Buffering sliding drive device based on memory alloy temperature response

Abstract

The utility model discloses an embodiment of buffer sliding drive arrangement based on memory alloy temperature response, include: fixed frame, buffer mechanism, sliding piece, memory alloy silk and temperature control module, buffer mechanism is fixed on the sliding piece, and is connected with one end of memory alloy silk, temperature control module is connected with memory alloy silk, is used for adjusting the temperature of memory alloy silk, the sliding piece is connected with fixed frame slidingly. The utility model embodiment is through each component cooperation, thereby realizes a simple structure, and the sliding drive arrangement of complex power source is not had.

Description

Technical Field

[0001] This utility model relates to the field of mechanical drive device technology, and in particular to a buffer sliding drive device based on the temperature response of shape memory alloy. Background Technology

[0002] Shape memory alloys (SMAs) are widely used in the actuation devices of automatic valves due to their characteristic of "shape recovery triggered by temperature changes." Their advantages include: no need for complex power sources such as motors and hydraulics, compact structure, and rapid response. However, existing actuation devices in automatic valves cannot achieve slow start-stop actions, and there is no buffering when the sliding stops. This is because: SMAs have a fast shape recovery speed (typically on the order of milliseconds), and directly driving the sliding component would cause excessively abrupt movement, making it difficult to meet the "slow and precise displacement" requirements of the door panel after it has reached its final position; the lack of an effective easing mechanism means that the restoring force of the SMA is directly transmitted to the sliding component, resulting in uncontrollable movement speed; and low temperature control accuracy prevents gradual heating / cooling of the SMA, further exacerbating the suddenness of the action. Summary of the Invention

[0003] The technical problem to be solved by this utility model embodiment is to provide a buffer sliding drive device based on the temperature response of shape memory alloy, which addresses the various shortcomings of existing drive devices.

[0004] To address the aforementioned technical problems, this utility model provides a buffer sliding drive device based on the temperature response of a shape memory alloy, comprising: a fixed frame, a easing mechanism, a sliding member, a shape memory alloy wire, and a temperature control module; the easing mechanism is fixed on the sliding member and connected to one end of the shape memory alloy wire; the temperature control module is connected to the shape memory alloy wire and is used to adjust the temperature of the shape memory alloy wire; the sliding member is slidably connected to the fixed frame. The temperature control module includes a heating element, a temperature sensor, and a power drive circuit. The heating element is connected to the shape memory alloy wire and is used to adjust the temperature of the shape memory alloy wire. The temperature sensor is connected to the shape memory alloy wire and is used to detect the temperature of the shape memory alloy wire. The power drive circuit is connected to the heating element and is used to supply energy to the heating element.

[0005] Preferably, the heating element is a resistance wire wound on the shape memory alloy wire; the power regulation circuit is a PWM pulse width modulation circuit.

[0006] Preferably, the temperature control module further includes a cooling device for reducing the temperature of the shape memory alloy wire.

[0007] Preferably, the shape memory alloy wire has a diameter of 1.2mm to 1.8mm; a length of 100mm to 150mm; and a shrinkage deformation of 10% to 15%.

[0008] Preferably, the easing mechanism includes an energy storage unit and an output unit; the energy storage unit is used to store part of the elastic potential energy of the shape memory alloy wire after deformation; the output unit is used to output the remaining elastic potential energy of the shape memory alloy wire after deformation to the sliding member.

[0009] Preferably, the energy storage unit is a damper; the output unit is a first spring; the damper is used to convert part of the elastic potential energy of the shape memory alloy wire into heat energy; the first spring is used to drive the sliding member to slide relative to the fixed frame by generating deformation according to another part of the elastic potential of the shape memory alloy wire.

[0010] Preferably, the energy storage unit is a damping fluid; the output unit is a piston; the damping fluid is used to convert part of the elastic potential energy of the shape memory alloy wire into heat energy; the piston is used to drive the sliding member to slide relative to the fixed frame by generating deformation according to another part of the elastic potential of the shape memory alloy wire.

[0011] Preferably, the easing mechanism includes a gear and a rack; the gear is connected to a shape memory alloy wire; the rack is disposed on a sliding member; and the gear meshes with the rack.

[0012] Preferably, the fixed frame is provided with a guide rail; the sliding member is provided with a sliding groove; the sliding groove slides relative to the guide rail; one end of the sliding member is also provided with a second spring; the other end of the second spring is connected to the fixed frame.

[0013] Implementing the embodiments of this utility model has the following beneficial effects: (1) In this embodiment of the utility model, the temperature of the shape memory alloy wire is precisely adjusted by using a temperature control module, thereby precisely controlling the deformation rate of the shape memory alloy wire. On this basis, the rapid deformation of the shape memory alloy wire is buffered by a easing mechanism, thereby realizing the adjustable speed of the sliding component relative to the fixed frame, meeting the requirements of precision scenarios, and thus realizing a sliding drive device with a simple structure and no complex power source.

[0014] (2) This utility model embodiment does not require complex power sources such as motors and hydraulic pumps, and can be driven by only shape memory alloy wires, easing mechanisms and temperature control modules. It is small in size and light in weight. The shape memory effect of the shape memory alloy wire is stable, the maintenance cost is low, the energy consumption is low and there is no noise or oil stains. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a buffer sliding drive device based on the temperature response of a shape memory alloy, provided in an embodiment of this utility model. Figure 2 This is a flowchart of the operation of the temperature control module provided in this embodiment of the utility model; Figure 3 This is a flowchart illustrating the operation of the easing mechanism provided in this embodiment of the utility model; Figure 4 This is a flowchart of the operation of the easing mechanism provided in another embodiment of the present invention; Figure 5 This is a flowchart of the operation of the easing mechanism provided in the third embodiment of this utility model.

[0017] 10-Fixed frame, 20-Sliding component, 201-Slide groove, 202-Guide rail, 30-Easing mechanism, 301-Damper, 302-Spring, 303-Damping fluid, 304-Piston, 305-Gear, 306-Rack, 40-Shape memory alloy wire, 50-Temperature control module, 501-Heating element, 502-Power drive circuit, 503-Temperature sensor, 504-Cooling device, 60-Controller. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Please see Figures 1-2This utility model provides a buffer sliding drive device based on the temperature response of a shape memory alloy. The buffer sliding drive device includes: a fixed frame 10, a easing mechanism 30, a sliding member 20, a shape memory alloy wire 40, and a temperature control module 50. The easing mechanism 10 is fixed to the sliding member 20 and connected to one end of the shape memory alloy wire 40. The easing mechanism buffers the deformation of the shape memory alloy wire 40 and pushes the sliding member 20 to move relative to the fixed frame 10. The temperature control module 50 is connected to the shape memory alloy wire 40 and is used to adjust the temperature of the shape memory alloy wire 40, thereby precisely controlling the degree of deformation of the shape memory alloy wire 40. The sliding member 20 is slidably connected to the fixed frame 10. The fixed frame 10 and the sliding member 20 are respectively connected to both sides of an external valve, and the automatic opening and closing of the external valve is achieved by the relative sliding of the fixed frame 10 and the sliding member 20.

[0020] The fixed frame 10 is provided with a guide rail 202. The sliding member 20 is provided with a sliding groove 201; the sliding groove 201 slides relative to the guide rail 202. A spring (not shown) is also provided at one end of the sliding member 20. The other end of the spring is connected to the fixed frame 10. After the sliding member 20 slides relative to the fixed frame 10 due to the deformation of the shape memory alloy wire 40, when the shape memory alloy wire 40 stops deforming and begins to recover, the spring will pull to make the fixed frame 10 and the sliding member 20 slide in opposite directions, thereby realizing the automatic closing of the external valve.

[0021] The temperature control module 50 includes a heating element 501, a temperature sensor 503, a power drive circuit 502, and a cooling device 504. The heating element 501 is connected to the shape memory alloy wire 40 and is used to regulate the temperature of the shape memory alloy wire 40. The temperature sensor 503 is connected to the shape memory alloy wire 40 and is used to detect the temperature of the shape memory alloy wire 40. The power drive circuit 502 is connected to the heating element 501 and is used to supply energy to the heating element 501. The heating element 501 is a resistance wire wound around the shape memory alloy wire 40. The power regulation circuit 502 is a PWM pulse width modulation circuit, which can accurately regulate the energy power output to the heating element 501 to achieve a slow temperature rise of the shape memory alloy wire 40. The temperature sensor 50 is a PT100 platinum resistance thermometer attached to the shape memory alloy wire 40, which can accurately sense the temperature of the shape memory alloy wire. The cooling device 504 is used to quickly reduce the temperature of the shape memory alloy wire 40 after deformation. A controller 60 is externally connected to the temperature control module 50. The cooling device 504 is a fan.

[0022] The temperature sensor 503 detects the temperature of the shape memory alloy wire 40 in real time and transmits the signal to the controller 60. Based on the temperature of the shape memory alloy wire 40, the controller 60 adjusts the power of the heating element 501 via the power drive circuit 502 to achieve a slow heating of the shape memory alloy wire 40. When the shape memory alloy wire 40 reaches its phase transition temperature, it begins to deform, driving the easing mechanism 30 to move the sliding member 20 relative to the fixed frame 10. When the sliding member 20 needs to move in the opposite direction, the controller 60 stops heating, and the shape memory alloy wire 40 is slowly cooled by the cooling device 504, losing its memory effect. The sliding member 20 slowly returns under the action of the spring's restoring force.

[0023] The shape memory alloy wire 40 has a diameter of 1.2mm to 1.8mm, preferably 1.5mm, a length of 100mm to 150mm, preferably 120mm, and a shrinkage deformation of 10% to 15%, preferably 12.5%. The shape memory alloy wire 40 is preferably a nickel-titanium alloy, which has a significant shape memory effect and a phase transformation temperature of about 40 to 45℃, making it suitable for room temperature environments.

[0024] See Figures 3-4 In some embodiments, the easing mechanism 30 includes an energy storage unit and an output unit. The energy storage unit stores a portion of the elastic potential energy of the shape memory alloy wire 30 after deformation. The output unit outputs the remaining elastic potential energy of the shape memory alloy wire 30 after deformation to the sliding member. See details... Figure 3 The energy storage unit is a damper 301. The output unit is a first spring 302. The damper 301 is used to convert part of the elastic potential energy of the shape memory alloy wire 30 into heat energy. The first spring 302 is used to drive the slider 20 to slide relative to the fixed frame 10 by deforming according to another part of the elastic potential energy of the shape memory alloy wire 30. Specifically, the shape memory alloy wire 30 is at a low temperature and in a stretched state, the first spring 302 is at its natural length, and the slider 20 is located at the bottom of the guide rail 202. The controller 60 activates the heating element 501, and the shape memory alloy wire 40 slowly heats up to the phase transition temperature and gradually deforms. The damper 301 absorbs part of the elastic potential energy of the deformation of the shape memory alloy wire 30, and the first spring 302 absorbs the other part of the elastic potential energy of the deformation of the shape memory alloy wire 30 and deforms. When the first spring 302 deforms to the static limit of the slider 20, the first spring 302 begins to push the slider 20 to slowly rise along the guide rail 202. The controller 60 stops heating, and the shape memory alloy wire 40 is slowly cooled to its initial temperature under the action of the cooling device 504, losing its shape memory effect. The first spring 302 returns to its natural length, and the spring pulls the slider 20 to slowly descend to its initial position.

[0025] Please see details. Figure 4The energy storage unit is a damping fluid 303, and the output unit is a piston 304. The damping fluid 303 is used to convert part of the elastic potential energy of the shape memory alloy wire 40 into heat energy. The piston 304 is used to drive the sliding member 20 to slide relative to the fixed frame 10 by deforming according to another part of the elastic potential energy of the shape memory alloy wire 40. Specifically, the shape memory alloy wire 30 is at a low temperature and in a stretched state, the piston 304 is in its original position, and the sliding member 20 is located at the bottom of the guide rail 202. The controller 60 activates the heating element 501, and the shape memory alloy wire 40 slowly heats up to the phase transition temperature, gradually deforming. The piston 304 is pulled to attempt to move inside the cylinder, and the damping fluid 303 generates a huge frictional force on the movement of the piston 304. When the piston 304 moves slowly, the damping fluid 303 generates a large amount of heat energy, and the movement speed of the piston 304 is slowed down. The piston 304 begins to push the sliding member 20 to slowly rise along the guide rail 202. The controller 60 stops heating, and the shape memory alloy wire 40 is slowly cooled to its initial temperature under the action of the cooling device 504, losing its shape memory effect. The piston 304 returns to its original position, and the spring pulls the slider 20 to slowly descend to its initial position.

[0026] See Figure 5 In some embodiments, the easing mechanism 30 includes a gear 305 and a rack 306. The gear 305 is connected to a shape memory alloy wire 40. The rack 306 is mounted on the slider 20. The gear 305 meshes with the rack 306. Specifically, the shape memory alloy wire 30 is at a low temperature and in a stretched state, and the slider 20 is located at the bottom of the guide rail 202. The controller 60 activates the heating element 501, and the shape memory alloy wire 40 slowly heats up to its phase transition temperature, gradually deforming. The shape memory alloy wire 40 pulls the gear 305, causing the gear to rotate. The gear 305 meshes with the rack 306 to perform linear motion. The controller 60 stops heating, and the shape memory alloy wire 40 is slowly cooled back to its initial temperature under the action of the cooling device 504, losing its shape memory effect. The spring pulls the slider 20 to slowly descend to its initial position.

[0027] In summary, the buffered sliding drive device based on the temperature response of shape memory alloy precisely controls the deformation rate of the shape memory alloy wire 40 by using various components of the temperature control module 50 to precisely adjust the temperature of the shape memory alloy wire 40. Based on this, the rapid deformation of the shape memory alloy wire 40 is buffered by the easing mechanism 30, thereby achieving adjustable sliding speed of the driving slider 20 relative to the fixed frame 10, meeting the requirements of precision scenarios, and thus realizing a sliding drive device with a simple structure and no complex power source.

[0028] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. Those skilled in the art will understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A buffer sliding drive device based on the temperature response of shape memory alloy, characterized in that, include: The device comprises a fixed frame, a easing mechanism, a sliding component, a shape memory alloy wire, and a temperature control module; the easing mechanism is fixed on the sliding component and connected to one end of the shape memory alloy wire; the temperature control module is connected to the shape memory alloy wire and is used to adjust the temperature of the shape memory alloy wire; the sliding component is slidably connected to the fixed frame. The temperature control module includes a heating element, a temperature sensor, and a power drive circuit. The heating element is connected to the shape memory alloy wire and is used to adjust the temperature of the shape memory alloy wire. The temperature sensor is connected to the shape memory alloy wire and is used to detect the temperature of the shape memory alloy wire. The power drive circuit is connected to the heating element and is used to supply energy to the heating element.

2. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The heating element is a resistance wire wound around the shape memory alloy wire; the power drive circuit is a PWM pulse width modulation circuit.

3. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The temperature control module also includes a cooling device for reducing the temperature of the shape memory alloy wire.

4. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The shape memory alloy wire has a diameter of 1.2mm to 1.8mm; the shape memory alloy wire has a length of 100mm to 150mm; and the shape memory alloy wire has a shrinkage deformation of 10% to 15%.

5. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The easing mechanism includes an energy storage unit and an output unit; the energy storage unit is used to store part of the elastic potential energy of the shape memory alloy wire after deformation; the output unit is used to output the remaining elastic potential energy of the shape memory alloy wire after deformation to the sliding component.

6. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 5, characterized in that, The energy storage unit is a damper; the output unit is a first spring; the damper is used to convert part of the elastic potential energy of the shape memory alloy wire into heat energy; the first spring is used to drive the sliding member to slide relative to the fixed frame by generating deformation according to another part of the elastic potential of the shape memory alloy wire.

7. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 5, characterized in that, The energy storage unit is a damping fluid; the output unit is a piston; the damping fluid is used to convert part of the elastic potential energy of the shape memory alloy wire into heat energy; the piston is used to drive the sliding member to slide relative to the fixed frame by generating deformation according to another part of the elastic potential of the shape memory alloy wire.

8. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The easing mechanism includes a gear and a rack; the gear is connected to a shape memory alloy wire; the rack is mounted on a sliding member; and the gear meshes with the rack.

9. The buffer sliding drive device based on the temperature response of shape memory alloy according to claim 1, characterized in that, The fixed frame is provided with a guide rail; the sliding member is provided with a sliding groove; the sliding groove slides relative to the guide rail; a second spring is also provided at one end of the sliding member; the other end of the second spring is connected to the fixed frame.

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