A turnover device and a laser film opening apparatus

Abstract

The application provides a turnover device and a laser film opening device. The turnover device comprises a mounting base and a turnover base. The mounting base is provided with a shaft body. The turnover base is connected with the shaft body and can rotate relative to the mounting base around the shaft body. The turnover base is provided with at least one containing groove for inserting an external silicon wafer. The containing groove is switched between different positions by rotating around the shaft body. The positions of the containing groove include a first position corresponding to a first conveying line for outputting the external silicon wafer and a second position corresponding to a second conveying line for inputting the external silicon wafer. The rotation of the turnover base can realize the turnover of the external silicon wafer in the containing groove, avoid the manual turnover of the external silicon wafer, and improve the turnover convenience of the turnover device.

Description

Technical Field

[0001] This utility model relates to the technical field of laser film-opening equipment, and in particular to a flipping device and a laser film-opening device. Background Technology

[0002] As an industrial device, laser wafer cutting equipment uses lasers to process external silicon wafers, causing certain areas of the wafers to gradually vaporize under the laser's treatment.

[0003] Existing laser film-opening equipment includes a first conveyor line and a second conveyor line. The first conveyor line is used to convey the front side of the external silicon wafer, and the second conveyor line is used to convey the back side of the external silicon wafer. The external silicon wafer on the front side of the first conveyor line needs to be flipped by human intervention and then placed on the second conveyor line by human intervention. Utility Model Content

[0004] The purpose of this invention is to provide a flipping device and a laser film-opening device. A shaft is provided on the mounting base; a flipping seat is connected to the shaft and can rotate relative to the mounting base around the shaft. The flipping seat is provided with at least one receiving slot for inserting an external silicon wafer. The flipping seat rotates around the shaft to switch the receiving slot between different positions. The position of the receiving slot includes a first position corresponding to a first conveyor line for outputting external silicon wafers and a second position corresponding to a second conveyor line for inputting external silicon wafers. This facilitates the flipping of the external silicon wafer in the receiving slot by rotating the flipping seat, avoiding the external silicon wafer from being flipped manually and improving the convenience of flipping the external silicon wafer.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flipping device, comprising:

[0006] Mounting base, wherein a shaft is provided on the mounting base;

[0007] A flip-up base is connected to the shaft and can rotate about the shaft relative to the mounting base. The flip-up base is provided with at least one receiving slot for inserting an external silicon wafer. The flip-up base rotates about the shaft to switch the receiving slot between different positions. The position of the receiving slot includes a first position corresponding to a first conveyor line for outputting external silicon wafers and a second position corresponding to a second conveyor line for inputting external silicon wafers.

[0008] Optionally, the flipping seat is provided with a plurality of receiving slots, which are arranged at intervals along the rotation direction of the flipping seat.

[0009] Optionally, the flip holder is further provided with a passageway extending from one end of the flip holder to the other end, the passageway being configured to allow an external silicon wafer to pass through.

[0010] Optionally, the flip seat is provided with a first through hole; the shaft is provided with a second through hole; when the second through hole and the first through hole are arranged opposite to each other, the second through hole and the first through hole are connected to each other and form the passageway;

[0011] The rotation cycle of the flipping seat is 0 to 20 seconds per revolution.

[0012] Optionally, if the flip seat is provided with multiple receiving slots, the first through hole is provided between two adjacent receiving slots; the width of the receiving slot is 3mm-10mm; and the width of the first through hole is 3mm-15mm.

[0013] Optionally, the axis of the second through hole is on the same axis as the axis of the shaft body;

[0014] The second through hole is a square hole, and the second through hole and the first through hole are aligned and in a relatively stationary state;

[0015] Both the second through-hole and the first through-hole are used for external silicon wafers to pass through.

[0016] Optionally, there are two first through holes, both of which extend toward the axis of the flip seat and are located on both sides of the same second through hole.

[0017] Optionally, the shaft body has a flat end in the middle;

[0018] The flip seat is sleeved on the shaft body, the flip seat is engaged with the flat end of the shaft body, and is positioned and connected to the shaft body.

[0019] Optionally, the tilting device may further include a power component and a speed reduction component;

[0020] The speed reducer is mounted on the mounting base. One end of the speed reducer is connected to the power component, and the other end of the speed reducer is connected to the shaft, thereby driving the shaft to rotate.

[0021] To achieve the above objectives, this utility model provides the following technical solution: a laser film-opening device, comprising:

[0022] First conveyor line;

[0023] Second conveyor line;

[0024] The aforementioned flipping device is located between the first conveyor line and the second conveyor line, with the output end of the first conveyor line corresponding to the flipping device and the input end of the second conveyor line corresponding to the flipping device.

[0025] Compared with the prior art, the beneficial effects of this utility model are:

[0026] This utility model provides a flipping device and a laser film-opening device. A shaft is provided on the mounting base. The flipping base is connected to the shaft and can rotate relative to the mounting base around the shaft. The flipping base is provided with at least one receiving groove for inserting an external silicon wafer. The flipping base can switch the receiving groove between different positions by rotating around the shaft. The position of the receiving groove includes a first position corresponding to a first conveyor line for outputting external silicon wafers and a second position corresponding to a second conveyor line for inputting external silicon wafers. This facilitates the flipping of the external silicon wafer in the receiving groove by rotating the flipping base, avoiding the external silicon wafer from being flipped by human intervention and improving the convenience of flipping the external silicon wafer. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0029] Figure 1 A schematic diagram of a flipping device according to an embodiment of this application is shown.

[0030] Figure 2 A schematic diagram showing the connection between the shaft and the flipping seat of a flipping device according to an embodiment of this application is shown.

[0031] Figure 3 A schematic diagram of the flipping base of a flipping device according to an embodiment of this application is shown.

[0032] Figure 4 A schematic diagram of a laser film-opening device according to a second embodiment of this application is shown.

[0033] Figure 5 An exploded view of a laser film-opening apparatus according to a second embodiment of this application is shown.

[0034] Figure Labels

[0035] 100. Tilting device;

[0036] 10. Mounting base; 11. Shaft body; 11a. Second through hole; 111. Flat end;

[0037] 20. Flip seat; 20a. Receiving groove; 20b. Passage channel; 20c. First through hole;

[0038] 30. Power components;

[0039] 40. Speed ​​reduction components;

[0040] 200. Laser film-opening equipment; 210. First conveyor line; 220. Second conveyor line;

[0041] 300. External silicon wafer. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0043] Please refer to the attached document. Figures 1-5 This application provides a flipping device 100, which is applied to a laser film-opening device 200 and is used to flip an external silicon wafer 300. The flipping device 100 includes a mounting base 10 and a flipping base 20. A shaft 11 is provided on the mounting base 10. The flipping base 20 is connected to the shaft 11 and can rotate relative to the mounting base 10 around the shaft 11. The flipping base 20 is provided with at least one receiving groove 20a for inserting the external silicon wafer 300. The receiving groove 20a can be switched between different positions by rotating around the shaft 11. The positions of the receiving groove 20a include a first position corresponding to a first conveying line 210 for outputting the external silicon wafer 300 and a second position corresponding to a second conveying line 220 for inputting the external silicon wafer 300. This facilitates the flipping of the external silicon wafer 300 in the receiving groove 20a by rotating the flipping base 20, avoiding the external silicon wafer 300 from being flipped manually and improving the convenience of flipping the external silicon wafer 300.

[0044] Please refer to the attached document. Figures 1-3In this embodiment, the mounting base 10 is provided with a shaft 11; the flip base 20 is connected to the shaft 11 and can rotate around the shaft 11 relative to the mounting base 10 to adjust the position of the flip base 20 relative to the shaft 11. The flip base 20 is provided with at least one receiving groove 20a for inserting an external silicon wafer 300. The flip base 20 rotates around the shaft 11 to switch the receiving groove 20a between different positions. The position of the receiving groove 20a includes a first position corresponding to the first conveying line 210 for outputting the external silicon wafer 300 and a second position corresponding to the second conveying line 220 for inputting the external silicon wafer 300, so that the external silicon wafer 300 output from the first conveying line 210 can be flipped through the receiving groove 20a to the second conveying line 220. This facilitates the flipping of the external silicon wafer 300 in the receiving groove 20a by rotating the flip base 20, avoiding the external silicon wafer 300 from being flipped under human intervention and improving the flipping convenience of the flipping device 100.

[0045] Please refer to the attached document. Figures 1-4 In this embodiment of the application, the flip base 20 is provided with a plurality of receiving slots 20a. The plurality of receiving slots 20a are arranged at intervals along the rotation direction of the flip base 20. The plurality of receiving slots 20a are all used to accommodate each external silicon wafer 300. The external silicon wafer 300 in each receiving slot 20a flips as the flip base 20 rotates. By arranging a plurality of receiving slots 20a, the number of external silicon wafers 300 that can be accommodated relative to the flip base 20 is increased, thereby improving the flipping efficiency of the external silicon wafers 300.

[0046] In this embodiment, the flip holder 20 is further provided with a passage channel 20b, which extends from one end of the flip holder 20 to the other end. The passage channel 20b is configured to allow external silicon wafers 300 to pass through, so that the external silicon wafers 300 can pass through the flip holder 20 in a straight line through the passage channel 20b. This facilitates the external silicon wafers 300 output from the first conveyor line 210 to move directly to the second conveyor line 220 through the passage channel 20b, so that some external silicon wafers 300 can pass through directly without flipping. This allows the flip holder 20 to meet the different needs of flipping and not flipping the external silicon wafers 300.

[0047] Please refer to the attached document. Figures 1-4In this embodiment, the flip base 20 is provided with a first through hole 20c; the shaft 11 is provided with a second through hole 11a; when the second through hole 11a and the first through hole 20c are arranged opposite to each other, the second through hole 11a and the first through hole 20c are connected and form a passage channel 20b, so that the external silicon wafer 300 can pass through the flip base 20 in a straight line through the first through hole 20c and the second through hole 11a, thereby facilitating the external silicon wafer 300 output through the first conveyor line 210 to directly pass through the first through hole 20c and the second through hole 11a and pass through to the second conveyor line 220; optionally, the rotation cycle of the flip base 20 is 0 to 20 seconds / revolution.

[0048] In this embodiment, based on the case where the flip holder 20 is provided with multiple receiving slots 20a, the first through hole 20c is provided between two adjacent receiving slots 20a, so that the external silicon wafer 300 can selectively enter the first through hole 20c or each receiving slot 20a. When the external silicon wafer 300 enters the first through hole 20c, the external silicon wafer 300 in the first through hole 20c does not need to be flipped. When the external silicon wafer 300 enters the receiving slot 20a, the external silicon wafer 300 in the receiving slot 20a is flipped. The flip holder 20 is compatible with flipping and not flipping the external silicon wafer 300. Optionally, the width of the receiving slot 20a is 3mm-10mm; the width of the first through hole 20c is 3mm-15mm.

[0049] Please refer to the attached document. Figures 2-4 In this embodiment, the axis of the second through hole 11a is coaxial with the axis of the shaft 11; the second through hole 11a is a square hole, and the second through hole 11a and the first through hole 20c are aligned and in a relatively stationary state; both the second through hole 11a and the first through hole 20c are used for the external silicon wafer 300 to pass through, so that the external silicon wafer 300 passes through the first through hole 20c and the second through hole 11a in sequence, thereby facilitating the external silicon wafer 300 to be in a linear motion state.

[0050] In this embodiment, there are two first through holes 20c. Both first through holes 20c extend toward the axis of the flip seat 20 and are located on both sides of the same second through hole 11a. The two first through holes 20c are respectively connected to the first conveying line 210 and the second conveying line 220, so that the external silicon wafer 300 output from the first conveying line 210 can move to the second conveying line 220 in sequence through one first through hole 20c, the second through hole 11a and the other first through hole 20c, thereby facilitating the straight passage of the external silicon wafer 300. At this time, the external silicon wafer 300 does not flip.

[0051] In this embodiment, the shaft 11 has a flat end 111 in the middle. The flip seat 20 is sleeved on the shaft 11. The flip seat 20 is engaged with the flat end 111 of the shaft 11 and is positioned and connected to the shaft 11. This ensures the positional accuracy of the flip seat 20 relative to the shaft 11, avoids the flip seat 20 from shifting its position relative to the shaft 11 during operation, and improves the connection stability between the flip seat 20 and the shaft 11.

[0052] Please refer to the attached document. Figures 1-3 In this embodiment of the application, the flipping device 100 further includes a power component 30 and a speed reducer 40; the speed reducer 40 is installed on the mounting base 10, one end of the speed reducer 40 is connected to the power component 30, and the other end of the speed reducer 40 is connected to the shaft 11, and drives the shaft 11 to rotate, so that the shaft 11 can achieve automatic rotation under the cooperation of the power component 30 and the speed reducer 40, thus ensuring the rotation effect of the shaft 11.

[0053] Workflow:

[0054] In the first working mode: when the first conveyor line 210 conveys the external silicon wafer 300 with its front side facing upward, the external silicon wafer 300 enters the receiving groove 20a at the first position with its front side facing upward. The power component 30 and the speed reducer 40 drive the shaft 11 to rotate. The flipping seat 20 rotates with the shaft 11. During the rotation, the flipping seat 20 drives the receiving groove 20a to rotate 180 degrees, causing the receiving groove 20a to rotate to the second position. The 180-degree rotation of the receiving groove 20a causes the external silicon wafer 300 in the receiving groove 20a to change from a front-facing-upward posture to a back-facing-upward posture. Correspondingly, the external silicon wafer 300 is conveyed under the drive of the second conveyor line 220 with its back side facing upward, so as to achieve the flipping effect of the external silicon wafer 300.

[0055] In the second working mode: when the first conveyor line 210 conveys the external silicon wafer 300 with its front facing upward, the external silicon wafer 300 with its front facing upward moves sequentially through a first through hole 20c, a second through hole 11a and another first through hole 20c to the second conveyor line 220, so that the external silicon wafer 300 with its front facing upward can be conveyed in a straight line, so as to achieve the effect of the external silicon wafer 300 not flipping.

[0056] Please refer to the attached document. Figures 1-5 In the second application embodiment, a laser film-opening device 200 includes a first conveyor line 210, a second conveyor line 220 and a flipping device 100. The flipping device 100 is located between the first conveyor line 210 and the second conveyor line 220. The output end of the first conveyor line 210 corresponds to the flipping device 100, and the input end of the second conveyor line 220 corresponds to the flipping device 100.

[0057] The receiving groove 20a of the flipping device 100 extends radially along the flipping base 20, and the receiving groove 20a of the flipping device 100 forms an opening at the edge of the flipping base 20, which allows the external silicon wafer 300 to be inserted into the receiving groove 20a.

[0058] The output end of the first conveyor line 210 and the input end of the second conveyor line 220 are spaced apart and correspond to each other. When the receiving tank 20a is in the first position, the opening of the receiving tank 20a is directly opposite the output end of the first conveyor line 210 so that the external silicon wafer 300 is conveyed from the first conveyor line 210 to the receiving tank 20a. When the receiving tank 20a is in the second position, the opening of the receiving tank 20a is directly opposite the input end of the second conveyor line 220 so that the external silicon wafer 300 is conveyed from the receiving tank 20a to the second conveyor line 220.

[0059] The external silicon wafer 300 output from the first conveyor line 210 is transferred to the second conveyor line 220 after being flipped by the flipping device 100, so that the second conveyor line 220 can output the flipped external silicon wafer 300 and avoid the external silicon wafer 300 being flipped by human intervention.

[0060] The first conveyor line 210 conveys the outer silicon wafer 300 with its front side facing upward, so that the outer silicon wafer 300 with its front side facing upward is transferred under the drive of the first conveyor line 210. The second conveyor line 220 conveys the outer silicon wafer 300 with its back side facing upward, or the second conveyor line 220 conveys the outer silicon wafer 300 with its front side facing upward, so that the second conveyor line 220 is compatible with both the outer silicon wafer 300 with its back side facing upward and the outer silicon wafer 300 with its front side facing upward.

[0061] Compared with the prior art, the beneficial effects of this utility model are:

[0062] This utility model provides a flipping device 100 and a laser film-opening device 200. The conveyor line assembly 10 includes a first conveyor line 210 and a second conveyor line 220. The second conveyor line 220 is disposed on one side of the first conveyor line 210, and a gap is provided between the second conveyor line 220 and the first conveyor line 210. The flipping device 100 is disposed between the first conveyor line 210 and the second conveyor line 220. The flipping device 100 includes a mounting base 10, a shaft 11, and a flipping seat 20. The shaft 11 is rotatably connected to the mounting base 10, and the flipping seat 20 is mounted on the shaft 11 and moves with it. The rotating body 11 rotates; the flipping seat 20 rotates along the axis of the connection between the flipping seat 20 and the mounting seat 10; the flipping seat 20 is provided with multiple receiving slots 20a; the multiple receiving slots 20a are arranged along the annular direction of the flipping seat 20 and are all used to receive the external silicon wafer 300; the external silicon wafer 300 in the receiving slot 20a is flipped as the flipping seat 20 rotates, so that the external silicon wafer 300 can be flipped by the flipping device 100, avoiding the external silicon wafer 300 being flipped under human action, and improving the flipping convenience of the flipping device 100.

[0063] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0064] It should also be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or may be connected to an intermediary component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component through an intermediary component.

[0065] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0066] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A flipping device, characterized in that, include: Mounting base, wherein a shaft is provided on the mounting base; A flip-up base is connected to the shaft and can rotate about the shaft relative to the mounting base. The flip-up base is provided with at least one receiving slot for inserting an external silicon wafer. The flip-up base rotates about the shaft to switch the receiving slot between different positions. The position of the receiving slot includes a first position corresponding to a first conveyor line for outputting external silicon wafers and a second position corresponding to a second conveyor line for inputting external silicon wafers. The flip-mount also has a passageway extending from one end of the flip-mount to the other end, and the passageway is configured to allow an external silicon wafer to pass through; the flip-mount has a first through hole; the shaft has a second through hole; when the second through hole and the first through hole are arranged opposite to each other, the second through hole and the first through hole are connected and form the passageway; the rotation cycle of the flip-mount is 0 to 20 seconds per revolution; The axis of the second through hole is on the same axis as the axis of the shaft; the second through hole is a square hole, and the second through hole and the first through hole are aligned and in a relatively stationary state; both the second through hole and the first through hole are used for the external silicon wafer to pass through; the external silicon wafer passes through the first through hole and the second through hole in sequence so that the external silicon wafer is in a linear motion state.

2. The flipping device according to claim 1, characterized in that, The flipping seat is provided with a plurality of receiving slots, which are arranged at intervals along the rotation direction of the flipping seat.

3. The flipping device according to claim 1, characterized in that, Given that the flipping seat is provided with multiple receiving slots, the first through hole is provided between two adjacent receiving slots; the width of the receiving slot is 3mm-10mm; the width of the first through hole is 3mm-15mm.

4. The flipping device according to claim 1, characterized in that, There are two first through holes, both of which extend toward the axis of the flip seat and are located on both sides of the same second through hole.

5. The flipping device according to claim 1, characterized in that, The shaft body has a flat end in the middle; The flip seat is sleeved on the shaft body, the flip seat is engaged with the flat end of the shaft body, and is positioned and connected to the shaft body.

6. The flipping device according to claim 1, characterized in that, The tilting device also includes a power component and a reduction component; The speed reducer is mounted on the mounting base. One end of the speed reducer is connected to the power component, and the other end of the speed reducer is connected to the shaft, thereby driving the shaft to rotate.

7. A laser film-opening device, characterized in that, include: First conveyor line; Second conveyor line; The flipping device as described in any one of claims 1 to 6 is located between the first conveyor line and the second conveyor line, the output end of the first conveyor line corresponds to the flipping device, and the input end of the second conveyor line corresponds to the flipping device.

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