Semiconductor clean room ultra-low liquid level trench drainage device

Abstract

The utility model relates to the technical field of super low liquid level ditch drainage, and disclose a kind of semiconductor clean room with super low liquid level ditch drainage device, including protective cover, the liquid level meter is fixedly connected in protective cover front, the mounting plate is fixedly connected in protective cover bottom, the pressure relief pipe is fixedly connected in protective cover right side, the cover plate is provided in protective cover top, the horn mouth water inlet frame is inserted in the mounting plate bottom, the submersible pump is fixedly connected in the cover plate bottom, the limit installation mechanism is set outside the mounting plate, the auxiliary pressure relief mechanism is set in the pressure relief pipe, in use process, by screw rod rotation, it is convenient to realize the adjustment mounting block position, by bolt rotation, it is convenient to realize the adjustment pressing frame position, to realize the installation and disassembly between horn mouth water inlet frame and mounting plate, by sealing block work, it is convenient to realize sealing block sliding in pressure relief pipe interior, satisfy to the pressure relief of pressure relief pipe interior.

Description

Technical Field

[0001] This utility model relates to the field of ultra-low liquid level drainage technology, specifically an ultra-low liquid level drainage device for semiconductor cleanrooms. Background Technology

[0002] Cleanrooms are specially designed rooms designed to remove airborne pollutants such as dust particles, harmful air, and bacteria from a defined space, and to control indoor temperature, humidity, cleanliness, pressure, airflow speed and distribution, noise and vibration, and static electricity from lighting within a specific range. They are commonly used in the semiconductor manufacturing industry.

[0003] In existing technologies, when submersible pumps are commonly used to treat wastewater in semiconductor cleanrooms, the outdoor drainage ditches are relatively shallow, so it is necessary to dig a wastewater pool (with a certain depth requirement) nearby to collect the wastewater through the drainage ditches and place the submersible pump in it for wastewater extraction. Due to the size requirements of the operating environment, it is not feasible to use deep pits in different semiconductor cleanrooms. At the same time, when the liquid level is low, the submersible pump will burn out the motor if it operates without water. Therefore, it is necessary to improve the technology by developing an ultra-low liquid level drainage device for semiconductor cleanrooms to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model employs a limiting installation mechanism that allows for adjustment of the mounting block position during use. This enables the limiting installation of different models of negative pressure suction connecting pipes and allows for adjustment of the clamping frame position. This facilitates the installation and removal of the flared inlet water frame and the mounting plate, ensuring a seal while facilitating subsequent cleaning operations. Furthermore, an auxiliary pressure relief mechanism allows the sealing block to slide inside the pressure relief pipe during use, ensuring pressure relief within the pipe and preventing excessive negative pressure inside the protective cover from drawing water into the external negative pressure suction device and affecting its operation.

[0005] By adopting the above technical solution, the purpose of this utility model is to provide an ultra-low liquid level drainage device for semiconductor cleanrooms, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an ultra-low liquid level drainage device for semiconductor cleanrooms, comprising a protective cover, a liquid level gauge fixedly connected to the front of the protective cover, an installation plate fixedly connected to the bottom of the protective cover, a pressure relief pipe fixedly connected to the right side of the protective cover, a cover plate provided on the top of the protective cover, a flared water inlet frame inserted into the bottom of the installation plate, a submersible pump fixedly connected to the bottom of the cover plate, a limit installation mechanism provided on the outside of the installation plate, and an auxiliary pressure relief mechanism provided inside the pressure relief pipe; The limiting installation mechanism includes an adjusting installation component and a limiting component. The adjusting installation component is located on the top of the cover plate, and the limiting component is located outside the installation plate.

[0007] Preferably, the adjustment and installation assembly includes a connecting flange, which is fixedly connected to the top of the cover plate. A connecting platform is fixedly connected inside the connecting flange, and a threaded rod is rotatably connected inside the connecting platform. A limit rod is fixedly connected inside the connecting platform, and an installation block is slidably connected to the outside of the limit rod, so as to facilitate the adjustment of the position of the installation block, thereby satisfying the limit installation of different models of negative pressure suction connection pipes.

[0008] Preferably, the mounting block is threadedly connected to the threaded rod, and the mounting block is slidably connected to the connecting table, which facilitates a more stable adjustment process.

[0009] Preferably, the limiting component includes a mounting frame, which is fixedly connected to the outside of the mounting plate. A support plate is fixedly connected to the bottom of the mounting frame. A clamping frame is rotatably connected to the outside of the support plate. A connecting rod is rotatably connected inside the clamping frame. A connecting frame is slidably connected inside the mounting frame. A support frame is fixedly connected to the top of the mounting frame. Bolts are threaded inside the support frame to facilitate adjustment of the clamping frame position, thereby enabling the installation and disassembly of the flared inlet water frame and the mounting plate, satisfying the sealing requirements while facilitating subsequent cleaning operations by staff.

[0010] Preferably, the bolt is rotatably connected to the connecting frame, and the connecting rod is rotatably connected to the connecting frame, which facilitates a more stable installation process.

[0011] Preferably, the auxiliary pressure relief mechanism includes a first fixing ring, which is fixedly connected inside the pressure relief pipe. A second fixing ring is fixedly connected inside the pressure relief pipe. A spring is fixedly connected to the right side of the second fixing ring, and a sealing block is fixedly connected to the right side of the spring. This facilitates the sliding of the sealing block inside the pressure relief pipe, allowing for pressure relief inside the pipe and preventing excessive negative pressure inside the protective cover, which could draw water into the external negative pressure suction device and affect its use.

[0012] Preferably, the sealing block contacts the first fixing ring, and the pressure relief pipe has a groove at the corresponding position of the sealing block, and the sealing block is slidably connected inside the groove, which facilitates more stable use.

[0013] Compared with the prior art, this utility model provides an ultra-low liquid level drainage trench device for semiconductor cleanrooms, which has the following beneficial effects: 1. This ultra-low liquid level drainage device for semiconductor cleanrooms, through its set limiting installation mechanism, allows for easy adjustment of the installation block position by rotating the threaded rod in conjunction with the limiting rod during use. This enables the limiting installation of different models of negative pressure suction connection pipes. By rotating the set bolts, the connecting frame slides inside the installation frame, facilitating the adjustment of the clamping frame position. This allows for the installation and disassembly of the flared water inlet frame and the installation plate, ensuring a seal while facilitating subsequent cleaning operations by staff.

[0014] 2. The ultra-low liquid level drainage device for this semiconductor cleanroom, through the auxiliary pressure relief mechanism, allows the sealing block to slide inside the pressure relief pipe during use, in conjunction with a spring. This facilitates pressure relief inside the pipe and prevents excessive negative pressure inside the protective cover from drawing water into the external negative pressure suction device, thus affecting its operation. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Figure 1 This is a schematic diagram of the front structure of this utility model; Figure 2 This is a schematic cross-sectional view of the present invention. Figure 3 This is a schematic diagram of the adjustment and installation component structure of this utility model; Figure 4 This is a schematic diagram of the internal structure of the adjustment and installation component of this utility model; Figure 5 This is a schematic diagram of the limiting component structure of this utility model; Figure 6 This is a schematic diagram of the internal structure of the limiting component of this utility model; Figure 7 This is a schematic diagram of the auxiliary pressure relief mechanism of this utility model.

[0016] In the diagram: 1. Protective cover; 2. Level gauge; 3. Mounting plate; 4. Pressure relief pipe; 5. Cover plate; 6. Trumpet-shaped water inlet frame; 7. Submersible pump; 8. Limiting installation mechanism; 81. Adjusting installation assembly; 811. Connecting flange; 812. Connecting platform; 813. Threaded rod; 814. Mounting block; 815. Limiting rod; 82. Limiting assembly; 821. Mounting frame; 822. Support plate; 823. Clamping frame; 824. Connecting rod; 825. Connecting frame; 826. Support frame; 827. Bolt; 9. Auxiliary pressure relief mechanism; 91. First fixing ring; 92. Second fixing ring; 93. Spring; 94. Sealing block. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0019] Example 1: Please see Figure 1-6 This utility model provides a technical solution: an ultra-low liquid level drainage device for semiconductor cleanrooms, including a protective cover 1, a liquid level gauge 2 fixedly connected to the front of the protective cover 1, an installation plate 3 fixedly connected to the bottom of the protective cover 1, a pressure relief pipe 4 fixedly connected to the right side of the protective cover 1, a cover plate 5 provided on the top of the protective cover 1, a flared water inlet frame 6 inserted into the bottom of the installation plate 3, a submersible pump 7 fixedly connected to the bottom of the cover plate 5, a limit installation mechanism 8 provided on the outside of the installation plate 3, and an auxiliary pressure relief mechanism 9 provided inside the pressure relief pipe 4; The limiting installation mechanism 8 includes an adjusting installation component 81 and a limiting component 82. The adjusting installation component 81 is located on the top of the cover plate 5, and the limiting component 82 is located outside the mounting plate 3.

[0020] Furthermore, the adjustment and installation assembly 81 includes a connecting flange 811, which is fixedly connected to the top of the cover plate 5. A connecting platform 812 is fixedly connected inside the connecting flange 811. A threaded rod 813 is rotatably connected inside the connecting platform 812. A limit rod 815 is fixedly connected inside the connecting platform 812. An installation block 814 is slidably connected to the outside of the limit rod 815, which facilitates the adjustment of the position of the installation block 814, thereby satisfying the limit installation of different models of negative pressure suction connection pipes.

[0021] Furthermore, the mounting block 814 is threadedly connected to the threaded rod 813, and the mounting block 814 is slidably connected to the connecting table 812, which facilitates a more stable adjustment process.

[0022] Furthermore, the limiting component 82 includes a mounting frame 821, which is fixedly connected to the outside of the mounting plate 3. A support plate 822 is fixedly connected to the bottom of the mounting frame 821. A clamping frame 823 is rotatably connected to the outside of the support plate 822. A connecting rod 824 is rotatably connected inside the clamping frame 823. A connecting frame 825 is slidably connected inside the mounting frame 821. A support frame 826 is fixedly connected to the top of the mounting frame 821. Bolts 827 are threaded inside the support frame 826 to facilitate the adjustment of the position of the clamping frame 823, thereby realizing the installation and disassembly between the flared inlet water inlet frame 6 and the mounting plate 3, satisfying the sealing requirements while facilitating subsequent cleaning operations by staff.

[0023] Furthermore, bolt 827 is rotatably connected to connecting bracket 825, and connecting rod 824 is rotatably connected to connecting bracket 825, which facilitates a more stable installation process.

[0024] During use, the limiting installation mechanism 8 rotates via the threaded rod 813, which, in conjunction with the limiting rod 815, causes the mounting block 814 to move. Then, the locking bolt completes the limiting installation of the mounting block 814 and the external negative pressure suction connection pipe. Next, the bolt 827 is rotated, causing the connecting frame 825 to slide inside the mounting frame 821. In conjunction with the connecting rod 824, the clamping frame 823 rotates outside the support plate 822. Finally, the flared inlet frame 6 is inserted into the mounting plate 3, thereby enabling the installation and disassembly of the flared inlet frame 6 and the mounting plate 3 by contacting the clamping frame 823 with the flared inlet frame 6.

[0025] Example 2: Based on Example 1, please refer to Figure 7Furthermore, in conjunction with Embodiment 1, the auxiliary pressure relief mechanism 9 includes a first fixing ring 91, which is fixedly connected inside the pressure relief pipe 4. A second fixing ring 92 is fixedly connected inside the pressure relief pipe 4. A spring 93 is fixedly connected to the right side of the second fixing ring 92, and a sealing block 94 is fixedly connected to the right side of the spring 93. This facilitates the sliding of the sealing block 94 inside the pressure relief pipe 4, thereby allowing pressure relief inside the pressure relief pipe 4 and preventing excessive negative pressure inside the protective cover 1, which could draw water into the external negative pressure suction device and affect its use.

[0026] Furthermore, the sealing block 94 contacts the first fixing ring 91, and the pressure relief pipe 4 has a groove at the corresponding position of the sealing block 94, and the sealing block 94 is slidably connected inside the groove, which facilitates a more stable operation.

[0027] During use, the auxiliary pressure relief mechanism 9 works by using the sealing block 94, which, in conjunction with the spring 93, allows the sealing block 94 to slide inside the pressure relief pipe 4, thus relieving pressure inside the pressure relief pipe 4.

[0028] In actual operation, when this device is used, the threaded rod is a T-shaped threaded rod, which has self-locking properties. The operator places the device in the trench of the semiconductor cleanroom, and then adjusts it according to the model of the external negative pressure suction connection pipe. The operator uses a hex wrench and other tools to turn the threaded rod 813. The rotation of the threaded rod 813, in conjunction with the limit rod 815, causes the mounting block 814 to move. Then, the locking bolt is used to complete the limit installation of the mounting block 814 and the external negative pressure suction connection pipe. Next, the bolt 827 is turned. The rotation of the bolt 827 causes the connecting frame 825 to slide inside the mounting frame 821. In conjunction with the connecting rod 824, the clamping frame 823 rotates outside the support plate 822. Then, the flared water inlet frame 6 is inserted into the mounting plate 3. The clamping frame 823 contacts the flared water inlet frame 6, realizing the installation and disassembly between the flared water inlet frame 6 and the mounting plate 3. This satisfies the sealing requirements and facilitates subsequent cleaning operations. The design facilitates the adjustment of the clamping frame 823, enabling the installation and removal of the flared inlet water frame 6 and the mounting plate 3. This ensures sealing while facilitating subsequent cleaning operations. During the pumping process, an external negative pressure suction device first creates a vacuum inside the protective cover 1. Under atmospheric pressure, the liquid level inside the pressure relief pipe 4 rises until it surpasses the inlet water level of the submersible pump 7. At this point, the external negative pressure suction device stops working, and the submersible pump 7 operates to drain water from the semiconductor cleanroom trench. Under the siphon principle, ultra-low liquid levels are drained. The level gauge 2 detects the liquid level inside the pressure relief pipe 4. During the negative pressure process, when the pressure inside the pressure relief pipe 4 is too low, the sealing block 94 operates in conjunction with the spring 93, allowing the sealing block 94 to slide inside the pressure relief pipe 4. This releases pressure inside the pressure relief pipe 4, preventing excessive negative pressure inside the protective cover 1 from drawing water into the external negative pressure suction device and affecting its use.

[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A low-level drainage trench device for semiconductor cleanrooms, comprising a protective cover (1), characterized in that: A level gauge (2) is fixedly connected to the front of the protective cover (1), a mounting plate (3) is fixedly connected to the bottom of the protective cover (1), a pressure relief pipe (4) is fixedly connected to the right side of the protective cover (1), a cover plate (5) is provided on the top of the protective cover (1), a flared water inlet frame (6) is inserted into the bottom of the mounting plate (3), a submersible pump (7) is fixedly connected to the bottom of the cover plate (5), a limit installation mechanism (8) is provided on the outside of the mounting plate (3), and an auxiliary pressure relief mechanism (9) is provided inside the pressure relief pipe (4). The limiting installation mechanism (8) includes an adjusting installation component (81) and a limiting component (82). The adjusting installation component (81) is located on the top of the cover plate (5), and the limiting component (82) is located outside the mounting plate (3).

2. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 1, characterized in that: The adjustment and installation assembly (81) includes a connecting flange (811), which is fixedly connected to the top of the cover plate (5). A connecting platform (812) is fixedly connected inside the connecting flange (811). A threaded rod (813) is rotatably connected inside the connecting platform (812). A limit rod (815) is fixedly connected inside the connecting platform (812). An installation block (814) is slidably connected to the outside of the limit rod (815).

3. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 2, characterized in that: The mounting block (814) is threadedly connected to the threaded rod (813), and the mounting block (814) is slidably connected to the connecting platform (812).

4. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 1, characterized in that: The limiting component (82) includes a mounting frame (821), which is fixedly connected to the outside of the mounting plate (3). A support plate (822) is fixedly connected to the bottom of the mounting frame (821). A clamping frame (823) is rotatably connected to the outside of the support plate (822). A connecting rod (824) is rotatably connected inside the clamping frame (823). A connecting frame (825) is slidably connected inside the mounting frame (821). A support frame (826) is fixedly connected to the top of the mounting frame (821). A bolt (827) is threaded inside the support frame (826).

5. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 4, characterized in that: The bolt (827) is rotatably connected to the connecting frame (825), and the connecting rod (824) is rotatably connected to the connecting frame (825).

6. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 1, characterized in that: The auxiliary pressure relief mechanism (9) includes a first fixing ring (91), which is fixedly connected inside the pressure relief pipe (4). A second fixing ring (92) is fixedly connected inside the pressure relief pipe (4). A spring (93) is fixedly connected to the right side of the second fixing ring (92), and a sealing block (94) is fixedly connected to the right side of the spring (93).

7. The ultra-low liquid level drainage device for semiconductor cleanrooms according to claim 6, characterized in that: The sealing block (94) is in contact with the first fixing ring (91), and the pressure relief pipe (4) is provided with a groove at the corresponding position of the sealing block (94), and the sealing block (94) is slidably connected inside the groove.

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