A double-sided panel LED lamp strip

Abstract

The utility model relates to LED lamp strip technical field discloses a double -sided panel LED lamp strip, including the lamp strip body, the power supply connection end of lamp strip body is equipped with the gold finger subassembly for connecting and transmission power and signal, the inside of lamp strip body is equipped with the functional assembly for transmission current and signal realizes the function of emitting light, the interval of functional assembly is provided with the first protection subassembly for protecting internal structure, the outermost layer of functional assembly and first protection subassembly is equipped with the auxiliary protection subassembly for the heat dissipation of auxiliary protection internal part. The utility model discloses a silk screen printing trigger layer, and the copper plating on the trigger layer reduces the black hole carbon deposition process, and also does not need to etch, reaches the effect of reducing waste. And the trigger layer can use a small amount of copper, nickel or silver conductive paste, and the copper plating layer realizes the conduction, which greatly reduces the cost.

Description

Technical Field

[0001] This utility model relates to the field of LED light strip technology, specifically to a double-sided LED light strip. Background Technology

[0002] Double-sided LED light strips are light strips with copper-clad substrates on both sides. The LED beads are arranged on both sides or alternately, which has the characteristics of double-sided light emission, uniform brightness, and good heat dissipation. They are flexible in installation and suitable for display cases, decorative lighting and other scenarios. They have a wider light emission range and stronger stability than single-sided light strips.

[0003] Traditional flexible double-sided LED light strips involve drilling holes in both copper-clad laminates, then performing a black hole process on the holes. This black hole process involves chemically depositing conductive carbon on the hole walls, followed by copper plating on the carbon to connect the upper and lower conductive layers. Finally, conductive lines are etched onto the copper-clad laminate using concentrated acid. Traditional flexible double-sided boards cause significant environmental pollution. Therefore, those skilled in the art provide a double-sided LED light strip to solve the problems mentioned in the background art. Utility Model Content

[0004] The purpose of this utility model is to provide a double-sided LED light strip to solve the problems mentioned in the background art of the prior art.

[0005] This utility model provides the following technical solution: a double-sided LED light strip, including a light strip body, characterized in that: the power supply connection end of the light strip body is provided with a gold finger component for connecting and transmitting power and signals, the interior of the light strip body is provided with a functional component for transmitting current and signals to realize light emission, the intervals between the functional components are provided with a first protective component for protecting the internal structure, and the outermost layer of the functional components and the first protective component is provided with an auxiliary protective component for assisting in heat dissipation of internal components.

[0006] As a preferred embodiment of the above technical solution, the functional component includes a first trigger layer, which is disposed in the center of the interior of the light strip body. A first conductive layer is disposed on one side of the first trigger layer. A second trigger layer is soldered to the side of the first trigger layer away from the first conductive layer. The side of the second trigger layer away from the first trigger layer is electrically connected to the second conductive layer. A first solder layer is disposed on the side of the first conductive layer away from the first trigger layer. An LED or electronic component is soldered to the side of the first solder layer away from the first conductive layer. A second solder layer is disposed on the side of the second conductive layer away from the second trigger layer. Multiple sets of LEDs or electronic components are provided. One LED or electronic component is soldered to the second solder layer. The first conductive layer and the second conductive layer are connected through metal vias.

[0007] As a preferred embodiment of the above technical solution, the first protective component includes a second PI or PET substrate layer, the second PI or PET substrate layer is laminated to the side of the first trigger layer away from the first conductive layer, the side of the first conductive layer away from the first trigger layer is laminated with a first insulating layer, a first protective layer is provided between the first solder layer and the first insulating layer, the first protective layer is laminated with the first insulating layer, a second insulating layer is provided on the side of the second PI or PET substrate layer away from the first insulating layer, the second insulating layer is laminated with the second conductive layer, a second protective layer is laminated to one side of the second insulating layer, and the second protective layer is laminated with the second conductive layer.

[0008] As a preferred embodiment of the above technical solution, the auxiliary protection component includes an adhesive backing, which is disposed on the side of the first insulating layer away from the second PI or PET substrate layer, and a second heat dissipation layer is pressed onto the side of the second insulating layer away from the adhesive backing.

[0009] As a preferred embodiment of the above technical solution, the gold finger assembly includes a reinforcing plate layer disposed inside the gold finger assembly. One side of the reinforcing plate layer is sequentially provided with a first heat dissipation layer, a first PI or PET substrate layer, a primary trigger layer, a primary conductive layer, an electroless gold plating layer, and a primary insulating layer. The primary trigger layer is integrated with the first trigger layer, the primary conductive layer is integrated with the first conductive layer, and the primary insulating layer is integrated with the first insulating layer. The first heat dissipation layer is formed by printed heat dissipation ink.

[0010] As a preferred embodiment of the above technical solution, the first trigger layer and the second trigger layer are formed by printing conductive paste, and the first conductive layer and the second conductive layer are formed by electroless copper or nickel plating on the trigger layer.

[0011] As a preferred embodiment of the above technical solution, the first protective layer and the second protective layer have hollow areas that expose the conductive layer, and the first insulating layer and the second insulating layer are formed by a cover film or printed insulating ink.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention creates a via layer by drilling holes between the second PI or PET substrate layer and the first PI or PET substrate layer. The via layer is printed with the same conductive paste as the trigger layer, and a conductive layer is formed during the electroless copper plating process of the trigger layer. The via layer connects the upper and lower conductive layers. By using screen printing for the trigger layer and electroless copper plating on it, the black hole carbon deposition process is reduced, and etching is unnecessary, thus reducing waste. Furthermore, the trigger layer can use a small amount of copper, nickel, or silver conductive paste, with conductivity achieved through the electroless copper plating layer, significantly reducing costs.

[0014] Based on the above-mentioned beneficial effects, this utility model utilizes the first conductive layer and the second conductive layer to transmit current and power the LED. It utilizes the first trigger layer and the second trigger layer to assist the conductive layer in starting the transmission signal and ensure current stability. It utilizes the first solder layer and the second solder layer to connect the LED and the conductive layer, allowing the current to be transmitted smoothly. It utilizes the first insulating layer and the second insulating layer to isolate the conductive layer from the outside and avoid short circuits and leakage. It utilizes the adhesive backing to provide a bonding and fixing function, making it convenient for the light strip to be installed on various surfaces. It utilizes the second heat dissipation layer to quickly dissipate the heat generated by the LED during operation, delaying aging and extending its service life. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a double-sided LED strip light circuit.

[0016] Figure 2 A schematic diagram of the main functional components of a double-sided LED light strip;

[0017] Figure 3 This is a structural schematic diagram of the first protective component of a double-sided LED light strip.

[0018] Figure 4 This is a structural schematic diagram of an auxiliary protection component for a double-sided LED light strip.

[0019] Figure 5 This is a schematic diagram of the gold finger area of ​​a double-sided LED light strip.

[0020] In the diagram: 1. LED strip body; 2. Gold finger assembly; 21. Reinforcing plate layer; 22. First heat dissipation layer; 23. First PI or PET substrate layer; 24. Primary trigger layer; 25. Primary conductive layer; 26. Electroless gold plating layer; 27. Primary insulation layer; 3. Functional component; 31. First trigger layer; 32. First conductive layer; 33. Second trigger layer; 34. Second conductive layer; 35. First solder layer; 36. LED lamp or electronic component; 37. Second solder layer; 4. First protection component; 41. Second PI or PET substrate layer; 42. First insulation layer; 43. First protective layer; 44. Second insulation layer; 45. Second protective layer; 5. Auxiliary protection component; 51. Adhesive backing; 52. Second heat dissipation layer. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0022] Please see Figures 1-5As shown, this utility model provides a technical solution: a double-sided LED light strip, including a light strip body 1, a gold finger component 2 for connecting and transmitting power and signals at the power supply connection end of the light strip body 1, a functional component 3 for transmitting current and signals to realize light emission inside the light strip body 1, a first protective component 4 for protecting the internal structure at the interval of the functional component 3, and an auxiliary protective component 5 for assisting in heat dissipation of internal components at the outermost layer of the functional component 3 and the first protective component 4.

[0023] Furthermore, the gold finger component 2 is used to input power and control signals, thereby driving the LEDs of the light strip to emit light. The functional component 3 is used to transmit current, transmit signals and realize light emission. The first protection component 4 is used to prevent short circuit leakage and protect the internal structure. The auxiliary protection component 5 is used to facilitate installation and assist in heat dissipation.

[0024] As one implementation method in this embodiment, please refer to Figures 2-4 As shown, functional component 3 includes a first trigger layer 31, which is located in the center of the lamp strip body 1. A first conductive layer 32 is provided on one side of the first trigger layer 31. A second trigger layer 33 is soldered to the side of the first trigger layer 31 away from the first conductive layer 32. A second conductive layer 34 is electrically connected to the side of the second trigger layer 33 away from the first trigger layer 31. A first solder layer 35 is provided on the side of the first conductive layer 32 away from the first trigger layer 31. An LED lamp or electronic component 36 is soldered to the side of the first solder layer 35 away from the first conductive layer 32. A second solder layer 37 is provided on the side of the second conductive layer 34 away from the second trigger layer 33. Multiple sets of LED lamps or electronic components 36 are provided. One LED lamp or electronic component 36 is soldered to the second solder layer 37. The first conductive layer 32 and the second conductive layer 34 are connected through metal vias.

[0025] The first protective component 4 includes a second PI or PET substrate layer 41, which is pressed onto the side of the first trigger layer 31 away from the first conductive layer 32. A first insulating layer 42 is pressed onto the side of the first conductive layer 32 away from the first trigger layer 31. A first protective layer 43 is provided between the first solder layer 35 and the first insulating layer 42. The first protective layer 43 is pressed onto the first insulating layer 42. A second insulating layer 44 is provided on the side of the second PI or PET substrate layer 41 away from the first insulating layer 42. The second insulating layer 44 is pressed onto the second conductive layer 34. A second protective layer 45 is pressed onto one side of the second insulating layer 44. The second protective layer 45 is pressed onto the second conductive layer 34.

[0026] The auxiliary protection component 5 includes an adhesive backing 51, which is disposed on the side of the first insulating layer 42 away from the second PI or PET substrate layer 41, and a second heat dissipation layer 52 is pressed onto the side of the second insulating layer 44 away from the adhesive backing 51.

[0027] The first trigger layer 31 and the second trigger layer 33 are formed by printing conductive paste, and the first conductive layer 32 and the second conductive layer 34 are formed by electroless copper or nickel plating on the trigger layer.

[0028] The first protective layer 43 and the second protective layer 45 have hollow areas that expose the conductive layer, and the first insulating layer 42 and the second insulating layer 44 are formed by a cover film or printed insulating ink.

[0029] Furthermore, the first conductive layer 32 and the second conductive layer 34 are used to transmit current and power the LED. The first trigger layer 31 and the second trigger layer 33 assist the conductive layer in initiating the conduction signal and ensuring current stability. The first solder layer 35 and the second solder layer 37 connect the LED and the conductive layer, allowing the current to flow smoothly. The first insulating layer 42 and the second insulating layer 44 isolate the conductive layer from the outside to prevent short circuits and leakage. The adhesive backing 51 provides a bonding and fixing function, making it easy for the LED strip to be installed on various surfaces. The second heat dissipation layer 52 quickly dissipates the heat generated by the LED during operation, delaying aging and extending its service life. The trigger layer is screen-printed, and copper plating is applied to the trigger layer, reducing the need for black hole carbon deposition and etching, thus reducing waste. Moreover, the trigger layer can use a small amount of copper, nickel, or silver conductive paste, with conductivity achieved by the copper plating layer, significantly reducing costs.

[0030] As one implementation method in this embodiment, please refer to Figure 5 As shown, the gold finger assembly 2 includes a reinforcing plate layer 21, which is disposed inside the gold finger assembly 2. One side of the reinforcing plate layer 21 is sequentially provided with a first heat dissipation layer 22, a first PI or PET substrate layer 23, a primary trigger layer 24, a primary conductive layer 25, an electroless gold plating layer 26, and a primary insulating layer 27. The primary trigger layer 24 is integrated with the first trigger layer 31, the primary conductive layer 25 is integrated with the first conductive layer 32, and the primary insulating layer 27 is integrated with the first insulating layer 42. The first heat dissipation layer 22 is formed by printed heat dissipation ink.

[0031] Furthermore, the gold finger assembly 2 is mainly used for external power supply and control signals. The gold finger assembly 2 is located at the leftmost end of the light strip and is the key part for connecting the light strip with external power supply and control equipment. Through it, power and control signals are input, thereby driving the LEDs of the light strip to emit light.

[0032] Working Principle: The LED strip body 1 mainly includes core components such as LEDs, resistors (R), first conductive wires, second conductive wires, and vias. The gold finger assembly 2 is mainly used for external power supply and control signals. Located at the leftmost end of the LED strip, the gold finger assembly 2 is a key part for connecting the LED strip to external power supplies and control devices. It enables the input of power and control signals, thereby driving the LEDs of the LED strip to emit light. The first conductive layer 32 and the second conductive layer 34 are used to transmit current to power the LEDs. The first trigger layer 31 and the second trigger layer 33 are used to assist the conductive layer in starting the conduction signal and ensure current stability. The first solder layer 35 and the second solder layer 37 are used to connect the LEDs and the conductive layers, allowing the current to flow smoothly. The first insulating layer 42 and the second insulating layer 44 are used to isolate the conductive layers from the outside to prevent short circuits and leakage. The adhesive backing 51 provides a bonding and fixing function, making it easy for the LED strip to be installed on various surfaces. The second heat dissipation layer 52 is used to quickly dissipate the heat generated by the LEDs during operation, delaying aging and extending service life. By employing screen printing of the trigger layer and then electroplating copper onto it, the black hole carbon deposition process is reduced, and etching is no longer required, thus achieving a reduction in waste emissions. Furthermore, the trigger layer can use a small amount of conductive paste made of copper, nickel, or silver, with conductivity achieved through the electroplated copper layer, significantly lowering costs.

[0033] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A double-sided LED light strip, comprising a light strip body (1), characterized in that: The power supply connection end of the light strip body (1) is provided with a gold finger assembly (2) for connecting and transmitting power and signals. The interior of the light strip body (1) is provided with a functional component (3) for transmitting current and signals to achieve light emission. A first protective component (4) for protecting the internal structure is provided at the interval of the functional component (3). The outermost layer of the functional component (3) and the first protective component (4) is provided with an auxiliary protective component (5) for assisting in the heat dissipation of the internal parts.

2. The double-sided LED light strip according to claim 1, characterized in that: The functional component (3) includes a first trigger layer (31), which is located in the center of the lamp strip body (1). A first conductive layer (32) is provided on one side of the first trigger layer (31). A second trigger layer (33) is soldered to the side of the first trigger layer (31) away from the first conductive layer (32). A second conductive layer (34) is electrically connected to the side of the second trigger layer (33) away from the first trigger layer (31). 1) A first solder layer (35) is provided on one side. An LED lamp or electronic component (36) is soldered on the side of the first solder layer (35) away from the first conductive layer (32). A second solder layer (37) is provided on the side of the second conductive layer (34) away from the second trigger layer (33). Multiple sets of LED lamps or electronic components (36) are provided. One LED lamp or electronic component (36) is soldered to the second solder layer (37). The first conductive layer (32) and the second conductive layer (34) are connected through metal vias.

3. A double-sided LED light strip according to claim 2, characterized in that: The first protective component (4) includes a second PI or PET substrate layer (41), the second PI or PET substrate layer (41) is pressed onto the side of the first trigger layer (31) away from the first conductive layer (32), the side of the first conductive layer (32) away from the first trigger layer (31) is pressed with a first insulating layer (42), a first protective layer (43) is provided between the first solder layer (35) and the first insulating layer (42), the first protective layer (43) is pressed with the first insulating layer (42), a second insulating layer (44) is provided on the side of the second PI or PET substrate layer (41) away from the first insulating layer (42), the second insulating layer (44) is pressed with the second conductive layer (34), a second protective layer (45) is pressed with one side of the second insulating layer (44), and the second protective layer (45) is pressed with the second conductive layer (34).

4. A double-sided LED light strip according to claim 3, characterized in that: The auxiliary protection component (5) includes an adhesive backing (51), which is disposed on the side of the first insulating layer (42) away from the second PI or PET substrate layer (41), and a second heat dissipation layer (52) is pressed onto the side of the second insulating layer (44) away from the adhesive backing (51).

5. A double-sided LED light strip according to claim 1, characterized in that: The gold finger assembly (2) includes a reinforcing plate layer (21) disposed inside the gold finger assembly (2). One side of the reinforcing plate layer (21) is sequentially provided with a first heat dissipation layer (22), a first PI or PET substrate layer (23), a primary trigger layer (24), a primary conductive layer (25), a chemically plated gold layer (26), and a primary insulating layer (27). The primary trigger layer (24) is integrated with the first trigger layer (31), the primary conductive layer (25) is integrated with the first conductive layer (32), and the primary insulating layer (27) is integrated with the first insulating layer (42). The first heat dissipation layer (22) is formed by printed heat dissipation ink.

6. A double-sided LED light strip according to claim 2, characterized in that: The first trigger layer (31) and the second trigger layer (33) are formed by printing conductive paste, and the first conductive layer (32) and the second conductive layer (34) are formed by electroless copper or nickel plating on the trigger layer.

7. A double-sided LED light strip according to claim 3, characterized in that: The first protective layer (43) and the second protective layer (45) have hollow areas that expose the conductive layer, and the first insulating layer (42) and the second insulating layer (44) are formed by a cover film or printed insulating ink.

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