A touch screen module compression mold

Abstract

The application relates to the technical field of electronic device processing, in particular to a touch screen module pressing die, which comprises a base, a lower die, an upper die, a pressing component and a buffer component, and is characterized in that the pressing component is connected to the base, the buffer component is arranged on the pressing component, the lower die is connected to the base, and the upper die is connected to the buffer component. The spring in the buffer mechanism cooperates with other buffer components to effectively absorb the impact force generated when the upper die and the lower die are closed during the pressing process. When the pressing component drives the upper die to move downward, the elastic deformation of the spring and the cooperation of other buffer structures ensure that the impact force does not directly act on the touch screen module. This greatly reduces the probability of problems such as glass breakage, circuit board fracture or poor contact in the touch screen module, effectively protects the precise components in the touch screen module, and significantly improves the yield of the product.

Description

Technical Field

[0001] This application relates to the field of electronic device processing technology, and in particular to a touch screen module pressing mold. Background Technology

[0002] In the manufacturing process of touch screen modules, the lamination process is a crucial step in precisely joining the various components of the touch screen. The performance of the lamination mold directly affects the product quality and production efficiency. Currently, some traditional touch screen module lamination molds use a direct lamination method, where the upper and lower molds directly contact each other under the drive of the clamping components to press the touch screen together, lacking an effective buffer structure.

[0003] This direct pressing method has several drawbacks. During the pressing process, due to the large and instantaneous driving force of the clamping components, a significant impact force is generated when the upper and lower molds close. Touchscreen modules typically contain precision components such as glass and flexible circuit boards, which have weak impact resistance. Excessive impact force can easily lead to problems such as glass breakage, circuit board fracture, or poor contact, seriously affecting the product yield. Furthermore, in long-term use, the impact force generated by direct pressing will also cause significant wear and tear on the mold itself, accelerating the wear of mold components, shortening the mold's lifespan, and increasing production costs for enterprises. In addition, due to the lack of a buffer structure, it is difficult to accurately control pressure changes during the pressing process, failing to meet the diverse pressing requirements of touchscreen modules of different specifications and materials, thus limiting the mold's applicability.

[0004] Therefore, how to design a touch screen module pressing mold that can effectively buffer the impact force during pressing, improve product quality, extend mold life and meet diverse production needs has become a technical problem that urgently needs to be solved in this field. Utility Model Content

[0005] In order to solve the problems mentioned in the background art, this application provides a touch screen module pressing mold.

[0006] This application provides a touch screen module pressing mold, which adopts the following technical solution: it includes a base, a lower mold, an upper mold, a pressing component, and a buffer component. The pressing component is connected to the base, the buffer component is disposed on the pressing component, the lower mold is connected to the base, and the upper mold is connected to the buffer component.

[0007] The lower mold is used to place the touch screen to be pressed. When the pressing component is operated to close the upper mold and the lower mold, the buffer component is used to buffer the pressure from the pressing component.

[0008] Through the above solution, the base provides a stable support foundation for the entire mold, ensuring the overall stability of the mold during the pressing process; the lower mold achieves precise positioning and bearing of the touch screen to be pressed; the upper mold is connected to the buffer component, which, under the action of the buffer component, buffers and adjusts the pressure transmitted by the pressing component before applying it evenly to the touch screen, avoiding damage to the touch screen due to excessive pressure at any moment; the pressing component is connected to the base, providing power for the movement of the upper mold; the buffer component can effectively buffer the pressure applied by the pressing component, reducing the impact force during the pressing process through its own buffering effect, ensuring that the touch screen is not damaged during the pressing process, and improving the product yield.

[0009] Optionally, the clamping component includes a shaft, a gear, a rack, and a mounting base;

[0010] The mounting base is connected to the base, the mounting base is rotatably connected to the shaft, the shaft is connected to the gear, the gear is meshed with the rack, and the rack is slidably connected to the mounting base.

[0011] Through the above scheme, the mounting base serves as a carrier connecting the base to other transmission components, providing stable support for the installation of the shaft, gear, and rack. The shaft rotates in the mounting base, transmitting power to the gear. The gear is connected to the shaft, and through meshing with the rack, it converts the rotational motion of the shaft into the linear motion of the rack. The rack slides on the mounting base, converting the motion transmitted by the gear into linear driving force, thereby driving the buffer component connected to the rack and the upper mold to move up and down, realizing the mold closing and opening actions of the upper and lower molds. This transmission structure can precisely control the movement distance and speed of the upper mold, ensuring the stability and accuracy of the pressing action.

[0012] Optionally, the clamping component further includes a handle connected to the shaft.

[0013] With the above solution, the handle provides the operator with a force application point. By connecting with the shaft, the operator can rotate the handle to drive the shaft to rotate, thereby driving the gears and racks to move.

[0014] Optionally, the buffer component includes an outer cylinder, two back plates, two guide grooves, and two bolts;

[0015] The outer cylinder is slidably connected to the rack, and the two sides of the outer cylinder are respectively attached to the two back plates. The two guide grooves are respectively machined on the two back plates. The two back plates are connected to the upper mold, and the two bolts are respectively threaded to the two sides of the outer cylinder.

[0016] With the above scheme, the outer cylinder is slidably connected to the rack, allowing it to move up and down under the drive of the rack, while providing an installation base for other components of the buffer component; the back plate fits against the outer cylinder, and its movement is guided by the guide groove, ensuring that the outer cylinder remains stable during the lifting process and avoiding deviation or shaking; the guide groove cooperates with the outer cylinder to play a precise guiding role, enabling the outer cylinder to move smoothly along the set direction; the bolt is threadedly connected to the outer cylinder, and by adjusting the tightness of the bolt, the friction between the back plate and the outer cylinder can be adjusted, thereby adjusting the buffer performance of the buffer component to adapt to the pressing requirements of different specifications of touch screens and achieve flexible control of the impact force during the pressing process.

[0017] Optionally, the bolt is pressed against the back plate near the end face of the outer cylinder.

[0018] With the above scheme, the end face of the bolt near the outer cylinder is pressed against the back plate. During the pressing process, when the outer cylinder is subjected to pressure and moves, friction is generated between the end face of the pressed bolt and the back plate, which is used to fix the upper mold.

[0019] Optionally, the buffer component further includes a first plate, a second plate, a rod, and a spring;

[0020] The first plate is connected to the rack, the second plate is connected to the outer cylinder, the second plate is connected to the rod, the rod is slidably connected to the first plate, the spring is sleeved on the rod, and the two ends of the spring are respectively connected to the bottom of the first plate and the top of the second plate.

[0021] Through the above scheme, the first plate is connected to the rack, which can transmit the movement of the rack to the buffer component; the second plate is connected to the outer cylinder, which is used to install the rod and spring, and transmit the buffering force of the buffer component to the upper mold; the rod slides in the first plate, providing guidance for the movement of the second plate and the spring, ensuring that the spring will not twist during compression and extension; the spring is sleeved on the rod, and during the pressing process, when the outer cylinder drives the second plate to move downward, the spring is compressed, and absorbs and stores energy through its own elastic deformation, thereby buffering the pressure from the pressing component. When the pressure is released, the spring releases energy and pushes the upper mold to reset, effectively reducing the impact force during the pressing process, protecting the touch screen from damage, and improving the service life of the mold.

[0022] In summary, this application includes the following beneficial technical effects:

[0023] 1. This utility model utilizes the spring in the buffer mechanism, working in conjunction with other buffer components, to effectively absorb the impact force generated when the upper and lower molds close during the pressing process. When the pressing component drives the upper mold downwards, the elastic deformation of the spring and the cooperation of other buffer structures prevent the impact force from directly acting on the touchscreen module. This significantly reduces the probability of problems such as glass breakage, circuit board fracture, or poor contact in the touchscreen module, effectively protecting the precision components in the touchscreen module and significantly improving the product yield. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure in an embodiment of this application;

[0025] Figure 2 This is an exploded view of the touch screen module pressing mold in the embodiments of this application;

[0026] Figure 3 This is a schematic diagram of the structure of the buffer component of the touch screen module pressing mold in the embodiments of this application;

[0027] Figure 4 This is a partial structural schematic diagram of the buffer component of the touch screen module pressing mold in an embodiment of this application.

[0028] Figure label:

[0029] 1. Base; 2. Lower mold; 3. Upper mold; 4. Clamping component; 401. Shaft; 402. Gear; 403. Handle; 404. Mounting base; 405. Rack; 5. Buffer component; 501. Outer cylinder; 502. First plate; 503. Rod; 504. Spring; 505. Second plate; 506. Back plate; 507. Guide groove; 508. Bolt. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0031] This application discloses a touch screen module pressing mold.

[0032] Please see Figure 1 A touch screen module pressing mold includes a base 1, a lower mold 2, an upper mold 3, a pressing component 4, and a buffer component 5.

[0033] Specifically, the base 1 serves as the basic support structure of the entire mold, providing a stable bearing surface for mounting other components. The lower mold 2 is fixedly connected to the bearing surface of the base 1. The lower mold 2 has a placement groove inside that matches the shape of the touch screen to be pressed. This placement groove can accurately position the touch screen to be pressed, keeping it stable during the pressing process.

[0034] The clamping component 4 is fixed to the base 1 by bolts or welding and is located on the side or around the base 1, with its output end facing vertically upward. The buffer component 5 is located on the output end of the clamping component 4.

[0035] When the touchscreen needs to be pressed, the operator first places the touchscreen to be pressed into the placement slot of the lower mold 2. Then, the pressing component 4 is activated, and its output end moves upward, causing the buffer component 5 and the upper mold 3 to move together towards the lower mold 2. During this process, as the upper mold 3 gradually approaches the lower mold 2, the buffer component 5 begins to function. When the pressing component 4 pushes the upper mold 3 into contact with the lower mold 2 and applies further pressure, the buffer component 5 effectively buffers the pressure from the pressing component 4, preventing excessive pressure from damaging the touchscreen. Through the buffering effect of the buffer component 5, the upper mold 3 and the lower mold 2 can complete the mold closing action with a smooth and appropriate pressure, accurately pressing the touchscreen to be pressed, thereby ensuring the pressing quality of the touchscreen module.

[0036] Please see Figure 2 The clamping component 4 includes a shaft 401, a gear 402, a rack 405, and a mounting base 404.

[0037] Mounting base 404 serves as the basic mounting carrier for clamping component 4. Mounting base 404 is securely connected to base 1 by bolts, welding, or other fixing methods, occupying a specific mounting area on base 1. Mounting base 404 has a through mounting hole through which shaft 401 passes. A bearing is installed in the mounting hole, enabling the rotatable connection between mounting base 404 and shaft 401. This connection method ensures that shaft 401 can rotate freely in mounting base 404 while restricting the radial movement of shaft 401.

[0038] One end of the shaft 401 extends beyond the mounting base 404. The gear 402 is securely connected to the extended end of the shaft 401 via a key connection, interference fit, or other fixed connection method, ensuring that the gear 402 can rotate synchronously with the shaft 401. The gear 402 adopts a standard involute tooth profile to achieve precise meshing and transmission with the rack 405.

[0039] The mounting base 404 is also provided with a slide rail parallel to the axial direction of the shaft 401. The side of the rack 405 is provided with a slide groove that matches the slide rail. Through the cooperation of the slide rail and the slide groove, the rack 405 and the mounting base 404 are slidably connected, so that the rack 405 can slide linearly on the mounting base 404 along the slide rail direction. The teeth on the rack 405 mesh with the teeth of the gear 402. When the shaft 401 rotates, it drives the gear 402 to rotate synchronously. The gear 402, through meshing with the rack 405, converts the rotational motion of the shaft 401 into the linear motion of the rack 405, thereby realizing the driving effect of the pressing component 4 on other components (such as the buffer component 5 and the upper mold 3 connected to the rack 405).

[0040] The clamping component 4 also includes a handle 403, which is used to manually drive the shaft 401 to rotate.

[0041] The handle 403 is positioned at an appropriate distance from the mounting base 404 to ensure that the operator has sufficient operating space and improves the convenience of mold use.

[0042] Please see Figure 3 and Figure 4 The buffer component 5 includes an outer cylinder 501, two back plates 506, two guide grooves 507 and two bolts 508. Its structural design aims to achieve effective buffering and guidance between the upper mold 3 and the pressing component 4.

[0043] The outer cylinder 501 has a hollow cylindrical structure, and its inner wall is provided with a sliding groove adapted to the rack 405. The shape of the sliding groove matches the cross-sectional shape of the rack 405, allowing the outer cylinder 501 to slide smoothly along the length of the rack 405, thereby establishing a sliding connection between the buffer component 5 and the pressing component 4. The two sides of the outer cylinder 501 are flat mating surfaces for mating with the back plate 506.

[0044] Two back plates 506 are located on both sides of the outer cylinder 501 and fit tightly against the sides of the outer cylinder 501. The back plates 506 are made of metal, and their surfaces near the outer cylinder 501 are precision-machined to ensure a precise fit with the sides of the outer cylinder 501. Two guide grooves 507 are machined on the opposing inner surfaces of the two back plates 506. The guide grooves 507 extend vertically, and their width matches the thickness of the sides of the outer cylinder 501. The two sides of the outer cylinder 501 are embedded in the guide grooves 507. Thus, during mold closing, the back plates 506 guide the outer cylinder 501 vertically through the guide grooves 507, ensuring the stability of the outer cylinder 501's sliding motion.

[0045] The other side of the back plate 506 is securely connected to the upper mold 3 by bolts, welding or other fixing methods, so that the upper mold 3 can move synchronously with the back plate 506.

[0046] Two bolts 508 correspond to the two sides of the outer cylinder 501, respectively. The two side walls of the outer cylinder 501 are provided with threaded holes adapted to the bolts 508. After passing through the pre-drilled through holes in the back plate 506, the bolts 508 are threadedly connected to the threaded holes on the side walls of the outer cylinder 501. During installation, the tightness of the fit between the back plate 506 and the outer cylinder 501 can be adjusted by tightening the bolts 508. When the clamping component 4 drives the outer cylinder 501 to move the upper mold 3 downwards to close with the lower mold 2, the outer cylinder 501 slides on the rack 405. The guide groove 507 can move relative to the bolts 508, and the back plate 506 is fixed by tightening the bolts.

[0047] The diameter of the rotating part of bolt 508 is larger than that of the screw part. The rotating part of bolt 508 can be pressed against the end face of back plate 506, which realizes the quick disassembly of upper mold 3 and avoids the upper mold 3 from moving at will.

[0048] The buffer component 5 further includes:

[0049] The first plate 502 is a rectangular flat plate structure, the dimensions of which are adapted to the width and length of the rack 405. It is fixed to the side of the rack 405 by welding or bolting. Specifically, through holes are provided on the first plate 502 corresponding to the bolt holes of the rack 405. High-strength bolts are passed through the through holes of the first plate 502 and the bolt holes of the rack 405 in sequence, and the nuts are tightened to make the first plate 502 and the rack 405 firmly connected, ensuring that the first plate 502 can move synchronously with the rack 405.

[0050] The second plate 505 is also a rectangular flat plate, the size of which matches the outer diameter of the outer cylinder 501. It is fixed to the bottom of the outer cylinder 501 by welding or bolting. The second plate 505 has a threaded hole at its center for connection with the rod 503.

[0051] The rod 503 is a cylindrical metal rod with an external thread at one end, which is threaded to the threaded hole at the center of the second plate 505. The installation depth of the rod 503 on the second plate 505 can be adjusted by rotating the rod 503. The other end of the rod 503 is a smooth cylindrical surface. A through sliding hole is provided on the first plate 502 at the position corresponding to the rod 503. The inner diameter of the sliding hole is slightly larger than the outer diameter of the rod 503, forming a clearance fit, so that the rod 503 can slide freely along the axis within the sliding hole, thereby realizing the sliding connection between the second plate 505 and the first plate 502.

[0052] Spring 504 is a helical compression spring, its inner diameter matching the outer diameter of rod 503, and it is sleeved on rod 503. One end of spring 504 abuts tightly against the bottom of first plate 502, and the other end abuts tightly against the top of second plate 505. In the initial state, spring 504 is in a compressed state with a certain preload, which is set according to the buffering force required for the touch screen module to be pressed together.

[0053] When the pressing component 4 drives the rack 405 to move, thereby causing the first plate 502 to move upward, the first plate 502 pushes the second plate 505 and the outer cylinder 501 to move upward through the rod 503. During this process, the spring 504 is further compressed to absorb the impact force during the movement. When the pressing is completed, when the pressing component 4 drives the rack 405 to move downward, the spring 504 releases its elastic potential energy, pushing the second plate 505 and the outer cylinder 501 to return to their original position downward, realizing the cyclical work of the buffer component 5, effectively buffering the impact force during the mold closing and opening process of the upper mold 3 and the lower mold 2, and protecting the touch screen module from damage during the pressing process.

[0054] The implementation principle of a touch screen module pressing mold in this application embodiment is as follows:

[0055] Material loading and positioning: Place the touch screen module to be pressed into the positioning groove of the lower mold 2. The lower mold 2 is precisely aligned with the base 1 through the positioning pin.

[0056] Manual drive: The operator rotates the handle 403, which drives the shaft 401 to rotate via a key connection.

[0057] Gear and rack transmission: The rotational motion of the shaft 401 is transmitted to the gear 402 through a key connection. The gear 402 meshes with the rack 405, converting the rotational motion into the linear upward motion of the rack 405.

[0058] Buffer pressing: The rack 405 drives the outer cylinder 501 and the upper mold 3 to rise synchronously. When the touch screen module contacts the upper mold 3, the buffer component 5 starts to work, absorbing and dispersing the pressure to ensure that the pressing force is uniform and controllable.

[0059] Pressure holding and curing: After the set pressure is reached, the current position is maintained by the self-locking structure of the handle 403, and the pressing operation of the touch screen module is completed.

[0060] Demolding and part removal: Rotate handle 403 in the opposite direction to lower and reset the upper mold 3, and remove the pressed touch screen module.

[0061] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A touch screen module pressing mold, comprising a base (1), a lower mold (2), an upper mold (3), a pressing component (4), and a buffer component (5), characterized in that: The clamping component (4) is connected to the base (1), the buffer component (5) is disposed on the clamping component (4), the lower mold (2) is connected to the base (1), and the upper mold (3) is connected to the buffer component (5); The lower mold (2) is used to place the touch screen to be pressed. When the pressing component (4) is operated to close the upper mold (3) and the lower mold (2), the buffer component (5) is used to buffer the pressure from the pressing component (4). The clamping component (4) includes a shaft (401), a gear (402), a rack (405), and a mounting base (404). The mounting base (404) is connected to the base (1), the mounting base (404) is rotatably connected to the shaft (401), the shaft (401) is connected to the gear (402), the gear (402) is meshed with the rack (405), and the rack (405) is slidably connected to the mounting base (404). The clamping component (4) also includes a handle (403), which is connected to the shaft (401); The buffer component (5) includes an outer cylinder (501), two back plates (506), two guide grooves (507) and two bolts (508); The outer cylinder (501) is slidably connected to the rack (405). The two sides of the outer cylinder (501) are respectively attached to the two back plates (506). The two guide grooves (507) are respectively machined on the two back plates (506). The two back plates (506) are connected to the upper mold (3). The two bolts (508) are respectively threaded to the two sides of the outer cylinder (501).

2. The touch screen module pressing mold according to claim 1, characterized in that: The bolt (508) abuts against the back plate (506) near the end face of the outer cylinder (501).

3. The touch screen module pressing mold according to claim 1, characterized in that: The buffer component (5) further includes a first plate (502), a second plate (505), a rod (503), and a spring (504); The first plate (502) is connected to the rack (405), the second plate (505) is connected to the outer cylinder (501), the second plate (505) is connected to the rod (503), the rod (503) is slidably connected to the first plate (502), the spring (504) is sleeved on the rod (503), and the two ends of the spring (504) are respectively connected to the bottom of the first plate (502) and the top of the second plate (505).

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