultraviolet disinfection lamps are located above the conveyor table and the vibrating plate, respectively.