Wafer pedestal and coating apparatus

Abstract

The utility model relates to wafer processing equipment technical field discloses a kind of wafer pedestals, including pedestal body and annular shell, the upper surface of pedestal body is provided with multiple mounting protrusions, multiple mounting protrusions are intervally arranged on the circumference concentric with pedestal body, and mounting protrusion is formed around and is used to accommodate the accommodating cavity for accommodating wafer, every mounting protrusion is away from the side of pedestal body and is provided with a let slot, when wafer is placed in accommodating cavity, the side circumference wall of wafer and the groove bottom of let slot are intervally arranged, annular shell is sleeved in the circumference of pedestal body, and annular shell can be contacted with the side of mounting protrusion away from the center of pedestal body.When wafer is placed in accommodating cavity, the side circumference wall of wafer and the groove bottom of let slot maintain interval state, i.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a wafer substrate and coating equipment. Background Technology

[0002] A wafer substrate is a base used to support a wafer for subsequent wafer processing. During the wafer coating process, the wafer is placed on the wafer substrate for coating. The wafer substrate typically has protrusions to position other components. However, as the coating process continues, the protrusions on the substrate surface continuously deposit film, causing the protrusions to increase in height and volume. When the film thickness reaches a certain level, the expanded protrusions physically contact the wafer edge or back surface, forming adhesion. Since wafers are typically thin sheets, when a robot arm enters to remove the wafer after coating, the adhesion between the wafer and the protrusions can lead to breakage, resulting in a risk of reduced product yield. Furthermore, broken pieces increase equipment downtime for cleaning, wafer remanufacturing costs, and potential robot arm damage costs, thus increasing the overall manufacturing cost. Utility Model Content

[0003] The purpose of this invention is to provide a wafer base that can prevent the wafer from sticking to the bumps.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A wafer substrate, comprising:

[0006] A base body for supporting a wafer has multiple mounting protrusions on its upper surface. These protrusions are spaced apart on a circumference concentric with the base body and form a receiving cavity for accommodating the wafer. Each mounting protrusion has a clearance groove on its side facing the center of the base body. The depth of the clearance groove is parallel to the radial direction of the base body. When the wafer is placed in the receiving cavity, the sidewall of the wafer is spaced apart from the bottom of the clearance groove.

[0007] An annular outer shell is fitted around the outer periphery of the base body, and the annular outer shell can abut against the side of the mounting protrusion that is away from the center of the base body.

[0008] Preferably, the structure of the mounting protrusion is a hemispherical structure, which includes a flat part and a curved part. The flat part is connected to the base body, and the curved part is provided with the clearance groove.

[0009] Preferably, the depth of the relief groove is one-third of the diameter of the mounting protrusion.

[0010] Preferably, the mounting protrusion is integrally formed with the base body.

[0011] Preferably, the plurality of mounting protrusions are evenly spaced on a circumference concentric with the base body.

[0012] Preferably, four mounting protrusions are provided.

[0013] Preferably, both the base body and the mounting protrusion are made of metal alloy.

[0014] Preferably, the annular outer shell includes a first shell portion and a second shell portion connected to each other. The first shell portion extends radially along the base body, and the second shell portion extends axially along the base body. The end of the first shell portion away from the second shell portion abuts against the mounting protrusion, and the second shell portion fits against the outer peripheral wall of the base body.

[0015] Preferably, the end of the second shell portion away from the first shell portion is flush with the bottom wall of the base body.

[0016] A coating apparatus includes a coating device and the aforementioned wafer pedestal, wherein the wafer pedestal is used to support a wafer, and the coating device is used to coat the wafer on the wafer pedestal.

[0017] The beneficial effects of this utility model are:

[0018] This utility model proposes a wafer base, including a base body and an annular outer shell. The base body is used to support the wafer. The upper surface of the base body is provided with multiple mounting protrusions. The multiple mounting protrusions are spaced apart on a circumference concentric with the base body, and the multiple mounting protrusions surround to form a receiving cavity for accommodating the wafer. Each mounting protrusion has a relief groove on the side away from the base body, and the depth direction of the relief groove is parallel to the radial direction of the base body. When the wafer is placed in the receiving cavity, the sidewall of the wafer is spaced apart from the bottom of the relief groove. The annular outer shell is fitted on the outer circumference of the base body, and the annular outer shell can abut against the side of the mounting protrusion away from the center of the base body. First, mounting protrusions are arranged concentrically on the upper surface of the base body, forming a circular cavity to accommodate the wafer. Each mounting protrusion has a relief groove on the side facing away from the center. When the wafer is placed in the cavity, the sidewall of the wafer remains spaced away from the bottom of the relief groove, i.e., in a non-contact state. This provides space for the expansion of the mounting protrusion due to film deposition. Even if the film layer thickens, increasing the height or volume of the mounting protrusion, the edge of the wafer will not directly contact the mounting protrusion. Instead, the buffer space provided by the relief groove prevents adhesion and avoids the risk of wafer breakage when the robot handles the wafer. Second, the annular shell can abut against the side of the mounting protrusion away from the center of the base body. The mounting protrusion can still position the annular shell, providing a positioning reference position for the annular shell. In other words, this design of the mounting protrusion not only avoids adhesion to the wafer but also ensures the accurate positioning of the annular shell.

[0019] On the other hand, this utility model also proposes a coating equipment, including a coating device and the aforementioned wafer base. The wafer base is used to support the wafer, and the coating device is used to coat the wafer on the wafer base. In this coating equipment, during the coating process, the wafer will not stick to the wafer due to the expansion of the coating protrusion, and it will no longer constitute a shutdown triggering factor. The coating equipment can continue to run for more cycles, improving the capacity utilization rate. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of the wafer base proposed in the embodiments of this utility model;

[0021] Figure 2 yes Figure 1 Sectional view at point A in the middle.

[0022] In the picture:

[0023] 1. Base body; 2. Mounting protrusion; 21. Relief groove; 3. Annular outer shell; 31. First shell part; 32. Second shell part; 10. Wafer. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0025] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0028] Reference Figure 1 and Figure 2This embodiment proposes a wafer base, including a base body 1 and an annular shell 3. The base body 1 is used to support a wafer 10. The upper surface of the base body 1 is provided with a plurality of mounting protrusions 2. The plurality of mounting protrusions 2 are spaced apart on a circumference concentric with the base body 1, and the plurality of mounting protrusions 2 surround to form a receiving cavity for accommodating the wafer 10. Each mounting protrusion 2 is provided with a relief groove 21 on the side away from the base body 1, and the groove depth direction of the relief groove 21 is parallel to the radial direction of the base body 1. When the wafer 10 is placed in the receiving cavity, the side wall of the wafer 10 is spaced apart from the bottom of the relief groove 21. The annular shell 3 is sleeved on the outer circumference of the base body 1, and the annular shell 3 can abut against the side of the mounting protrusion 2 away from the center of the base body 1. First, mounting protrusions 2 are arranged concentrically on the upper surface of the base body 1, forming a circular cavity for accommodating the wafer 10. Each mounting protrusion 2 has a relief groove 21 facing away from the center. When the wafer 10 is placed in the cavity, the sidewall of the wafer 10 and the bottom of the relief groove 21 remain in a spaced-apart, non-contact state. This provides space for the expansion of the mounting protrusions 2 due to film deposition. Even if the film layer thickens, increasing the height or volume of the mounting protrusions 2, the edge of the wafer 10 will remain unaffected. It will not directly contact the mounting protrusion 2, but will avoid adhesion through the buffer space provided by the clearance groove 21, thus avoiding the risk of wafer breakage when the robot handles the wafer; secondly, the annular shell 3 can abut against the side of the mounting protrusion 2 away from the center of the base body 1, and the mounting protrusion 2 can still position the installation of the annular shell 3, that is, it provides a positioning reference position for the annular shell 3. In other words, the design of this mounting protrusion 2 can not only avoid adhesion to the wafer 10, but also ensure the accurate positioning of the annular shell 3.

[0029] The base body 1 is a cylindrical structure with a relatively small height. The depth of the clearance groove 21 is radial to the base body 1, and the bottom of the clearance groove 21 corresponds to and is spaced apart from the outer peripheral wall of the wafer 10. The diameter of the base body 1 is 180.8 mm, and the diameter of the wafer 10 is 136.3 mm.

[0030] Furthermore, the base body 1 supports the wafer 10, and the mounting protrusions 2 are provided with relief grooves 21 to reserve expansion space, achieving non-interference and avoiding adhesion to the wafer 10. Multiple mounting protrusions 2 surround a receiving cavity for accommodating the wafer 10. Since each mounting protrusion 2 has a relief groove 21 on the side facing away from the base body 1, the cavity wall is composed of the bottoms of the relief grooves 21 on the multiple mounting protrusions 2. The sidewalls of the wafer 10 are spaced apart from the bottoms of the relief grooves 21, meaning the sidewalls of the wafer 10 are spaced apart from the cavity wall. When the wafer 10 is placed in the receiving cavity, the wafer 10 and the cavity wall are in a non-contact state.

[0031] In addition, the annular shell 3 and the mounting protrusion 2 can provide mutual constraint. The annular shell 3 and the mounting protrusion 2 abut against each other on the side away from the center of the base body 1. The mounting protrusion 2 provides a positioning reference for the installation of the annular shell 3. At the same time, the annular shell 3 also provides rigid constraint for the mounting protrusion 2. In the high temperature coating environment, the mounting protrusion 2 may undergo slight deformation. The abutment between the annular shell 3 and the mounting protrusion 2 can prevent the mounting protrusion 2 from expanding and deforming outward due to film stress or thermal effect during the coating cycle, thereby indirectly avoiding the deformation of the receiving cavity caused by the positional displacement of the mounting protrusion 2.

[0032] Furthermore, the mounting protrusion 2 and the base body 1 are integrally formed, thus there is no splicing gap between the mounting protrusion 2 and the base body 1, resulting in strong connection stability and improved resistance to deformation. In this embodiment, the mounting protrusion 2 and the base body 1 are fixed by welding.

[0033] The mounting protrusion 2 is specifically a hemispherical structure, comprising a flat portion and a curved portion. The flat portion connects to the base body 1, and the curved portion has a clearance groove 21. In other words, the mounting protrusion 2 is specifically a hemispherical structure with a clearance groove 21. Therefore, the manufacturing of this mounting protrusion 2 is very convenient. First, the flat portion of the hemispherical structure is connected to the base body 1. Then, the curved portion of the mounting protrusion 2 near the center of the base body 1 is machined until the clearance groove 21 is formed. The clearance groove 21 is directly machined from the mounting protrusion 2, simplifying the manufacturing process and reducing costs. Furthermore, the connection between the flat portion of the hemispherical structure and the base body 1 provides a larger contact area, avoiding stress concentration and improving overall rigidity. Specifically, the shape of the relief groove 21 can be determined according to actual needs. In this embodiment, the relief groove 21 is cut directly downward from the mounting protrusion 2 which has a hemispherical structure. Therefore, the bottom of the relief groove 21 is flat. In other embodiments, the bottom of the relief groove 21 can also be arc-shaped, etc., so that when the wafer 10 is placed in the receiving cavity, the side wall of the wafer 10 and the bottom of the relief groove 21 can be spaced apart.

[0034] Furthermore, the depth of the relief groove 21 is one-third of the diameter of the mounting protrusion 2. In other words, the depth of the relief groove 21 is one-third of the maximum diameter of the mounting protrusion 2, which is the original diameter of the hemispherical structure. When machining the mounting protrusion 2 to form the relief groove 21, one-third of the original diameter of the hemispherical structure is cut off from the side of the mounting protrusion 2 closest to the center of the base body 1. This ensures that the wafer 10 and the bottom of the receiving groove are not in contact, while also maintaining the rigidity of the mounting protrusion 2.

[0035] Multiple mounting protrusions 2 are evenly spaced on a circumference concentric with the base body 1, providing a uniformly distributed abutment force to the annular outer shell 3. This allows the load to be distributed and transferred through the multiple mounting protrusions 2, avoiding localized stress concentration. In this embodiment, four mounting protrusions 2 are provided. The angle between the connecting line of two adjacent mounting protrusions 2 and the center of the base body 1 is 90 degrees. Therefore, the connecting line of two non-adjacent mounting protrusions 2 on the base body 1 passes through the center of the base body 1, and the distance between these two mounting protrusions 2 is 159 mm. The bottoms of the clearance grooves 21 on these two mounting protrusions 2 are 154 mm apart. The distance between two mounting protrusions 2 is the distance between the centers of the two hemispherical structures.

[0036] Both the base body 1 and the mounting protrusion 2 are made of metal alloy. Metal alloy has the characteristics of high strength, high thermal strength and good corrosion resistance. Even in a high-temperature coating environment, it will not deform and can effectively maintain the support of the wafer 10.

[0037] The annular outer shell 3 includes a first shell portion 31 and a second shell portion 32 connected to each other. The first shell portion 31 extends radially along the base body 1, and the second shell portion 32 extends axially along the base body 1. The end of the first shell portion 31 away from the second shell portion 32 abuts against the mounting protrusion 2, and the second shell portion 32 fits against the outer peripheral wall of the base body 1. The annular outer shell 3 is fitted around the outer periphery of the base body 1, and the annular outer shell 3 can abut against the side of the mounting protrusion 2 away from the center of the base body 1. Therefore, the mounting position of the mounting protrusion 2 is a certain distance away from the outer edge of the base body 1. Thus, the first shell portion 31 of the annular outer shell 3 can fit against the area on the upper surface of the base body 1 located outside the mounting protrusion 2. The first shell portion 31 extends radially along the base body 1. When the annular outer shell 3 is fitted onto the base body 1, the first shell portion 31 can fit against the upper surface of the base body 1, and the end of the first shell portion 31 away from the second shell portion 32 abuts against the mounting protrusion 2. The first shell portion 31 fits against the outer peripheral wall of the base body 1, providing protection for the base body 1.

[0038] Furthermore, the end of the second shell 32 away from the first shell 31 is flush with the bottom wall of the base body 1, forming a complete support plane, so that the weight of the entire device is evenly transmitted to the base body 1 and the annular shell 3, avoiding deformation or cracking caused by local stress concentration in the annular shell 3.

[0039] In this embodiment, the wafer substrate reduces the die adhesion rate by setting a clearance groove 21 on the mounting protrusion 2, thereby reducing the side effects such as die breakage caused by die adhesion. The die breakage rate is significantly reduced. At the same time, the number of wafer substrate maintenance cycles is reduced from 300 PCS to 100 PCS, a reduction of 3 times, saving corresponding cleaning costs. The normal service life of the wafer substrate is increased by 2.6%.

[0040] On the other hand, this embodiment also proposes a coating equipment, including a coating device and the aforementioned wafer base. The wafer base is used to support the wafer 10, and the coating device is used to coat the wafer 10 on the wafer base. In this coating equipment, during the coating process of the coating device on the wafer 10 on the wafer base, the wafer 10 will not stick to the mounting protrusion 2 due to the coating expansion, and it will no longer constitute a shutdown triggering factor. The coating equipment can continue to run for more cycles, improving the capacity utilization rate.

[0041] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer substrate, characterized in that, include: A base body (1) is used to support a wafer (10). The upper surface of the base body (1) is provided with a plurality of mounting protrusions (2). The plurality of mounting protrusions (2) are spaced apart on a circumference concentric with the base body (1), and the plurality of mounting protrusions (2) surround to form a receiving cavity for accommodating the wafer (10). Each mounting protrusion (2) is provided with a relief groove (21) on one side facing the center of the base body (1). The groove depth direction of the relief groove (21) is parallel to the radial direction of the base body (1). When the wafer (10) is placed in the receiving cavity, the side wall of the wafer (10) is spaced apart from the bottom of the relief groove (21). An annular outer shell (3) is fitted around the outer periphery of the base body (1), and the annular outer shell (3) can abut against the side of the mounting protrusion (2) away from the center of the base body (1).

2. The wafer substrate according to claim 1, characterized in that, The structure of the mounting protrusion (2) is a hemispherical structure, which includes a flat part and a curved part. The flat part is connected to the base body (1), and the curved part is provided with the clearance groove (21).

3. The wafer substrate according to claim 1, characterized in that, The depth of the clearance groove (21) is one-third of the diameter of the mounting protrusion (2).

4. The wafer substrate according to claim 1, characterized in that, The mounting protrusion (2) is integrally formed with the base body (1).

5. The wafer substrate according to claim 1, characterized in that, The mounting protrusions (2) are evenly spaced on a circumference concentric with the base body (1).

6. The wafer substrate according to claim 1, characterized in that, The mounting protrusions (2) are provided in four parts.

7. The wafer substrate according to claim 1, characterized in that, Both the base body (1) and the mounting protrusion (2) are made of metal alloy.

8. The wafer substrate according to any one of claims 1-7, characterized in that, The annular outer shell (3) includes a first shell portion (31) and a second shell portion (32) connected to each other. The first shell portion (31) extends radially along the base body (1), and the second shell portion (32) extends axially along the base body (1). The end of the first shell portion (31) away from the second shell portion (32) abuts against the mounting protrusion (2), and the second shell portion (32) fits against the outer peripheral wall of the base body (1).

9. The wafer substrate according to claim 8, characterized in that, The end of the second shell (32) away from the first shell (31) is flush with the bottom wall of the base body (1).

10. A coating apparatus, characterized in that, The device includes a coating apparatus and a wafer pedestal as described in any one of claims 1-9, the wafer pedestal being used to support a wafer (10), and the coating apparatus being used to coat the wafer (10) on the wafer pedestal.

Images