Wafer tray assembly and evaporation apparatus

Abstract

The utility model discloses a wafer tray assembly and evaporation equipment relates to the technical field of semiconductor processing. Wafer tray assembly includes planet disc, apron and pressure buckle. Among them, planet disc is set with accommodation groove, and accommodation groove includes round groove and sets up the limit slot in one side of round groove and with round groove intercommunication, and apron includes cover and limit protruding, and limit protruding is connected with one side of cover, and limit protruding is used for with limit slot cooperation to limit cover body rotation, and cover is covered in round groove, and the side of cover is set up with first pressure groove away from planet disc, and pressure buckle includes connecting piece and reed, and reed includes the connecting portion and pressure joint portion that are connected, and connecting portion is worn in connecting piece, and connecting piece is installed in the circumferential side of round groove, and pressure joint portion is used for covering at least partial first pressure groove. Wafer tray assembly provided by the utility model can effectively reduce the phenomenon that wafer is scratched in the evaporation processing, and is favorable to improve the yield of wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer tray assembly and vapor deposition equipment. Background Technology

[0002] In the wafer coating process, the wafer is typically placed on a planetary disk and covered with a cover plate to secure it. Then, vacuum evaporation is performed to form a uniform coating on the wafer surface. During this process, external forces often cause scratches on the wafer, leading to a decrease in wafer yield. Utility Model Content

[0003] The main purpose of this invention is to provide a wafer tray assembly and vapor deposition equipment, which aims to solve the problem that wafers are easily scratched during the wafer coating process.

[0004] To achieve the above objectives, this utility model proposes a wafer tray assembly, comprising: A planetary disk having a receiving groove, the receiving groove including a circular groove and a limiting groove disposed on one side of the circular groove and communicating with the circular groove; A cover plate, the cover plate including a cover body and a limiting protrusion, the limiting protrusion being connected to one side of the cover body, the limiting protrusion being used to cooperate with the limiting groove to restrict the rotation of the cover body, the cover body covering the circular groove, and a first pressing groove being formed on the side of the cover body away from the planetary disk; A snap fastener, comprising a connector and a spring, the spring comprising a connecting portion and a pressing portion connected together, the connecting portion passing through the connector, the connector being mounted on the periphery of the circular groove, and the pressing portion being used to cover at least a portion of the first pressing groove.

[0005] In one embodiment, the receiving groove further includes an auxiliary groove, which is formed on one side of the circular groove and communicates with the circular groove. The auxiliary groove is spaced apart from the limiting groove, and the limiting protrusion is received in the limiting groove or the auxiliary groove. The cover body is provided with a second pressing groove on the side away from the planetary disk, and the pressing part can cover at least part of the second pressing groove.

[0006] In one embodiment, the cover plate has a first position and a second position; When the cover plate is in the first position, the limiting protrusion is accommodated in the limiting groove, and the pressing part covers at least a portion of the first pressing groove. When the cover plate is in the second position, the limiting protrusion is accommodated in the auxiliary groove, and the pressing part covers at least a portion of the second pressing groove.

[0007] In one embodiment, there are multiple snap fasteners, the first pressure groove, and the second pressure groove. The multiple snap fasteners are arranged in a circular array along the circumference of the circular groove, and each snap fastener corresponds to either the first pressure groove or the second pressure groove.

[0008] In one embodiment, the planetary disk has a plurality of receiving slots arranged in a circular array, and there are a plurality of cover plates, with each cover plate corresponding to one of the receiving slots.

[0009] In one embodiment, the top surface of the planetary disk has a center, and a plurality of the limiting grooves are formed on the side of the corresponding circular groove facing the center.

[0010] In one embodiment, the cover plate further includes a handle mounted on the top surface of the cover.

[0011] In one embodiment, the handle includes a mounting plate, a connecting rod, and a grip plate connected in sequence. The mounting plate is fitted onto the top surface of the cover plate, and the connection points between the connecting rod and the mounting plate and the grip plate are rounded.

[0012] In one embodiment, the buckle further includes a spring, the connector is a bolt, the connecting portion passes through the thread of the bolt, the spring is sleeved on the thread of the bolt, and the two ends of the spring abut against the nut of the bolt and the connecting portion, respectively.

[0013] This invention also proposes a vapor deposition apparatus, including a wafer tray assembly as described in any of the above embodiments.

[0014] According to the technical solution of this utility model, the wafer tray assembly includes a planetary disk, a cover plate, and a snap fastener. The planetary disk has a receiving groove, which includes a circular groove and a limiting groove disposed on one side of the circular groove and communicating with it. The cover plate includes a cover body and a limiting protrusion. The limiting protrusion is connected to one side of the cover body and is used to cooperate with the limiting groove to restrict the rotation of the cover body. The cover body covers the circular groove, and a first pressing groove is formed on the side of the cover body away from the planetary disk. The snap fastener includes a connector and a spring. The spring includes a connecting part and a pressing part connected together. The connecting part passes through the connector and is installed on the periphery of the circular groove. The pressing part is used to cover at least a portion of the first pressing groove. With this arrangement, when the cover plate is placed, the cooperation between the limiting protrusion and the limiting groove has a positioning function, allowing the first pressing groove to be accurately positioned at the location of the spring. Therefore, the pressing part can be placed on the first pressing groove without rotating the cover plate, thus avoiding scratches to the wafer caused by rotating the cover plate. During vapor deposition, the matching of the limiting protrusions and limiting grooves provides a limiting effect, preventing the cover plate from rotating due to centrifugal force and thus avoiding scratches on the wafer during the vapor deposition process. This helps reduce wafer scratches during the vapor deposition process, thereby improving wafer yield. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of an embodiment of the planetary disk provided by this utility model; Figure 2 A schematic diagram of the structure of an embodiment of the cover plate provided by this utility model; Figure 3 for Figure 2 A structural diagram from another perspective; Figure 4 A schematic diagram of the structure of an embodiment of the snap fastener provided by this utility model; Figure 5 A schematic diagram of a handle embodiment provided by this utility model.

[0017] Explanation of icon numbers: 1. Planetary disk; 11. Receiving slot; 111. Circular slot; 112. Limiting slot; 113. Auxiliary slot; 2. Cover plate; 21. Cover body; 211. First pressing groove; 212. Second pressing groove; 22. Limiting protrusion; 23. Handle; 231. Mounting plate; 232. Connecting rod; 233. Grip plate; 3. Buckle; 31. Connector; 32. Spring; 321. Connecting part; 322. Pressing part; 33. Spring.

[0018] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0021] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0022] Vacuum evaporation equipment (hereinafter referred to as evaporation equipment) is a device that uses heating to evaporate materials (such as metals or oxides), causing them to be deposited onto the surface of a wafer in a vacuum to form a thin film. In this equipment, a planetary disk is used to support the wafer, and a cover plate is needed to cover the wafer to prevent it from shifting during the evaporation process.

[0023] According to the applicant's observations, after the cover plate is placed on the wafer surface, operators typically need to manually rotate the cover plate to adjust its position. This step aims to ensure the cover plate precisely engages with the compression spring, allowing it to be stably pressed down. However, during manual rotation and adjustment, relative friction inevitably occurs between the cover plate and the wafer, which can potentially damage the wafer surface.

[0024] In view of this, the present invention proposes a wafer tray assembly.

[0025] Please see Figures 1 to 4 In one embodiment of this application, the wafer tray assembly includes a planetary disk 1, a cover plate 2, and a snap fastener 3. The planetary disk 1 has a receiving groove 11 for placing wafers. The receiving groove 11 includes a circular groove 111 and a limiting groove 112 disposed on one side of the circular groove 111 and communicating with the circular groove 111; the cover plate 2 includes a cover body 21 and a limiting protrusion 22, the limiting protrusion 22 is connected to one side of the cover body 21, the limiting protrusion 22 is used to cooperate with the limiting groove 112 to limit the rotation of the cover body 21, the cover body 21 covers the circular groove 111, and a first pressing groove 211 is opened on the side of the cover body 21 away from the planetary disk 1; the snap fastener 3 includes a connector 31 and a spring 32, the spring 32 includes a connecting part 321 and a pressing part 322 connected together, the connecting part 321 passes through the connector 31, the connector 31 is installed on the periphery of the circular groove 111, and the pressing part 322 is used to cover at least part of the first pressing groove 211.

[0026] Specifically, in this embodiment, the outer contour shape of the planetary disk 1 includes either a cylindrical shape or a regular prism shape. A receiving groove 11 is formed on one end face of the planetary disk 1, and the wafer is placed in the circular groove 111, with a cover plate 2 covering it. The shape of the limiting protrusion 22 is adapted to the shape of the limiting groove 112, which can be rectangular, semi-circular, triangular, or other irregular shapes. In this embodiment, the limiting protrusion 22 and the limiting groove 112 are semi-circular, and the edge of the limiting groove 112 has a gradient transition feature, so that after the cover plate 2 is removed, tweezers can be used to reach into the limiting groove 112 to grasp the wafer. Furthermore, the limiting protrusion 22 and the cover 21 are integrally formed from stainless steel. After vapor deposition, acid pickling is required to clean the cover plate 2, and stainless steel has good corrosion resistance, which can improve the service life of the cover plate 2. The one-piece molding eliminates the connection and assembly process between the cover 21 and the limiting protrusion 22, which is beneficial to improving the production efficiency of the cover 21. Furthermore, the absence of a connecting seam between the two improves the overall strength of the cover 21. In this embodiment, the spring 32 is made of one of the following materials: carbon steel, copper alloy, or stainless steel. The spring 32 has a certain degree of elasticity, and after the cover 2 is installed, it can press against the first pressure groove 211 to limit the position of the cover 2 and prevent the cover 2 from rotating and damaging the wafer.

[0027] It should be noted that during the wafer evaporation process, the planetary disk 1 revolves and rotates, subjecting the cover plate 2 to centrifugal force. During this process, if the spring 32's elasticity is insufficient (possibly due to aging or excessive use), it may fail to provide sufficient pressure to the cover plate 2, causing it to shift under centrifugal force and resulting in further frictional damage to the wafer. However, the solution provided in this embodiment not only includes spring 32 on the planetary disk 1 to apply pressure to the cover plate 2 and initially limit its position, but also a limiting protrusion 22 that engages with a limiting groove 112, allowing the limiting groove 112 to provide secondary limiting for the cover plate 2. Thus, with this double limiting action, the cover plate 2 can be prevented from rotating relative to the planetary disk 1 during wafer evaporation, thereby preventing further frictional damage to the wafer.

[0028] Through the technical solution of this embodiment, when the cover plate 2 is placed, the cooperation between the limiting protrusion 22 and the limiting groove 112 has a positioning function, so that the first pressing groove 211 can be accurately positioned at the position of the spring 32. Therefore, the pressing part 322 can be placed on the first pressing groove 211 without rotating the cover plate 2, thereby avoiding the situation where the wafer is scratched due to rotating the cover plate 2. During the vapor deposition process, since the cooperation between the limiting protrusion 22 and the limiting groove 112 and the cooperation between the spring 32 and the first pressing groove 211 both have a limiting function, the cover plate 2 will not rotate due to centrifugal force, thereby avoiding the situation where the wafer is scratched during the vapor deposition process. In this way, it is beneficial to reduce the situation where the wafer is scratched during the wafer vapor deposition process, thereby improving the wafer yield.

[0029] Furthermore, in another embodiment of this application, please refer to Figure 1 and Figure 2The receiving groove 11 also includes an auxiliary groove 113, which is formed on one side of the circular groove 111 and communicates with it. The auxiliary groove 113 is spaced apart from the limiting groove 112, and the limiting protrusion 22 is received in the limiting groove 112 or the auxiliary groove 113. A second pressing groove 212 is also formed on the side of the cover 21 away from the planetary disk 1, and the pressing part 322 can cover at least part of the second pressing groove 212. In this embodiment, the auxiliary groove 113 and the limiting groove 112 have the same shape and opening depth, and the fitting tolerance between the limiting protrusion 22 and the limiting groove 112 and the auxiliary groove 113 is controlled within ±0.1mm. When the cover plate 2 is covered, the limiting protrusion 22 is usually fitted with the limiting groove 112. At this time, the pressing part 322 of the spring 32 presses against the first groove. At this time, the auxiliary groove 113 is usually used as the part for inserting tweezers to pick up the wafer, so as to improve the convenience of wafer picking and placing. When the work pace is fast, the operator can choose to match the limiting protrusion 22 with any one of the limiting groove 112 and the auxiliary groove 113 to improve the efficiency of the cover plate 2 installation.

[0030] According to the scheme in this embodiment, the cover plate 2 has a first position and a second position. When the cover plate 2 is in the first position, the limiting protrusion 22 is accommodated in the limiting groove 112, and the pressing part 322 covers at least a portion of the first pressing groove 211. When the cover plate 2 is in the second position, the limiting protrusion 22 is accommodated in the auxiliary groove 113, and the pressing part 322 covers at least a portion of the second pressing groove 212. That is to say, when the cover plate 2 is in either the first position or the second position, the cover plate 2 can be connected to the spring 32. The limiting groove 112 and the auxiliary groove 113 can both limit and position the cover plate 2, so that the cover plate 2 will not rotate during installation and vapor deposition, thereby avoiding scratches on the wafer.

[0031] Furthermore, in another embodiment of this application, please refer to... Figure 1 and Figure 2 There are multiple snap fasteners 3, first pressure grooves 211, and second pressure grooves 212. These snap fasteners 3 are arranged in a ring array along the circumference of the circular groove 111, and each snap fastener 3 corresponds one-to-one with either the first pressure groove 211 or the second pressure groove 212. This ring array arrangement ensures that the pressure applied by the spring clips 32 to the cover 21 is evenly distributed in the circumferential direction, avoiding concentrated force at a single point or a few points. This improves the limiting ability of the snap fasteners 3 on the cover 21, thereby preventing the cover 2 from rotating as a whole and further reducing the probability of the wafer being scratched.

[0032] In another embodiment of this application, please refer to Figure 1The planetary disk 1 has multiple receiving slots 11 arranged in a ring array. Multiple cover plates 2 are also present, each corresponding to one of the receiving slots 11. This arrangement allows each planetary disk to hold multiple wafers simultaneously, facilitating simultaneous deposition of multiple wafers by the vapor deposition equipment and improving wafer processing efficiency. The ring array arrangement also centralizes the center of gravity of the planetary disk 1, enhancing its rotational stability.

[0033] In another embodiment of this application, please refer to Figure 1 The planetary disk 1 has a central point on the side of the receiving groove 11, and multiple limiting grooves 112 are formed on the side of the corresponding circular groove 111 facing the center. This arrangement ensures that the connecting lines of the various limiting grooves 112 converge at the center, which helps to center the center of gravity of the planetary disk 1. At the same time, the limiting grooves 112 are oriented towards the center, so that the limiting grooves 112 will not encroach on the outer peripheral area of ​​the planetary disk 1, which helps to reduce the outer peripheral size of the planetary disk 1.

[0034] In another embodiment of this application, please refer to Figure 2 and Figure 3 The cover plate 2 also includes a handle 23, which is mounted on the top surface of the cover body 21. This design makes it easier for the operator to grip the handle 23 to move the cover plate 2, thereby improving the efficiency of installation and removal of the cover plate 2 and the installation accuracy of the cover plate 2.

[0035] Furthermore, in another embodiment of this application, please refer to Figure 5 The handle 23 includes a mounting plate 231, a connecting rod 232, and a gripping plate 233 connected in sequence. The mounting plate 231 is fitted onto the top surface of the cover plate 2, and the connection points between the connecting rod 232 and the mounting plate 231 and the gripping plate 233 are rounded. In this embodiment, the mounting plate 231 is welded or threaded to the cover body 21. The mounting plate 231, the connecting rod 232, and the gripping plate 233 are integrally formed. The diameter of the gripping plate 233 is 25mm, the diameter of the connecting rod 232 is 10mm, and the rounded corner diameters at both ends of the connecting rod 232 are 2mm. This size of the handle 23 is ergonomically designed, which helps the operator to stably pick up the cover plate 2 and prevents the cover plate 2 from falling and damaging the wafer or causing damage to the cover plate 2 itself.

[0036] In another embodiment of this application, please refer to Figure 4The snap fastener 3 also includes a spring 33. The connecting member 31 is a bolt, with a connecting part 321 passing through the bolt's thread. The spring 33 is sleeved on the bolt's thread, with its two ends abutting against the bolt's nut and the connecting part 321, respectively. The spring 33 is compressed during bolt tightening, generating a counterforce. This elastic force continuously acts between the connecting part 321 and the nut, allowing the spring plate 32 to be stably mounted on the planetary disk 1. Simultaneously, the spring 33 allows the spring plate 32 to be lifted as a whole, preventing excessive tension on the spring plate 32 from causing plastic deformation and spring plate 32 failure.

[0037] This utility model also proposes a vapor deposition equipment, which includes a wafer tray assembly. The specific structure of the wafer tray assembly is as described in the above embodiments. Since this vapor deposition equipment adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0038] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A wafer tray assembly, characterized in that, include: A planetary disk having a receiving groove, the receiving groove including a circular groove and a limiting groove disposed on one side of the circular groove and communicating with the circular groove; A cover plate, the cover plate including a cover body and a limiting protrusion, the limiting protrusion being connected to one side of the cover body, the limiting protrusion being used to cooperate with the limiting groove to restrict the rotation of the cover body, the cover body covering the circular groove, and a first pressing groove being formed on the side of the cover body away from the planetary disk; A snap fastener, comprising a connector and a spring, the spring comprising a connecting portion and a pressing portion connected together, the connecting portion passing through the connector, the connector being mounted on the periphery of the circular groove, and the pressing portion being used to cover at least a portion of the first pressing groove.

2. The wafer tray assembly as described in claim 1, characterized in that, The receiving groove also includes an auxiliary groove, which is formed on one side of the circular groove and communicates with the circular groove. The auxiliary groove is spaced apart from the limiting groove, and the limiting protrusion is received in the limiting groove or the auxiliary groove. The cover body is provided with a second pressing groove on the side away from the planetary disk, and the pressing part can cover at least part of the second pressing groove.

3. The wafer tray assembly as described in claim 2, characterized in that, The cover plate has a first position and a second position; When the cover plate is in the first position, the limiting protrusion is accommodated in the limiting groove, and the pressing part covers at least a portion of the first pressing groove. When the cover plate is in the second position, the limiting protrusion is accommodated in the auxiliary groove, and the pressing part covers at least a portion of the second pressing groove.

4. The wafer tray assembly as described in claim 3, characterized in that, The number of the snap fasteners, the first pressure groove, and the second pressure groove is multiple. The multiple snap fasteners are arranged in a ring array along the circumference of the circular groove, and the snap fasteners are set in a one-to-one correspondence with the first pressure groove or the second pressure groove.

5. The wafer tray assembly as described in any one of claims 1 to 4, characterized in that, The planetary disk has multiple receiving slots arranged in a circular array. There are multiple cover plates, and each cover plate corresponds to one of the receiving slots.

6. The wafer tray assembly as claimed in claim 5, characterized in that, The planetary disk has a center on the side of the receiving groove, and multiple limiting grooves are opened on the side of the corresponding circular groove facing the center.

7. The wafer tray assembly as described in any one of claims 1 to 4, characterized in that, The cover also includes a handle, which is mounted on the top surface of the cover.

8. The wafer tray assembly as claimed in claim 7, characterized in that, The handle includes a mounting plate, a connecting rod, and a grip plate connected in sequence. The mounting plate is fitted onto the top surface of the cover plate, and the connection points between the connecting rod and the mounting plate and the grip plate are rounded.

9. The wafer tray assembly as described in any one of claims 1 to 4, characterized in that, The buckle also includes a spring, the connector is a bolt, the connecting part passes through the bolt's thread, the spring is sleeved on the bolt's thread, and the two ends of the spring abut against the bolt's nut and the connecting part, respectively.

10. A vapor deposition apparatus, characterized in that, Includes the wafer tray assembly as described in any one of claims 1 to 9.

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