A high-power uv curing lamp with convenient heat dissipation

Abstract

The utility model discloses a high -power UV curing lamp convenient to radiate heat, including shell body, light -transmitting plate, heat conduction plate, UV light source and blower mechanism, the side of shell body is provided with ventilation and heat dissipation groove, and the bottom detachably fixed of shell body has light -transmitting plate, and heat conduction plate fixed mounting is in the inside top of shell body, and UV light source fixed mounting is in the downside of heat conduction plate, and the upside of heat conduction plate is fixed with a plurality of extension to the outside of shell body's big heat dissipation fin, and one side of big heat dissipation fin is installed with the other side of honeycomb hole structure and is provided with semiconductor refrigeration piece, and the hot end of semiconductor refrigeration piece is installed with small heat dissipation fin. The utility model discloses through heat conduction, semiconductor refrigeration, the compound radiating structure of shunt type air cooling realizes high -efficient heat dissipation, and the whole structure does not adopt water -cooling design, and the radiating efficiency and equipment compactness are given full play to.

Description

Technical Field

[0001] This utility model relates to the field of UV curing lamp technology, and in particular to a high-power UV curing lamp that is easy to dissipate heat. Background Technology

[0002] In the application of high-power UV curing lamps, UV light sources generate a lot of heat during operation. If the heat cannot be dissipated in time, it will not only accelerate the light decay of the light source and shorten its service life, but may also affect the curing efficiency and the curing quality of photosensitive materials due to local overheating. Therefore, efficient heat dissipation is the core requirement for the design of high-power UV curing lamps.

[0003] Existing technologies for heat dissipation solutions for high-power UV curing lamps have significant limitations: On the one hand, mainstream air-cooling solutions mostly employ a single airflow direct blowing or a simple finned heat dissipation structure, failing to provide targeted and precise heat dissipation for the light source and heat dissipation components. Furthermore, the fins are mostly smooth designs with limited contact area with air, causing heat to easily accumulate around the light source and on the fins, resulting in low heat dissipation efficiency and difficulty in meeting the continuous heat dissipation requirements of high-power light sources. On the other hand, some water-cooling solutions with better heat dissipation effects require supporting components such as water tanks, water pipes, and water pumps, leading to a large overall size and heavy weight of the equipment. Therefore, in response to the above situation, there is an urgent need to develop a high-power UV curing lamp that achieves efficient heat dissipation through a composite heat dissipation structure combining heat conduction, semiconductor cooling, and shunt air cooling, without adopting a water-cooling design, and balancing heat dissipation efficiency with equipment compactness, in order to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content

[0004] The purpose of this invention is to provide a high-power UV curing lamp that facilitates heat dissipation, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-power UV curing lamp with convenient heat dissipation includes a housing, a light-transmitting plate, a heat-conducting plate, a UV light source, and a blower mechanism. The housing has ventilation and heat dissipation grooves on its side. The light-transmitting plate is detachably fixed to the bottom of the housing. The heat-conducting plate is fixedly installed inside the top of the housing. The UV light source is fixedly installed below the heat-conducting plate. Multiple large heat dissipation fins extending to the outside of the housing are fixed to the upper side of the heat-conducting plate. A semiconductor cooling chip is installed on one side of each large heat dissipation fin, and a honeycomb structure is provided on the other side. Small heat dissipation fins are installed at the hot end of the semiconductor cooling chip. The blower mechanism includes a sleeve, a fan, a first nozzle, a splitter pipe, and second nozzles. The sleeve is fixed inside the housing. A fan is installed at the inlet of the sleeve. A first nozzle is installed on the right side of the sleeve. A splitter pipe extending to the outside of the housing is connected to the first nozzle. Multiple second nozzles are installed on the splitter pipe, and the second nozzles face the semiconductor cooling chip.

[0007] Preferably, the first blower nozzle is facing the UV light source.

[0008] Preferably, two hanging mounting brackets are fixed on the upper side of the outer casing.

[0009] Preferably, the heat-conducting plate, large heat dissipation fins, and small heat dissipation fins are all made of copper.

[0010] The beneficial effects of this invention are as follows: This high-power UV curing lamp, which facilitates heat dissipation, directly conducts heat to the outside through the heat-conducting plate and large heat dissipation fins when the UV light source generates a large amount of heat during operation. The honeycomb structure increases the contact area between the large heat dissipation fins and the air, improving heat dissipation efficiency. The semiconductor cooling chip cools the large heat dissipation fins, enhancing their heat dissipation effect on the UV light source. Simultaneously, a fan blows air into the sleeve; one portion of the direct current blows directly from the first nozzle to the UV light source, carrying away heat from the UV light source; the other portion of the airflow blows from the splitter pipe and the second nozzle to the semiconductor cooling chip for heat dissipation, thus maintaining the continuous cooling effect of the semiconductor cooling chip. In summary, this invention achieves efficient heat dissipation through a composite heat dissipation structure of heat conduction, semiconductor cooling, and split-flow air cooling, and the overall structure does not employ a water-cooling design, balancing heat dissipation efficiency and equipment compactness. Attached Figure Description

[0011] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0012] Figure 2 This is an internal sectional view of the present invention.

[0013] Figure 3 This is a partial structural diagram of the present invention. Figure 1 .

[0014] Figure 4 This is a partial structural diagram of the present invention. Figure 2 .

[0015] Legend:

[0016] 1. Outer casing; 101. Ventilation and heat dissipation slot; 2. Hanging mounting bracket; 3. Light-transmitting plate; 4. Heat-conducting plate; 401. Large heat dissipation fins; 4011. Honeycomb structure; 402. Semiconductor cooling chip; 403. Small heat dissipation fins; 5. UV light source; 6. Air blower mechanism; 601. Sleeve; 602. Fan; 603. First air nozzle; 604. Diverter pipe; 605. Second air nozzle. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0018] Specific implementation examples are given below.

[0019] See Figures 1-4In this embodiment of the present invention, a high-power UV curing lamp with convenient heat dissipation includes a housing 1, a light-transmitting plate 3, a heat-conducting plate 4, a UV light source 5, and a blower mechanism 6. The housing 1 has ventilation and heat dissipation grooves 101 on its side for airflow to achieve heat dissipation. The light-transmitting plate 3 is detachably fixed to the bottom of the housing 1. The heat-conducting plate 4 is fixedly installed inside the top of the housing 1. The UV light source 5 is fixedly installed below the heat-conducting plate 4. Multiple large heat dissipation fins 401 extending to the outside of the housing 1 are fixed to the upper side of the heat-conducting plate 4. A semiconductor cooling chip 402 is installed on one side of each large heat dissipation fin 401, and a honeycomb structure 4011 is provided on the other side. The honeycomb structure 4011 increases the contact area between the large heat dissipation fins 401 and the air, improving heat dissipation efficiency. Small heat dissipation fins 403 are installed on the hot end of the semiconductor cooling chip 402, which dissipate heat from the semiconductor cooling chip 402. The heat from the hot end of the thermoelectric cooler 402 is dissipated outwards. The blower mechanism 6 includes: a sleeve 601, a fan 602, a first nozzle 603, a splitter pipe 604, and a second nozzle 605. The sleeve 601 is fixed inside the outer casing 1. The fan 602 is installed at the inlet of the sleeve 601. The first nozzle 603 is installed on the right side of the sleeve 601. The first nozzle 603 faces the UV light source 5. A splitter pipe 604 extending to the outside of the outer casing 1 is connected to the first nozzle 603. Multiple second nozzles 605 are installed on the splitter pipe 604. The second nozzles 605 face the thermoelectric cooler 402. The fan 602 blows air into the sleeve 601. One part of the direct current blows directly from the first nozzle 603 to the UV light source 5, and the other part of the airflow blows from the splitter pipe 604 and the second nozzles 605 to the thermoelectric cooler 402 to dissipate heat.

[0020] Electrical control components (not shown in the figure) are also installed inside the outer casing 1.

[0021] The heat-conducting plate 4, the large heat dissipation fins 401, and the small heat dissipation fins 403 are all made of copper, giving them good thermal conductivity.

[0022] Two hanging brackets 2 are fixed on the upper side of the outer shell 1 for hanging and installing the outer shell 1.

[0023] Working principle: This high-power UV curing lamp, which facilitates heat dissipation, generates a large amount of heat when the UV light source 5 is running. The heat is directly conducted to the outside through the heat-conducting plate 4 and the large heat dissipation fins 401. The honeycomb structure 4011 increases the contact area between the large heat dissipation fins 401 and the air, improving the heat dissipation efficiency. The semiconductor cooling chip 402 cools the large heat dissipation fins 401, improving the heat dissipation effect of the large heat dissipation fins 401 on the UV light source 5. At the same time, the fan 602 blows air into the sleeve 601. One part of the direct current blows directly from the first air nozzle 603 to the UV light source 5, and the airflow carries away the heat on the UV light source 5. The other part of the airflow blows from the split pipe 604 and the second air nozzle 605 to the semiconductor cooling chip 402 to dissipate heat, thereby maintaining the continuous cooling effect of the semiconductor cooling chip 402.

[0024] Furthermore, it should be noted that, in the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-power UV curing lamp with convenient heat dissipation, characterized in that, The device includes an outer shell (1), a light-transmitting plate (3), a heat-conducting plate (4), a UV light source (5), and a blower mechanism (6). The outer shell (1) has ventilation and heat dissipation grooves (101) on its side. The light-transmitting plate (3) is detachably fixed to the bottom of the outer shell (1). The heat-conducting plate (4) is fixedly installed inside the top of the outer shell (1). The UV light source (5) is fixedly installed below the heat-conducting plate (4). Multiple large heat dissipation fins (401) extending to the outside of the outer shell (1) are fixed to the upper side of the heat-conducting plate (4). One side of each large heat dissipation fin (401) is equipped with a semiconductor cooling chip (402), and the other side has a honeycomb structure (4011). The semiconductor cooling chip (402)... The hot end is equipped with small heat dissipation fins (403). The blower mechanism (6) includes: a sleeve (601), a fan (602), a first blower nozzle (603), a diverter pipe (604), and a second blower nozzle (605). The sleeve (601) is fixed inside the outer shell (1). The fan (602) is installed at the inlet of the sleeve (601). The first blower nozzle (603) is installed on the right side of the sleeve (601). The diverter pipe (604) extending to the outside of the outer shell (1) is connected to the first blower nozzle (603). A plurality of second blower nozzles (605) are installed on the diverter pipe (604). The second blower nozzles (605) face the semiconductor cooling chip (402).

2. The high-power UV curing lamp with easy heat dissipation according to claim 1, characterized in that, The first blower nozzle (603) is facing the UV light source (5).

3. The high-power UV curing lamp with easy heat dissipation according to claim 1, characterized in that, Two hanging brackets (2) are fixed on the upper side of the outer shell (1).

4. The high-power UV curing lamp with easy heat dissipation according to claim 1, characterized in that, The heat-conducting plate (4), large heat dissipation fins (401), and small heat dissipation fins (403) are all made of copper.

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