Continuous slitting and converting apparatus for RFID tags

Abstract

The utility model relates to a continuous slitting composite device for RFID label, and the continuous slitting composite device comprises a negative pressure roller connecting a chip film material transmission path and a bottom film transmission path, a slitting cutter arranged on the chip film material transmission path, and a glue applicator arranged on the bottom film transmission path. The continuous slitting composite device further comprises a shaping component arranged on the chip film material transmission path. According to the utility model, the shaping channel and the slitting channel are connected and matched, so that the chip film material can be kept flat and adhered to the surface of the negative pressure roller for cutting, thereby effectively improving the success rate of chip slitting. In addition, a single-layer chip layer is adopted, and the shaping channel, the slitting channel and the bonding channel are sequentially aligned. After cutting, the chip layer can be directly adsorbed on the surface of the negative pressure roller and accurately transferred to the surface of the bottom film, thereby ensuring the continuity of the slitting and composite production and significantly improving the production efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of tag production technology, specifically relating to a continuous slitting and composite device for RFID tags. Background Technology

[0002] RFID (Radio Frequency Identification) tags are electronic tags attached to assets or items that store and transmit data via radio signals to enable automatic identification and tracking of assets.

[0003] Currently, in existing RFID tag production processes, the chip film and the base film are usually transported separately. The existing chip film is a double-layer film (i.e., including a release film layer and a chip layer). On the transport path of the chip film, a cutter is used to cut the chip layer in the film to form individual sheets (the release film layer is not cut). Then, a peeling plate is used to separate the cut chip from the release film layer. The peeled chip is then adsorbed and transferred to the base film by a vacuum roller connected between the chip film transport path and the base film transport path.

[0004] However, in actual production processes, existing technologies have the following drawbacks: 1. Chip film material has a certain degree of flexibility and is easily deformed by external forces during transmission. If the chip film material is in a non-flat state after being cut, it cannot be guaranteed that the chip can be completely cut in one go. 2. After the chips are slit, a peeling operation is required. This operation is not only complicated, but also prone to peeling failure, which may cause the release film layer to be simultaneously adhered to the base film under the adsorption and traction of the vacuum roller, affecting the continuity of the slit and composite process. 3. During the chip stripping process, the lack of wide-range directional limiting makes the chip prone to displacement, which interferes with and affects the positional accuracy of subsequent bonding with the substrate. Summary of the Invention

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide an improved continuous slitting and composite device for RFID tags.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: A continuous slitting and laminating device for RFID tags includes a negative pressure roller connecting a chip film transport path and a base film transport path, a slitting cutter disposed on the chip film transport path, and an adhesive applicator disposed on the base film transport path. An adhesive channel is formed between the negative pressure roller and the base film transport path. The chip film used is a single-layer chip. A slitting channel is formed between the slitting cutter and the negative pressure roller. The continuous slitting and laminating device also includes a shaping component disposed on the chip film transport path. The shaping component forms a shaping channel close to the surface of the negative pressure roller and used to flatten the chip film. The shaping channel, slitting channel, and adhesive channel are sequentially aligned circumferentially on the negative pressure roller. Based on the adsorption force and rotational cooperation formed by the negative pressure roller, the chip film exiting from the outlet of the shaping channel adheres to and is adsorbed onto the surface of the negative pressure roller and transported to the slitting channel. The slitting cutter cuts the chip film entering the slitting channel and forms individual chip units. Multiple chip units enter the adhesive channel one by one with the rotation of the negative pressure roller and are transferred to the surface of the base film.

[0007] Preferably, the chip film transport path and the bottom film transport path are located above and below the negative pressure roller, respectively, and in the orthographic projection on the horizontal plane, the chip film transport direction in the slitting channel is opposite to the bottom film transport direction in the bonding channel.

[0008] Preferably, the slitting and laminating device further includes a transfer module disposed below the negative pressure roller. The bottom film passing through the transfer module forms a horizontally extending bonding section, which passes through the bonding channel in a horizontal direction. This reduces the loss of adhesive on the surface of the bottom film before bonding, ensuring the bonding strength between the chip and the bottom film; at the same time, it avoids separation of the chip and the bottom film caused by the bending of the film layer due to changes in the transfer direction after bonding and lamination.

[0009] Furthermore, the bottom film of the transmission module also forms a vertically extending adhesive coating section and a connecting section that is inclined up and down and connects the upper end of the adhesive coating section and the bonding section located at one end of the inlet of the bonding channel. The adhesive applicator is set on one side of the adhesive coating section and is used to spray adhesive liquid onto the adhesive coating section.

[0010] Preferably, the plane containing the lower wall of the shaping channel is tangent to the surface of the negative pressure roller. This ensures that the chip film is cut into and adheres to the surface of the negative pressure roller for transport.

[0011] Preferably, the shaping component includes an upper shaping plate and a lower shaping plate spaced apart to form a shaping channel, wherein the distance between the upper and lower shaping plates is equal to the thickness of the chip film. Both the upper and lower shaping plates are made of metal plates, which have a low coefficient of friction and reduce wear.

[0012] Specifically, multiple through holes are formed on the upper and / or lower shaping plates. This prevents the chip film from forming a vacuum and adsorbing with the upper and lower shaping plates, reducing interference with the transfer of the chip film.

[0013] Preferably, the slitting and laminating device further includes a conveying module disposed on one side of the forming channel inlet. The conveying module generates the power to transport the chip film material towards the forming channel, and based on the cooperation of the negative pressure roller and the conveying roller assembly, the transmission rate of the chip film material in the conveying module is equal to the transmission rate of the individual chip pieces in the slitting channel. Here, after each individual chip piece is cut, the power of the conveying module drives the subsequent chip film material to fill the gap in time; at the same time, by matching the rotational speeds of the negative pressure roller and the conveying module, the transmission rate of the chip film material remains consistent at any position between the slitting cutter and the conveying module, so as to avoid stretching or loosening of the chip film material.

[0014] Specifically, the conveying module includes an upper conveying roller and a lower conveying roller, wherein the surfaces of the upper and lower conveying rollers are formed with multiple exhaust grooves spaced apart along their own axial direction.

[0015] In addition, the slitting tool includes a cutting roller and a plurality of cutting heads spaced circumferentially around the cutting roller, wherein the cutting distance formed by each pair of adjacent cutting heads is equal to the width of the chip unit.

[0016] Due to the implementation of the above technical solution, this utility model has the following advantages compared with the prior art: Existing chip film materials have a certain degree of flexibility and are prone to deformation during transportation due to external forces. If the chip film material is in an uneven state when cut, it cannot be guaranteed that the chip can be completely cut in one go. After chip slitting, a peeling operation is required, which is not only complicated but also prone to peeling failure, resulting in the release film layer being simultaneously adhered to the base film under the adsorption and traction of the vacuum roller, affecting the continuity of the slitting and lamination process. During chip peeling, due to the lack of width-direction limiting, the chip is prone to displacement, which interferes with the positional accuracy of subsequent lamination with the base film. This application provides an overall structural design for a continuous slitting and laminating device for RFID tags, cleverly addressing the shortcomings and defects of existing technologies. Using this continuous slitting and laminating device, the chip film material is a single-layer chip. Based on the alignment of the shaping channel, slitting channel, and bonding channel in the circumferential direction of the negative pressure roller, adhesive is sprayed onto the surface of the base film using an applicator, and then the base film is transferred to the bonding channel. After the chip film material is flattened through the shaping channel, based on the adsorption force and rotational cooperation of the negative pressure roller, the chip film material exiting from the outlet of the shaping channel adheres to the surface of the negative pressure roller and is transferred to the slitting channel. The slitting blade then... The chip film material entering the slitting channel is cut and formed into individual chip units one by one. Multiple chip units enter the bonding channel one by one as the negative pressure roller rotates and are precisely bonded to the surface of the base film. Therefore, compared with the prior art, this utility model, on the one hand, is based on the connection and cooperation between the shaping channel and the slitting channel, which enables the chip film material to remain flat and adhere to the surface of the negative pressure roller for cutting, effectively improving the chip slitting success rate; on the other hand, it adopts a single-layer chip layer, and based on the sequential alignment of the shaping channel, slitting channel and bonding channel, after cutting, it can be directly adsorbed onto the surface of the negative pressure roller and precisely transferred to the surface of the base film, ensuring the continuity of slitting and composite production and significantly improving production efficiency. Attached Figure Description

[0017] Figure 1 This is a front view schematic diagram of the continuous slitting and laminating device for RFID tags in this embodiment; Figure 2 for Figure 1 A top-down view; Figure 3 for Figure 1 Enlarged schematic diagram of a local part of the structure; Wherein: M1, chip film material; M10, chip unit; M2, base film; M20, adhesive coating section; M21, bonding section; M22, connecting section; 1. Conveyor roller assembly; 11. Upper conveyor roller; 12. Lower conveyor roller; c. Exhaust chute; 2. Conveying module; 21. First conveying roller; 22. Second conveying roller; t0. Bonding channel; 3. Adsorption roller; 4. Cutting tool; 40. Cutting roller; 41. Cutting head; t1. Slitting channel; 5. Pressing component; 50. Upper forming plate; 51. Lower forming plate; k. Through hole; t2. Forming channel; 6. Adhesive applicator. Detailed Implementation

[0018] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0019] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0020] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0021] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0022] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0024] Combination Figures 1 to 3 As shown, the continuous slitting and laminating device for RFID tags in this embodiment includes a conveying module 1 for conveying chip film material M1, a conveying module 2 for conveying base film M2, a negative pressure roller 3 connecting the chip film material conveying path and the base film conveying path, slitting cutters 4 and shaping components 5 distributed on the chip film material conveying path, and an applicator 6 disposed on the base film conveying path.

[0025] Specifically, in this embodiment, the chip film material M1 is a single-layer chip layer.

[0026] In this example, an bonding channel t0 is formed between the negative pressure roller 3 and the bottom film transport path, and a slitting channel t1 is formed between the slitting cutter 4 and the negative pressure roller 3. The chip film transport path and the bottom film transport path are located above and below the negative pressure roller 3, respectively. In the orthographic projection on the horizontal plane, the transport direction of the chip film M1 located in the slitting channel t1 is opposite to the transport direction of the bottom film M2 located in the bonding channel t0.

[0027] In some specific embodiments, the conveying module 1 includes an upper conveying roller 11 and a lower conveying roller 12, wherein both the upper conveying roller 11 and the lower conveying roller 12 are rubber power rollers, and the surfaces of the upper conveying roller 11 and the lower conveying roller 12 are formed with a plurality of exhaust grooves c spaced apart along their own axial direction.

[0028] In this example, the transfer module 2 is positioned below the negative pressure roller 3. The bottom film M2 passing through the transfer module 2 forms a vertically extending adhesive coating section M20, an adhesive section M21 extending horizontally above the adhesive coating section M20 to pass through the adhesive channel t0, and a connecting section M22 that is inclined vertically and connects the upper end of the adhesive coating section M20 and the adhesive section M21 at one end of the inlet of the adhesive channel t0. An adhesive applicator 6 is positioned on one side of the adhesive coating section M20 and is used to spray adhesive onto its surface. This reduces adhesive loss from the bottom film surface before bonding, ensuring the bonding strength between the chip and the bottom film; it also prevents separation of the chip and bottom film due to film bending caused by changes in the transfer direction after bonding.

[0029] In some specific embodiments, the transmission module 2 includes a first transmission roller 21 located at the connection between the adhesive section M20 and the connecting section M22, and a plurality of second transmission rollers 22 arranged side by side at intervals along the horizontal direction, wherein one of the plurality of transmission rollers 20 is vertically aligned with the center line of the negative pressure roller 3, and the adhesive section M21 is horizontally transmitted along the plurality of second transmission rollers 22.

[0030] In this example, the negative pressure roller 3 is any conventional vacuum roller with multiple vacuum adsorption holes distributed circumferentially.

[0031] In this example, the slitting cutter 4 includes a cutter roller 40 and a plurality of cutter heads 41 spaced circumferentially around the cutter roller, wherein the cutting distance formed by each pair of adjacent cutter heads 41 is equal to the width of a single chip unit. In some specific embodiments, each cutter head is movably connected to the cutter roller 40 to achieve cutting of chip units of different widths. As the cutter roller and the negative pressure roller rotate synchronously, the cutter heads synchronously slit the chip film material with the surface of the negative pressure roller as a reference. For ease of implementation, each cutter head 41 is movably connected to the cutter roller 40 to cut chip units of different widths.

[0032] In some specific embodiments, the cross-section of the cutter head 41 is an isosceles triangle; the angle between the center of adjacent cutter heads 41 and the center of the cutter roller 40 is adjustable, wherein the movable connection structure between each cutter head 41 and the cutter roller 40 can be any conventional movable connection structure to meet the angle adjustment. This satisfies the cutting requirements of multi-specification chips.

[0033] In this example, the shaping component 5 has a shaping channel t2 arranged close to the surface of the negative pressure roller 3 and used to flatten the chip film material M1. The shaping channel t2, the slitting channel t1, and the bonding channel t0 are sequentially aligned in the circumferential direction of the negative pressure roller 3. Based on the adsorption force and rotation cooperation formed by the negative pressure roller 3, the chip film material M1 passing through the outlet of the shaping channel t2 is adhered and adsorbed onto the surface of the negative pressure roller 3 and transferred to the slitting channel t1. The slitting cutter 4 is used to cut the chip film material M1 entering the slitting channel t1 and form chip units M10 piece by piece. As the negative pressure roller 3 rotates, multiple chip units M10 enter the bonding channel t0 piece by piece and are transferred to the surface of the base film M2.

[0034] In some specific embodiments, the plane containing the lower wall of the shaping channel t2 is tangent to the surface of the negative pressure roller 3. This ensures that the chip film is cut into and adheres to the surface of the negative pressure roller for transport.

[0035] The shaping component 5 includes an upper shaping plate 50 and a lower shaping plate 51 spaced apart to form a shaping channel t2, wherein the distance between the upper shaping plate 50 and the lower shaping plate 51 is equal to the thickness of the chip film material M1. Both the upper and lower shaping plates are made of metal plates, which have a low coefficient of friction and reduce wear.

[0036] Multiple strip-shaped through holes k are formed on the upper shaping plate 50 and / or the lower shaping plate 51. This prevents the chip film from forming a vacuum adsorption between it and the upper and lower shaping plates, reducing interference with the transmission of the chip film.

[0037] In other specific embodiments, the shaping component 5 may also be an upper shaping plate 50, and a shaping channel t2 is formed between the upper shaping plate 50 and the surface of the negative pressure roller 3, so that the chip film material M1 is flattened during bonding and rotation with the negative pressure roller 3.

[0038] Meanwhile, to further facilitate implementation, the power generated by the conveying module 1 transports the chip film material M1 towards the shaping channel t2, that is, the chip film material M is clamped and fed towards the shaping channel t2 by the upper and lower conveying rollers. Here, after each chip unit is cut, the power of the conveying module drives the subsequent chip film material to fill the gap in time.

[0039] Furthermore, based on the coordinated movement of the negative pressure roller 3 and the conveying module 1, the transmission rate of the chip film material M1 in the conveying module 1 is equal to the transmission rate of the chip unit M10 in the slitting channel t1. In other words, by matching the rotational speeds of the negative pressure roller and the conveying module, the transmission rate of the chip film material remains consistent at any position between the slitting cutter and the conveying module, thus preventing stretching or loosening of the chip film material. Moreover, since the replacement rate and the slitting rate are equal, the multiple chip units after slitting can remain tightly arranged on the surface of the negative pressure roller. This allows for tight adhesion to the base film surface, improving the utilization rate of the base film and saving costs.

[0040] In summary, the continuous slitting and laminating device for RFID tags uses a single-layer chip film. The forming channel, slitting channel, and bonding channel are sequentially aligned circumferentially by the negative pressure roller. After applying adhesive to the bottom film surface via a glue applicator, the bottom film is conveyed to the bonding channel. After the chip film is flattened through the forming channel, it adheres to the surface of the negative pressure roller due to the suction force and rotation of the roller, and is conveyed to the slitting channel. The slitting cutter cuts the chip film entering the slitting channel. The process involves breaking and forming individual chip units one by one, with multiple chip units entering the bonding channel sequentially as the negative pressure roller rotates and precisely bonding to the surface of the base film. Therefore, compared to existing technologies, this invention, on the one hand, leverages the seamless connection between the shaping and slitting channels to ensure the chip film material remains flat and adheres to the surface of the negative pressure roller for cutting, effectively improving the chip cutting success rate; on the other hand, it employs a single-layer chip, and based on the sequential alignment of the shaping, slitting, and bonding channels, after cutting, it can be directly adsorbed onto the surface of the negative pressure roller and precisely transferred to the surface of the base film, ensuring... The continuous slitting and laminating process significantly improves production efficiency; thirdly, both the upper and lower shaping plates are made of metal plates, resulting in a low coefficient of friction and reduced wear; fourthly, multiple through holes are formed on the upper and / or lower shaping plates to prevent vacuum adsorption between the chip film and the upper and lower shaping plates, reducing interference with the transmission of the chip film; fifthly, after each chip unit is cut, the power of the conveying module drives the subsequent chip film to fill the gap in time; sixthly, by matching the rotational speed of the negative pressure roller and the conveying module, the chip film can be positioned at any position between the slitting cutter and the conveying module. Maintaining a consistent transmission rate prevents stretching or loosening of the chip film. Furthermore, because the replacement rate and slitting rate are equal, the slitting multiple chip units remain tightly arranged on the negative pressure roller surface. This ensures tight adhesion to the base film surface, improving base film utilization and saving costs. Seventhly, horizontal transmission of the base film and bonding with the chip units reduces adhesive loss from the base film surface before bonding, ensuring strong adhesion between the chip and the base film. Simultaneously, it prevents separation of the chip and base film due to film bending caused by changes in transmission direction after bonding and lamination.

[0041] The present utility model has been described in detail above, with the aim of enabling those skilled in the art to understand its contents and implement it. However, this description should not be construed as limiting the scope of protection of the present utility model. All equivalent changes or modifications made in accordance with the spirit and essence of the present utility model should be included within the scope of protection of the present utility model.

Claims

1. A continuous slitting and laminating device for RFID tags, the continuous slitting and laminating device comprising a negative pressure roller connecting a chip film transport path and a base film transport path, a slitting cutter disposed on the chip film transport path, and an adhesive applicator disposed on the base film transport path, wherein an adhesive channel is formed between the negative pressure roller and the base film transport path, characterized in that, The chip film material used is a single-layer chip layer; a slitting channel is formed between the slitting cutter and the negative pressure roller; the continuous slitting and composite device also includes a shaping component arranged on the chip film material transport path. The shaping component forms a shaping channel that is arranged close to the surface of the negative pressure roller and is used to drive the chip film material to flatten. The shaping channel, the slitting channel and the bonding channel are aligned sequentially in the circumferential direction of the negative pressure roller. Based on the adsorption force and rotation cooperation formed by the negative pressure roller, the chip film material passing through the outlet of the shaping channel is bonded and adsorbed onto the surface of the negative pressure roller and transported to the slitting channel. The slitting cutter is used to cut the chip film material entering the slitting channel and form chip units one by one. Multiple chip units enter the bonding channel one by one with the rotation of the negative pressure roller and are transferred to the surface of the base film.

2. The continuous slitting and laminating device for RFID tags according to claim 1, characterized in that, The chip film transport path and the bottom film transport path are located above and below the negative pressure roller, respectively. In the orthogonal projection on the horizontal plane, the chip film transport direction in the slitting channel is opposite to the bottom film transport direction in the bonding channel.

3. The continuous slitting and laminating device for RFID tags according to claim 2, characterized in that, The slitting and laminating device also includes a transmission module disposed below the negative pressure roller. The bottom film passing through the transmission module forms a horizontally extending adhesive section, which passes through the adhesive channel in a horizontal direction.

4. The continuous slitting and laminating device for RFID tags according to claim 3, characterized in that, The bottom film of the transmission module also forms a vertically extending adhesive coating section and a connecting section that is inclined vertically and connects the upper end of the adhesive coating section and the bonding section located at one end of the inlet of the bonding channel. The adhesive applicator is disposed on one side of the adhesive coating section and is used to spray adhesive liquid onto the adhesive coating section.

5. The continuous slitting and laminating device for RFID tags according to claim 1, characterized in that, The plane containing the lower wall of the shaping channel is tangent to the surface of the negative pressure roller.

6. The continuous slitting and laminating device for RFID tags according to claim 1, characterized in that, The shaping component includes an upper shaping plate and a lower shaping plate spaced apart to form the shaping channel, wherein the spacing between the upper shaping plate and the lower shaping plate is equal to the thickness of the chip film.

7. The continuous slitting and laminating device for RFID tags according to claim 6, characterized in that, Multiple through holes are formed on the upper shaping plate and / or the lower shaping plate.

8. The continuous slitting and laminating device for RFID tags according to claim 1, characterized in that, The slitting and laminating device also includes a conveying module disposed on one side of the feed inlet of the shaping channel. The conveying module generates the power to transport the chip film material to the shaping channel. Based on the cooperation of the negative pressure roller and the conveying roller group, the transmission rate of the chip film material in the conveying module is equal to the transmission rate of the individual chip in the slitting channel.

9. The continuous slitting and laminating device for RFID tags according to claim 8, characterized in that, The conveying module includes an upper conveying roller and a lower conveying roller, wherein the surfaces of the upper and lower conveying rollers are formed with a plurality of exhaust grooves spaced apart along their own axial direction.

10. The continuous slitting and laminating device for RFID tags according to claim 1, characterized in that, The slitting tool includes a cutting roller and a plurality of cutting heads spaced circumferentially around the cutting roller, wherein the cutting distance formed by each two adjacent cutting heads is equal to the width of a single chip.

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