A sealed door plate of a wafer transfer passage

Abstract

The utility model relates to the technical field of semiconductor manufacturing equipment discloses a sealing door plate of wafer transmission channel, including sealing door plate and installation frame, sealing door plate top is rotatoryly installed in the inboard of installation frame through hinged member, and installation frame is installed between the interface flange of cavity and transmission channel, the inboard sealing installation of installation frame top plate has the equipment box, and the inside installation of equipment box has drive mechanism, drive mechanism adopts connecting rod structure, and drive source is cylinder, and drive mechanism is connected with sealing door plate, is used for controlling the opening and closing of sealing door plate. The utility model has the advantages compared with prior art: drive mechanism is integrated in the equipment box, and through the cooperation of connecting rod, limiting frame body and positioning center shaft, the stable opening and closing of sealing door plate are realized, the compact overall structural layout occupies small, is convenient for installing and maintaining in semiconductor equipment.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, specifically to a sealing door plate for a wafer transport channel. Background Technology

[0002] In semiconductor manufacturing processes, such as thin film deposition and etching, operations typically require high vacuum or specific inert gas atmospheres. During wafer transport, the wafer passes through multiple cavities. The interface components between these cavities and the external environment must possess excellent sealing performance to prevent external air, moisture, or impurities from entering the cavities, while also preventing process gases from leaking into the external environment. Existing sealing gates suffer from problems such as incomplete sealing, slow response speed, and insufficient pressure balance during opening and closing, which can easily lead to wafer contamination, process gas leakage, or cavity pressure fluctuations, affecting process stability and product yield.

[0003] To address the aforementioned technical problems, this application proposes a sealing door panel with a reasonable structure, excellent sealing performance, rapid response, and pressure balancing function. Utility Model Content

[0004] I. Technical problems to be solved

[0005] The technical problem to be solved by this utility model is that the sealing door panel has problems such as poor sealing, slow response speed and insufficient pressure balance during the opening and closing process.

[0006] II. Technical Solution

[0007] To solve the above-mentioned technical problems, the technical solution provided by this utility model is: a sealing door plate for a wafer transmission channel, including a sealing door plate and a mounting frame, wherein the top of the sealing door plate is rotatably mounted inside the mounting frame via a hinge, and the mounting frame is installed between the cavity and the interface flange of the transmission channel;

[0008] An equipment box is sealed and installed inside the top plate of the mounting frame. A drive mechanism is installed inside the equipment box. The drive mechanism adopts a linkage structure and the drive source is a cylinder. The drive mechanism is connected to the sealing door panel and is used to control the opening and closing of the sealing door panel.

[0009] As an improvement, the driving mechanism includes a connecting rod and a limiting frame. The limiting frame comprises two sets and is fixedly installed on the outside of the sealing door panel. Limiting rods that slide inside the limiting frame are respectively installed on both sides of the lower end of the connecting rod. The cylinder is fixedly installed inside the equipment box, and a connecting ear is installed on the protruding end. The top of the connecting rod is rotatably connected to the connecting ear.

[0010] As an improvement, the drive mechanism also includes a positioning center shaft. The bottom of the equipment box is provided with a through hole through which the connecting rod swings. The positioning center shaft is fixedly installed inside the through hole. The middle part of the connecting rod is provided with a slide rail through which the positioning center shaft slides.

[0011] As an improvement, the positioning center axis is in contact with the inside of the slide, and the limiting rod is in contact with the inner wall of the limiting frame.

[0012] As an improvement, a storage groove for storing the connecting rod is provided on the outer side of the sealing door panel and between the two sets of limiting frames.

[0013] As an improvement, mounting strips are installed on both sides of the equipment box. The mounting strips are connected to the mounting frame by bolts, and a sealing gasket is provided between them.

[0014] As an improvement, a sealing assembly is provided between the sealing door panel and the mounting frame. The sealing assembly is a double-layer sealing structure, including a main sealing ring and an auxiliary sealing ring. The main sealing ring is used to achieve normal sealing, and the auxiliary sealing ring enhances the sealing effect under high pressure differential environment.

[0015] III. Beneficial Effects

[0016] The advantages of this utility model compared with the prior art are as follows:

[0017] 1. The drive mechanism is integrated into the equipment box. Through the cooperation of the connecting rod, the limiting frame and the positioning center shaft, the sealing door panel can be opened and closed smoothly. The cylinder is used as the drive source. With the cooperation of the connecting rod and the limiting structure, the door panel is subjected to uniform force and the movement trajectory is controllable during the opening and closing process. This effectively avoids poor sealing or component wear caused by vibration or uneven load. The overall structure is compact and occupies little space, which is convenient for installation and maintenance in semiconductor equipment.

[0018] 2. The integral sealed door panel connects to the cavity and transmission channel through the mounting frame, which facilitates standardized design and modular replacement, and is suitable for the interface sealing requirements of various semiconductor process cavities. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of a sealing door plate for a wafer transmission channel according to this utility model.

[0020] Figure 2 This is a schematic diagram of the cavity side structure of a sealing door plate for a wafer transmission channel according to this utility model.

[0021] Figure 3 This is a schematic diagram of the transmission channel structure of a sealing door plate for a wafer transmission channel according to this utility model.

[0022] Figure 4This is a schematic diagram of the sealing door structure of a wafer transmission channel according to this utility model.

[0023] Figure 5 This is a schematic diagram of the connecting rod structure of a sealing door plate for a wafer transmission channel according to this utility model.

[0024] Figure 6 This is a schematic diagram of the inner structure of the mounting frame of a sealing door panel for a wafer transmission channel according to this utility model.

[0025] As shown in the figure: 1. Sealing door panel; 2. Mounting frame; 3. Equipment box; 4. Mounting strip; 5. Cylinder; 6. Connecting ear; 7. Connecting rod; 8. Through hole; 9. Positioning center shaft; 10. Slide rail; 11. Limiting rod; 12. Storage slot; 13. Limiting frame. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0027] Example 1

[0028] As attached Figure 1 and attached Figure 2 As shown, a sealing door panel for a wafer transfer channel includes a sealing door panel 1 and a mounting frame 2. The top of the sealing door panel 1 is rotatably mounted on the inner side of the mounting frame 2 via a hinge, realizing the pivotal movement of the door panel and providing a stable rotation center for opening and closing actions. The mounting frame 2 is installed between the cavity and the interface flange of the transfer channel, ensuring the rigid connection and accurate positioning of the module and the main equipment.

[0029] The equipment box 3 is sealed and installed inside the top plate of the mounting frame 2. The equipment box 3 is equipped with a drive mechanism. The drive mechanism adopts a linkage structure and the drive source is a cylinder 5. Its advantage is that it can provide stable and fast linear thrust and respond quickly. It is particularly suitable for semiconductor equipment scenarios that require high-frequency opening and closing. The drive mechanism is connected to the sealing door plate 1 and is used to control the opening and closing of the sealing door plate 1.

[0030] As attached Figure 2 Appendix Figure 3 Appendix Figure 4 Appendix Figure 5 and attached Figure 6The drive mechanism shown includes a connecting rod 7, a positioning center shaft 9, and a limiting frame 13. The limiting frame 13 comprises two sets and is fixedly installed on the outside of the sealing door panel 1. Limiting rods 11 that slide inside the limiting frame 13 are respectively installed on both sides of the lower end of the connecting rod 7. The limiting rods 11 are in contact with the inner wall of the limiting frame 13. This sliding pair connection ensures that the force transmission is smooth and without impact. The outer side of the sealing door panel 1 and located between the two sets of limiting frames 13 are provided with a storage groove 12 for storing the connecting rod 7. This structure ensures that the connecting rod 7 can be partially embedded in it when the door panel is fully opened, thereby minimizing the structural space occupation and providing a wide channel for wafer transmission.

[0031] The cylinder 5 is fixedly installed inside the equipment box 3, and a connecting lug 6 is installed at its extended end. The top of the connecting rod 7 is rotatably connected to the connecting lug 6. The bottom of the equipment box 3 is provided with a through hole 8 through which the connecting rod 7 swings. The through hole 8 is precisely designed to allow the connecting rod 7 to swing freely while minimizing gaps. The positioning center shaft 9 is fixedly installed inside the through hole 8. The middle part of the connecting rod 7 is provided with a slide rail 10 through which the positioning center shaft 9 slides. The positioning center shaft 9 is in contact with the inside of the slide rail 10. The cooperation between the positioning center shaft 9 and the slide rail 10 constitutes the motion core and core guiding constraint of the entire drive mechanism.

[0032] Example 2

[0033] Based on Example 1, in order to ensure a sealing effect, as shown in the attached... Figure 1 and attached Figure 4 As shown, mounting strips 4 are installed on both sides of the equipment box 3. The mounting strips 4 are connected to the mounting frame 2 by bolts, and a sealing gasket is provided between them.

[0034] A sealing assembly is provided between the sealing door panel 1 and the mounting frame 2. The sealing assembly is a double-layer sealing structure, including a main sealing ring and an auxiliary sealing ring. The main sealing ring is used to achieve normal sealing, and the auxiliary sealing ring enhances the sealing effect under high pressure differential environment.

[0035] The specific usage method is as follows:

[0036] The sealing door panel 1 is initially in a closed state, and the sealing components on it are pressed against the sealing surface of the mounting frame 2 to form a highly airtight seal, isolating the cavity from the transmission channel.

[0037] When wafer transfer is required, the control system first confirms that the pressure between the cavity and the transfer channel has reached equilibrium. Then, it sends an opening signal to the cylinder 5, which is fixedly installed inside the equipment housing 3. The piston rod of the cylinder 5 retracts, pushing the connecting lug 6 at its end to move laterally. The connecting lug 6 drives the connecting rod 7, which is rotatably connected to it, to move laterally. Because the slide rail 10 in the middle of the connecting rod 7 slides in cooperation with the positioning center shaft 9 fixedly installed inside the through hole 8, the movement trajectory of the connecting rod 7 is precisely constrained, causing it to swing outwards. The two limiting rods 11 at the lower end of the connecting rod 7 slide inside the limiting frame 13 fixedly installed on the outside of the sealing door plate 1. This sliding action is converted into a pulling force on the sealing door plate 1, forcing the sealing door plate 1 to rotate and open towards the cavity around its top hinge point.

[0038] In the final stage of the opening process, the lower part of the connecting rod 7 is retracted into the storage slot 12 on the sealing door panel 1 to achieve maximum opening space and provide an unobstructed passage for wafer transfer. The robotic arm transfers the wafer through the opened channel in the mounting frame 2 between the transfer channel and the cavity.

[0039] After the wafer transfer is completed, the piston rod of the cylinder 5 extends and pulls the connecting rod 7 in the opposite direction through the connecting lug 6. The connecting rod 7 swings in the opposite direction under the guidance of the positioning center shaft 9, and the limiting rod 11 at its lower end slides in the limiting frame 13, pushing the sealing door plate 1 to rotate inward around the hinge point and close.

[0040] As the sealing door 1 approaches the closed position, the cylinder 5 continuously provides sufficient closing force to ensure that the sealing door 1 is ultimately pressed tightly against the mounting frame 2, thereby fully compressing the main sealing ring and auxiliary sealing ring of the sealing assembly and achieving a high airtightness seal of the cavity. After the sealing door 1 is closed and sealed, the cavity can begin or continue operations such as vacuuming and filling with process gases to enter the next semiconductor process cycle.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0043] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A sealing door plate for a wafer transfer channel, comprising a sealing door plate (1) and a mounting frame (2), characterized in that: The top of the sealing door panel (1) is rotatably mounted inside the mounting frame (2) via a hinge, and the mounting frame (2) is installed between the cavity and the interface flange of the transmission channel; The equipment box (3) is sealed and installed inside the top plate of the mounting frame (2). The equipment box (3) is equipped with a drive mechanism. The drive mechanism adopts a linkage structure and the drive source is a cylinder (5). The drive mechanism is connected to the sealing door plate (1) and is used to control the opening and closing of the sealing door plate (1).

2. The sealing door plate of a wafer transport channel according to claim 1, characterized in that: The driving mechanism includes a connecting rod (7) and a limiting frame (13). The limiting frame (13) comprises two sets and is fixedly installed on the outside of the sealing door panel (1). Limiting rods (11) that slide inside the limiting frame (13) are respectively installed on both sides of the lower end of the connecting rod (7). The cylinder (5) is fixedly installed inside the equipment box (3) and a connecting ear (6) is installed on its extended end. The top of the connecting rod (7) is rotatably connected to the connecting ear (6).

3. The sealing door plate of a wafer transport channel according to claim 2, characterized in that: The drive mechanism also includes a positioning center shaft (9). The bottom of the equipment box (3) is provided with a through hole (8) through which the connecting rod (7) swings. The positioning center shaft (9) is fixedly installed inside the through hole (8). The middle part of the connecting rod (7) is provided with a slide rail (10) through which the positioning center shaft (9) slides.

4. The sealing door plate of a wafer transport channel according to claim 3, characterized in that: The positioning center shaft (9) is in contact with the inside of the slide (10), and the limiting rod (11) is in contact with the inner wall of the limiting frame (13).

5. The sealing door plate of a wafer transport channel according to claim 2, characterized in that: The sealing door panel (1) is provided with a storage groove (12) on the outside of the door panel (1) and between the two sets of limiting frames (13) to accommodate the connecting rod (7).

6. The sealing door plate of a wafer transport channel according to claim 1, characterized in that: The equipment box (3) is equipped with mounting strips (4) on both sides. The mounting strips (4) are connected to the mounting frame (2) by bolts and a sealing gasket is provided between them.

7. The sealing door plate of a wafer transport channel according to claim 1, characterized in that: A sealing assembly is provided between the sealing door panel (1) and the mounting frame (2). The sealing assembly is a double-layer sealing structure, including a main sealing ring and an auxiliary sealing ring. The main sealing ring is used to achieve normal sealing, and the auxiliary sealing ring enhances the sealing effect under high pressure differential environment.

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