Heat dissipation device and photographic lamp

Abstract

The utility model relates to a kind of heat sink and photographic lamp, belong to photographic camera equipment technical field.Heat sink includes connecting plate, heat dissipation component and heat conduction component;Connecting plate has the object surface for carrying light source;Heat dissipation component is set in the side of connecting plate away from the object surface, and heat dissipation component is equipped with multiple heat dissipation channels arranged at intervals along the first direction.Heat sink includes at least two groups of heat conduction component sequentially arranged along the third direction;The evaporation section of one group of heat conduction component close to connecting plate is abutted with connecting plate, and its condensation section is connected with the evaporation section of another group of heat conduction component away from connecting plate heat conduction, to form the circulating heat dissipation structure of multiple levels in series in the third direction, so that the height difference between the evaporation section and condensation section inside each heat conduction component is segmented, and the span of the condensation section to the evaporation section of each heat conduction component significantly reduces, so that the backflow resistance of cold carrier in the direction of gravity is greatly reduced, and then the heat dissipation efficiency of heat sink is improved.

Description

Technical Field

[0001] This utility model relates to the field of photographic and video equipment technology, and in particular to a heat dissipation device and a photographic lamp. Background Technology

[0002] As the film and television industry continues to demand higher levels of lighting efficiency and brightness, the application of high-power film and television lights is becoming increasingly widespread. To achieve higher light output, film and television lights typically employ large-sized COB light sources. However, with the continuous increase in the power and area of ​​COB light sources, the heat generated is significantly increasing, placing higher demands on the heat dissipation system.

[0003] In existing technologies, high-power film and television lights generally adopt a forced convection cooling structure consisting of heat pipes, heat dissipation fins, and fans. The evaporation section of the heat pipes is in close contact with the COB lamp board, transferring the heat generated by the light source to the heat dissipation components that are far away from the light source. The heat dissipation components achieve condensation heat exchange through the condensation section, and then the fan accelerates the airflow to remove the accumulated heat.

[0004] However, as the power of film and television lights continues to increase, the size of the heat sink fins also increases, and the span (height difference) of the heat pipe from the evaporation section to the condensation section increases significantly. This makes it difficult for some of the refrigerant to return to the evaporation section in time, resulting in a continuous lack of liquid in the evaporation section. Heat cannot be effectively conducted, causing significant heat accumulation near the COB light source. This raises the temperature of the phosphor layer, leading to a decrease in spectral conversion efficiency and causing optical quality problems such as color temperature drift and reduced color rendering performance. Utility Model Content

[0005] The purpose of this invention is to solve the technical problem of poor heat dissipation in existing photographic lights.

[0006] To address the aforementioned technical problems, this application provides a heat dissipation device for dissipating heat from a light source, comprising: a connecting plate having a support surface for supporting the light source; a heat dissipation assembly disposed on the side of the connecting plate away from the support surface, the heat dissipation assembly having a plurality of heat dissipation channels spaced apart along a first direction; the heat dissipation channels extending along a second direction perpendicular to the first direction to penetrate both sides of the heat dissipation assembly; and a heat-conducting assembly including an evaporation section, a condensation section, and a transition section; the evaporation section and the condensation section passing through the heat dissipation assembly along the first direction; the evaporation section and the condensation section spaced apart along a third direction perpendicular to the support surface, the transition section connecting the evaporation section and the condensation section to form a circulation pipeline; wherein, the heat dissipation device includes at least two sets of heat-conducting assemblies arranged sequentially along a third direction; the evaporation section of one set of heat-conducting assemblies near the connecting plate abuts against the connecting plate, and its condensation section is thermally connected to the evaporation section of another set of heat-conducting assemblies away from the connecting plate, to form a multi-stage series circulation heat dissipation structure in the third direction.

[0007] In some examples of this application, the heat dissipation device includes a first heat-conducting component and a second heat-conducting component; the first heat-conducting component and the second heat-conducting component are arranged sequentially in a third direction; the evaporation section of the first heat-conducting component abuts against the connecting plate, and the outer wall of the condensation section of the first heat-conducting component is thermally connected to the outer wall of the evaporation section of the second heat-conducting component.

[0008] In some examples of this application, the heat dissipation device further includes a third heat-conducting component, which is arranged sequentially with the first heat-conducting component in a third direction; the evaporation section of the third heat-conducting component is thermally connected to the condensation section of the first heat-conducting component, and the distance between the evaporation section and the condensation section of the third heat-conducting component is greater than the distance between the evaporation section and the condensation section of the second heat-conducting component.

[0009] In some examples of this application, the distance between the evaporation section and the condensation section of the first thermally conductive component is less than or equal to the distance between the evaporation section and the condensation section of the second thermally conductive component.

[0010] In some examples of this application, the first heat-conducting component, the second heat-conducting component, and the third heat-conducting component all include a plurality of heat-conducting pipes spaced apart along a second direction; each heat-conducting pipe includes an evaporation section, a condensation section, and a transition section connecting the evaporation section and the condensation section, so that each heat-conducting pipe constitutes a closed loop pipeline; and each heat-conducting pipe is filled with a refrigerant.

[0011] In some examples of this application, the heat pipes of the second heat-conducting component and the heat pipes of the third heat-conducting component are arranged alternately along a second direction.

[0012] In some examples of this application, the heat dissipation assembly includes a first fin group and a second fin group arranged sequentially along a third direction; the first fin group has a plurality of first receiving grooves extending along a first direction on the side facing the connecting plate for accommodating the evaporation section of the first heat-conducting component; the first fin group has a plurality of second receiving grooves extending along the first direction on the side facing away from the connecting plate for accommodating the condensation section of the first heat-conducting component; the second fin group has a plurality of third receiving grooves extending along the first direction on the side facing the first fin group for accommodating the evaporation sections of the second heat-conducting component and the third heat-conducting component; the second fin group also has two sets of mounting holes extending along the first direction for accommodating the condensation sections of the second heat-conducting component and the third heat-conducting component.

[0013] In some examples of this application, the heat dissipation assembly further includes an adapter plate; the adapter plate is disposed between the first fin group and the second fin group; the side of the adapter plate facing the first fin group is provided with a fourth receiving groove that matches the second receiving groove; the side of the adapter plate facing the second fin group is provided with a fifth receiving groove that matches the third receiving groove.

[0014] In some examples of this application, the heat dissipation device further includes a third heat-conducting component, the third heat-conducting component and the second heat-conducting component are arranged sequentially in a third direction, the evaporation section of the third heat-conducting component is thermally connected to the condensation section of the second heat-conducting component, and the condensation section and the evaporation section of the third heat-conducting component are spaced apart along the third direction.

[0015] This application also provides a photographic lamp, comprising: a light source for generating photographic illumination; a heat dissipation device as described above, wherein the light source is disposed on the loading surface of the connecting plate of the heat dissipation device; a fan mounting bracket disposed on the heat dissipation device and located on the opening side of the heat dissipation channel of the heat dissipation device; and a cooling fan disposed on the heat dissipation device via the fan mounting bracket for forming an airflow flowing along the direction of the heat dissipation channel within the heat dissipation channel.

[0016] As can be seen from the above technical solution, the beneficial effects of this utility model are as follows: This application provides a heat dissipation device. The device comprises at least two sets of sequentially arranged heat-conducting components arranged in a third-order direction. The evaporation section of the heat-conducting component closest to the connecting plate directly contacts the connecting plate, rapidly absorbing the heat generated by the light source. Simultaneously, its condensation section is thermally connected to the evaporation section of the adjacent set of heat-conducting components. Multiple heat-conducting components can be arranged in this manner, forming a multi-stage series heat dissipation circulation structure in the height direction. The height difference between the evaporation and condensation sections within each heat-conducting component is segmented, significantly reducing the span between the condensation and evaporation sections in each circulation pipe. This greatly reduces the backflow resistance of the refrigerant in the anti-gravity direction, allowing it to smoothly return to the corresponding evaporation section to participate in the next round of thermal circulation. This effectively avoids the problems of obstructed refrigerant backflow, insufficient liquid in the evaporation section, and decreased heat transfer efficiency caused by excessive overall height difference in traditional single long pipes. It achieves continuous and efficient heat dissipation of the light source, making the operating temperature of the light source more stable and avoiding phenomena such as decreased phosphor conversion efficiency, spectral drift, and brightness attenuation caused by high temperature accumulation, thereby improving the overall performance and service life of the equipment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the three-dimensional structure of a photographic light.

[0018] Figure 2 for Figure 1A three-dimensional structural diagram of the heat dissipation device for a photographic light.

[0019] Figure 3 for Figure 2 A cross-sectional view of the heat dissipation device.

[0020] Figure 4 for Figure 2 Another cross-sectional view of the heat dissipation device.

[0021] Figure 5 for Figure 2 Another cross-sectional structural diagram of the heat dissipation device in the middle.

[0022] Figure 6 for Figure 2 A schematic diagram of the exploded structure of the heat dissipation device.

[0023] The annotations in the attached figures are explained as follows: 100. Photographic light; 10. Heat dissipation device; 11. Connecting plate; 111. Loading surface; 12. Heat dissipation assembly; 121. First fin group; 1211. First receiving slot; 1212. Second receiving slot; 122. Second fin group; 1221. Third receiving slot; 1222. Mounting hole; 123. Adapter plate; 1231. Fourth receiving slot; 1232. Fifth receiving slot; 13. Thermal conductive assembly; 130. Heat pipe; 1301. Evaporation section; 1302. Condensation section; 1303. Transition section; 131. First thermal conductive assembly; 132. Second thermal conductive assembly; 133. Third thermal conductive assembly; 14. Fan mounting bracket; 20. Light source; 30. Cooling fan. Detailed Implementation

[0024] Typical embodiments embodying the features and advantages of this utility model will be described in detail in the following description. It should be understood that this utility model can have various variations in different embodiments, all of which do not depart from the scope of this utility model, and the descriptions and illustrations therein are for illustrative purposes only and not intended to limit this utility model.

[0025] In the description of this application, it should be understood that, in the embodiments shown in the accompanying drawings, the indications of direction or positional relationships (such as up, down, left, right, front, and back, etc.) are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the mechanism or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. These descriptions are appropriate when these elements are in the positions shown in the accompanying drawings. If the description of the positions of these elements changes, these directional indications also change accordingly.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0027] Please see Figures 1 to 6 This embodiment provides a photographic lamp 100, which includes a heat dissipation device 10, a light source 20, and a cooling fan 30.

[0028] The light source 20 is typically a high-power COB light source board, which can be mounted on the top surface of the heat dissipation device 10 and closely fitted to it to ensure that the heat generated by the light source 20 can be transferred through the heat dissipation device 10. The cooling fan 30 can be mounted on the side of the heat dissipation device 10 to create airflow that carries away the heat from the heat dissipation device 10, thereby achieving rapid temperature reduction and stable control of the light source 20 under high-power operation, ensuring the luminous efficiency and color quality of the light source 20.

[0029] Please see Figures 2 to 6 In some embodiments, the heat dissipation device 10 includes a connecting plate 11, a heat dissipation component 12, and a heat conduction component 13.

[0030] The connecting plate 11 has a carrying surface 111 for supporting the light source 20. The heat dissipation assembly 12 is disposed on the side of the connecting plate 11 away from the carrying surface 111, and the heat dissipation assembly 12 has a plurality of heat dissipation channels arranged at intervals along a first direction; the heat dissipation channels extend along a second direction perpendicular to the first direction to penetrate both sides of the heat dissipation assembly 12.

[0031] The heat-conducting component 13 includes an evaporation section 1301, a condensation section 1302, and a transition section 1303. The evaporation section 1301 and the condensation section 1302 are disposed within the heat dissipation component 12 along a first direction. The evaporation section 1301 and the condensation section 1302 of each heat-conducting component 13 are arranged at intervals along a third direction perpendicular to the loading surface 111, and the transition section 1303 connects the evaporation section 1301 and the condensation section 1302 to form a circulation pipeline.

[0032] The heat dissipation device 10 includes at least two sets of heat-conducting components 13 arranged sequentially along a third direction. The evaporation section 1301 of the set of heat-conducting components 13 near the connecting plate 11 abuts against the connecting plate 11, and its condensation section 1302 is thermally connected to the evaporation section 1301 of the other set of heat-conducting components 13 away from the connecting plate 11, so as to form a multi-stage series circulating heat dissipation structure in the third direction.

[0033] Specifically, the heat dissipation device 10 is installed on the back of the light source 20 module of the photographic lamp 100 to conduct and dissipate the large amount of heat generated by the light source 20 during operation in a timely and effective manner.

[0034] The heat dissipation device 10 includes a connecting plate 11, which can be a VC heat spreader. One side of the connecting plate 11 is provided with a support surface 111 for supporting the COB light source 20 module or other forms of high-power light source 20. The heat generated by the light source 20 is first transferred to the connecting plate 11, and then transferred through the connecting plate 11 to the heat dissipation component 12 located on the side of the component facing away from the support surface 111.

[0035] The heat dissipation component 12 is provided with multiple heat dissipation channels arranged at intervals along the first direction. The heat dissipation channels penetrate the heat dissipation component 12 along the second direction, so that the airflow generated by the cooling fan 30 can form a stable through-flow heat dissipation path in the heat dissipation channel, thereby efficiently removing the heat released by the condensation section 1302.

[0036] By tightly abutting the evaporation section 1301 of a group of heat-conducting components 13 near the connecting plate 11, the heat source 20 directly absorbs the initial heat transferred from the connecting plate 11. The condensation section 1302 of the heat dissipation component 12 is positioned further away from the connecting plate 11 and is thermally connected to the evaporation section 1301 of another adjacent group of heat-conducting components 13. This allows the condensation section 1302 of the heat-conducting component 13 to not only release heat into the heat dissipation component 12 but also transfer some heat to the evaporation section 1301 of the next group of heat-conducting components 13, enabling it to continue evaporative heat exchange as a relay. This creates a multi-stage series heat dissipation circulation structure for the entire heat dissipation device 10.

[0037] This multi-stage series structure decomposes the height difference between the evaporation section 1301 and the condensation section 1302 of a traditional single long tube into multiple smaller stage differences. This allows the refrigerant inside each stage of the heat-conducting component 13 to smoothly complete the process of returning from the condensation section 1302 to the evaporation section 1301 under smaller height differences. Because the gravitational resistance of the return path is significantly reduced, the refrigerant can continuously, stably, and promptly return to the evaporation section 1301 to participate in the next round of vaporization heat exchange. This effectively avoids problems such as poor refrigerant return, insufficient liquid in the evaporation section 1301, and decreased heat transfer efficiency caused by excessive height differences in traditional structures. Even under extreme conditions where the photographic lamp 100 is pointing upwards and the heat pipe is in the opposite direction of gravity, the multi-stage series structure of this embodiment can still ensure smooth return, allowing the heat generated by the light source 20 to be extracted in a timely manner.

[0038] Please see Figure 3In some embodiments, the heat dissipation device 10 includes a first heat-conducting component 131 and a second heat-conducting component 132. The first heat-conducting component 131 and the second heat-conducting component 132 are arranged sequentially in the third direction. The evaporation section 1301 of the first heat-conducting component 131 abuts against the connecting plate 11, and the outer wall of the condensation section 1302 of the first heat-conducting component 131 is thermally connected to the outer wall of the evaporation section 1301 of the second heat-conducting component 132.

[0039] Specifically, such as Figure 3 As shown, the heat dissipation device 10 includes a first heat-conducting component 131 and a second heat-conducting component 132, which are arranged sequentially along a third direction perpendicular to the loading surface 111, thereby forming a two-stage heat dissipation path in the height direction.

[0040] The evaporation section 1301 of the first heat-conducting component 131 directly abuts against the connecting plate 11, allowing the heat generated by the light source 20 during operation to be quickly absorbed by the heat-conducting component 13 and transferred to the refrigerant inside within the shortest distance. After absorbing heat, the refrigerant enters the transition section 1303 from the evaporation section 1301 and flows to the condensation section 1302 to complete heat exchange. To reduce the height span of a single-stage heat-conducting component 13, in this embodiment, the condensation section 1302 of the first heat-conducting component 131 is thermally connected to the evaporation section 1301 of the second heat-conducting component 132, enabling the heat condensed by the first heat-conducting component 131 to be efficiently transferred to the evaporation section 1301 of the second heat-conducting component 132, achieving segmented heat relay conduction.

[0041] That is, by connecting two sets of heat-conducting components 13 in series in the height direction, the height difference between the condensation section 1302 and the evaporation section 1301, which originally needed to be carried by a single long heat pipe, is divided into several smaller sections, which significantly improves the stability of the heat dissipation device 10 in the anti-gravity direction. In particular, when the photography light 100 shines upward, it can still ensure that the refrigerant flows back quickly and participates in the next heat dissipation cycle.

[0042] Please see Figure 4 In some embodiments, the heat dissipation device 10 further includes a third heat-conducting component 133. The third heat-conducting component 133 and the first heat-conducting component 131 are arranged sequentially in a third direction; the evaporation section 1301 of the third heat-conducting component 133 is thermally connected to the condensation section 1302 of the first heat-conducting component 131. Furthermore, the distance h3 between the evaporation section 1301 and the condensation section 1302 of the third heat-conducting component 133 is greater than the distance h2 between the evaporation section 1301 and the condensation section 1302 of the second heat-conducting component 132.

[0043] Specifically, the third heat-conducting component 133 and the first heat-conducting component 131 are also arranged sequentially along the third direction. The spacing between the evaporation section 1301 and the condensation section 1302 of the third heat-conducting component 133 is designed to be larger, allowing the condensation section 1302 to be located further away from the light source 20. This enables the second heat-conducting component 132 and the third heat-conducting component 133 to form a gradient heat dissipation. That is, because the spacing between the evaporation section 1301 and the condensation section 1302 of the third heat-conducting component 133 is larger, a height difference is formed between it and the condensation area of ​​the second heat-conducting component 132, making it easier for both the third heat-conducting component 133 and the condensation section 1302 of the second heat-conducting component 132 to dissipate heat and cool down.

[0044] Of course, in some other embodiments, the third heat-conducting component 133 and the second heat-conducting component 132 can also be arranged sequentially in the third direction. In this case, the evaporation section 1301 of the third heat-conducting component 133 and the condensation section 1302 of the second heat-conducting component 132 are thermally connected, and the condensation section 1302 and the evaporation section 1301 of the third heat-conducting component 133 are spaced apart along the third direction. That is, the first heat-conducting component 131, the second heat-conducting component 132 and the third heat-conducting component 133 are arranged side by side in the third direction to form a three-stage series heat dissipation structure.

[0045] Please see Figure 4 In some embodiments, the distance h1 between the evaporation section 1301 and the condensation section 1302 of the first heat-conducting component 131 is less than or equal to the distance h2 between the evaporation section 1301 and the condensation section 1302 of the second heat-conducting component 132.

[0046] Specifically, the first heat-conducting component 131 is the heat-conducting path closest to the connecting plate 11, and its evaporation section 1301 is directly attached to the connecting plate 11 to absorb heat from the light source 20 in the first instance. In order to ensure that the component can quickly complete the evaporation and reflux circulation of the liquid medium, a small height difference is designed between its evaporation section 1301 and condensation section 1302, so that the coolant can quickly flow back to the evaporation section 1301.

[0047] The distance h2 between the evaporation section 1301 and the condensation section 1302 of the second heat-conducting component 132 is slightly greater than or equal to that of the first heat-conducting component 131, and the distance h3 between the evaporation section 1301 and the condensation section 1302 of the third heat-conducting component 133 is greater than that between the evaporation section 1301 and the condensation section 1302 of the second heat-conducting component 132; so that heat dissipation can be carried out in stages at the height H of the heat dissipation component 12, so as to take into account both fast response and large-volume heat dissipation.

[0048] This height difference design allows the first heat-conducting component 131 at the front end to complete the closed loop of evaporation and recirculation at the fastest speed, thereby reducing the initial heat accumulation on the back of the light source 20. The second and third heat-conducting components 132 and 133 serve as subsequent heat dissipation units to cool the first heat-conducting component 131. This not only improves the circulation stability of the working medium inside the heat dissipation device 10 but also avoids the problem of excessively high local temperatures caused by poor recirculation in a certain stage of the heat-conducting component 13. This ensures that the operating temperature of the light source 20 is always maintained within a low and stable range, effectively improving the luminous efficacy, lifespan, and color temperature stability of the light source 20. Please see Figure 3 and Figure 4 In some embodiments, the first heat-conducting component 131, the second heat-conducting component 132, and the third heat-conducting component 133 each include a plurality of heat-conducting pipes 130 spaced apart along a second direction. Each heat-conducting pipe 130 includes an evaporation section 1301, a condensation section 1302, and a transition section 1303 connecting the evaporation section 1301 and the condensation section 1302, so that each heat-conducting pipe 130 forms a closed-loop pipeline. Furthermore, each heat-conducting pipe 130 is filled with a refrigerant.

[0049] Specifically, the first heat-conducting component 131, the second heat-conducting component 132, and the third heat-conducting component 133 are all composed of multiple heat-conducting pipes 130 arranged at intervals along the second direction. Each heat-conducting pipe 130 has an evaporation section 1301, a condensation section 1302, and a transition section 1303 connecting the two, so that the entire heat-conducting pipe 130 forms a closed circulation pipeline. The parallel arrangement of multiple heat-conducting pipes 130 can significantly increase the effective heat exchange area of ​​the evaporation end and the condensation end, improve the heat dispersion rate, and enable different heat-conducting components 13 to achieve more efficient heat transfer under their respective heat flux densities.

[0050] Of course, in some other embodiments, the heat-conducting component 13 can adopt an annular flat plate-shaped loop structure, that is, the heat-conducting component 13 is composed of multiple flat heat-conducting plates, which sequentially form an evaporation zone, a transition zone and a condensation zone, and are also filled with a refrigerant to form a closed loop system.

[0051] Please see Figure 3 and Figure 4 In some embodiments, the heat pipe 130 of the second heat-conducting component 132 and the heat pipe 130 of the third heat-conducting component 133 are arranged alternately along a second direction.

[0052] Specifically, the heat pipes 130 of the second heat-conducting component 132 and the third heat-conducting component 133 are arranged in a hybrid "cross-connection" layout. This alternating arrangement allows the condensation sections 1302 of the second and third heat-conducting components 132 and 133 to form a more uniform distribution along the height of the heat dissipation component 12, preventing excessive heat load in localized areas due to concentrated placement of any one component. Furthermore, the condensation sections 1302 of different heat pipes 130 are no longer clustered in the same localized area, but are evenly distributed in a larger condensation space, allowing the airflow generated by the fan to more effectively act on each condensation zone, further improving the overall heat exchange efficiency of the heat dissipation device 10.

[0053] Please see Figure 6 In some embodiments, the heat dissipation assembly 12 includes a first fin group 121 and a second fin group 122 arranged sequentially along a third direction.

[0054] On the side of the first fin assembly 121 facing the connecting plate 11, there are multiple first receiving grooves 1211 extending along the first direction for accommodating the evaporation section 1301 of the first heat-conducting component 131. On the side of the first fin assembly 121 away from the connecting plate 11, there are multiple second receiving grooves 1212 extending along the first direction for accommodating the condensation section 1302 of the first heat-conducting component 131.

[0055] The second fin assembly 122 has a plurality of third receiving grooves 1221 extending along a first direction on one side facing the first fin assembly 121, for accommodating the evaporation sections 1301 of the second heat-conducting component 132 and the third heat-conducting component 133. The second fin assembly 122 also has two sets of mounting holes 1222 extending along the first direction, for accommodating the condensation sections 1302 of the second heat-conducting component 132 and the third heat-conducting component 133.

[0056] Specifically, the heat dissipation assembly 12 consists of a first fin group 121 and a second fin group 122 arranged along a third direction. Each fin group consists of multiple metal fins stacked at intervals along the first direction, forming a heat dissipation channel with uniform height and consistent size between adjacent fins, so that the airflow generated by the cooling fan 30 can pass through the fins fully, improving the convective heat transfer efficiency.

[0057] The first fin assembly 121 has multiple first receiving grooves 1211 extending along a first direction on its top surface near the connecting plate 11. These grooves stably fix the evaporation section 1301 of the first heat-conducting component 131, ensuring that the evaporation section 1301 is tightly fitted to the high-temperature area of ​​the fins, thereby enabling it to absorb heat from the connecting plate 11 and the light source 20 in a timely manner. The first fin assembly 121 also has multiple second receiving grooves 1212 extending along the first direction on its bottom surface away from the connecting plate 11, for embedding the condensation section 1302 of the first heat-conducting component 131.

[0058] Furthermore, the second fin assembly 122 is also composed of multiple uniformly stacked metal fins. A third receiving groove 1221 extending along a first direction is provided on the top surface of the second fin assembly 122 for embedding the evaporation sections 1301 of the second heat-conducting component 132 and the third heat-conducting component 133, bringing them close to the condensation zone of the first fin assembly 121 and enabling them to directly absorb the heat released by the condensation section 1302 of the first heat-conducting component 131. In addition, two sets of mounting holes 1222 of different heights are provided on the distal fins of the second fin assembly 122 for accommodating the condensation sections 1302 of the second heat-conducting component 132 and the third heat-conducting component 133, placing them in a more efficient, distal condensation region for higher condensation efficiency.

[0059] Please see Figure 6 In some embodiments, the heat dissipation assembly 12 further includes an adapter plate 123. The adapter plate 123 is disposed between the first fin group 121 and the second fin group 122.

[0060] The adapter plate 123 has a fourth receiving groove 1231 on the side facing the first fin group 121 that matches the second receiving groove 1212; the adapter plate 123 has a fifth receiving groove 1232 on the side facing the second fin group 122 that matches the third receiving groove 1221.

[0061] Specifically, a metal adapter plate 123 is added between the first fin group 121 and the second fin group 122 in the heat dissipation component 12. The adapter plate 123 is closely attached to the two fin groups to form a stable heat transfer interface between the first fin group 121 and the second fin group 122.

[0062] The adapter plate 123 forms a plurality of fourth receiving grooves 1231 on the side facing the first fin group 121. The shape, size and spacing of the fourth receiving grooves 1231 are matched with the second receiving grooves 1212 on the first fin group 121, so that the condensation section 1302 of the first heat conduction component 131 can be accommodated in the circular through hole formed by the docking of the second receiving groove 1212 and the fourth receiving grooves 1231.

[0063] Correspondingly, a fifth receiving groove 1232 is provided on the side of the adapter plate 123 facing the second fin group 122, which matches the third receiving groove 1221 on the second fin group 122, for positioning the evaporation section 1301 of the second heat conduction component 132 and the third heat conduction component 133.

[0064] By setting a transition plate 123 between the two fin assemblies as a transition layer, the thermal coupling between adjacent heat-conducting components 13 is made tighter. The metal body of the transition plate 123 has good planar rigidity and lateral heat transfer capability, so it can form a uniform heat diffusion plane between the first heat-conducting component 131 and the second and third heat-conducting components 133, avoiding heat transfer only through the fin edges or local contact areas.

[0065] Please see Figure 6 In some embodiments, the heat dissipation device 10 is further provided with a fan mounting bracket 14. The fan mounting bracket 14 is disposed on the heat dissipation assembly 12 and is connected to the opening side of the heat dissipation channel located on the heat dissipation assembly 12 for connecting the cooling fan 30.

[0066] Specifically, the fan mounting bracket 14 is fixedly mounted on the outer surface of the heat dissipation assembly 12 and covers the opening side of the heat dissipation channel. The fan mounting bracket 14 can be made of die-cast aluminum alloy, and its structure is usually ring-shaped or plate-shaped, with a mounting opening matching the fan's dimensions formed on the side near the heat dissipation channel. Threaded holes can be provided around the mounting opening so that the cooling fan 30 can be quickly installed onto the fan mounting bracket 14.

[0067] In summary, this embodiment provides a heat dissipation device 10. The heat dissipation device 10 has at least two sets of sequentially arranged heat-conducting components 13 arranged in the third direction, so that the evaporation section 1301 of the heat-conducting component 13 closest to the connecting plate 11 is in direct contact with the connecting plate 11, so as to quickly absorb the heat generated by the light source 20. At the same time, its condensation section 1302 is thermally connected to the evaporation section 1301 of the adjacent heat-conducting component 13, so that multiple heat-conducting components 13 form a multi-stage series heat dissipation circulation structure in the height direction.

[0068] With this structure, the height difference between the evaporation section 1301 and the condensation section 1302 inside each heat-conducting component 13 is segmented. The span between the condensation section 1302 and the evaporation section 1301 in each stage of the circulation pipeline is significantly reduced, greatly reducing the backflow resistance of the refrigerant in the anti-gravity direction, allowing it to smoothly return to the corresponding evaporation section 1301 to participate in the next round of thermal cycling. This effectively avoids the problems of refrigerant backflow obstruction, liquid shortage in the evaporation section 1301, and decreased heat transfer efficiency caused by the excessive overall height difference in traditional single long heat pipes. It achieves continuous and efficient heat dissipation of the light source 20, making the operating temperature of the light source 20 more stable, avoiding phenomena such as decreased phosphor conversion efficiency, spectral drift, and brightness decay caused by high temperature accumulation, thereby improving the overall performance and service life of the equipment.

[0069] Although the present invention has been described with reference to several typical embodiments, it should be understood that the terminology used is descriptive and exemplary, and not restrictive. Since the present invention can be embodied in many forms without departing from the spirit or essence of the invention, it should be understood that the above embodiments are not limited to any of the foregoing details, but should be interpreted broadly within the spirit and scope defined by the appended claims. Therefore, all variations and modifications falling within the scope of the claims or their equivalents should be covered by the appended claims.

Claims

1. A heat dissipation device for dissipating heat from a light source, characterized in that, include: A connecting plate having a support surface for supporting the light source; A heat dissipation assembly is disposed on the side of the connecting plate away from the loading surface. The heat dissipation assembly has a plurality of heat dissipation channels arranged at intervals along a first direction. The heat dissipation channels extend along a second direction perpendicular to the first direction to penetrate both sides of the heat dissipation assembly. A heat-conducting component includes an evaporation section, a condensation section, and a transition section; the evaporation section and the condensation section are disposed within the heat dissipation component along a first direction; the evaporation section and the condensation section are arranged at intervals along a third direction perpendicular to the surface of the object, and the transition section connects the evaporation section and the condensation section to form a circulation pipeline; The heat dissipation device includes at least two sets of heat-conducting components arranged sequentially along a third direction; the evaporation section of the set of heat-conducting components near the connecting plate abuts against the connecting plate, and its condensation section is thermally connected to the evaporation section of the other set of heat-conducting components away from the connecting plate, so as to form a multi-stage series circulating heat dissipation structure in the third direction.

2. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device includes a first heat-conducting component and a second heat-conducting component; the first heat-conducting component and the second heat-conducting component are arranged sequentially in a third direction; the evaporation section of the first heat-conducting component abuts against the connecting plate, and the outer wall of the condensation section of the first heat-conducting component is thermally connected to the outer wall of the evaporation section of the second heat-conducting component.

3. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device further includes a third heat-conducting component, which is arranged sequentially with the first heat-conducting component in a third direction; the evaporation section of the third heat-conducting component is thermally connected to the condensation section of the first heat-conducting component, and the distance between the evaporation section and the condensation section of the third heat-conducting component is greater than the distance between the evaporation section and the condensation section of the second heat-conducting component.

4. The heat dissipation device according to claim 3, characterized in that, The distance between the evaporation section and the condensation section of the first heat-conducting component is less than or equal to the distance between the evaporation section and the condensation section of the second heat-conducting component.

5. The heat dissipation device according to claim 3, characterized in that, The first, second, and third heat-conducting components each include a plurality of heat-conducting pipes spaced apart along a second direction; each heat-conducting pipe includes an evaporation section, a condensation section, and a transition section connecting the evaporation section and the condensation section, so that each heat-conducting pipe forms a closed loop; and each heat-conducting pipe is filled with a refrigerant.

6. The heat dissipation device according to claim 5, characterized in that, The heat pipes of the second heat-conducting component and the heat pipes of the third heat-conducting component are arranged alternately along the second direction.

7. The heat dissipation device according to claim 3, characterized in that, The heat dissipation assembly includes a first fin group and a second fin group arranged sequentially along a third direction. The first fin assembly has a plurality of first receiving grooves extending in a first direction on the side facing the connecting plate, for accommodating the evaporation section of the first heat-conducting component; the first fin assembly has a plurality of second receiving grooves extending in a first direction on the side facing away from the connecting plate, for accommodating the condensation section of the first heat-conducting component. The second fin assembly has a plurality of third receiving grooves extending along a first direction on one side facing the first fin assembly, for accommodating the evaporation sections of the second and third heat-conducting components; the second fin assembly also has two sets of mounting holes extending along the first direction, for accommodating the condensation sections of the second and third heat-conducting components.

8. The heat dissipation device according to claim 7, characterized in that, The heat dissipation assembly further includes an adapter plate; the adapter plate is disposed between the first fin group and the second fin group; the side of the adapter plate facing the first fin group is provided with a fourth receiving groove that matches the second receiving groove; the side of the adapter plate facing the second fin group is provided with a fifth receiving groove that matches the third receiving groove.

9. The heat dissipation device according to claim 2, characterized in that, The heat dissipation device further includes a third heat-conducting component. The third heat-conducting component and the second heat-conducting component are arranged sequentially in a third direction. The evaporation section of the third heat-conducting component is thermally connected to the condensation section of the second heat-conducting component. The condensation section and the evaporation section of the third heat-conducting component are spaced apart along the third direction.

10. A photographic light, characterized in that, include: Light source, used to generate photographic lighting; The heat dissipation device as described in any one of claims 1-9, wherein the light source is disposed on the loading surface of the connecting plate of the heat dissipation device; A fan mounting bracket is disposed on the heat dissipation device and located on the opening side of the heat dissipation channel of the heat dissipation device; A cooling fan, mounted on the heat dissipation device via a fan mounting bracket, is used to generate airflow along the direction of the heat dissipation channel within the heat dissipation channel.

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