A double-sided electroplating carrier
Patent Information
- Application Number
- CN202522213323.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-20
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-20
AI Technical Summary
[0003]现有双面电镀载具通过使用螺丝固定载具基板和盖板，在载具基板与盖板中间使用密封圈进行密封，从而防止电镀液渗入载具内部影响导电性能或损坏组件，然而一方面，针对尺寸较大的产品片，为保证基板与盖板的装配稳定性和密封可靠性，需要锁附的螺丝数量较多，导致载具的拆装操作消耗时间长、步骤繁琐，严重制约了产线的加工效率；另一方面，螺丝在反复拆装过程中易出现滑牙问题，一旦发生滑牙，不仅会破坏基板或盖板的螺纹结构，还会导致载具无法正常密封和固定，进而需要对载具进行返修，甚至直接报废，显著增加了生产成本，降低了生产的连续性，因此有必要对现有的电镀载具进行改进以解决这一问题
1.通过在基板上均匀固定连接若干旋扣组件并通过设置同列或同行的若干下压抵接板之间基于同步驱动组件实现同步运动，一方面，通过旋扣组件代替传统的螺丝固定结构，首先通过设置在基板上的定位销与盖板上的定位孔从而实现盖板与基板之间的快速定位，随后通过旋转下压抵接板从而实现将盖板压紧固定在基板上从而实现将待电镀板夹持固定在基板与盖板之间，避免需要拆装螺丝以实现盖板固定的流程，大大降低了盖板的拆装时间，提升了电镀的效率，另一方面，同步驱动组件通过在下压抵接板上开设插接滑移槽并在插接滑移槽内设置旋转杆，并设置若干旋转杆之间通过连接杆实现连接，当盖板需要固定或打开时，通过将旋转杆对应插设在插接滑移槽内，随后拉动旋转杆即可带动同行或同列旋扣组件的下压抵接板同步旋转以实现盖板固定，进一步增加了盖板的拆装效率；
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Figure CN224799008U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroplating carrier technology, and in particular to a double-sided electroplating carrier. Background Technology
[0002] In the field of electroplating technology, double-sided electroplating racks are the core tooling for realizing simultaneous double-sided electroplating of product pieces. Their main function is to load the product pieces to be processed and immerse them in the electroplating solution, while connecting to an external power source through conductive components to provide a stable current to the product pieces to ensure the smooth progress of the electroplating process.
[0003] Existing double-sided electroplating carriers use screws to fix the carrier substrate and cover plate, and a sealing ring is used between the substrate and cover plate to seal them, thereby preventing electroplating solution from seeping into the carrier and affecting conductivity or damaging components. However, on the one hand, for larger product pieces, a large number of screws are required to ensure the assembly stability and sealing reliability of the substrate and cover plate, resulting in time-consuming and cumbersome disassembly and assembly operations, which seriously restricts the processing efficiency of the production line. On the other hand, the screws are prone to stripping during repeated disassembly and assembly. Once stripping occurs, it will not only damage the thread structure of the substrate or cover plate, but also prevent the carrier from sealing and fixing properly, thus requiring rework of the carrier or even scrapping it, significantly increasing production costs and reducing production continuity. Therefore, it is necessary to improve the existing electroplating carriers to solve this problem. Utility Model Content
[0004] The purpose of this invention is to provide a double-sided electroplating carrier, which has the advantages of reducing the difficulty of disassembling and assembling the carrier and improving the production efficiency of electroplating.
[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a double-sided electroplating carrier, including a substrate and a cover plate connected to the substrate, a plate to be electroplated is clamped and fixedly connected between the substrate and the cover plate, the substrate and the cover plate are respectively provided with a first conductive component and a second conductive component that are in communication with the back and front of the plate to be electroplated to realize current conduction, and a plurality of screw fastener components for pressing the cover plate onto the substrate are uniformly fixedly connected on the substrate.
[0006] The present invention is further configured such that: the first conductive component includes a first conductive groove formed on the substrate and a plurality of first conductive teeth fixedly connected in the first conductive groove; a first conductive post connected to the first conductive teeth is fixedly connected in the first conductive groove; a set of conductive copper plates is fixedly connected on the substrate; and the conductive copper plates and the first conductive posts are connected by wires to achieve current conduction.
[0007] The present invention is further configured such that: the second conductive component includes a second conductive groove formed on the cover plate and a plurality of second conductive teeth fixedly connected in the second conductive groove; a second conductive post for realizing conduction between adjacent second conductive teeth is fixedly connected in the second conductive groove; a conductive plug connected to the conductive copper plate is fixedly connected on the substrate; a conductive plate inserted into the conductive plug is fixedly connected in the second conductive groove; and the conductive plate is connected to the second conductive teeth.
[0008] The present invention is further configured such that: the first conductive tooth and the second conductive tooth have the same structure; the first conductive tooth includes a conductive tooth plate disposed in the first conductive groove and a locking plate fixedly connected to the first conductive groove for pressing and fixing the conductive tooth plate to the first conductive groove; the locking plate is evenly provided with a plurality of positioning and shaping grooves for positioning the conductive teeth on the conductive tooth plate; the conductive teeth on the conductive tooth plate are curved upward and extend beyond the upper surface of the locking plate; and a positioning block for positioning the plate to be electroplated is fixedly connected to the locking plate.
[0009] The present invention is further configured such that: at least two positioning pins for positioning the cover plate are fixedly connected on the substrate, and the cover plate is provided with positioning holes that cooperate with the positioning pins.
[0010] The present invention is further configured such that: a sealing groove is formed around the periphery of the second conductive groove on the substrate, and a sealing gasket is provided in the sealing groove for sealing between the substrate and the cover plate.
[0011] The present invention is further configured such that: the snap fastener assembly includes a stepped rotating mounting hole formed on the substrate and a stepped rotating shaft coaxially rotatably connected in the stepped rotating mounting hole; one end of the stepped rotating shaft away from the cover plate is fixedly connected to a limiting abutment piece abutting against the back of the substrate; the other end of the stepped rotating shaft is fixedly connected to a pressing abutment plate for pressing down against the front of the cover plate; and the limiting abutment piece is fixedly connected to the stepped rotating shaft based on a locking bolt.
[0012] The present invention is further configured such that at least two sealing rings are coaxially connected on the stepped rotating shaft.
[0013] The present invention is further configured such that: a plurality of the pressing abutment plates in the same row or column achieve synchronous rotation based on a synchronous drive component, the synchronous drive component includes an insertion sliding groove formed on the pressing abutment plate and a rotating rod inserted and connected in the insertion sliding groove, the plurality of rotating rods are connected based on a connecting rod, and the rotating rod is rotatably connected to the connecting rod.
[0014] In summary, this utility model has the following beneficial effects: 1. By uniformly fixing several swivel fasteners on the substrate and setting several downward pressing abutment plates in the same row or column to achieve synchronous movement based on a synchronous drive component, on the one hand, the swivel fasteners replace the traditional screw fixing structure. First, the positioning pins set on the substrate and the positioning holes on the cover plate are used to achieve quick positioning between the cover plate and the substrate. Then, by rotating the downward pressing abutment plates, the cover plate is pressed and fixed on the substrate, thereby clamping and fixing the plate to be electroplated between the substrate and the cover plate. This avoids the process of removing and installing screws to fix the cover plate, greatly reducing the disassembly and assembly time of the cover plate and improving the efficiency of electroplating. On the other hand, the synchronous drive component opens the insertion sliding groove on the downward pressing abutment plate and sets the rotating rod in the insertion sliding groove. Several rotating rods are connected by connecting rods. When the cover plate needs to be fixed or opened, the rotating rod is inserted into the insertion sliding groove, and then the rotating rod is pulled to drive the downward pressing abutment plates of the swivel fasteners in the same row or column to rotate synchronously to fix the cover plate, further increasing the disassembly and assembly efficiency of the cover plate. 2. The snap fastener assembly has stepped rotating mounting holes on the base plate and a stepped rotating shaft is set in the stepped rotating mounting holes. A limiting abutment piece is set at the end of the stepped rotating shaft away from the cover plate based on the locking bolt. When the snap fastener assembly is damaged, only the locking bolt needs to be removed to remove the limiting abutment piece, and the stepped rotating shaft can be removed from the base plate without replacing the whole assembly, which greatly reduces the maintenance cost. 3. By setting a first conductive component and a second conductive component on the substrate and cover plate respectively, the first conductive component provides power to the first conductive tooth by setting a first conductive tooth in the first conductive groove and setting a first conductive post that is connected to the conductive copper plate. The second conductive component provides power to the first conductive tooth by setting a second conductive tooth in the second conductive groove, and simultaneously fixing a conductive plug block connected to the conductive copper plate on the substrate, and setting a conductive plug plate inserted into the conductive plug block in the second conductive groove. The conductive copper plate is connected to an external power source, and the current passes through the conductive copper plate and then through the first conductive post to power the first conductive tooth. At the same time, the conductive plug plate is inserted into the conductive plug block to power the second conductive tooth. The first and second conductive teeth contact the back and back surfaces of the plate to be electroplated to power the plate and achieve electroplating. The first and second conductive teeth are designed with upward-curved conductive teeth to ensure that the conductive teeth can make close contact with the surface of the plate to be electroplated, avoiding poor contact that would affect the electroplating effect. At the same time, the positioning and shaping groove on the locking plate is used to position and calibrate the conductive teeth to ensure the consistency of electroplating quality. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall structure of this embodiment; Figure 2 yes Figure 1Enlarged schematic diagram of part A; Figure 3 This is an exploded view of the structure of the first conductive component in this embodiment; Figure 4 yes Figure 3 Enlarged diagram of part B; Figure 5 yes Figure 3 Enlarged schematic diagram of part C; Figure 6 This is an exploded view of the second conductive component in this embodiment; Figure 7 yes Figure 6 Enlarged schematic diagram of part D.
[0016] Reference numerals: 1. Substrate; 2. Cover plate; 3. Plate to be electroplated; 4. First conductive component; 41. First conductive groove; 42. First conductive tooth; 421. Conductive tooth plate; 422. Locking pressure plate; 423. Positioning and shaping groove; 424. Positioning block; 43. First conductive post; 44. Conductive copper plate; 5. Second conductive component; 51. Second conductive groove; 52. Second conductive tooth; 53. Second conductive post; 54. Conductive insert; 55. Conductive insert plate; 6. Thrust assembly; 61. Stepped rotating mounting hole; 62. Stepped rotating shaft; 63. Limiting abutment piece; 64. Lowering abutment plate; 65. Sealing ring; 7. Positioning pin; 8. Positioning hole; 9. Sealing groove; 10. Sealing gasket; 11. Synchronous drive assembly; 111. Insertion sliding groove; 112. Rotating rod; 113. Connecting rod. Detailed Implementation
[0017] The present invention will be further described in detail below with reference to the accompanying drawings.
[0018] Example: refer to Figures 1 to 7 A double-sided electroplating carrier includes a substrate 1 and a cover plate 2 connected to the substrate 1. A plate to be electroplated 3 is clamped and fixedly connected between the substrate 1 and the cover plate 2. At least two positioning pins 7 for positioning the cover plate 2 are fixedly connected on the substrate 1. Positioning holes 8 that cooperate with the positioning pins 7 are provided on the cover plate 2. The positioning pins 7 on the substrate 1 and the positioning holes 8 on the cover plate 2 are used to achieve rapid positioning between the cover plate 2 and the substrate 1. A first conductive component 4 and a second conductive component 5 are respectively provided in the substrate 1 and the cover plate 2 to conduct current through the back and front of the plate to be electroplated 3, respectively. A plurality of screw fasteners 6 for pressing the cover plate 2 onto the substrate 1 are uniformly fixedly connected on the substrate 1. The screw fasteners 6 are used to achieve rapid fixing of the cover plate 2, replacing the traditional screw fixing method and greatly increasing the efficiency of disassembly and assembly of the cover plate 2.
[0019] refer to Figures 3 to 7Specifically, the first conductive component 4 includes a first conductive groove 41 formed on the substrate 1 and a plurality of first conductive teeth 42 fixedly connected in the first conductive groove 41. A first conductive post 43 connected to the first conductive teeth 42 is fixedly connected in the first conductive groove 41. A set of conductive copper plates 44 is fixedly connected on the substrate 1. The conductive copper plates 44 and the first conductive posts 43 are connected by wires to achieve current conduction. The conductive copper plates 44 are connected to an external power source. Current flows through the conductive copper plates 44 and then through the first conductive posts 43 to power the first conductive teeth 42. The second conductive component 5 includes a second conductive groove 51 formed on the cover plate 2 and a plurality of second conductive teeth 52 fixedly connected in the second conductive groove 51. A second conductive post 53 is fixedly connected inside the second conductive groove 51 to enable electrical conduction between adjacent second conductive teeth 52. A conductive plug 54 connected to the conductive copper plate 44 is fixedly connected on the substrate 1. A conductive plug plate 55 is fixedly connected inside the second conductive groove 51 and inserted into the conductive plug 54. The conductive plug plate 55 is connected to the second conductive teeth 52. The conductive plug plate 55 is connected to the second conductive post 53 by a wire. The second conductive tooth 52 is powered through the second conductive post 53. The second conductive tooth 52 is powered through the conductive plug plate 55 inserted into the conductive plug 54. The first conductive tooth 42 and the second conductive tooth 52 are in contact with the back side and the back side of the plate to be electroplated, respectively, to power the plate to be electroplated and achieve electroplating. The first conductive tooth 42 and the second conductive tooth 52 have the same structure. The first conductive tooth 42 includes a conductive tooth plate 421 disposed in the first conductive groove 41 and a locking plate 422 locked and fixedly connected in the first conductive groove 41 for pressing and fixing the conductive tooth plate 421 in the first conductive groove 41. A plurality of positioning and shaping grooves 423 for positioning the conductive teeth on the conductive tooth plate 421 are evenly formed on the locking plate 422. The conductive teeth on the conductive tooth plate 421 are curved upward and extend beyond the upper surface of the locking plate 422. A positioning block 424 for positioning the plate to be electroplated 3 is fixedly connected to the locking plate 422. The first conductive tooth 42 and the second conductive tooth 52 are designed with upward-curved conductive teeth to ensure that the conductive teeth can make close contact with the surface of the plate to be electroplated 3, so as to avoid poor contact and affect the electroplating effect. At the same time, the positioning and shaping groove 423 on the locking plate 422 is used to calibrate the conductive teeth to ensure the consistency of electroplating quality. The positioning block 424 can ensure the positioning accuracy of the plate to be electroplated 3 and ensure the consistency of electroplating effect.
[0020] refer to Figure 3 Specifically, a sealing groove 9 is formed around the periphery of the second conductive groove 51 on the substrate 1. A sealing gasket 10 is provided in the sealing groove 9 to achieve a seal between the substrate 1 and the cover plate 2. By setting the sealing gasket 10, the electroplating solution is isolated, preventing the electroplating solution from seeping into the interior of the carrier and damaging the conductive components, thus extending the service life.
[0021] refer to Figure 3 Specifically, the snap fastener assembly 6 includes a stepped rotating mounting hole 61 formed on the base plate 1 and a stepped rotating shaft 62 coaxially rotatably connected within the stepped rotating mounting hole 61. A limiting abutment piece 63 is fixedly connected to one end of the stepped rotating shaft 62 away from the cover plate 2, abutting against the back of the base plate 1. A pressing abutment plate 64 for pressing down against the front of the cover plate 2 is fixedly connected to the other end of the stepped rotating shaft 62. The limiting abutment piece 63 is fixedly connected to the stepped rotating shaft 62 by a locking bolt. The snap fastener assembly 6 achieves this by forming a stepped rotating mounting hole 61 on the base plate 1 and setting a stepped rotating shaft 62 within the stepped rotating mounting hole 61. A limiting abutment piece 63 is set at the end of the stepped rotating shaft 62 away from the cover plate 2 based on the locking bolt. By rotating and pressing down the abutment piece 64, the cover plate 2 is pressed and fixed on the base plate 1 to achieve the fixation of the cover plate 2. When the buckle assembly 6 is damaged, only the locking bolt needs to be removed to remove the limiting abutment piece 63 to remove the stepped rotating shaft 62 from the base plate 1. There is no need to replace the whole structure, which greatly reduces the maintenance cost. At least two sealing rings 65 are coaxially sleeved and connected on the stepped rotating shaft 62. By setting the sealing rings 65, the electroplating liquid can be prevented from seeping into the stepped rotating mounting hole 61 to avoid corrosion of the stepped rotating shaft 62.
[0022] refer to Figures 1 to 2 Specifically, several downward pressing abutment plates 64 in the same row or column rotate synchronously based on a synchronous drive assembly 11. The synchronous drive assembly 11 includes an insertion sliding groove 111 opened on the downward pressing abutment plate 64 and a rotating rod 112 inserted and connected in the insertion sliding groove 111. Several rotating rods 112 are connected based on a connecting rod 113. The rotating rod 112 is rotatably connected to the connecting rod 113. When the cover plate 2 needs to be fixed or opened, the rotating rod 112 is inserted into the insertion sliding groove 111, and then the rotating rod 112 is pulled to drive the downward pressing abutment plates 64 of the same row or column of rotary fastener assembly 6 to rotate synchronously to fix the cover plate 2, which further increases the efficiency of disassembly and assembly of the cover plate 2. After the rotation is completed, the synchronous rotation assembly can be pulled out from the insertion sliding groove 111 to achieve disassembly. In order to improve versatility, the spacing between the rotary fastener assemblies 6 in the same row or column is equal.
[0023] Brief description of the usage process: First, the positioning pin 7 set on the substrate 1 and the positioning hole 8 on the cover plate 2 are used to quickly position the cover plate 2 and the substrate 1. Then, by rotating the pressing down abutment plate 64, the cover plate 2 is pressed and fixed on the substrate 1, thereby clamping and fixing the plate to be electroplated 3 between the substrate 1 and the cover plate 2, avoiding the need to remove and install screws to fix the cover plate 2. When the cover plate 2 needs to be fixed or opened, the rotating rod 112 is inserted into the corresponding insertion sliding groove 111. Then, pulling the rotating rod 112 will drive the pressing down abutment plate 64 of the same row or column of the rotating buckle assembly 6 to rotate synchronously to fix the cover plate 2. Then, the entire carrier is immersed in the electroplating solution, and the first conductive component 4 and the second conductive component 5 are used to supply power to the plate to be electroplated to achieve electroplating of the plate to be electroplated 3.
[0024] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment that make creative contributions as needed, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.
Claims
1. A double-sided electroplating carrier, characterized in that, The system includes a substrate (1) and a cover plate (2) connected to the substrate (1). The plate to be electroplated (3) is clamped and fixedly connected between the substrate (1) and the cover plate (2). The substrate (1) and the cover plate (2) are respectively provided with a first conductive component (4) and a second conductive component (5) that are connected to the back and front of the plate to be electroplated (3) to realize current conduction. A plurality of screw fastener components (6) for pressing the cover plate (2) onto the substrate (1) are uniformly fixedly connected on the substrate (1).
2. The double-sided electroplating carrier according to claim 1, characterized in that, The first conductive component (4) includes a first conductive groove (41) formed on the substrate (1) and a plurality of first conductive teeth (42) fixedly connected in the first conductive groove (41). A first conductive post (43) connected to the first conductive teeth (42) is fixedly connected in the first conductive groove (41). A set of conductive copper plates (44) is fixedly connected on the substrate (1). The conductive copper plates (44) and the first conductive posts (43) are connected by wires to realize current conduction.
3. A double-sided electroplating carrier according to claim 2, characterized in that, The second conductive component (5) includes a second conductive groove (51) formed on the cover plate (2) and a plurality of second conductive teeth (52) fixedly connected in the second conductive groove (51). A second conductive post (53) for realizing the conduction between adjacent second conductive teeth (52) is fixedly connected in the second conductive groove (51). A conductive plug (54) connected to the conductive copper plate (44) is fixedly connected on the substrate (1). A conductive plug plate (55) inserted into the conductive plug plate (54) is fixedly connected in the second conductive groove (51). The conductive plug plate (55) is connected to the second conductive teeth (52).
4. A double-sided electroplating carrier according to claim 3, characterized in that, The first conductive tooth (42) and the second conductive tooth (52) have the same structure. The first conductive tooth (42) includes a conductive tooth plate (421) disposed in the first conductive groove (41) and a locking plate (422) fixedly connected in the first conductive groove (41) for pressing and fixing the conductive tooth plate (421) in the first conductive groove (41). The locking plate (422) has a plurality of positioning and shaping grooves (423) evenly opened on it for positioning the conductive teeth on the conductive tooth plate (421). The conductive teeth on the conductive tooth plate (421) are raised upward and extend beyond the upper surface of the locking plate (422). The locking plate (422) is fixedly connected with a positioning block (424) for positioning the plate to be electroplated (3).
5. A double-sided electroplating carrier according to claim 1, characterized in that, At least two positioning pins (7) for positioning the cover plate (2) are fixedly connected on the substrate (1), and the cover plate (2) is provided with positioning holes (8) that cooperate with the positioning pins (7).
6. A double-sided electroplating carrier according to claim 3, characterized in that, The substrate (1) has a sealing groove (9) around the periphery of the second conductive groove (51), and a sealing gasket (10) is provided in the sealing groove (9) for sealing between the substrate (1) and the cover plate (2).
7. A double-sided electroplating carrier according to claim 1, characterized in that, The swivel assembly (6) includes a stepped rotating mounting hole (61) opened on the substrate (1) and a stepped rotating shaft (62) rotatably connected to the stepped rotating mounting hole (61) on the same axis. One end of the stepped rotating shaft (62) away from the cover plate (2) is fixedly connected to a limiting abutment piece (63) that abuts against the back of the substrate (1). The other end of the stepped rotating shaft (62) is fixedly connected to a pressing abutment plate (64) for pressing down against the front of the cover plate (2). The limiting abutment piece (63) is fixedly connected to the stepped rotating shaft (62) based on a locking bolt.
8. A double-sided electroplating carrier according to claim 7, characterized in that, At least two sealing rings (65) are coaxially connected on the stepped rotating shaft (62).
9. A double-sided electroplating carrier according to claim 7, characterized in that, The several pressing abutment plates (64) in the same row or column rotate synchronously based on a synchronous drive assembly (11). The synchronous drive assembly (11) includes an insertion sliding groove (111) opened on the pressing abutment plate (64) and a rotating rod (112) inserted and connected in the insertion sliding groove (111). The several rotating rods (112) are connected based on a connecting rod (113). The rotating rod (112) is rotatably connected to the connecting rod (113).