Automatic protection device for wafer unloading machine

Abstract

The utility model discloses a kind of automatic protection devices for wafer tipping machine, from inside to outside, including the inner layer protection cover, middle layer protection cover and outer layer protection cover sequentially arranged;The automatic protection device further includes first guide rail and driving device;The outer layer protection cover is fixedly arranged in the side of the wafer box placement position to be tipped;The first guide rail is extended and arranged by the outer layer protection cover to the wafer box placement position direction to be tipped.This application provides automatic protection device, when wafer box is placed, can retract protection cover to thereby not affect the normal placement of wafer box, can control protection cover to extend and protect when tipping operation, greatly avoid the harm caused to operator due to tipping process fragment, effectively solve the problem that semiconductor tipping machine equipment has no protective measures.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor production, and particularly relates to an automatic protection device for a wafer unloading machine. BACKGROUND

[0002] In the production process of semiconductor wafers, because the wafer box types used in the front and rear processes are different, the wafer needs to be unloaded in a specific process section; however, most of the current wafer unloading machines do not have a protection device, which may cause damage to the operator when abnormal fragments occur. UTILITY MODEL CONTENTS

[0003] The utility model aims at providing an automatic protection device for a wafer unloading machine to solve the problems in the prior art.

[0004] The utility model aims at providing an automatic protection device for a wafer unloading machine to solve the problems in the prior art. An automatic protection device for a wafer unloading machine comprises, from the inside to the outside, an inner protection cover, a middle protection cover, and an outer protection cover arranged in sequence. The automatic protection device further comprises a first guide rail and a driving device; the outer protection cover is fixedly arranged on one side of a wafer box placement position to be unloaded; and the first guide rail is arranged in an extending manner from the outer protection cover to the wafer box placement position to be unloaded. The middle protection cover and the inner protection cover can be switched between the stacked state and the flat state by reciprocating along the first guide rail under the action of the driving device; when in the stacked state, the middle protection cover is located in the outer protection cover, and the inner protection cover is located in the middle protection cover; and when in the flat state, the middle protection cover and the inner protection cover are just above the wafer box placement position to be unloaded to form protection.

[0005] Preferably, the driving device is connected with the inner protection cover. The inner side of the front end edge of the middle protection cover is provided with a first stop block; the outer side of the front end edge of the inner protection cover is provided with a second stop block, and the outer side of the rear end edge is provided with a third stop block; when the inner protection cover moves forward under the action of the driving device and the third stop block contacts the first stop block, the middle protection cover is driven to move forward together until reaching a target position; and when the inner protection cover moves backward under the action of the driving device and the second stop block contacts the first stop block, the middle protection cover is driven to move backward together until reaching a target position.

[0006] Preferably, the driving device is a rodless cylinder. The automatic protection device further comprises a cylinder guide rail arranged in parallel with the first guide rail. The rodless cylinder can reciprocate along the cylinder guide rail.

[0007] Preferably, the first guide rail is located outside the middle protective cover and the inner protective cover; The rodless cylinder is located inside the inner protective cover.

[0008] Preferably, the rodless cylinder is connected to the inner sidewall of the inner protective cover by screws.

[0009] Preferably, the first guide rail includes an upper guide rail and a lower guide rail, the inner protective cover is slidably connected to the lower guide rail via a lower slider, and the middle protective cover is slidably connected to the upper guide rail via an upper slider.

[0010] Preferably, both the middle protective cover and the inner protective cover are partially transparent.

[0011] Preferably, the first guide rail includes two sets, and the two sets of the first guide rail are respectively located on both sides of the wafer cassette placement position of the wafer cassette to be poured.

[0012] The automatic protective device provided in this application can retract the protective cover when placing the wafer cassette, so as not to affect the normal placement of the wafer cassette. During the wafer flipping operation, the protective cover can be extended for protection, which greatly avoids injury to operators caused by fragments during the wafer flipping process and effectively solves the problem of semiconductor wafer flipping machine equipment lacking protective measures. Attached Figure Description

[0013] Fig. 1 This is a three-dimensional structural diagram of the automatic protection device provided in this application (the three protective covers are in a flattened state). Fig. 2 This is a top view of the automatic protection device provided in this application (the three protective covers are in a flattened state). Fig. 3 This is a schematic diagram of the main structure of the automatic protection device provided in this application (the three protective covers are in a flattened state). Explanation of reference numerals in the attached figures: 1-Inner protective cover; 2-Middle protective cover; 3-Outer protective cover; 4-First guide rail; 41-Upper guide rail; 42-Lower guide rail; 5-Drive device; 61-First stop; 62-Second stop; 63-Third stop; 8-Cylinder guide rail; 91-Upper slider; 92-Lower slider. Detailed Implementation

[0014] A preferred embodiment of this application provides an automatic protection device for a wafer flipping machine, such as... Figs. 1-3 As shown, from the inside out, it includes an inner protective cover 1, a middle protective cover 2, and an outer protective cover 3.

[0015] The automatic protection device also includes a first guide rail 4 and a drive device 5; the outer protective cover 3 is fixedly installed on one side of the wafer cassette placement position of the cassette to be tilted; the first guide rail 4 extends from the outer protective cover toward the wafer cassette placement position of the cassette to be tilted.

[0016] Under the action of the driving device 5, the middle protective cover 2 and the inner protective cover 1 can reciprocate along the first guide rail 4, switching between stacked and flattened states. In the stacked state, the middle protective cover is located inside the outer protective cover, and the inner protective cover is located inside the middle protective cover. That is, both the middle and inner protective covers are retracted into the outer protective cover, and the wafer cassette to be flipped is exposed to the environment. At this time, the wafer cassette to be flipped can be placed on the wafer flipping machine. When the wafer cassette is placed and the flipping operation is required, the driving device drives the inner and middle protective covers to move along the first guide rail and extend to a predetermined position (i.e., the wafer cassette to be flipped position). At this time, it is in the flattened state, and the middle and inner protective covers extend and cover the wafer cassette to be flipped position, forming a protection for the wafer cassette to be flipped inside, preventing the flying fragments from causing injury to the operator when abnormal breakage occurs during the flipping operation. When the box-turning operation is finished, the drive unit moves the middle protective cover and the inner protective cover to their original positions along the first guide rail, waiting for the next operation.

[0017] The drive unit 5 can be a conventional device such as a cylinder, hydraulic cylinder, or motor, as long as it can provide extension and retraction power.

[0018] Preferably, the driving device 5 is connected to the inner protective cover 1. The inner front edge of the middle protective cover 2 is provided with a first stop 61; the outer front edge of the inner protective cover 1 is provided with a second stop 62, and the outer rear edge is provided with a third stop 63. When the inner protective cover 1 moves forward under the action of the driving device 5 until the third stop 63 contacts the first stop 61, the third stop 63 will move forward together with the first stop 61 due to the obstruction of the first stop 61, thereby driving the middle protective cover 2 forward together until it reaches the target position; when the inner protective cover 1 moves backward under the action of the driving device 5 until the second stop 62 contacts the first stop 61, the second stop 62 will move backward together with the first stop 61 due to the obstruction of the first stop 61, driving the middle protective cover backward together until it reaches the target position.

[0019] More preferably, the driving device 5 is a rodless cylinder; the automatic protection device also includes a cylinder guide rail 8 arranged parallel to the first guide rail; the rodless cylinder can drive the inner protective cover to move back and forth along the cylinder guide rail 8.

[0020] More preferably, for ease of installation, the first guide rail 4 is located outside the middle protective cover 2 and the inner protective cover 1; the rodless cylinder and the cylinder guide rail 8 are located inside the inner protective cover 1.

[0021] Furthermore, both the outer walls of the middle protective cover 2 and the inner protective cover 1 are provided with sliders that can move along the first guide rail 4.

[0022] Preferably, the rodless cylinder is connected to the inner sidewall of the inner protective cover 1 by screws, and the rodless cylinder drives the inner protective cover to move together.

[0023] Preferably, the outer protective cover 3 is made of stainless steel; the middle protective cover 2 and the inner protective cover 1 are partially transparent, so that the internal box-turning action can be easily observed.

[0024] Preferably, the first guide rail 4 includes two sets, which are located on both sides of the wafer cassette placement position to be flipped.

[0025] Preferably, the first guide rail 4 includes an upper guide rail 41 and a lower guide rail 42. The inner protective cover 1 is slidably connected to the lower guide rail 42 via a lower slider 92, and the middle protective cover 2 is slidably connected to the upper guide rail 41 via an upper slider 91. The middle protective cover 2 and the inner protective cover 1 reciprocate along the upper guide rail 41 and the lower guide rail 42, respectively.

[0026] The automatic protective device provided in this application can retract the protective cover when placing the wafer cassette, so as not to affect the normal placement of the wafer cassette. During the wafer flipping operation, the protective cover can be extended for protection, which greatly avoids injury to operators caused by fragments during the wafer flipping process and effectively solves the problem of semiconductor wafer flipping machine equipment lacking protective measures.

[0027] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if such modifications and modifications fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and modifications.

Claims

1. An automatic protective device for a wafer flipping machine, characterized in that, From the inside out, it includes an inner protective cover, a middle protective cover, and an outer protective cover arranged in sequence; The automatic protection device also includes a first guide rail and a drive device; the outer protective cover is fixedly disposed on one side of the wafer cassette placement position of the cassette to be tilted; the first guide rail extends from the outer protective cover toward the wafer cassette placement position of the cassette to be tilted. Under the action of the driving device, the middle protective cover and the inner protective cover can reciprocate along the first guide rail and switch between stacked and flattened states. When in the stacked state, the middle protective cover is located inside the outer protective cover, and the inner protective cover is located inside the middle protective cover. When in the flattened state, the middle protective cover and the inner protective cover cover the wafer cassette to be flipped, forming protection.

2. The automatic protective device for a wafer flipping machine as described in claim 1, characterized in that, The drive device is connected to the inner protective cover; The inner front edge of the middle protective cover is provided with a first stop; the outer front edge of the inner protective cover is provided with a second stop, and the outer rear edge is provided with a third stop; when the inner protective cover moves forward under the action of the driving device until the third stop contacts the first stop, it drives the middle protective cover to move forward together until it reaches the target position; when the inner protective cover moves backward under the action of the driving device until the second stop contacts the first stop, it drives the middle protective cover to move backward together until it reaches the target position.

3. The automatic protective device for a wafer flipping machine as described in claim 1, characterized in that, The driving device is a rodless cylinder; The automatic protection device also includes a cylinder guide rail arranged parallel to the first guide rail. The rodless cylinder can reciprocate along the cylinder guide rail.

4. The automatic protective device for a wafer flipping machine as described in claim 3, characterized in that, The first guide rail is located outside the middle protective cover and the inner protective cover; The rodless cylinder is located inside the inner protective cover.

5. The automatic protective device for a wafer flipping machine as described in claim 4, characterized in that, The rodless cylinder is connected to the inner wall of the inner protective cover by screws.

6. The automatic protective device for a wafer flipping machine as described in claim 4, characterized in that, The first guide rail includes an upper guide rail and a lower guide rail. The inner protective cover is slidably connected to the lower guide rail via a lower slider, and the middle protective cover is slidably connected to the upper guide rail via an upper slider.

7. The automatic protective device for a wafer flipping machine as described in claim 1, characterized in that, Both the middle protective shield and the inner protective shield are partially transparent.

8. The automatic protective device for a wafer flipping machine as described in claim 1, characterized in that, The first guide rail includes two sets, and the two sets of the first guide rail are respectively located on both sides of the wafer cassette placement position of the wafer cassette to be flipped.

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