Temperature reducing assembly and air outlet device

Abstract

The utility model relates to the technical field of home appliances, disclose cooling assembly and air outlet device, cooling assembly includes semiconductor refrigeration spare, its cold end is located on the air supply path of air outlet device, is used for absorbing the heat in the air supply of air outlet device, heat dissipation module includes airflow driving part and heat dissipation air duct, and the export direction of heat dissipation air duct is different from the air outlet direction of air outlet device, the hot end of semiconductor refrigeration spare is located in heat dissipation air duct, and airflow driving part is used for driving airflow to be guided to the hot end of semiconductor refrigeration spare along heat dissipation air duct, and is discharged from the export of heat dissipation air duct after cooling semiconductor refrigeration spare. Heat dissipation air duct can isolate hot air and export hot air to the whole machine outside, thereby can effectively avoid the heat diffusion of semiconductor refrigeration spare hot end to the whole machine inside, make the air outlet temperature of whole machine too high, or cause the problem of heat damage to the electric element in the whole machine inside.

Description

Technical Field

[0001] This utility model relates to the field of home appliance technology, specifically to cooling components and air outlet devices. Background Technology

[0002] Existing air conditioners and evaporative coolers have limited cooling effects. To improve cooling efficiency, most current technologies use ice crystal boxes or electronic ice tanks to lower the water temperature in the water tank. However, evaporative cooling technology has an upper limit to its cooling capacity due to its inherent principles. In contrast, portable air conditioners with compressor cooling are more powerful, but at the cost of being bulky and significantly noisy. Both types of air conditioners have technical bottlenecks in terms of portability and user experience, requiring further optimization.

[0003] To address the aforementioned issues, those skilled in the art employ thermoelectric coolers for cooling, which improves the cooling capacity of the air outlet device while minimizing size and noise. However, since thermoelectric coolers generate a significant amount of heat during cooling, this heat may cause excessively high outlet temperatures or excessively high temperatures in other internal electrical components of the unit. Utility Model Content

[0004] In view of this, the present invention provides a cooling component and an air outlet device to solve the problem that the heat dissipated by the semiconductor cooling component in the existing air outlet device using semiconductor refrigeration can easily lead to excessively high air outlet temperature of the whole machine or excessively high temperature rise of other electrical components inside the whole machine.

[0005] In a first aspect, this utility model provides a cooling component, comprising: A semiconductor cooling device, the cold end of which is located in the air supply path of the air outlet device, is used to absorb heat in the air supply of the air outlet device; The heat dissipation module includes an airflow drive component and a heat dissipation duct. The outlet of the heat dissipation duct is connected to the external space of the air outlet device, and the outlet direction of the heat dissipation duct is different from the air outlet direction of the air outlet device. The hot end of the semiconductor cooling device is located in the heat dissipation duct. The airflow drive is used to drive the airflow along the heat dissipation duct to the hot end of the semiconductor cooling device, and after cooling the semiconductor cooling device, it is discharged from the outlet of the heat dissipation duct.

[0006] Beneficial effects: By placing the cold end of the semiconductor cooling component in the air supply path of the air outlet device, the air blown out by the air outlet device can be directly cooled, resulting in better cooling effect. Furthermore, the airflow drive component and heat dissipation duct not only guide the airflow to the hot end of the semiconductor cooling component to cool it down, but the heat dissipation duct also isolates the hot air and vents it to the outside of the whole machine. This effectively prevents the heat from the hot end of the semiconductor cooling component from diffusing into the whole machine, causing the outlet air temperature of the whole machine to be too high, or causing thermal damage to the electrical components inside the whole machine. This solves the problem that the heat dissipated by the semiconductor cooling component in the existing semiconductor cooling air outlet device can easily lead to the outlet air temperature of the whole machine being too high or the temperature rise of other electrical components inside the whole machine being too high.

[0007] In one alternative implementation, the heat dissipation module further includes: The heat sink is located inside the heat dissipation duct, and the hot end of the semiconductor cooling device is connected to the heat sink.

[0008] Beneficial effects: By installing a heat sink in the heat dissipation duct and connecting the hot end of the semiconductor cooling device to the heat sink, the heat generated by the hot end of the semiconductor cooling device can be transferred to the heat sink, thereby expanding the heat dissipation area. When the semiconductor cooling device is working, the airflow drive blows air into the heat dissipation duct. Due to the large heat dissipation area of ​​the heat sink, the heat on the heat sink can be quickly carried away, further improving the heat dissipation efficiency of the semiconductor cooling device. In one alternative implementation, the cooling component further includes: The cold end of the semiconductor refrigeration component is connected to the heat-conducting component. The air supplied by the air outlet device passes through the heat-conducting component, which absorbs the heat in the air and transfers it to the semiconductor refrigeration component.

[0009] Beneficial Effects: The cold end of the thermoelectric cooler is tightly connected to the heat-conducting component. When the thermoelectric cooler is energized, the cold end quickly absorbs heat from the heat-conducting component, lowering its temperature. The air blown out by the air outlet passes through the heat-conducting component, which has a large contact area with the air, resulting in high thermal conductivity. The heat of the blown air is absorbed by the heat-conducting component and conducted to the cold end of the thermoelectric cooler. This application, by connecting the cold end of the thermoelectric cooler to the heat-conducting component, increases the contact area between the cold end of the thermoelectric cooler and the air. Furthermore, the air from the air outlet passes through the heat-conducting component, achieving a direct cooling effect on the blown air, further cooling the air blown out by the air outlet and improving the cooling capacity of the air outlet.

[0010] In one alternative implementation, the cooling component further includes: The fixed bracket is used to mount the semiconductor cooling components and airflow drive components, and the fixed bracket forms a heat dissipation airflow channel.

[0011] Beneficial effects: The fixed brackets can secure the various components of the cooling system and connect them to the main air duct or the outer casing of the unit. A heat dissipation duct is formed on the brackets, and the air blown out by the airflow drive component flows through the heat dissipation duct and finally exits from the outlet of the heat dissipation duct. This design can prevent the hot air blown out by the airflow drive component from flowing into the main air duct or other electrical components, which would cause the air temperature in the main air duct to be too high or cause other electrical components to overheat and cause related safety hazards. At the same time, the heat dissipation duct can quickly dissipate hot air to the outside of the unit, thereby improving heat dissipation efficiency.

[0012] In one alternative implementation, the mounting bracket forms two sets of heat dissipation ducts; Two sets of heat dissipation air ducts are distributed on opposite sides of the fixed bracket, with two sets corresponding to the semiconductor cooling components and airflow driving components. Beneficial effects: By setting up two sets of heat dissipation ducts, semiconductor cooling components, and airflow drive components, the heat dissipation effect of the semiconductor cooling components and the cooling efficiency of the air outlet device can be further improved.

[0013] In one alternative embodiment, the fixing bracket is installed at the main air outlet of the air outlet device; The fixed bracket also has a heat-conducting component mounting part for installing heat-conducting components. When the heat-conducting component is installed in the heat-conducting component mounting part, the heat-conducting component corresponds to the main air outlet.

[0014] Beneficial effects: The heat-conducting component can be installed and fixed by the heat-conducting component mounting part set on the fixed bracket. The heat-conducting component corresponds to the main air outlet, so that the air coming out of the main air outlet first absorbs part of the heat of the air through the heat-conducting component before being blown out. In addition, the entire cooling component is set in a position close to the main air outlet, so that the air cooled by the cooling component is directly blown out through the main air outlet, with less heat loss and better cooling effect.

[0015] In one alternative embodiment, the heat-conducting component mounting portion includes a mounting groove formed in the middle of the fixed bracket; The heat-conducting component is embedded in the mounting groove, and the cold end of the semiconductor cooling component abuts against the side wall of the heat-conducting component.

[0016] Beneficial effects: The heat-conducting component is embedded in the mounting groove, making the overall structure more compact. Furthermore, the cold end of the semiconductor cooling component and the side wall of the heat-conducting component are engaged by abutting each other, which can achieve heat conduction on the one hand and fixation of the semiconductor cooling component and the heat-conducting component on the other.

[0017] In one alternative embodiment, the fixing bracket includes an annular bracket body, the bracket body comprising: The two support sidewalls are arranged opposite each other, and the cross-section of the support sidewalls is U-shaped, and the side openings of the two support sidewalls are arranged opposite each other; The semiconductor cooling component is sealed at the side opening of the bracket sidewall and forms the air inlet section of the heat dissipation air duct with the bracket sidewall; A heat sink is installed inside the air inlet section, and a semiconductor cooling component is clamped and fixed between the heat sink and the heat conduction component. Beneficial effects: The bracket body, with its two U-shaped sidewalls, not only limits the heat-conducting components but also forms a heat dissipation duct. By placing the thermoelectric cooler at the side opening of the blocked bracket sidewall, the thermoelectric cooler also functions as part of the heat dissipation duct structure. This ensures the airtightness of the heat dissipation duct while facilitating contact and engagement between the thermoelectric cooler and the heat sink and heat conductor, ensuring the cooling effect of the thermoelectric cooler on the airflow from the outlet device. Furthermore, the thermoelectric cooler is fixed between the heat sink and heat conductor by clamping, ensuring close contact and heat conduction while also securing the thermoelectric cooler and simplifying the assembly process.

[0018] In one optional implementation, the heat dissipation duct further includes an air outlet section, which is connected to the air inlet section and the two are set at a set angle. The mounting bracket also includes: A lateral air outlet is fixedly mounted on the top of the support body and extends away from the side wall of the support. The interior of the lateral air outlet is hollow to form an air outlet section; and / or, The supporting and limiting part is fixedly installed at the bottom of the bracket body and avoids the inlet of the heat dissipation air duct. The supporting and limiting part can restrict the downward displacement of the heat conduction component, and the two sides of the supporting and limiting part and the bottom wall of the bracket body form an installation space that can accommodate the airflow driving component. The air outlet of the airflow drive component is connected to the inlet of the heat dissipation duct.

[0019] Beneficial effects: The fixed bracket adopts a side air outlet design, with an air outlet section set at a predetermined angle to the air inlet section. This allows for reverse airflow, ensuring that the hot airflow from the heat dissipation module exits from the side of the air outlet, preventing the hot airflow from blowing directly out from the top of the air outlet and spreading throughout the room. The support and limiting part at the bottom of the bracket body not only restricts the downward displacement of the guide component, preventing it from falling, but also forms an installation space with the bottom wall of the bracket body to accommodate the airflow drive component, facilitating its installation.

[0020] Secondly, this utility model also provides an air outlet device, including a housing and a cooling component installed inside the housing; The outer casing is equipped with a main air outlet and a heat dissipation air outlet. The main air outlet and the heat dissipation air outlet face different directions, and the outlet of the heat dissipation air duct is adapted to connect with the heat dissipation air outlet.

[0021] In one alternative implementation, the air outlet device includes a cooling fan or an air conditioner. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0023] Figure 1 This is a front view of the air outlet device in an embodiment of this utility model; Figure 2 This is a longitudinal sectional view of the air outlet device in an embodiment of this utility model; Figure 3 This is a cross-sectional view of the air outlet device in an embodiment of this utility model; Figure 4 for Figure 3 Enlarged view of the structure at the intermediate cooling component; Figure 5 This is a schematic diagram of the internal structure of the air outlet device in an embodiment of this utility model; Figure 6 for Figure 5 A partial isometric sectional view; Figure 7 for Figure 6 The front view; Figure 8 for Figure 7 A schematic diagram after removing the heat sink; Figure 9 for Figure 6 Cross-sectional view of the cooling component; Figure 10 This is a schematic diagram of the structure of the fixed bracket in an embodiment of this utility model; Figure 11 This is a schematic diagram of the structure of the heat-conducting component in an embodiment of this utility model; Figure 12 This is a schematic diagram of the heat sink in an embodiment of the present invention; Figure 13 This is a schematic diagram of the structure of the semiconductor cooling device in an embodiment of this utility model.

[0024] Explanation of reference numerals in the attached figures: 100. Cooling components; 11. Semiconductor cooling components; 12. Airflow drive components; 13. Heat sink components; 14. Thermal conductive components; 15. Fixed bracket; 150. Heat dissipation duct; 1501. Inlet; 1502. Outlet; 151. Support body; 1510. Mounting groove; 1511. Support side wall; 152. Side air outlet; 153. Supporting and limiting part; 200. Air outlet device; 201. Main air outlet; 202. Air outlet grille; 203. Outer shell; 204. Chassis; 205. Fan wheel; 206. Main air duct. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0026] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0029] The following is combined Figures 1 to 13 The following describes embodiments of the present invention.

[0030] According to an embodiment of the present invention, in one aspect, the present invention provides a cooling component 100, including a semiconductor cooling element 11 and a heat dissipation module. The cold end of the semiconductor cooling element 11 is located on the air supply path of the air outlet device 200 and is used to absorb heat in the air supply of the air outlet device 200. The heat dissipation module includes an airflow drive element 12 and a heat dissipation duct 150. The outlet 1502 of the heat dissipation duct 150 is connected to the external space of the air outlet device 200, and the direction of the outlet 1502 of the heat dissipation duct 150 is different from the air supply direction of the air outlet device 200. The hot end of the semiconductor cooling element 11 is located in the heat dissipation duct 150. The airflow drive element 12 is used to drive the airflow along the heat dissipation duct 150 to the hot end of the semiconductor cooling element 11, and after cooling the semiconductor cooling element 11, it is discharged from the outlet 1502 of the heat dissipation duct 150.

[0031] In the above embodiment, by placing the cold end of the thermoelectric cooler 11 in the air supply path of the air outlet device 200, the air blown out by the air outlet device can be directly cooled, resulting in a better cooling effect. Furthermore, the airflow drive 12 and the heat dissipation duct 150 not only guide the airflow to the hot end of the thermoelectric cooler 11 to cool it down, but the heat dissipation duct 150 also isolates the hot air and exhausts it to the outside of the machine, thereby effectively preventing the heat from the hot end of the thermoelectric cooler 11 from spreading into the machine. This design avoids the problem of the hot air coming out of the heat dissipation duct 150 mixing with the air coming out of the air outlet 200, which would otherwise cause the overall air temperature to rise or damage the electrical components inside the unit. Furthermore, the direction of the outlet 1502 of the heat dissipation duct 150 is different from the air outlet direction of the air outlet device 200, which can effectively prevent the hot air coming out of the heat dissipation duct 150 from mixing with the air coming out of the air outlet device 200, resulting in a high air temperature and affecting the user experience. This design solves the problem in the prior art where the air outlet device 200 using the semiconductor cooling component 11 for cooling is prone to excessively high air temperature of the whole unit or other electrical components inside the unit.

[0032] Based on the above embodiments, as a further defined embodiment, the semiconductor cooling element 11 is a semiconductor cooling chip, which has a cold side and a hot side. The cold end of the semiconductor cooling element 11 is the cold side of the semiconductor cooling chip, and the hot end of the semiconductor cooling element 11 is the hot side of the semiconductor cooling chip. The semiconductor cooling element 11 is located on the side of the air supply path of the air outlet device 200 that is close to the main air outlet 201 of the whole machine.

[0033] Based on the above embodiments, as a further defined embodiment, the airflow drive component 12 includes, but is not limited to, a fan or a heatsink. Preferably, the airflow drive component 12 is a cooling fan; specifically, the airflow drive component 12 is a conventional small fan.

[0034] It should be explained that the semiconductor cooling method used in this embodiment achieves directional heat transfer through the Peltier effect. The Peltier effect is as follows: when current passes through a junction composed of two different semiconductor materials (P-type and N-type), heat is absorbed on one side of the junction, i.e., the cold end, and heat is released on the other side, i.e., the hot end.

[0035] The air outlet device 200 in this embodiment includes, but is not limited to, a cooling fan and an air conditioner. Preferably, the air outlet device 200 is a cooling fan. Compared with the prior art, the cooling fan of this application achieves a better cooling effect by using the aforementioned cooling component 100. In addition, the cooling component 100 can be located at any position on the fan's air delivery path. Preferably, the cooling component 100 is located on the side near the main air outlet 201. The cooling fan provided in this embodiment includes a fan assembly, which includes a main air duct 206 and a fan wheel 205 disposed in the main air duct 206. The blades of the fan wheel 205 are driven to rotate by a motor, and electrical energy is converted into airflow using aerodynamics, thereby achieving the purpose of ventilation or cooling.

[0036] In one optional embodiment, the heat dissipation module further includes a heat sink 13, which is disposed within the heat dissipation duct 150, and the hot end of the semiconductor cooling element 11 is connected to the heat sink 13.

[0037] Based on the above embodiments, as a further defined embodiment, the hot end of the semiconductor cooling element 11 is in contact with the heat sink 13.

[0038] In the above embodiment, by providing a heat sink 13 in the heat dissipation duct 150 and connecting the hot end of the semiconductor cooler 11 to the heat sink 13, the heat generated by the hot end of the semiconductor cooler 11 can be transferred to the heat sink 13, thereby expanding the heat dissipation area. When the semiconductor cooler 11 is working, the airflow drive 12 blows air into the heat dissipation duct 150. Since the heat dissipation area of ​​the heat sink 13 is large, the heat on the heat sink 13 can be quickly carried away, further improving the heat dissipation efficiency of the semiconductor cooler 11.

[0039] In a specific example of the above implementation, the heat sink 13 is a heat sink with a larger heat dissipation area. The hot end of the semiconductor cooling element 11 is closely connected to the heat sink. The heat conducted to the hot end of the semiconductor cooling element 11 through the Peltier effect will be quickly conducted to the heat sink. The heat sink expands the heat dissipation area and improves the heat dissipation efficiency. A cooling fan is installed at one end of the heat sink. After the cooling fan blows air, it will quickly carry away the heat on the heat sink, further improving the heat dissipation efficiency.

[0040] In one optional embodiment, the cooling component 100 further includes a heat-conducting element 14, the cold end of the semiconductor cooling element 11 is connected to the heat-conducting element 14, and the air supplied by the air outlet device 200 passes through the heat-conducting element 14, whereby the heat-conducting element 14 absorbs the heat in the air supply and transfers it to the semiconductor cooling element 11.

[0041] In the above embodiment, the cold end of the thermoelectric cooler 11 is closely connected to the heat conductor 14. When the thermoelectric cooler 11 is energized, the cold end quickly absorbs the heat from the heat conductor 14, reducing the temperature of the heat conductor 14. The air blown out by the air outlet device 200 passes through the heat conductor 14. The heat conductor 14 has a large contact area with the air and high thermal conductivity. The heat of the blown air is absorbed by the heat conductor 14 and conducted to the cold end of the thermoelectric cooler 11. By connecting the cold end of the thermoelectric cooler 11 to the heat conductor 14, this application can increase the contact area between the cold end of the thermoelectric cooler 11 and the air. Furthermore, the air delivered by the air outlet device 200 passes through the heat conductor 14, achieving a direct cooling effect on the blown air, further cooling the air blown out by the air outlet device 200, and improving the cooling capacity of the air outlet device 200.

[0042] Based on the above embodiments, as a further defined embodiment, both the heat-conducting component 14 and the heat-dissipating component 13 are composed of materials with good thermal conductivity, such as copper or aluminum alloy. The heat-conducting component 14 is a heat-conducting plate with several ventilation holes. The extension direction of the plate surface of the heat-conducting component 14 intersects the air outlet direction of the main air outlet 201. Preferably, the extension direction of the plate surface of the heat-conducting component 14 is perpendicular to the air outlet direction of the main air outlet 201, so that the air delivered by the air outlet device 200 can pass perpendicularly through the heat-conducting component 14.

[0043] Based on the above embodiments, as a further defined embodiment, the heat-conducting component 14 includes an outer frame and a heat-conducting plate disposed within the outer frame. The heat-conducting plate is hollowed out and has several ventilation holes.

[0044] In one optional embodiment, the cooling component 100 further includes a fixed bracket 15, on which the semiconductor cooling component 11 and the airflow driving component 12 are mounted, and the fixed bracket 15 forms a heat dissipation duct 150.

[0045] In the above embodiment, the fixed bracket 15 can fix the various components of the cooling component 100 and connect and fix it to the main air duct 206 or the outer casing 203 of the whole machine. A heat dissipation air duct 150 is formed on it. The air blown out by the airflow drive component 12 will flow through the heat dissipation air duct 150 and finally blow out from the outlet 1502 of the heat dissipation air duct 150. This arrangement can prevent the hot air blown out by the airflow drive component 12 from flowing into the main air duct 206 or other electrical components, so that the temperature of the air in the main air duct 206 is too high, or other electrical components will overheat and cause related safety hazards. At the same time, the heat dissipation air duct 150 can quickly dissipate hot air to the outside of the machine body, thereby improving the heat dissipation efficiency.

[0046] Based on the above embodiments, as a further specified embodiment, the fixed bracket 15 is made of a rigid material, preferably a plastic part, which is convenient for processing and molding. The fixed bracket 15 can be fixedly connected to the main air duct 206 or the machine body by means of screws, snap-fit, welding or other methods.

[0047] In one optional embodiment, the fixed bracket 15 has two sets of heat dissipation ducts 150; the two sets of heat dissipation ducts 150 are distributed on opposite sides of the fixed bracket 15, and the semiconductor cooling component 11 and the airflow driving component 12 are respectively provided in two sets. In the above embodiment, by setting two sets of heat dissipation ducts 150, semiconductor cooling components 11, and airflow drive components 12, the heat dissipation effect of semiconductor cooling components 11 and the cooling efficiency of air outlet device 200 can be further improved.

[0048] Based on the above embodiments, as a further defined embodiment, two sets of semiconductor cooling components 11 are disposed on opposite sides of the heat-conducting component 14, and two sets of heat dissipation air ducts 150 are also distributed on both sides of the heat-conducting component 14. The semiconductor cooling components 11 abut against the side walls of the heat-conducting component 14, and the airflow driving component 12 is disposed at the inlet 1501 of the heat dissipation air duct 150. The outlets 1502 of the two heat dissipation air ducts 150 are in opposite directions to avoid the airflow blown out by the heat dissipation module being concentrated on one side, resulting in a higher temperature and affecting the user experience.

[0049] In one alternative embodiment, the fixing bracket 15 is installed at the main air outlet 201 of the air outlet device 200; the fixing bracket 15 also forms a heat-conducting component mounting part for installing the heat-conducting component 14, and when the heat-conducting component 14 is installed in the heat-conducting component mounting part, the heat-conducting component 14 corresponds to the main air outlet 201.

[0050] In the above embodiment, the heat-conducting component 14 can be installed and fixed by the heat-conducting component mounting part provided on the fixed bracket 15, and the heat-conducting component 14 corresponds to the main air outlet 201, so that the air coming out of the main air outlet 201 first absorbs part of the heat of the air through the heat-conducting component 14 before being blown out. In addition, the entire cooling component 100 is set in a position close to the main air outlet 201, so that the air cooled by the cooling component 100 is directly blown out through the main air outlet 201, resulting in less heat loss and better cooling effect.

[0051] Based on the above embodiments, as a further defined embodiment, the projection of the heat-conducting element 14 on the outer casing 203 falls into the main air outlet 201.

[0052] In one alternative embodiment, the heat-conducting component mounting portion includes a mounting groove 1510 formed in the middle of the fixed bracket 15; the heat-conducting component 14 is embedded in the mounting groove 1510, and the cold end of the semiconductor cooling component 11 abuts against the side wall of the heat-conducting component 14.

[0053] In the above embodiment, the heat-conducting component 14 is embedded in the mounting groove 1510, making the overall structure more compact. Furthermore, the cold end of the semiconductor cooling component 11 and the side wall of the heat-conducting component 14 are engaged by abutting each other, which can achieve heat conduction on the one hand and fixation of the semiconductor cooling component 11 and the heat-conducting component 14 on the other.

[0054] In one optional embodiment, the fixed bracket 15 includes an annular bracket body 151, the bracket body 151 includes two bracket sidewalls 1511 disposed opposite to each other, the cross-section of the bracket sidewalls 1511 is U-shaped, and the side openings of the two bracket sidewalls 1511 are disposed opposite to each other; the semiconductor cooling element 11 is sealed at the side opening of the bracket sidewall 1511 and forms an air inlet section of the heat dissipation duct 150 with the bracket sidewall 1511; a heat sink 13 is installed in the air inlet section, and the semiconductor cooling element 11 is clamped and fixed between the heat sink 13 and the heat conductor 14. In the above embodiment, the bracket body 151, by employing two U-shaped bracket sidewalls 1511, not only limits the heat-conducting component 14 but also forms a heat dissipation duct 150. By placing the thermoelectric cooler 11 at the side opening of the bracket sidewall 1511, the thermoelectric cooler 11 also serves as part of the heat dissipation duct 150 structure. This ensures the airtightness of the heat dissipation duct 150 while facilitating contact and engagement between the thermoelectric cooler 11 and the heat sink 13 and heat-conducting component 14, ensuring the cooling effect of the thermoelectric cooler 11 on the airflow from the air outlet device 200. Furthermore, the thermoelectric cooler 11 is fixed by clamping it between the heat sink 13 and heat-conducting component 14, ensuring close contact between the thermoelectric cooler 11 and the heat sink 13 and heat-conducting component 14, guaranteeing heat conduction, and also fixing the thermoelectric cooler 11, simplifying the assembly process.

[0055] Based on the above embodiments, as a further defined embodiment, the bracket sidewall 1511 includes a first wall surface and two second wall surfaces disposed on opposite sides of the first wall surface. The first wall surface and the two second wall surfaces enclose and form a bracket sidewall 1511 with a cross-section of U-shape. The distance between the two second wall surfaces matches the thickness of the heat-conducting component 14, and the length of the heat dissipation component 13 matches the height of the bracket sidewall 1511.

[0056] Specifically, the heat sink 13 includes a plate-shaped heat sink body, the width of which matches the distance between the two second walls. The heat sink body has a U-shaped plate structure in cross-section. The heat sink 13 also includes multiple heat sink fins spaced along the width of the heat sink body. The gaps between the multiple heat sink fins and between the heat sink fins and the heat sink body form air passages. The outer periphery of the heat sink body matches the inner periphery of the support sidewall 1511. The heat sink 13 is interference-fitted into the support sidewall 1511, and the U-shaped heat sink body and the opening of the U-shaped support sidewall 1511 are opposite each other, that is, the heat sink body and the support sidewall 1511 are nested together in an interlocking manner. The cold side of the semiconductor cooling element 11 is attached to the back of the heat sink body. It should be explained that the front of the heat sink body is its opening side. The heat sink body includes a main support wall and two bent walls formed by bending and extending on both sides of the main support wall. The cold side of the semiconductor cooling element 11 is attached to the outer wall of the main support wall.

[0057] Furthermore, the sum of the thickness of the semiconductor cooling element 11 and the extension length of the bent wall of the heat sink body matches the width of the second wall surface of the bracket sidewall 1511. Both the semiconductor cooling element 11 and the heat sink 13 are installed inside the bracket sidewall 1511, making the overall structure more compact and small. The bracket sidewall 1511 extends vertically, and the bracket body 151 also includes two sets of connecting walls connecting the upper and lower ends of the two bracket sidewalls 1511. Each set of connecting walls includes two oppositely arranged connecting walls, which are connected between the two second wall surfaces of the two bracket sidewalls 1511.

[0058] In one optional embodiment, the heat-conducting component mounting part further includes limiting ribs connected to both sides of the two bracket sidewalls 1511. The limiting ribs can further improve the stability of the heat-conducting component 14 and prevent the heat-conducting component 14 from shaking due to excessive wind force.

[0059] In one optional embodiment, the heat dissipation duct 150 further includes an air outlet section, which is connected to the air inlet section and the two are set at a set angle; the fixed bracket 15 further includes a lateral air outlet section 152, which is fixedly disposed on the top of the bracket body 151 and extends away from the bracket side wall 1511. The lateral air outlet section 152 is hollow inside to form an air outlet section; the fixed bracket 15 further includes a supporting and limiting section 153, which is fixedly disposed on the bottom of the bracket body 151 and avoids the inlet 1501 of the heat dissipation duct 150. The supporting and limiting section 153 can limit the downward displacement of the heat conduction component 14, and the two sides of the supporting and limiting section 153 and the bottom wall of the bracket body 151 form an installation space for accommodating the airflow drive component 12. The air outlet of the airflow drive component 12 is connected to the inlet 1501 of the heat dissipation duct 150.

[0060] In the above embodiment, the fixed bracket 15 adopts a side air outlet 152, which has an air outlet section set at a predetermined angle to the air inlet section. This enables reverse airflow, allowing the hot airflow from the heat dissipation module to be blown out from the side of the air outlet device 200, preventing the hot airflow from being blown out directly from the top of the air outlet device 200 and spreading throughout the room. The support and limiting part 153 provided at the bottom of the bracket body 151 not only restricts the downward displacement of the guide member and prevents it from falling, but also forms an installation space with the bottom wall of the bracket body 151 to accommodate the airflow drive component 12, facilitating the installation of the airflow drive component 12.

[0061] Based on the above embodiments, as a further defined embodiment, the lateral air outlet 152 has two sets, which are correspondingly arranged with the two support sidewalls 1511. One end of the lateral air outlet 152 is connected and fixed to the support sidewall 1511, and the other end extends away from the support sidewall 1511. The end opening of the lateral air outlet 152 forms the air duct outlet 1502. The end openings of the two sets of lateral air outlets 152 face opposite directions, which can realize that the hot airflow is dispersed from both sides of the air outlet device 200, which can quickly cool down and avoid the problem of hot airflow being concentrated from one side, resulting in more hot air, higher temperature, and difficulty in cooling down. Specifically, in this embodiment, the lateral air outlet 152 is a hollow tubular structure. One end of the lateral air outlet 152 has an opening communicating with the support sidewall 1511. Preferably, the lateral air outlet 152 and the support sidewall 1511 are integrally formed.

[0062] Furthermore, the supporting and limiting part 153 is a protrusion fixedly installed in the middle of the bottom wall of the bracket body 151, and the protrusion is hollow.

[0063] In this embodiment, the cold end of the semiconductor cooling element 11 is in close contact with the outer wall of the heat conductor 14, and the hot end is in close contact with the back of the heat sink 13. The semiconductor cooling element 11, the heat conductor 14, and the heat sink 13 are clamped and assembled on the fixed bracket 15. The heat dissipation air duct 150 of the fixed bracket 15 will wrap the heat sink 13. The air blown out by the cooling fan can blow through the gap between the heat sinks 13 and carry away the heat. The semiconductor cooling element 11 is a very thin semiconductor cooling chip attached to the outer wall of the heat sink 13.

[0064] According to an embodiment of the present invention, in another aspect, an air outlet device 200 is provided, including a housing 203 and a cooling component 100 installed in the housing 203; the housing 203 is provided with a main air outlet 201 and a heat dissipation air outlet, the main air outlet 201 and the heat dissipation air outlet have different orientations, and the outlet 1502 of the heat dissipation air duct 150 is adapted to connect with the heat dissipation air outlet.

[0065] Furthermore, the air outlet device 200 includes a body and a chassis 204. The body is mounted on the chassis 204. The outer casing 203 of the body has a main air outlet 201, and an air outlet grille 202 is provided at the main air outlet 201. The air outlet device 200 also includes a fan assembly, which includes a fan wheel 205 and a main air outlet duct connecting the fan wheel 205 and the main air outlet 201. The cooling component 100 is disposed between the air outlet of the main air outlet duct and the main air outlet 201. The outer casing 203 also has an air inlet, which is opposite to the main air outlet 201. One end of the main air outlet duct is connected to the air inlet, and the other end is connected to the main air outlet 201.

[0066] In one alternative implementation, the air outlet device 200 includes a cooling fan or an air conditioner.

[0067] In this embodiment, the cooling component 100 can cool the air outlet device 200. It is located behind the main air outlet 201 of the whole machine and at the air outlet of the main air outlet duct. The outlet 1502 of the heat dissipation duct 150 is in a different direction from the air supply direction of the fan component. This can prevent the dissipated heat from affecting the cooling effect of the fan component.

[0068] The working process of the air supply device provided in this embodiment is as follows: The airflow from the fan assembly passes through the heat conductor 14, which absorbs the heat from the air and conducts it to the cold end of the energized semiconductor cooling component 11. Through the Peltier effect, the heat is conducted to the hot end of the semiconductor cooling component 11, and then to the heat sink 13. Finally, it is blown away by the airflow drive component 12, ensuring that the semiconductor cooling component 11 always has a high cooling efficiency. After the heat in the air blown out by the fan is absorbed, the temperature decreases, and finally, the cooled air is blown out, achieving a good cooling effect. Based on the working principle of semiconductor cooling, conductor cooling achieves directional heat transfer through the Peltier effect, thus achieving cooling. The noise impact is low, and the noise of the airflow drive component 12 is masked by the wind noise of the impeller 205. The cooling effect is good, and it is less affected by the environment. Moreover, the overall size of the cooling component 100 is relatively small, which facilitates installation and layout.

[0069] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the protection scope of the embodiments of this application.

Claims

1. A cooling component, characterized in that, include: A semiconductor cooling element (11) is provided, with its cold end located on the air supply path of the air outlet device (200) for absorbing heat from the air supply of the air outlet device (200). The heat dissipation module includes an airflow drive (12) and a heat dissipation duct (150). The outlet (1502) of the heat dissipation duct (150) is connected to the external space of the air outlet device (200), and the direction of the outlet (1502) of the heat dissipation duct (150) is different from the air outlet direction of the air outlet device (200). The hot end of the semiconductor cooling element (11) is located in the heat dissipation duct (150). The airflow drive element (12) is used to drive the airflow along the heat dissipation duct (150) to the hot end of the semiconductor cooling element (11), and discharge it from the outlet (1502) of the heat dissipation duct (150) after cooling the semiconductor cooling element (11).

2. The cooling component according to claim 1, characterized in that, The heat dissipation module also includes: Heat sink (13) is disposed in the heat dissipation duct (150), and the hot end of the semiconductor cooling device (11) is connected to the heat sink (13).

3. The cooling component according to claim 1, characterized in that, The cooling component (100) also includes: The heat-conducting element (14) is connected to the cold end of the semiconductor cooling element (11). The air supply of the air outlet device (200) passes through the heat-conducting element (14). The heat-conducting element (14) absorbs the heat in the air supply and transfers it to the semiconductor cooling element (11).

4. The cooling component according to any one of claims 1 to 3, characterized in that, The cooling component (100) also includes: The fixed bracket (15) is on which the semiconductor cooling component (11) and the airflow driving component (12) are mounted, and the fixed bracket (15) forms the heat dissipation air duct (150).

5. The cooling component according to claim 4, characterized in that, The fixed bracket (15) forms two sets of heat dissipation air ducts (150). Two sets of heat dissipation air ducts (150) are distributed on opposite sides of the fixed bracket (15), and two sets of semiconductor cooling components (11) and airflow driving components (12) are provided respectively.

6. The cooling component according to claim 4, characterized in that, The fixed bracket (15) is installed at the main air outlet (201) of the air outlet device (200); The fixed bracket (15) also has a heat-conducting component mounting part for mounting the heat-conducting component (14). When the heat-conducting component (14) is installed in the heat-conducting component mounting part, the heat-conducting component (14) corresponds to the main air outlet (201).

7. The cooling component according to claim 6, characterized in that, The heat-conducting component mounting part includes a mounting groove (1510) formed in the middle of the fixed bracket (15). The heat-conducting component (14) is embedded in the mounting groove (1510), and the cold end of the semiconductor cooling component (11) abuts against the side wall of the heat-conducting component (14).

8. The cooling component according to claim 4, characterized in that, The fixed bracket (15) includes an annular bracket body (151), the bracket body (151) comprising: Two support sidewalls (1511) are arranged opposite to each other. The cross-section of the support sidewalls (1511) is U-shaped, and the side openings of the two support sidewalls (1511) are arranged opposite to each other. The semiconductor cooling element (11) blocks the side opening of the bracket sidewall (1511) and forms the air inlet section of the heat dissipation duct (150) with the bracket sidewall (1511). A heat sink (13) is installed in the air inlet section, and the semiconductor cooling component (11) is clamped and fixed between the heat sink (13) and the heat conductor (14).

9. The cooling component according to claim 8, characterized in that, The heat dissipation duct (150) also includes an air outlet section, which is connected to the air inlet section and the two are set at a set angle. The fixing bracket (15) also includes: A lateral air outlet (152) is fixedly disposed on the top of the support body (151) and extends in a direction away from the side wall (1511) of the support. The lateral air outlet (152) is hollow inside to form the air outlet section; and / or, The supporting and limiting part (153) is fixedly installed at the bottom of the bracket body (151) and avoids the inlet (1501) of the heat dissipation duct (150). The supporting and limiting part (153) can limit the downward displacement of the heat conduction component (14), and the two sides of the supporting and limiting part (153) and the bottom wall of the bracket body (151) form an installation space for accommodating the airflow drive component (12). The air outlet of the airflow drive component (12) is connected to the inlet (1501) of the heat dissipation duct (150).

10. An air outlet device, characterized in that, Includes a housing (203) and a cooling component (100) according to any one of claims 1 to 9 installed within the housing (203). The outer casing (203) is provided with a main air outlet (201) and a heat dissipation air outlet. The main air outlet (201) and the heat dissipation air outlet have different orientations. The outlet (1502) of the heat dissipation duct (150) is adapted to connect with the heat dissipation air outlet.

11. The air outlet device according to claim 10, characterized in that, The air outlet device (200) includes a cooling fan or an air conditioner.

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