High-temperature-resistant electronic blister tray made of abs resin

Abstract

The utility model discloses ABS resin high temperature resistance electronic blister tray relates to the field of blister tray, including tray box, the top of tray box is opened with recess, and recess is connected with the supporting plate in, a plurality of depositing grooves are seted up in the supporting plate, the fixed frame pad is seted up on depositing groove inner wall, the lifting of frame pad inside is seted up with sucking disc, the top of sucking disc adsorbs chip, and frame pad sets up in chip bottom, the bottom center of depositing groove is opened with enough sucking disc lifting through's through -hole, the through -hole bottom and recess intercommunication, two corner department of tray box all is provided with connecting plate, and the winding shaft rotation is connected between two connecting plates, the dustproof film is seted up with winding outside winding shaft, press control button (up button), and control electric push rod moves upward, and electric push rod drives lifting plate and sucking disc synchronous rise, and sucking disc drives chip to extend depositing groove, and the operator can directly manually take out chip.

Description

Technical Field

[0001] This utility model relates to the field of blister trays, and in particular to a high-temperature resistant electronic blister tray made of ABS resin. Background Technology

[0002] Plastic sheets are made into specific grooves to place products inside, serving to protect and beautify them. There are also transport-type pallet packaging. Pallets are used more often for convenience. In the production process of electronic chips, blister trays are needed for position transfer.

[0003] When placing chips on existing trays, the chips are placed directly into the grooves at the top of the tray. To prevent the chips from moving during transportation, the grooves are matched to the size of the chips. However, because the gap between the chips and the grooves is small, it is difficult for personnel to retrieve the chips later.

[0004] Therefore, it is necessary to propose a high-temperature resistant ABS resin electronic blister tray to solve the above problems. Utility Model Content

[0005] The purpose of this utility model is to provide a high-temperature resistant ABS resin electronic blister tray to solve the problem that when placing chips on existing trays, the chips are placed directly in the groove at the top of the tray. In order to prevent the chips from moving during transportation, the groove is matched with the size of the chip. However, due to the small gap between the chip and the groove, it is difficult for personnel to retrieve the chip later.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an ABS resin high-temperature resistant electronic blister tray, including a tray box, the top of the tray box having a groove, a support plate being snapped into the groove, the support plate having multiple placement slots, a frame-shaped pad being fixed on the inner wall of the placement slot, a suction cup being raised and lowered inside the frame-shaped pad, a chip being adsorbed on the top of the suction cup, and the frame-shaped pad being placed at the bottom of the chip, and a through hole being opened at the center of the bottom of the placement slot, large enough for the suction cup to rise and fall, the bottom of the through hole communicating with the inside of the groove;

[0007] The tray box is provided with connecting plates at both corners, and a winding shaft is rotatably connected between the two connecting plates. A dustproof film is wound around the outside of the winding shaft, and a magnetic end is fixed to the end of the dustproof film. The magnetic end is magnetically attracted to one side of the top of the support plate.

[0008] Preferably, each of the four corners of the groove is fixedly connected to an electric push rod, the top of each of the four electric push rods is fixedly connected to a lifting plate, and the bottom of each of the multiple suction cups is fixedly connected to the top of the lifting plate.

[0009] Preferably, a support shaft is provided above the winding shaft, and the support shaft is fixed between the two connecting plates.

[0010] Preferably, auxiliary handles are fixedly connected to both sides of the tray box, and both auxiliary handles are U-shaped.

[0011] Preferably, both ends of the winding shaft are rotatably connected to the corresponding connecting plates via rotating shafts, and the rotating shafts are provided with torsion springs.

[0012] Preferably, a charging power supply is provided inside the tray box, and a control button for controlling the raising and lowering of the electric push rod is provided on the outside of the tray box.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] 1. By combining the suction force of the suction cup with the support and cushioning effect of the frame pad, the chip is double-fixed. Compared with the traditional slot-type fixing method, the fixing stability is significantly improved, which can effectively prevent the chip from shifting or colliding during transportation, reduce the risk of chip damage, and ensure the chip's appearance and performance remain intact.

[0015] 2. A dustproof structure is set up with a winding shaft, a dustproof film and a magnetic end. The dustproof film can quickly cover the top of the support plate, effectively blocking dust from entering the placement slot, avoiding dust contamination of the chip and ensuring chip performance. At the same time, the dustproof film is made of transparent material, making it easy to observe the chip storage status. The magnetic fixing method is convenient to operate and reliable.

[0016] 3. By controlling the electric push rod, the lifting plate retracts downward inside the groove of the tray box. The lifting plate moves multiple suction cups fixed at the top downward synchronously. When the bottom of the chip contacts the frame pad, the frame pad blocks the chip, stopping its movement. The suction cups continue to move downward with the lifting plate. Under the pulling force, the adsorption between the chip and the suction cups is broken, completing the separation of the chip from the suction cups. If it is necessary to quickly remove the chip, the control button (up button) can also be pressed to control the electric push rod to move upward. The electric push rod moves the lifting plate and suction cups upward synchronously. The suction cups pull the chip out of the placement slot, and the operator can directly remove the chip manually. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the ABS resin high-temperature resistant electronic blister tray of this utility model.

[0018] Figure 2 This is a schematic diagram of the structure of the support plate of this utility model.

[0019] Figure 3 This utility model Figure 2 Enlarged diagram of point A in the middle.

[0020] Figure 4 This is a schematic diagram of the lifting plate of this utility model.

[0021] Figure 5 This is a schematic diagram of the structure of the electric actuator of this utility model.

[0022] In the diagram: 1. Tray box; 2. Auxiliary handle; 3. Connecting plate; 4. Winding shaft; 5. Dustproof film; 6. Magnetic end; 7. Suction cup; 8. Support shaft; 9. Placement slot; 10. Frame pad; 11. Through hole; 12. Lifting plate; 13. Electric push rod; 14. Support plate. Detailed Implementation

[0023] This utility model provides, for example Figures 1-5 The ABS resin high-temperature resistant electronic blister tray shown includes a tray box 1, which is made of ABS resin. ABS resin has excellent high-temperature resistance. The top of the tray box 1 has a groove, and a support plate 14 is snapped into the groove. The snap-fit ​​between the support plate 14 and the groove facilitates the disassembly and installation of the support plate 14. When the support plate 14 is damaged or needs to be replaced with a different specification, it can be quickly replaced.

[0024] The support plate 14 has multiple placement slots 9, which are evenly distributed in a matrix to ensure efficient use of the tray space while preventing chips from squeezing against each other. A frame-shaped pad 10 is fixed to the inner wall of the placement slot 9. The frame-shaped pad 10 is made of silicone and has a certain degree of elasticity, which can buffer and protect the bottom of the chip to prevent the chip from directly colliding with the bottom of the placement slot 9.

[0025] The frame-shaped pad 10 has a suction cup 7 installed inside, with a chip attached to the top of the suction cup 7. The frame-shaped pad 10 is located at the bottom of the chip. The bottom center of the mounting groove 9 has a through hole 11 that is large enough for the suction cup 7 to move through. The bottom of the through hole 11 is connected to the inside of the groove. The diameter of the through hole 11 is larger than the diameter of the suction cup 7 to ensure that the suction cup 7 does not get stuck during the lifting process.

[0026] A connecting plate 3 is provided at each of the two corners of the tray box 1. A winding shaft 4 is rotatably connected between the two connecting plates 3. A dustproof film 5 is wound around the outside of the winding shaft 4. A magnetic end 6 is fixed at the end of the dustproof film 5. The magnetic end 6 is magnetically attracted to one side of the top of the support plate 14. A magnet is provided inside the support plate 14. The magnet and the magnetic end 6 are attracted to each other.

[0027] Electric push rods 13 are fixedly connected to the four corners of the groove, and lifting plates 12 are fixedly connected to the top of each of the four electric push rods 13. The bottom ends of multiple suction cups 7 are fixedly connected to the top of the lifting plates 12. The lifting plates 12 are raised and lowered by the electric push rods 13, thereby realizing the synchronous raising and lowering of the suction cups 7 and ensuring the consistency of the picking and placing of multiple chips.

[0028] A support shaft 8 is provided above the winding shaft 4, and the support shaft 8 is fixed between the two connecting plates 3.

[0029] Auxiliary handles 2 are fixedly connected to both sides of the pallet box 1, and both auxiliary handles 2 are U-shaped. The U-shaped auxiliary handles 2 facilitate the operator's handling of the pallet and improve the convenience of pallet use.

[0030] The two ends of the winding shaft 4 are rotatably connected to the corresponding connecting plate 3 via a rotating shaft, and a torsion spring is provided on the rotating shaft.

[0031] The tray box 1 contains a charging power supply, and the outside of the tray box 1 has control buttons for raising and lowering the electric push rod 13. The control buttons include an up button and a down button, which control the raising and lowering actions of the electric push rod 13, respectively.

[0032] Working principle: The electronic chip to be placed is placed into the multiple placement slots 9 on the support plate 14, and then the chip is gently pressed down so that the bottom of the chip is in full contact with the top of the suction cup 7 in the placement slot 9. The chip is initially fixed by the adsorption force of the suction cup 7. At this time, the bottom of the chip is supported on the frame pad 10. The frame pad 10 plays a role in buffering protection and auxiliary support for the chip, thus completing the chip placement operation.

[0033] After the chip is placed, the operator pulls the magnetic end 6 at the end of the dustproof film 5 to pull out the dustproof film 5 wound on the winding shaft 4. Under the support and guidance of the support shaft 8, the dustproof film 5 is flatly covered on the top of the support plate 14 until the magnetic end 6 contacts one side of the top of the support plate 14. The position of the dustproof film 5 is fixed by the attraction between the magnet inside the support plate 14 and the magnetic end 6, so as to achieve dust protection for the chip and prevent dust from entering the placement slot 9 and contaminating the chip.

[0034] When the chip needs to be removed, the operator can first separate the magnetic end 6 from the support plate 14. The winding shaft 4 automatically rewinds the dust-proof film 5 under the action of the torsion spring. Then, press the control button (lowering button) on the outside of the tray box 1 to control the electric push rod 13 to drive the lifting plate 12 to retract downward inside the groove of the tray box 1. The lifting plate 12 drives the multiple suction cups 7 fixed at the top to move downward synchronously. When the bottom of the chip contacts the frame pad 10, the frame pad 10 blocks the chip, stopping the chip from moving. The suction cups 7 continue to move downward with the lifting plate 12. Under the action of the pulling force, the adsorption force between the chip and the suction cups 7 is broken, and the chip is separated from the suction cups 7. If the chip needs to be removed quickly, the control button (upper button) can also be pressed to control the electric push rod 13 to move upward. The electric push rod 13 drives the lifting plate 12 and the suction cups 7 to rise synchronously. The suction cups 7 drive the chip out of the placement slot 9. The operator can directly remove the chip manually without having to go deep into the placement slot 9, improving the convenience of picking up and putting down.

Claims

1. A high-temperature resistant electronic blister tray made of ABS resin, comprising a tray box (1), characterized in that: The top of the tray box (1) has a groove, and a support plate (14) is snapped into the groove. The support plate (14) has multiple placement slots (9). A frame-shaped pad (10) is fixed on the inner wall of the placement slot (9). A suction cup (7) is installed inside the frame-shaped pad (10). A chip is attached to the top of the suction cup (7), and the frame-shaped pad (10) is located at the bottom of the chip. A through hole (11) is provided at the center of the bottom of the placement slot (9) to allow the suction cup (7) to pass through. The bottom of the through hole (11) is connected to the inside of the groove. The tray box (1) is provided with connecting plates (3) at both corners. A winding shaft (4) is rotatably connected between the two connecting plates (3). A dustproof film (5) is wound around the outside of the winding shaft (4). A magnetic end (6) is fixed at the end of the dustproof film (5). The magnetic end (6) is magnetically attracted to one side of the top of the support plate (14).

2. The ABS resin high-temperature resistant electronic blister tray according to claim 1, characterized in that: Electric push rods (13) are fixedly connected to the four corners of the groove, and lifting plates (12) are fixedly connected to the top of the four electric push rods (13). The bottom ends of multiple suction cups (7) are fixedly connected to the top of the lifting plates (12).

3. The ABS resin high-temperature resistant electronic blister tray according to claim 1, characterized in that: A support shaft (8) is provided above the winding shaft (4), and the support shaft (8) is fixed between the two connecting plates (3).

4. The ABS resin high-temperature resistant electronic blister tray according to claim 1, characterized in that: Both sides of the tray box (1) are fixedly connected with auxiliary handles (2), and both auxiliary handles (2) are set in U shape.

5. The ABS resin high-temperature resistant electronic blister tray according to claim 1, characterized in that: The two ends of the winding shaft (4) are rotatably connected to the corresponding connecting plate (3) via a rotating shaft, and a torsion spring is provided on the rotating shaft.

6. The ABS resin high-temperature resistant electronic blister tray according to claim 1, characterized in that: The tray box (1) is equipped with a charging power supply inside, and a control button for raising and lowering the electric push rod (13) is provided on the outside of the tray box (1).

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