Chip burning device

Abstract

The utility model relates to the technical field of chip processing, and concretely relates to a chip burning equipment, the burning equipment includes bottom plate, moving mechanism, transfer spare and burns the mechanism, and the operator first moves to the chip with mechanical arm above the burning mechanism, carries out the clamping and fixed to the burning module with the chip through the movement of burning mechanism, then continues to move to the transfer spare with the chip through the burning mechanism and carries out the collection and the transfer, simplifies the chip operation procedure, and simultaneously, can according to the different free control of chip burning time Place time and transfer time, effectively improve the burning efficiency, have better practicality and economy, be beneficial to the popularization and use of equipment.

Description

Technical Field

[0001] This utility model relates to the technical field of chip processing, and more specifically to a chip programming device. Background Technology

[0002] The chip programming process is one of the processes for customizing a chip. By contacting the chip and inputting different electrical signals, the control effect can be recorded, which can improve the efficiency of use. In the existing programming technology, the chip is usually clamped and fixed to the device for programming in sequence using a clamp. The operation is cumbersome and requires multiple clamping during transportation, which is time-consuming. At the same time, it is difficult to control the force of the clamping chip against the programming module, which may damage the chip. Utility Model Content

[0003] In order to solve the above-mentioned problems in the existing technology, the purpose of this utility model is to provide a chip programming device with a simple structure, which effectively improves the clamping effect and facilitates transportation.

[0004] The technical solution adopted by this utility model is as follows: a chip programming device, including a base plate, a programming mechanism for carrying chips is provided above the base plate, the programming mechanism includes a support platform and movable parts, and a plurality of programming modules are provided on the support platform; The programming mechanism is provided with a moving mechanism on the side away from the base plate. The moving mechanism is used to transfer the chip, and the movable part moves the chip to abut against the programming module; or the moving mechanism.

[0005] In one embodiment, the support platform includes two sets of support plates, with a fixing plate between the two sets of support plates, and a plurality of the programming modules arranged in a linear array on the side of the fixing plate away from the base plate.

[0006] In one embodiment, the movable component includes a plurality of lifting cylinders, which are located on the side of the fixed plate away from the programming module. The programming modules have the same number of lifting rod through-holes on one side. The lifting rods of the fixed plate pass through these lifting rod through-holes. A lifting bending plate is provided at the end of the lifting rod of the fixed plate. The lifting bending plate has an L-shaped structure, and a material placement groove is provided at one end of the lifting bending plate. The lifting rod of the fixed plate pushes the lifting bending plate to move between the programming module and the moving mechanism. A placement ring is provided in the material placement groove for placing chips, and the chip pins abut against the programming module through the placement ring.

[0007] In one embodiment, the moving mechanism includes two sets of supporting plates, with a guide rail between the two sets of supporting plates. The axis of the guide rail is parallel to the array lines of the programming modules. A sliding block is provided on the guide rail, and the sliding block is slidably connected to the guide rail by the axis of the guide rail. A movable fixing plate is provided on the side of the sliding block near the programming module, and a transfer component is provided on the movable fixing plate for gripping the chip.

[0008] In one embodiment, the transfer component includes a plurality of main rotating wheels arranged in a linear array on the movable fixed plate. An auxiliary rotating wheel is located on the side of each main rotating wheel closest to the burning mechanism. A transmission belt is wrapped between adjacent main rotating wheels and auxiliary rotating wheels. A plurality of drive motors are also provided on the movable fixed plate, driving the adjacent main rotating wheels to rotate. An upgraded movable plate is located in the middle of the transmission belt, and a core suction tube is located in the middle of the upgraded movable plate. The core suction tube is located on the central axis of the material placement groove, and a contact suction cup is located at one end of the core suction tube closest to the material placement groove.

[0009] In one embodiment, the end of the suction tube away from the contact suction cup is provided with an air extraction port, the air extraction port is connected to an air extraction device, and the air extraction port passes through the middle of the contact suction cup to extract air from the middle of the chip that is in contact with the contact suction cup.

[0010] In one embodiment, the material placement groove and the two sides of the placement ring that abut against it are provided with through movable grooves. A pressing plate is provided in the movable groove. A positioning plate is provided at the end of the pressing plate away from the programming module. An arc-shaped pressing plate is connected to the end of the positioning plate away from the pressing plate. The positioning plate and the pressing plate are combined to form an extension plate with a bent structure. Two sets of extension plates are bent and arranged opposite to each other. Rotating shafts are provided on both sides of the pressing plate. The rotating shafts pass through and are rotatably connected to both sides of the movable groove to clamp and fix the chip to abut against the programming module.

[0011] In one embodiment, a torsion spring, which is penetrated by the rotating central shaft, is provided between the movable groove and the pressing plate.

[0012] The beneficial effects of this utility model are as follows: The purpose is to provide a chip programming device with a simple structure, which effectively improves the clamping effect and facilitates transfer. The specific implementation method is as follows: First, using a robotic arm or manually, the chips are placed sequentially into the placement ring of the material placement groove in the middle of the lifting and bending plate. Then, the lifting cylinder is activated to lower the lifting and bending plate. During the descent of the lifting and bending plate, the pressing plate in the movable groove comes into contact with the surface of the programming module. The pressing plate pushes the position plate closer to the chip. Then, the rotating shaft in the middle of the pressing plate resists the torque of the torsion spring and drives the position plate closer to the chip. The arc-shaped pressing plate connected to the position plate abuts against the chip. Since the arc-shaped pressing plate is connected to the position plate on one side, it can be elastically held from left to right when the arc-shaped pressing plate abuts, slowly clamping the chip above the placement ring. This makes it easy for the programming module to contact the chip contacts. The flexible pressing of the arc-shaped pressing plate ensures that the chip is fixed and abutted, avoiding damage to the chip during the clamping and pressing process.

[0013] After the programming is completed, the programming module is restarted to move the lifting and bending plate to below the core suction tube. During this period, the pressing plate loses the support of the programming module and is restored to its original position by the torque of the torsion spring, waiting for the next contact. After the chip in the placement ring comes into contact with the suction cup below the core suction tube, air is sucked in through the air extraction port so that the contact suction cup adheres to the chip for clamping and transfer. At this time, the lifting cylinder can be lowered to wait for the next programming process. After the chip is picked up by the suction tube, the drive motor is started to rotate the main rotating wheel, which in turn drives the transmission belt to rotate. At the same time, the upgraded moving plate is lifted and lowered away from the programming module. Then, the sliding block is moved to move the entire absorption structure to other areas that have not been programmed, and then the transfer and collection can be carried out. The moving process can be achieved by an automated moving structure or manually, which are existing technologies. The above-mentioned lateral moving function can be achieved, so it will not be described in detail. Meanwhile, a mobile mechanism can be used to move the chip to the placement ring instead of a robotic arm, simplifying the equipment structure and achieving the desired function.

[0014] Meanwhile, due to the setting of the programming time, the chip can be transferred to the placement ring in other areas by a moving mechanism during programming, and the programmed chip can be transferred to a blank position after programming is completed, so as to achieve time control and improve efficiency.

[0015] The device has a simple structure and effectively utilizes a lifting and bending plate to achieve flexible clamping and pressing of the programmed chip and to provide support during the transfer process. This effectively avoids the problem of chip damage during clamping, and has good practicality and economy, which is beneficial to the promotion and use of the equipment. Attached Figure Description

[0016] The present invention will now be described in further detail with reference to the accompanying drawings and specific implementation methods.

[0017] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2This is a three-dimensional structural diagram of the moving mechanism of this utility model; Figure 3 This is a three-dimensional structural diagram of the transfer component of this utility model; Figure 4 This is a three-dimensional structural diagram of the burning mechanism of this utility model; Figure 5 This is a partial three-dimensional structural schematic diagram of the burning mechanism of this utility model; Figure 6 This is a partial three-dimensional structural schematic diagram of the burning mechanism of this utility model.

[0018] Reference numerals: 1. Base plate; 2. Moving mechanism; 21. Supporting upright plate; 22. Wire guide crossbar; 23. Sliding crossbar; 3. Transfer component; 31. Moving fixed plate; 32. Main rotating wheel; 33. Auxiliary rotating wheel; 331. Transmission belt; 34. Drive motor; 35. Upgrading moving plate; 36. Core suction tube; 361. Air extraction port; 362. Contact suction cup; 4. Burning mechanism; 41. Lifting cylinder; 42. Lifting bending plate; 43. Material placement groove; 431. Placement ring; 432. Movable groove; 44. Burning module; 45. Supporting upright plate; 46. Fixed plate; 461. Lifting rod through hole; 47. Pressing plate; 471. Position plate; 472. Arc-shaped pressing plate; 473. Rotating central shaft; 474. Torsion spring. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model; that is, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The components of the embodiments of the present utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0020] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0021] The following is combined Figure 1-6This invention describes a specific embodiment of a chip programming device, which includes a base plate 1 and a programming mechanism 4 for carrying chips on the base plate 1. The programming mechanism 4 includes a support platform and movable parts. The support platform is provided with a plurality of programming modules 44, the number of which can be arranged according to the actual situation. The programming module 44 has a structure with contacts and mainly programs the chip after it is placed. This is existing technology and will not be described in detail. The function is sufficient. The burning mechanism 4 is provided with a moving mechanism 2 on the side away from the base plate 1. The moving mechanism 2 is used to transfer the chip, and the moving part moves the chip to abut against the burning module 44; or the moving mechanism 2.

[0022] Beneficially, the support platform includes two sets of support plates 45, with a fixing plate 46 between the two sets of support plates 45, and a number of programming modules 44 arranged in a linear array on the side of the fixing plate 46 away from the base plate 1.

[0023] Beneficially, the movable components include several lifting cylinders 41, which can be electrically or pneumatically controlled to achieve fixed-point lifting. The lifting cylinders 41 are located on the side of the fixed plate 46 away from the programming module 44. Several programming modules 44 have the same number of lifting rod through holes 461 on one side. The lifting rods of the fixed plate 46 pass through the lifting rod through holes 461. The ends of the lifting rods of the fixed plate 46 are provided with lifting bending plates 42, which have an L-shaped structure and can be fixed or guided by one side plate. To improve the stability of the lifting process, the attached diagram is not shown, but can be referred to the actual usage. One end of the lifting bending plate 42 is provided with a material placement groove 43. The lifting rod of the fixed plate 46 pushes the lifting bending plate 42 to move between the programming module 44 and the moving mechanism 2. The material placement groove 43 is provided with a placement ring 431. The shape of the placement ring 431 is the same as the projection surface of the inner cavity of the material placement groove 43. A through area is provided in the middle for placing the chip and chip pins abutting against the programming module 44 through the placement ring 431.

[0024] Beneficially, the moving mechanism 2 includes two sets of supporting uprights 21, with a guide rail 22 between the two sets of supporting uprights 21. The axis of the guide rail 22 is parallel to the array lines of several programming modules 44. The programming modules 44 are existing technologies, mainly performing chip programming by contacting or abutting chip contacts. They are usually platform structures to facilitate chip placement. A sliding block 23 is provided on the guide rail 22. The sliding block 23 is slidably connected to the guide rail 22 by the guide rail axis. A movable fixing plate 31 is provided on the side of the sliding block 23 near the programming module 44. A transfer component 3 is provided on the movable fixing plate 31 to grasp the chip. Specifically, the sliding block 23 can be moved laterally by a motor or manually. The attached figure is not shown, but can be referred to for details.

[0025] Specifically, the transfer component 3 includes several main rotating wheels 32 arranged in a linear array on the movable fixed plate 31. Auxiliary rotating wheels 33 are located on the side of the main rotating wheels 32 closest to the burning mechanism 4. A transmission belt 331 is wrapped between adjacent main rotating wheels 32 and auxiliary rotating wheels 33. Several drive motors 34 are also provided on the movable fixed plate 31, driving the adjacent main rotating wheels 32 to rotate. An upgrading moving plate 35 is located in the middle of the transmission belt 331. A suction tube 36 is provided in the middle of the board 35. The suction tube 36 is located on the central axis of the material placement groove 43. A contact suction cup 362 is provided at one end of the suction tube 36 near the material placement groove 43. Conversely, an air extraction port 361 is provided at the other end of the suction tube 36 away from the contact suction cup 362. The air extraction port 361 is connected to an air extraction device, such as an air pump. The air extraction port 361 passes through the middle of the contact suction cup 362 and is used to extract air from the middle of the chip that is in contact with the contact suction cup 362, forming a negative pressure to prevent the chip from falling off.

[0026] Beneficially, the material placement groove 43 and the abutting placement ring 431 are provided with through movable grooves 432 on both sides. A pressing plate 47 is provided in the movable groove 432. The end of the pressing plate 47 away from the programming module 44 is provided with a positioning plate 471. The end of the positioning plate 471 away from the pressing plate 47 is connected to an arc-shaped pressing plate 472. The positioning plate 471 and the pressing plate 47 are combined to form an extension plate with a bent structure. The two sets of extension plates are bent and arranged opposite to each other. The two sets of pressing plates 47 are provided with a rotating shaft 473 on both sides. The rotating shaft 473 passes through and is rotatably connected to the two sides of the movable groove 432 to clamp and fix the chip to abut the programming module 44. Specifically, a torsion spring 474 is provided between the movable groove 432 and the pressing plate 47 and is penetrated by the rotating shaft 473, so that the pressing plate 47 can quickly return to its position after the lifting and bending plate 42 is pressed down to avoid affecting the chip transfer.

[0027] Working principle of this utility model: First, using a robotic arm or manually, the chips are placed sequentially into the placement ring 431 of the material placement groove 43 in the middle of the lifting and bending plate 42. Then, the lifting cylinder 41 is activated to lower the lifting and bending plate 42. During the descent of the lifting and bending plate 42, the pressing plate 47 in the movable groove 432 abuts against the surface of the programming module 44. The pressing plate 47 pushes the position plate 471 closer to the chip. Then, the rotating shaft 473 in the middle of the pressing plate 47 resists the torque of the torsion spring 474 and drives the position plate 471 to move inward. The arc-shaped pressing plate 472 connected to the position plate 471 abuts against the chip. Since the arc-shaped pressing plate 472 is connected to the position plate 471 on one side, it can be elastically clamped to the top of the placement ring 431 when the arc-shaped pressing plate 472 abuts, so that the programming module 44 can contact the core contacts. The flexible pressing of the arc-shaped pressing plate 472 ensures that the chip is fixed and abutted, avoiding damage to the chip during the clamping and pressing process.

[0028] After the programming is completed, the programming module 44 is started again to move the lifting and bending plate 42 to below the core suction tube 36. During this period, since the pressing plate 47 loses the contact of the programming module 44, it is restored to its original position by the torque of the torsion spring 474 and waits for the next contact. After the chip in the placement ring 431 abuts against the suction cup below the core suction tube 36, air is sucked in by the air extraction port 361 so that the contact suction cup 362 fits the chip for clamping and transfer. At this time, the lifting cylinder 41 can be lowered to wait for the next programming process. After the chip is picked up by the suction tube 36, the drive motor 34 is started to rotate the main rotating wheel 32, which drives the transmission belt 331 to rotate. At the same time, the upgraded moving plate 35 is lifted and lowered away from the burning module 44. Then, the sliding block 23 moves the entire absorption structure to other areas that have not been burned, and then the transfer and collection can be carried out. The moving process can be achieved by an automated moving structure or manually, which are existing technologies. The above-mentioned horizontal moving function can be achieved, so it will not be described in detail. Meanwhile, the moving mechanism 2 can be used to move the chip to the placement ring 431 instead of the robotic arm, simplifying the equipment structure and realizing the function.

[0029] Meanwhile, due to the setting of the programming time, the chip can be transferred to the placement ring 431 in other areas by the moving mechanism 2 during programming, and the programmed chip can be transferred to the blank position after programming is completed, so as to achieve time control and improve efficiency.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The above content is merely an example and illustration of the structure of this utility model. Those skilled in the art can make various modifications or additions to the specific embodiments described or use similar methods to replace them, as long as they do not deviate from the structure of the utility model or the scope defined by the claims of this utility model, they should all fall within the protection scope of this utility model.

Claims

1. A chip programming device, characterized in that: Includes a base plate (1), and a chip-carrying programming mechanism (4) is provided on the top of the base plate (1). The programming mechanism (4) includes a support platform and movable parts. A plurality of programming modules (44) are provided on the support platform. The programming mechanism (4) has a moving mechanism (2) on the side away from the base plate (1). The moving mechanism (2) is used to transfer the chip. The moving part moves the chip to abut against the programming module (44); or the moving mechanism (2).

2. The chip programming device according to claim 1, characterized in that: The support platform includes two sets of support plates (45), and a fixing plate (46) is provided between the two sets of support plates (45). A plurality of programming modules (44) are arranged in a linear array on the side of the fixing plate (46) away from the base plate (1).

3. The chip programming device according to claim 2, characterized in that: The movable component includes several lifting cylinders (41), which are located on the side of the fixed plate (46) away from the programming module (44). Each of the programming modules (44) has the same number of lifting rod through holes (461) on one side. The lifting rod of the fixed plate (46) passes through the lifting rod through holes (461). The end of the lifting rod of the fixed plate (46) is provided with a lifting bending plate (42). The lifting bending plate (42) has an L-shaped structure. One end of the lifting bending plate (42) is provided with a material placement groove (43). The lifting rod of the fixed plate (46) pushes the lifting bending plate (42) to move between the programming module (44) and the moving mechanism (2). The material placement groove (43) is provided with a placement ring (431) for placing the chip and the chip pins abut against the programming module (44) through the placement ring (431).

4. The chip programming device according to claim 3, characterized in that: The moving mechanism (2) includes two sets of supporting plates (21), and a wire crossbar (22) is provided between the two sets of supporting plates (21). The axis of the wire crossbar (22) is parallel to the array line of the plurality of programming modules (44). A sliding block (23) is provided on the wire crossbar (22). The sliding block (23) is slidably connected to the wire crossbar (22) by the wire axis. A movable fixing plate (31) is provided on the side of the sliding block (23) near the programming module (44). A transfer component (3) is provided on the movable fixing plate (31) for gripping the chip.

5. The chip programming device according to claim 4, characterized in that: The transfer component (3) includes several main rotating wheels (32), which are arranged in a linear array on the movable fixed plate (31). Each main rotating wheel (32) has an auxiliary rotating wheel (33) on the side near the burning mechanism (4). A transmission belt (331) is wrapped between the adjacent main rotating wheels (32) and the auxiliary rotating wheels (33). The movable fixed plate (31) is also provided with several drive motors (34), which drive the adjacent main rotating wheels (32) to rotate. An upgrade moving plate (35) is provided in the middle of the transmission belt (331), and a suction tube (36) is provided in the middle of the upgrade moving plate (35). The suction tube (36) is located on the central axis of the material placement groove (43), and a contact suction cup (362) is provided at one end of the suction tube (36) near the material placement groove (43).

6. The chip programming device according to claim 5, characterized in that: The suction tube (36) has an air extraction port (361) at one end away from the contact suction cup (362). The air extraction port (361) is connected to an air extraction device and passes through the middle of the contact suction cup (362) to extract air from the middle of the chip that is in contact with the contact suction cup (362).

7. The chip programming device according to claim 3, characterized in that: The material placement groove (43) and the abutting placement ring (431) are provided with through movable grooves (432) on both sides. A pressing plate (47) is provided in the movable groove (432). A positioning plate (471) is provided at one end of the pressing plate (47) away from the programming module (44). An arc-shaped pressing plate (472) is connected to the other end of the positioning plate (471) away from the pressing plate (47). The positioning plate (471) and the pressing plate (47) are combined to form an extension plate with a bent structure. The two sets of extension plates are bent and arranged opposite to each other. A rotating central shaft (473) is provided on both sides of the pressing plate (47). The rotating central shaft (473) passes through and is rotatably connected to both sides of the movable groove (432) to clamp and fix the chip to abut the programming module (44).

8. The chip programming device according to claim 7, characterized in that: A torsion spring (474) is provided between the movable groove (432) and the pressing plate (47), which is penetrated by the rotating central shaft (473).

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