Refrigerator

CN224801940UActive Publication Date: 2026-09-25PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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Patent Information

Application Number
CN202490000362.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Priority Date
2023-06-23
Filing Date
2024-06-21
Publication Date
2026-09-25
Estimated Expiration
2034-06-21

AI Technical Summary

Benefits of technology

[0009]本实用新型的冷藏库能够抑制连接电线的温度变动,使高频电功率的传送路径的阻抗稳定。

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Abstract

The utility model discloses a refrigeration house includes main part, storage room, oscillation circuit, electrode and connecting electric wire. The storage room has the storage space of the storage preservation. Oscillation circuit is used to produce high -frequency electric power. The electrode produces the electric field corresponding with high -frequency electric power in the storage room. Connecting electric wire connects oscillation circuit and electrode. Connecting electric wire includes: the oscillation side electric wire of the extension from oscillation circuit, the load side electric wire of the extension from electrode and the electric wire connecting portion of connecting the oscillation side electric wire with load side electric wire. The electric wire connecting portion is arranged at the position of the heel side before the center of the depth direction of main part.
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Description

Technical Field

[0001] This utility model relates to a cold storage room with a storage compartment that has the function of thawing frozen food. Background Technology

[0002] Patent Document 1 discloses a cold storage room capable of thawing frozen goods. The cold storage room described in Patent Document 1 has a freezing device and a freezing chamber inside its main body, as well as a magnetron and a heating chamber for generating high frequencies.

[0003] Patent Document 1 describes a cold storage room that can supply cold air from a refrigeration unit to a heating chamber via a cold air circulation pipe, and can supply high frequency from a magnetron to the heating chamber to thaw frozen goods stored in the heating chamber. That is, the heating chamber is a storage room capable of thawing frozen goods.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2002-147919 Utility Model Content

[0007] The purpose of this invention is to provide a cold storage that can suppress the impedance characteristic changes and radiated noise of the connecting wires connecting the oscillation circuit and the electrode connection due to temperature variations, wherein the oscillation circuit can generate high-frequency electrical power (also known as "high-frequency power").

[0008] The cold storage unit of this invention includes a main body, a storage chamber, an oscillating circuit, electrodes, and connecting wires. The storage chamber is disposed within the main body and has a storage space capable of storing stored items. The oscillating circuit generates high-frequency electrical power. The electrodes are disposed within the storage chamber and generate an electric field corresponding to the high-frequency electrical power. The connecting wires connect the oscillating circuit and the electrodes. The connecting wires include an oscillating-side wire extending from the oscillating circuit, a load-side wire extending from the electrodes, and a wire connection portion connecting the oscillating-side wire and the load-side wire. The wire connection portion is positioned further forward than the center of the main body in the depth direction.

[0009] The cold storage of this invention can suppress temperature fluctuations in the connecting wires, thereby stabilizing the impedance of the high-frequency power transmission path. Attached Figure Description

[0010] Figure 1 This is a longitudinal cross-sectional view of a cold storage room according to an embodiment of this utility model.

[0011] Figure 2 This is a front cross-sectional view of the freezing / thawing chamber of the cold storage facility, illustrating the implementation method.

[0012] Figure 3 This is a side cross-sectional view of the freezing / thawing chamber of the cold storage facility, illustrating the implementation method.

[0013] Figure 4 This is a longitudinal cross-sectional view showing the case where a freezing / thawing chamber is installed in the main body of the cold storage in the embodiment.

[0014] Figure 5 This is a front cross-sectional view showing a modified example of the freezing / thawing chamber of the cold storage according to the embodiment.

[0015] Figure 6 This is a side cross-sectional view showing a modified example of the freezing / thawing chamber of the cold storage according to the embodiment.

[0016] Figure 7 This is a longitudinal cross-sectional view showing the case where a freezing / thawing chamber is installed in the main body of the cold storage in the embodiment.

[0017] Figure 8 This is a schematic diagram showing the electrode holding area on the rear side of the freezing / thawing chamber of the cold storage in the embodiment.

[0018] Figure 9 This is a structural block diagram of the medium heating mechanism (also known as the dielectric heating mechanism) configured in the cold storage of the embodiment.

[0019] Figure 10 This is a schematic circuit diagram of the AC / DC converter in the medium heating mechanism.

[0020] Figure 11 This is a top view of the first and second electrodes of the freezing / thawing chamber of the cold storage in the embodiment, viewed from above.

[0021] Figure 12 This is a graph showing the relationship between the electrode spacing of the first and second electrodes and the electric field strength between the two electrodes.

[0022] Figure 13A This is an electric field simulation diagram showing the results obtained by simulating the heating mechanism of the medium.

[0023] Figure 13B This is an electric field simulation diagram showing the result obtained by simulating the medium heating mechanism of the freezing / thawing chamber of the cold storage in the embodiment.

[0024] Figure 14 This is a diagram showing the control signals in the electric field generation process, the temperature of the food and the freezing / thawing chamber, and the humidity of the freezing / thawing chamber in the implementation scheme.

[0025] Figure 15This is a flowchart illustrating the control process after the electric field generation process is completed in the freezing / thawing chamber in the implementation embodiment.

[0026] Figure 16A It is a waveform diagram representing the cooling action of a cold storage facility using existing technology.

[0027] Figure 16B It is a waveform diagram showing the cooling action of the cold storage in the implementation method.

[0028] Figure 17 It is a waveform diagram showing the state of each element in the rapid cooling operation within the structure of the implementation method.

[0029] Figure 18A This is a diagram illustrating an example of a high-frequency blocking circuit when the door of the cold storage in the embodiment has been opened.

[0030] Figure 18B This is another example of a high-frequency blocking circuit when the door of the cold storage in the embodiment has been opened.

[0031] Figure 18C This is another example of a high-frequency blocking circuit that illustrates the implementation of a cold storage door when it has been opened.

[0032] Figure 19A This is a cross-sectional view illustrating an example of cable wiring leading to the freezing / thawing compartment in a cold storage facility according to an embodiment.

[0033] Figure 19B This is a cross-sectional view illustrating an example of cable wiring leading to the freezing / thawing compartment in a cold storage facility according to an embodiment.

[0034] Figure 20 This is a schematic cross-sectional view showing the wiring structure of the coaxial cable in the cold storage of the embodiment. Detailed Implementation

[0035] (Insights that form the basis of this utility model, etc.)

[0036] When the inventors conceived of the subject matter of this utility model, they already knew of a cold storage facility described in Patent Document 1.

[0037] Patent Document 1 describes a cold storage unit that uses an antenna or similar means to irradiate frozen goods inside the heating chamber with high-frequency radiation from a magnetron for high-frequency heating. However, when the high-frequency radiation distribution within the heating chamber is uneven (concentrated in specific areas), it is difficult to uniformly heat the frozen goods and thaw them to the desired state. The aforementioned prior art cold storage units include not only the magnetron that generates the high frequency but also a cooling mechanism for the magnetron. Therefore, it is difficult to miniaturize the aforementioned prior art cold storage units.

[0038] Furthermore, in the aforementioned prior art cold storage facilities, it is necessary to suppress the reduction in transmission efficiency caused by impedance changes corresponding to ambient temperature in the high-frequency transmission path. Moreover, in the aforementioned prior art cold storage facilities, it is also necessary to suppress the generation of normal mode noise or common mode noise in the power supply circuit. To solve these problems, the inventors conceived of the subject matter of this utility model.

[0039] The purpose of this invention is to provide a small and highly reliable cold storage that can freeze, store, and thaw items stored in the storage room in the required condition.

[0040] The following description, with reference to the accompanying drawings, describes a cold storage unit having both freezing (cooling) and defrosting functions, as an embodiment of the present invention. The cold storage unit of the present invention is not limited to the structure described in the following embodiments, and can also be applied to a freezer unit with only a freezing function. Therefore, in the present invention, the cold storage unit is a device having one or both of a cold storage compartment and a freezer compartment.

[0041] (Implementation Method)

[0042] The cold storage 1 of the present invention will be described with reference to the accompanying drawings.

[0043] [1-1. Overall Structure of Cold Storage]

[0044] Figure 1 This is the longitudinal section of the cold storage 1 in this embodiment. Figure 1 The left and right sides in the diagram correspond to the front and back sides of cold storage room 1, respectively. For example... Figure 1 As shown, the main body 2 of the cold storage 1 is an insulated box including an outer box 3, an inner box 4 and insulation material 40.

[0045] The outer casing 3 is mainly formed of steel plate. The inner casing 4 is formed of resin such as ABS (acrylonitrile, butadiene, styrene). The thermal insulation material 40 is a foamed material, such as rigid polyurethane foam, that fills the space between the outer casing 3 and the inner casing 4.

[0046] The main body 2 of the cold storage 1 includes multiple storage compartments, namely, a cold storage compartment 5, a freezing / thawing compartment 6, an ice-making compartment 7, a freezing compartment 8, and a vegetable compartment 9. Each storage compartment has an openable and closable door at its front opening. The doors cover the front openings of multiple storage compartments to prevent cold air from leaking out of the storage compartments.

[0047] In the cold storage 1 of this embodiment, the cold storage compartment 5 is the uppermost of the multiple storage compartments. Directly below the cold storage compartment 5, an ice-making compartment 7 and a freezing / thawing compartment 6 are arranged side-by-side. A freezing compartment 8 is located directly below the ice-making compartment 7 and the freezing / thawing compartment 6. A vegetable compartment 9 is located directly below the freezing compartment 8.

[0048] The structure and configuration of each storage compartment in the cold storage 1 of this embodiment are examples, and the present invention is not limited thereto. The structure and configuration of each storage compartment can be appropriately changed according to specifications, etc.

[0049] The cold storage compartment 5 is maintained at a temperature used for cold storage of food and other items, specifically, between 1°C and 5°C. The vegetable compartment 9 is maintained at a temperature range the same as or slightly higher than that of the cold storage compartment 5, for example, between 2°C and 7°C. The freezer compartment 8 is maintained at a freezing temperature range for freezing preservation, specifically, for example, between -22°C and -15°C.

[0050] The freezer / thaw chamber 6 is typically maintained at the same freezing temperature as the freezer chamber 8. Within the freezer / thaw chamber 6, an electric field generation process is performed to thaw the stored items (frozen goods) based on a user's instruction to initiate electric field generation (hereinafter referred to as an electric field generation instruction). The structure of the freezer / thaw chamber 6 and details of the electric field generation process will be described later.

[0051] A machine compartment 10 is disposed in the upper part (the uppermost part in this embodiment) of the cold storage 1. The machine compartment 10 houses the compressor 19 and components constituting the refrigeration cycle, such as a dryer for removing moisture from the refrigeration cycle. The placement of the machine compartment 10 is not limited to the upper part of the cold storage 1, and can be appropriately determined according to the placement of the refrigeration cycle. For example, the machine compartment 10 may also be disposed in the lower part of the cold storage 1.

[0052] A cooling chamber 11 is located behind the freezer compartment 8 and vegetable compartment 9 in the lower part of the cold storage 1. The cooling chamber 11 includes a cooler 13 and a cooling fan 14. The cooler 13 is a component of the refrigeration cycle that generates cold air. The cooling fan 14 delivers the cold air generated by the cooler 13 to the three storage compartments (cold storage compartment 5, freezer / thaw compartment 6, and ice-making compartment 7) via air duct 12.

[0053] An air damper 12a is installed in the air duct 12. Control unit 50 (see description below) Figure 9 and Figure 20 The compressor 19 and cooling fan 14 speeds are controlled, and the damper 12a is opened and closed to maintain the temperature of each storage compartment within the specified temperature range.

[0054] A defrost heater 15 is disposed at the lower part of the cooling chamber 11. The defrost heater 15 is a heater used to remove frost and ice adhering to the cooler 13 and its surroundings. Below the defrost heater 15 are a drain pan 16, a drain pipe 17, and an evaporation dish 18. These components are structures used to evaporate moisture generated during defrosting, etc.

[0055] The cold storage 1 in this embodiment includes an operation unit 47 (see description below). Figure 9 The user uses the operation unit 47 to input various commands to the cold storage 1 (e.g., temperature settings for each storage compartment, rapid cooling command, electric field generation command, ice-making stop command, etc.). The operation unit 47 has a display unit for providing the user with necessary information.

[0056] The cold storage unit 1 may also include a wireless communication unit capable of connecting to a wireless LAN (local area network) to input various commands from the user's external terminal. The cold storage unit 1 may also include a voice recognition unit for inputting commands using the user's voice.

[0057] Figure 2 , Figure 3 , Figure 5 , Figure 6 This is a longitudinal cross-sectional view of the freezing / thawing chamber 6 of the cold storage 1 in this embodiment.

[0058] Figure 2 , Figure 5 This is a diagram showing the view of cold storage room 1 from the front side. Therefore, Figure 2 , Figure 5 The left and right sides in the middle correspond to the left and right sides of cold storage 1, respectively. Figure 3 , Figure 6 This is a view of cold storage room 1 from the right. Therefore, Figure 3 , Figure 6 The left and right sides in the diagram correspond to the front and back sides of cold storage 1, respectively. The following diagrams illustrating the structure of cold storage 1 (excluding...) Figure 11 In addition to the above, the top and bottom of the cold storage 1 are consistent with the top and bottom of the attached diagram.

[0059] exist Figure 2 , Figure 3 , Figure 5 , Figure 6 In this configuration, the freezing / thawing chamber 6 is both a freezing chamber and a thawing chamber. That is, the freezing / thawing chamber 6 freezes food and other preserved items and maintains them within the freezing temperature range. Furthermore, when an electric field generation command is input to the operation unit 47, an electric field generation process is performed in the freezing / thawing chamber 6, and the frozen preserved items are thawed by dielectric heating (dielectric heating).

[0060] The following is a description Figure 2 , Figure 3 , Figure 5 , Figure 6 Their respective characteristics.

[0061] An air duct 12 is arranged behind and above the freezer / defrost chamber 6. The air duct 12 connects the cooling chamber 11 and the freezer / defrost chamber 6. A plurality of cold air inlet holes 20 are arranged on the top surface of the freezer / defrost chamber 6. The cold air generated by the cooler 13 flows in the air duct 12 and is introduced into the freezer / defrost chamber 6 through the plurality of cold air inlet holes 20. As a result, the freezer / defrost chamber 6 is maintained at the same freezing temperature zone as the freezer chamber 8.

[0062] An air damper 12a is installed in the air duct 12. By controlling the opening and closing of the air damper 12a, the freezer / thaw chamber 6 can be maintained at a specified freezing temperature range. As a result, the items stored in the freezer / thaw chamber 6 are frozen and preserved.

[0063] A cold air exhaust vent (not shown) is formed on the back of the freezer / thaw chamber 6. The cold air cooled inside the freezer / thaw chamber 6 is returned to the cooling chamber 11 via the cold air exhaust vent and air duct (not shown), where it is cooled again by the cooler 13. That is, in the cold storage 1 of this embodiment, the cold air generated by the cooler 13 circulates in the cold storage 1.

[0064] The top, back, two sides, and bottom of the freezer / thaw chamber 6 form the storage space of the freezer / thaw chamber 6. These surfaces are formed by inner surface components 32a, 33b, and 32c, which are molded from an electrically insulating material (e.g., resin). Hereinafter, inner surface components 32a to 32c will be collectively referred to as inner surface components 32.

[0065] A door 29 is provided at the front opening of the freezer / thaw compartment 6. Closing the door 29 seals the storage space of the freezer / thaw compartment 6. Inside the freezer / thaw compartment 6, an open-top storage box 31 is provided on the back side of the door 29. When the door 29 is opened and closed, the storage box 31 moves back and forth in conjunction with the door 29. This movement allows the storage box 31 to be easily removed from the freezer / thaw compartment 6, facilitating the placement and removal of stored items such as food.

[0066] [1-2. Dielectric heating mechanism for generating an electric field in a storage space]

[0067] The dielectric heating mechanism that generates an electric field in the storage space of the freezing / thawing chamber 6 will be described.

[0068] The heating element can be adjusted by controlling the output electrical power. When the heating amount of the preserved item exceeds the cooling amount of the freezing / thawing chamber 6, the preserved item is heated. When the heating amount of the preserved item is less than the cooling amount of the freezing / thawing chamber 6, the preserved item is cooled.

[0069] Figure 9This is a structural block diagram of the medium heating mechanism configured in cold storage 1. (Example) Figure 9 As shown, the medium heating mechanism in this embodiment includes a power supply unit 48, an oscillation circuit 22, a matching circuit 23, a first electrode 24, a second electrode 25, and a control unit 50.

[0070] The oscillation circuit 22 is an oscillation unit that receives electrical power from the power supply unit 48 and generates a high-frequency signal. The oscillation circuit 22 is miniaturized by using semiconductor components.

[0071] Figure 20 This is a schematic cross-sectional view showing the wiring structure of the coaxial cable in the cold storage 1 of this embodiment. (Example) Figure 20 As shown, an oscillation circuit 22, a power supply unit 48, and a control unit 50 are arranged above the top surface of the outer casing 3 of the main body 2. A matching circuit 23 is disposed in the electrode holding region 30 (see also...). Figure 3 , Figure 4 , Figure 6 , Figure 7 Electrode holding circuit board 52 is located within the freezer / thaw chamber 6. Electrode holding area 30 is the space behind the freezer / thaw chamber 6.

[0072] As another configuration, the oscillator circuit 22 can also be configured together with the matching circuit 23 on the electrode holding circuit board 52 described later (e.g., see reference 1). Figure 3 The oscillation circuit 22 and the matching circuit 23 correspond to the electric field forming section, which is used to form a high-frequency electric field applied between the first electrode 24 and the second electrode 25.

[0073] The first electrode 24 is a flat plate electrode disposed on the upper part (near the top surface) of the freezing / thawing chamber 6. The second electrode 25 is a flat plate electrode disposed on the lower part (near the bottom surface) of the freezing / thawing chamber 6. The first electrode 24 and the second electrode 25 are vertically separated by a predetermined interval in the storage space (thawing space) of the freezing / thawing chamber 6 (see reference). Figure 8 A pair of electrodes arranged opposite each other with an electrode spacing H. The first electrode 24 and the second electrode 25 are fixed to the electrode holding circuit board 52, which will be described later.

[0074] That is, in the medium heating mechanism of this embodiment, the first electrode 24 and the second electrode 25 are arranged substantially parallel. In this invention, "substantially parallel" does not mean strictly parallel, but includes errors caused by deviations (uniformity) such as machining accuracy.

[0075] The first electrode 24 is disposed near the top surface of the storage space, and the second electrode 25 is disposed near the bottom surface of the storage space across the storage space. The inner surface component 32 prevents damage to these components due to contact with the stored items by covering the matching circuit 23 on the back side, the first electrode 24 on the top side, and the second electrode 25 on the bottom side.

[0076] In this embodiment, a first electrode 24 and a second electrode 25 are respectively disposed near the top and bottom surfaces of the storage space. However, the present invention is not limited to this structure. The first electrode 24 and the second electrode 25 can be disposed opposite to each other and approximately parallel, separated by the storage space (thawing space).

[0077] For example, the second electrode 25 can be positioned near the top surface of the storage space, and the first electrode 24 can be positioned near the bottom surface of the storage space. The first electrode 24 and the second electrode 25 can also be positioned in the left-right direction (…). Figure 1 The relative configuration in the depth direction.

[0078] The oscillation circuit 22 outputs a high-frequency voltage in the VHF band (40.68MHz band in this embodiment). The high-frequency voltage output by the oscillation circuit 22 creates an electric field between the first electrode 24 and the second electrode 25, resulting in the medium heating the contents of the storage container, which is a dielectric material disposed in the storage space.

[0079] By utilizing the first electrode 24, the second electrode 25, and the storage medium, a load impedance for the storage space can be formed. The matching circuit 23 adjusts its impedance to match the load impedance with the output impedance of the oscillation circuit 22.

[0080] To minimize the reflected wave relative to the incident wave, the matching circuit 23 performs impedance matching. The incident wave is the electromagnetic wave output by the oscillating circuit 22 to the first electrode 24. The reflected wave is the electromagnetic wave from the first electrode 24 back to the oscillating circuit 22 within the incident wave.

[0081] like Figure 9 As shown, the oscillation circuit 22 includes a detector 51. The detector 51 detects the incident wave and the reflected wave, and sends the respective detection values ​​to the control unit 50. The oscillation circuit 22 is electrically connected to the first electrode 24 via the detector 51 and the matching circuit 23. The control unit 50 calculates the ratio of the detected value of the reflected wave electric power to the detected value of the incident wave electric power as the reflectivity, and performs various controls described later based on the reflectivity.

[0082] The control unit 50 may also calculate the reflectivity as the ratio of the detected value of the reflected wave power to the set power value of the electromagnetic wave output from the oscillation circuit 22. The control unit 50 may also perform various controls, described later, based solely on the detected value of the reflected wave, without relying on the set output value of the electromagnetic wave or the detected value of the incident wave.

[0083] The control unit 50 controls the oscillation circuit 22 and the matching circuit 23 based on signals from the operation unit 47, the temperature sensor 49, etc. The control unit 50 includes a processor such as a CPU (Central Processing Unit) and a memory such as ROM (Read-Only Memory). The control unit 50 performs various controls by causing the CPU to execute control programs stored in the memory.

[0084] [1-3. Structure of the circuit board of the medium heating mechanism]

[0085] Preferably, the wiring connecting the oscillation circuit 22, the matching circuit 23, and the first electrode 24 is short. Similarly, it is preferable that the wiring connecting the oscillation circuit 22, the matching circuit 23, and the second electrode 25 is also short.

[0086] Therefore, the electrode holding circuit board 52 (reference) Figure 3 , Figure 4 , Figure 6 , Figure 7 , Figure 8 , Figure 19A , Figure 19B The electrode holding circuit board 52 is directly connected to the first electrode 24 without via leads or coaxial cables. Similarly, the electrode holding circuit board 52 is directly connected to the second electrode 25. The electrode holding circuit board 52 is located in the electrode holding area 30 behind the freezer / thaw chamber 6 and includes a matching circuit 23.

[0087] Matching circuit 23 has adjustable inductance and capacitance values. Control unit 50 adjusts the inductance and capacitance values ​​of matching circuit 23 to control impedance matching of matching circuit 23. Matching circuit 23 generates heat due to inductor losses. Hereinafter, this heat will be referred to as waste heat of matching circuit 23.

[0088] The matching circuit 23, and the first electrode 24, second electrode 25 disposed around the matching circuit 23, and the electromagnetic wave shielding 26 described later (e.g., Figure 2 , Figure 3 The devices with metal components such as the top-side electromagnetic wave shielding component 26a, the back-side electromagnetic wave shielding component 26b, the bottom-side electromagnetic wave shielding component 26c, and the door-side electromagnetic wave shielding component 26d shown are prone to condensation in the freezing temperature range. In this embodiment, because the matching circuit 23 is disposed on the electrode holding circuit board 52, the waste heat generated by the matching circuit 23 is transferred to the above-mentioned devices to prevent condensation.

[0089] The first electrode 24, the second electrode 25, and the electromagnetic wave shielding element 26, described later, also generate heat due to electrical losses. However, this heat generation is usually minimal and does not help prevent condensation and frost. Therefore, by intentionally using materials with high losses to increase heat generation, condensation and frost can also be prevented.

[0090] Regardless of whether an electric field is generated in the freezer / thaw chamber 6, if the possibility of condensation or frost is detected, the control unit 50 implements a process to prevent condensation or frost by utilizing waste heat. That is, the control unit 50 intentionally generates waste heat by appropriately activating the oscillation circuit 22 to prevent condensation or frost.

[0091] like Figure 20 As shown, the oscillation circuit 22 is located at the top of the cold storage compartment 1, specifically on the top surface of the outer casing 3. The matching circuit 23 is located behind the freezing / thawing compartment 6, near the first electrode 24 and the second electrode 25. The oscillation circuit 22 and the matching circuit 23 are electrically connected by leads or wires (hereinafter referred to as coaxial cables).

[0092] A shielding box 57, made of metal or similar material, is mounted on the top surface of the outer casing 3. The shielding box 57 houses the oscillation circuit 22, the power supply unit 48, and the control unit 50. The shielding box 57 suppresses leakage of electromagnetic waves to the outside by being electrically connected to the outer casing 3, which is made of metal and functions as a ground wire.

[0093] For example, the shielding box 57 can also be installed in the machine room 10. This allows for efficient use of the space within the cold storage 1. In this case, to ensure impedance matching for the coaxial cable, it is preferable to mount the oscillation circuit 22 and the detector 51 on a single substrate.

[0094] The shielding box 57 is made of metal. That is, the bottom surface that contacts the top surface of the outer casing 3 is also made of metal. This can suppress the leakage of electromagnetic waves from the oscillation circuit 22 into the cold storage chamber 5.

[0095] The bottom surface of the shielding box 57, the top surface of the outer casing 3, and the heat insulation material (also called heat insulation component) 40 of the cold storage chamber 5 are arranged between the oscillating circuit 22 and the cold storage chamber 5. The heat insulation material 40 cuts off the transfer of waste heat generated by the loss of the oscillating circuit 22 to the cold storage chamber 5, preventing a decrease in cooling efficiency.

[0096] The outer casing 3 and the shielding box 57 function as electromagnetic wave shielding components to prevent electromagnetic waves leaking from the oscillation circuit 22 into the cold storage 5 from radiating to the outside of the cold storage 1.

[0097] To suppress the temperature rise inside the shielding box 57, a cooling fan 58 is installed inside the shielding box 57. The control unit 50 activates the cooling fan 58 according to the operation of the oscillation circuit 22.

[0098] As a heat dissipation duct, the shielding box 57 has an intake port 59a and an exhaust port 59b, which are slit-shaped. The intake port 59a and exhaust port 59b are disposed on the side of the shielding box 57 so that water and dust cannot enter from the intake port 59a and exhaust port 59b.

[0099] In this embodiment, the detector 51 is included in the oscillation circuit 22, which is disposed in the shielding box 57. However, in order to determine impedance matching with high accuracy, the detector 51 may also be disposed together with the matching circuit 23 on the electrode holding circuit board 52.

[0100] Alternatively, the matching circuit 23, the detector 51, and the oscillation circuit 22 can all be configured on the electrode holding circuit board 52. This can suppress power loss caused by leads and coaxial cables and improve the accuracy of impedance matching.

[0101] [1-4. System structure of the medium heating mechanism]

[0102] In the dielectric heating mechanism of this embodiment, the first electrode 24 and the second electrode 25 are separated by a predetermined interval (see reference). Figure 8 The electrodes are spaced apart by a distance H and are positioned approximately parallel to each other. This homogenizes the electric field within the storage space of the freezing / thawing chamber 6. In this medium heating mechanism, the electrode spacing H is maintained as described below.

[0103] Figure 8 This indicates the electrode holding area 30 on the back side of the freeze / thaw chamber 6. Figure 8 This is a schematic diagram of the electrode holding area 30 as viewed from the back side of the freezing / thawing chamber 6. Therefore, Figure 8 The left and right sides in the middle correspond to the right and left sides of the cold storage 1 when viewed from the front, respectively.

[0104] like Figure 8 As shown, a first electrode 24 is disposed in the upper part (near the top surface) of the freezing / thawing chamber 6, and a second electrode 25 is disposed in the lower part (near the bottom surface) of the freezing / thawing chamber 6.

[0105] The first electrode 24 has positive terminals 24a, 24b, and 24c. The positive terminals 24a to 24c are arranged in a left-right direction near the center of the back side end of the first electrode 24. Each of the positive terminals 24a to 24c has a shape that protrudes from the back side end of the first electrode 24 and bends at a right angle upward or downward.

[0106] Similarly, the second electrode 25 has cathode terminals 25a, 25b, and 25c. Cathode terminals 25a to 25c are arranged in a left-right direction near the center of the back side end of the second electrode 25. Each of the cathode terminals 25a to 25c has a shape that protrudes from the back side end of the second electrode 25 and is bent at a right angle upward or downward.

[0107] The first electrode 24 and the second electrode 25 are respectively fixed to the upper and lower parts of the electrode holding circuit board 52. A matching circuit 23 (including a detector 51, depending on the structure) is disposed on the electrode holding circuit board 52. Therefore, using the electrode holding circuit board 52, the first electrode 24 and the second electrode 25 are separated by a predetermined interval (see reference 52). Figure 8 The electrode spacing H is maintained.

[0108] Because the matching circuit 23, etc., is configured on the electrode holding circuit board 52, the rigidity of the electrode holding circuit board 52 is increased through the copper foil wiring pattern. Therefore, the electrode holding circuit board 52 can be spaced at a predetermined interval (see reference). Figure 8 The first electrode 24 and the second electrode 25 are cantilevered and supported at an electrode spacing H. As described above, an oscillation circuit 22, etc., can also be configured on the electrode holding circuit board 52.

[0109] The positive terminals 24a-24c of the first electrode 24 are connected to the connection terminals (not shown) on the positive side of the matching circuit 23. The cathode terminals 25a-25c of the second electrode 25 are connected to the connection terminals (not shown) on the cathode side of the matching circuit 23. The positive terminals 24a-24c and the cathode terminals 25a-25c are connected to the connection terminals of the matching circuit 23 through surface contact with a specified contact area, ensuring reliability even when a large current flows.

[0110] In this embodiment, to ensure reliable surface contact, the flat terminals are connected to each other by screws. The connection between the terminals is not limited to screw-based connections, as long as a reliable connection can be achieved. However, to utilize the aforementioned waste heat to prevent condensation and frost, a connection between the terminals with excellent thermal conductivity is preferred.

[0111] As described above, an electrode holding circuit board 52, which serves as an electrode holding mechanism, is disposed behind the freeze / thaw chamber 6. The first electrode 24 and the second electrode 25 are arranged approximately parallel to each other via the electrode holding circuit board 52.

[0112] In this embodiment, the freeze / thaw chamber 6 includes a high-frequency heating module 53 (for example, see reference 53). Figure 4The high-frequency heating module 53 is a module that integrates the first electrode 24, the second electrode 25 parallel to the first electrode 24, and the electrode holding circuit board 52 that holds the first electrode 24 and the second electrode 25. Therefore, it is easy to hold the first electrode 24 and the second electrode 25 approximately in parallel.

[0113] [1-5. Structure of the freezing / thawing compartment]

[0114] As described above, the main body 2 of the cold storage 1 is an insulated box consisting of an outer box 3, a resin inner box 4, and insulation material 40. The outer box 3 is formed of steel plate. The insulation material 40 is, for example, rigid polyurethane foam, which is filled and foamed in the space between the outer box 3 and the inner box 4.

[0115] like Figure 2 , Figure 3 As shown, the freezer / defrost chamber 6 has an inner surface component 32a disposed inside the insulation material 40 as an outer frame. An electromagnetic wave shielding member 26 is disposed around the freezer / defrost chamber 6. The electromagnetic wave shielding member 26 includes a top-side electromagnetic wave shielding member 26a, a back-side electromagnetic wave shielding member 26b, a bottom-side electromagnetic wave shielding member 26c, and a door-side electromagnetic wave shielding member 26d, surrounding the freezer / defrost chamber 6 to prevent electromagnetic waves from leaking to the outside.

[0116] The inner surface component 32a separates the electrode holding area 30 from the freeze / thaw chamber 6. A rear-side electromagnetic wave shield 26b is disposed on the rear side of the inner surface component 32a. The rear-side electromagnetic wave shield 26b separates the interior of the freeze / thaw chamber 6 from the electrode holding circuit board 52, which includes the matching circuit 23, etc. Therefore, the freeze / thaw chamber 6 and the electrode holding circuit board 52 can be prevented from interfering with each other regarding impedance and electric field.

[0117] In the upper and lower parts of the space surrounded by the inner surface component 32a, a flat inner surface component 32b and an inner surface component 32c are respectively disposed. A first electrode 24 is disposed on the upper surface of the inner surface component 32b, and a second electrode 25 is disposed on the lower surface of the inner surface component 32c.

[0118] Inner surface component 32b and inner surface component 32c are separated by a specified interval (see reference). Figure 2 , Figure 3 The electrodes are held at a distance H. That is, the first electrode 24 and the second electrode 25 are held in a substantially parallel state by the electrode holding circuit board 52 and the inner surface component 32.

[0119] Sometimes, due to uneven foaming of the insulating material 40, the upper surface of the freezing / thawing chamber 6 is not parallel to the bottom surface. However, by adopting the structure described above, the first electrode 24 and the second electrode 25 remain in a substantially parallel state unaffected by the outer casing 3.

[0120] Figure 4 This is a longitudinal cross-sectional view showing the freezing / thawing chamber 6 being installed in the main body 2 of the cold storage 1. Figure 4 This is a view of cold storage room 1 from the right. Therefore, Figure 4 The left and right sides of the image correspond to the front and back sides of cold storage 1, respectively.

[0121] The high-frequency heating module 53 is pre-assembled before the manufacturing process. For example... Figure 4 As shown, in the manufacturing process, firstly, a high-frequency heating module 53 is inserted into the outer casing 3 of the cold storage 1. Next, the door unit, including the door 29, the door-side electromagnetic wave shielding component 26d, the gasket 36, and the storage box 31, is inserted into the high-frequency heating module 53. Thus, the cold storage 1 is completed.

[0122] This implementation method can also be Figure 5 , Figure 6 , Figure 7 The structure shown. Figure 7 and Figure 4 This is also a longitudinal cross-sectional view showing the freezing / thawing chamber 6 being installed in the main body 2 of the cold storage 1. Therefore, Figure 7 The left and right sides of the middle Figure 4 Same. Figures 5-7 In the middle, the outer casing 3, the inner casing 4, the heat insulation material 40, the inner surface components 32, and the electromagnetic wave shielding component 26 are... Figure 2 , Figure 3 same.

[0123] like Figures 5-7 As shown, flat inner surface components 32b and 32c are horizontally arranged in the upper and lower parts of the space surrounded by inner surface component 32a, respectively. A first electrode 24 is arranged on the upper surface of inner surface component 32b, and a second electrode 25 is arranged on the lower surface of inner surface component 32c.

[0124] The front sides of inner surface components 32b and 32c are fixed by support pillar 54. The back sides of inner surface components 32b and 32c are fixed by electrode holding circuit board 52 and inner surface component 32c. Thus, the first electrode 24 and the second electrode 25 are held in a substantially parallel state.

[0125] Inner surface component 32b and inner surface component 32c are separated by a specified interval (see reference). Figures 5-7 The electrodes are held at a distance H, so that the first electrode 24 and the second electrode 25 are held in a generally parallel state by the electrode holding circuit board 52, the support 54 and the inner surface component 32.

[0126] The inner surface component 32 is preferably made of a common industrial ceramic material with a thermal conductivity of less than 10 W / (m·K) that is not prone to condensation even in the freezer 8. In this embodiment, the inner surface component 32 is made of resins such as polypropylene, ABS (acrylonitrile-butadiene-styrene copolymer), and polycarbonate.

[0127] To suppress heat capacity, the electromagnetic wave shield 26 is made thinner than the inner surface component 32. This prevents condensation from forming on the electromagnetic wave shield 26 and the inner surface component 32 that contacts it.

[0128] Thus, according to this embodiment, the first electrode 24 and the second electrode 25 can be separated by a predetermined interval (for example, refer to...) using the electrode holding mechanism. Figure 5 The electrodes are spaced apart by H and arranged approximately parallel to each other. Therefore, in the medium heating mechanism of the freezing / thawing chamber 6, the non-uniformity of the high-frequency electric field on the electrode surface can be suppressed, and the high-frequency electric field can be homogenized. As a result, the preserved items (frozen products) can be heated more uniformly.

[0129] According to this embodiment, the cold storage 1 is completed by inserting the pre-assembled unit, namely the high-frequency heating module 53, into the outer casing 3. That is, the cold storage 1 can be manufactured through a simple manufacturing process.

[0130] [1-6. Electromagnetic wave shielding mechanism and wiring]

[0131] As described above, the cold storage 1 of this embodiment can perform dielectric heating by placing a storage medium (dielectric) between the first electrode 24 and the second electrode 25 in the freezing / thawing chamber 6. Therefore, in order to prevent electromagnetic waves from leaking to the outside of the freezing / thawing chamber 6, the cold storage 1 of this embodiment includes an electromagnetic wave shielding mechanism surrounding the freezing / thawing chamber 6.

[0132] like Figure 2 , Figure 3 , Figure 5 As shown, a top-side electromagnetic wave shielding member 26a is disposed above the top surface of the freezer / thaw chamber 6. The top-side electromagnetic wave shielding member 26a is disposed on the upper surface of the inner surface member 32a constituting the top surface of the freezer / thaw chamber 6, and is configured to cover the top surface of the freezer / thaw chamber 6. The top-side electromagnetic wave shielding member 26a has multiple openings. Therefore, the area of ​​the portion of the top-side electromagnetic wave shielding member 26a opposite to the first electrode 24 is reduced.

[0133] These openings have a slit shape with the long side (length direction) of the cold storage 1. Therefore, the magnetic field (or current) traveling forward from the positive terminals 24a-24c passes smoothly through the electromagnetic wave shielding member 26a on the top surface. This suppresses leakage magnetic fields that diffuse into the surrounding area. The inventors analyzed this situation using electromagnetic wave simulation.

[0134] This structure can suppress the generation of unwanted electric fields between the top-side electromagnetic wave shield 26a and the first electrode 24. The top-side electromagnetic wave shield 26a can also be a mesh structure with multiple openings.

[0135] The top-side electromagnetic wave shield 26a can also be disposed inside the cold storage compartment 5 located above the freezing / thawing compartment 6. However, since micro-freezing compartments and chilled compartments are often disposed in the cold storage compartment 5, the top surface of the micro-freezing compartment and the chilled compartment can also be used as an electromagnetic wave shield.

[0136] The rear-side electromagnetic wave shield 26b is configured to cover the electrode holding area 30 disposed on the rear side of the freezer / defrost chamber 6. The rear-side electromagnetic wave shield 26b prevents the electric field generated between the first electrode 24 and the second electrode 25 and the high-frequency noise generated in the matching circuit 23 from affecting the control of the cooling fan 14 and the damper 12a. In addition, an electromagnetic wave shield (not shown) is also disposed on the side of the freezer / defrost chamber 6.

[0137] Next, the door-side electromagnetic wave shielding member 26d disposed on the door 29 will be described. The door 29 is installed on the main body of the cold storage 1, covering the front opening of the freezer / thaw chamber 6 in a manner that allows the freezer / thaw chamber 6 to be opened and closed. Therefore, in a structure where the door-side electromagnetic wave shielding member 26d is connected to the grounding portion of the main body of the cold storage 1 via a wired line (conductor), the wired line repeatedly expands and contracts due to the opening and closing of the door 29. That is, such a structure becomes a major cause of wire breakage due to metal fatigue, and is therefore unsatisfactory.

[0138] Typically, to prevent electromagnetic wave leakage, the electromagnetic wave shielding component 26d on the door side when the door 29 is closed needs to be aligned with the transverse beam 21 (see reference). Figure 1 The spacing between the cross rails is narrower than 1 / 4 of the wavelength λ of the electromagnetic wave. The cross rail 21 is an electromagnetic wave shield on the main body side that is connected to and grounded by the outer casing 3. In this embodiment, the spacing is further reduced (e.g., within 30 mm).

[0139] When the door 29 is closed, the door-side electromagnetic wave shield 26d approaches the grounded transverse beam 21. This structure achieves the same effect as wired grounding. By shaping the end of the door-side electromagnetic wave shield 26d into a shape that bends towards the main body of the cold storage 1, the door-side electromagnetic wave shield 26d can easily approach the transverse beam 21.

[0140] The door-side electromagnetic wave shield 26d can also be placed near components other than the transverse beam 21, such as the top-side electromagnetic wave shield 26a and the bottom-side electromagnetic wave shield 26c.

[0141] Next, the connection between the electromagnetic wave shielding component and other circuits and grounding will be explained.

[0142] Figure 10 This is a schematic circuit diagram of the AC / DC converter in the dielectric heating mechanism. In this circuit, the AC voltage from the commercial AC power supply ACV is rectified and converted into a DC voltage by a bridge diode BD1 and a rectifier capacitor C0. This DC voltage is then input to the DC / DC converter.

[0143] Figure 10 The DC / DC converter shown is a flyback switching power supply circuit. However, this invention is not limited to this; any forward, push-pull, half-bridge, or transformer-based switching power supply is acceptable. Figure 10 Only the main circuit components are described; noise filters, power control circuits, and protection circuits are omitted.

[0144] like Figure 10 As shown, the AC voltage from the commercial AC power supply ACV is rectified and smoothed by the bridge diode BD1 and the rectifier capacitor C0 to convert it into a DC voltage. This DC voltage is referred to as the primary-side DC power supply DCV0 (or the first power supply section). The zero-volt reference potential of the primary-side DC power supply DCV0 is referred to as the primary-side ground GND0 (or the first ground).

[0145] A primary-side DC power supply DCV0 is applied to the primary winding P1 of the switching transformer T1. The switching transformer T1 operates at a switching frequency of several tens of kHz via the field-effect transistor Q1.

[0146] The power stored in the primary winding P1 is transferred to the electrically insulated secondary winding S1 through electromagnetic induction, and rectified by the secondary rectifier diode D1 and the secondary rectifier capacitor C1. This enables the output of a secondary DC power supply DCV1 (second power supply unit).

[0147] The secondary winding S2 has an output section disposed between its two ends. The output voltage of the secondary winding S2 is rectified by the secondary rectifier diode D2 and the secondary rectifier capacitor C2. Thus, a secondary DC power supply DCV2 (second power supply section) with a voltage lower than that of the secondary DC power supply DCV1 can be output. The zero-volt reference potential of the secondary DC power supplies DCV1 and DCV2 is called the secondary ground GND1 (or second ground).

[0148] The primary-side DC power supply DCV0 is applied not only to the switching transformer T1, but also to the primary winding P2 of the switching transformer T2. The switching transformer T2 operates at a switching frequency of several tens of kHz via the field-effect transistor Q2.

[0149] The power stored in the primary winding P2 is transferred to the electrically insulated secondary winding S3 through electromagnetic induction, and rectified by the secondary rectifier diode D3 and the secondary rectifier capacitor C3. This enables the output of the secondary DC power supply DCV3 (the third power supply section). The zero-volt reference potential of the secondary DC power supply DCV3 is called the secondary ground GND2 (or the third ground).

[0150] In switching transformer T1, the insulation between the primary winding P1 and the secondary winding S1 has performance exceeding the basic insulation performance determined by the Japanese Electrical Appliance and Material Safety Law or IEC (International Electrotechnical Commission) standards. The insulation between the primary winding P2 and the secondary winding S3 in switching transformer T2 is also the same.

[0151] In the oscillation circuit 22, the oscillation source 22a uses a crystal oscillator or similar device to output a weak electrical power at a frequency of 40.68 MHz allocated to the ISM band (Industrial Scientific and Medical Band). This weak electrical power is amplified by a first amplifier circuit 22b and further amplified by a second amplifier circuit 22c. The amplified electrical power is then output to the matching circuit 23. Furthermore, the output frequency of the oscillation source 22a is not limited to 40.68 MHz.

[0152] In this embodiment, the secondary-side DC power supply DCV1 is supplied to the second amplifier circuit 22c of the oscillation circuit 22. The secondary-side DC power supply DCV2 is supplied to the oscillation source 22a, the first amplifier circuit 22b, the detector 51, and the matching circuit 23 of the oscillation circuit 22. The secondary-side DC power supply DCV3 is supplied to the control unit 50.

[0153] Therefore, the circuit system using secondary-side ground GND1 as a zero-volt reference potential includes an oscillation circuit 22, a detector 51, a matching circuit 23, and a second electrode 25. The circuit system using secondary-side ground GND2 as a zero-volt reference potential includes a control unit 50. The control unit 50 can also be connected to the secondary-side DC power supply DCV2 and the secondary-side ground GND1.

[0154] The second electrode 25 has the same potential as the secondary side ground GND1. The electromagnetic wave shield 26 is preferably insulated from the second electrode 25 or connected away from it to a certain extent. This reduces the electric and magnetic fields applied to the electromagnetic wave shield and suppresses leakage of these fields to the outside. In other words, the effectiveness of the electromagnetic wave shield is improved.

[0155] Methods for improving the effectiveness of electromagnetic wave shielding components are explained.

[0156] The first method is to ensure that the electromagnetic wave shielding component 26 is not connected to any of the primary-side grounding GND0, secondary-side grounding GND1, or secondary-side grounding GND2. This method is particularly effective when the total area or volume of the electromagnetic wave shielding component exceeds a specified value. According to this method, the adverse effects caused by noise, such as high-frequency noise leakage to the outside through the grounding wire, are reduced.

[0157] The second method is to connect the electromagnetic wave shielding component 26 to the primary-side grounding GND0. The primary-side grounding GND0 is typically connected to a metal outer casing 3, providing a wide grounding area. Therefore, the zero-volt reference potential of the primary-side grounding GND0 is the most stable. This method not only improves the effectiveness of the electromagnetic wave shielding component 26 but also reduces malfunctions caused by noise.

[0158] The third method is to connect the electromagnetic wave shield 26 to the secondary side ground GND2. According to this method, the second electrode 25 and the electromagnetic wave shield 26 are insulated in both stages of the switching transformer T1 and T2. Therefore, high-frequency noise is less likely to leak from the first electrode 24 to the electromagnetic wave shield 26, and the electric field generated between the first electrode 24 and the second electrode 25 is stable.

[0159] The fourth method is to connect the secondary-side ground GND1 at a location that is separated from the second electrode 25 to a certain extent (at least outside the electromagnetic wave shielding 26). According to this method, a certain degree of shielding effect can be obtained, and high-frequency noise is less likely to leak from the first electrode 24 to the electromagnetic wave shielding 26. Therefore, the electric field generated between the first electrode 24 and the second electrode 25 is stable.

[0160] Among the methods described above for improving shielding effectiveness, the results can vary depending on the system structure and wiring. Therefore, considering the efficiency of the electric field generated between the first electrode 24 and the second electrode 25, as well as the effectiveness of the electromagnetic wave shielding device, it is necessary to select the optimal method from these options.

[0161] In the cold storage 1 of this embodiment, the outer casing 3, made of steel plates, functions as an electromagnetic wave shield. This prevents electromagnetic waves from leaking from the interior of the cold storage 1 to the outside.

[0162] In the aforementioned electromagnetic wave shielding structure, malfunctions and electromagnetic wave leakage caused by common-mode noise generated within the system and common-mode noise conducted to the secondary side ground GND1 or GND2 sometimes become problems. In particular, the common-mode noise largely overlaps with the high-frequency output cable generated in the conducted oscillation circuit 22 and radiates from the cable surface.

[0163] Therefore, coaxial cables are typically used for conducting high-frequency outputs. However, common-mode noise can sometimes be conducted to the outside of the outer conductor within the coaxial cable, which is intended to provide shielding.

[0164] Figure 19A and Figure 19B This describes the specific structure used to prevent malfunctions and radio wave leakage caused by common-mode noise. Figure 19A In this configuration, the electrode holding circuit board 52, including the matching circuit 23, is positioned away from the oscillation circuit 22, which includes the detector 51 (see the description below). Figure 20 The location is described. Coaxial cable 56a electrically connects the electrode holding circuit board 52 and the detector 51. The outer casing 3 of the cold storage 1 is made of metal, and coaxial cable 56a is wired to the inside of the outer casing 3.

[0165] This structure enables the suppression of electromagnetic wave leakage to the outside caused by common-mode noise conducted to the coaxial cable 56a. Furthermore, the various coaxial cables shown below are collectively referred to as coaxial cable 56. In this embodiment, coaxial cable 56 is equivalent to a connecting wire.

[0166] like Figure 19A As shown, coaxial cable 56a is wired to contact the inside of outer casing 3 at at least one location. The surface area of ​​outer casing 3 is [width missing], which is connected to the primary side ground GND0 (refer to [reference missing]). Figure 10 The reference potential is approximately equal to that of the coaxial cable 56a. Therefore, the common-mode noise conducted to the coaxial cable 56a can be released to the primary side ground GND0.

[0167] like Figure 19B As shown, the coaxial cable 56b is wired inside the outer casing 3, and on the other hand, the coaxial cable 56b is wired so as not to contact the inside of the outer casing 3.

[0168] To suppress malfunctions and electromagnetic leakage, the path of common-mode noise conducted through the coaxial cable 56 and the outer casing 3 is selected. Figure 19A Structure and Figure 19B Any structure within the structure. It needs to be designed so that the positional relationship between the coaxial cable 56 and the outer casing 3 reliably becomes... Figure 19A structure or Figure 19B The structure should not be something that results in uncertainty about its final structure during mass production.

[0169] Figure 20 Indicates that it is used to Figure 19B Based on the wiring, a structure is designed to suppress reliability degradation caused by temperature variations around the coaxial cable 56, bending of the coaxial cable 56 during wiring, etc. Figure 20 In the above, the coaxial cables 56a and 56b are described as the load-side coaxial cable 56d.

[0170] like Figure 20 As shown, one end of the coaxial cable 56c on the oscillation side is connected to the oscillation circuit 22 inside the shielding box 57. One end of the coaxial cable 56d on the load side is connected to the electrode holding region 30 (e.g., see reference 2010). Figure 3 The electrode holding circuit 52 is connected to the matching circuit 23.

[0171] A high-frequency connector 60c is disposed at one end of the coaxial cable 56c, and a high-frequency connector 60d is disposed at the other end of the coaxial cable 56d. The high-frequency connectors 60c and 60d are connected and electrically conductive. In this embodiment, the high-frequency connectors 60c and 60d are collectively referred to as the wire connection portion 60. That is, the storage space portion 61 houses the wire connection portion 60.

[0172] The wire connection part 60 is positioned further forward (towards the door) than the center of the main body 2 of the cold storage 1 in the depth direction.

[0173] The reasons for using two types of coaxial cables and for placing the wire connection part 60 further forward (towards the door) of the main body 2 of the cold storage 1 will be explained below.

[0174] The coaxial cable 56c is constructed from a cable referred to as a flexible cable. This flexible cable has an outer conductor formed by a metal coating (metal sheath) and an outer sheath covered by a flexible (i.e., bendable) insulating material. The coaxial cable 56c is introduced from the top surface of the outer casing 3 into the insulation material 40, and is wired within the insulation material 40 along the shape of the inner casing 4, being introduced into the inner casing 4 from the rear of the freezing / thawing chamber 6. Therefore, the flexible cable possesses a degree of flexibility, thus having the advantage of being easily wired along the shape of the inner casing 4 for use as the coaxial cable 56c.

[0175] The coaxial cable 56d is made of a cable called a semi-rigid cable. This semi-rigid cable has an outer conductor made of a metal tube such as copper.

[0176] Semi-rigid cables are less flexible than flexible cables. However, because their outer sheath (profile) is made of a metal tube, semi-rigid cables can maintain their shape when bent. Furthermore, their performance does not deteriorate even when bent at small radii of curvature.

[0177] Therefore, when the coaxial cable 56 is housed together with the high-frequency connectors 60c and 60d in the storage space 61, the operability of connecting the coaxial cable 56 can be improved by using materials with different flexibility to construct the outer sheath of the coaxial cable 56c and the outer sheath of the coaxial cable 56d.

[0178] like Figure 20 As shown, the storage space 61 is positioned closer to the opening than the back of the freezer / thaw chamber 6. This position closer to the opening than the back of the freezer / thaw chamber 6 is further forward than the center of the freezer / thaw chamber 6 in the depth direction.

[0179] In the high-frequency heating module 53 (for example, refer to...) Figure 4 When the refrigerator is stored in the main body 2 of the cold storage 1 through the opening of the freezing / thawing chamber 6, the storage space 61 is positioned above the high-frequency heating module 53. The storage space 61 may also be formed of molded (shaped) heat insulation material or the like.

[0180] To ensure impedance stability and shielding performance, the housings (outlines) of high-frequency connectors 60c and 60d are typically made of metal. However, metal components have high thermal conductivity; therefore, with changes in ambient temperature, the temperature of the insulation components within the high-frequency connectors 60c and 60d and the nearby coaxial cables 56c and 56d also varies. Consequently, high-frequency connectors 60c and 60d with metal housings are susceptible to changes in relative permittivity, etc.

[0181] Changes in the relative permittivity affect impedance and reduce the efficiency of radio wave transmission. In particular, the closer a location is to the air duct 12 inside the cold storage 1, the greater the temperature fluctuations due to cold air during cooling. Therefore, it is preferable to house the high-frequency connectors 60c and 60d within the storage space 61 in a resin box (not shown) or the like to suppress the influence of ambient temperature.

[0182] like Figure 20As shown, high-frequency connectors 60c and 60d are positioned away from the air duct 12. This "away from the air duct 12" means a position further forward than the center of the main body 2 in the depth direction (i.e., the front half of the cold storage 1). This structure suppresses temperature fluctuations caused by the influence of cold air.

[0183] [1-7. Structure of the first and second electrodes and the defrosting performance based on the structure]

[0184] Figure 11 This is a top view of the first electrode 24 and the second electrode 25 of the freezing / thawing chamber 6 from above. Figure 11 The left, right, top, and bottom sides of the middle correspond to the left, right, back, and front sides of cold storage 1, respectively.

[0185] like Figure 11 As shown, the size of the first electrode 24 is smaller than that of the second electrode 25. The first electrode 24 has an electrode hole 41, and the second electrode 25 has an electrode hole 42. Electrode holes 41 and 42 correspond to the first electrode hole and the second electrode hole, respectively.

[0186] Electrode holes 41 and 42 each have multiple through holes in the shape of elongated slits. In electrode holes 41 and 42, the multiple through holes are formed such that the long side of the through hole is along the front-back direction of the cold storage 1. Furthermore, the multiple through holes are arranged along the short side direction of the through holes, i.e., the left-right direction of the cold storage 1. The multiple through holes of electrode hole 41 have the same size and spacing as the multiple through holes of electrode hole 42.

[0187] By adopting such an electrode shape, from the positive terminals 24a to 24c (refer to) where the first electrode 24 is disposed, the electrode can be used to achieve the following: Figure 8 The high-frequency current input from the back side of the freezing / thawing chamber 6 tends to flow forward. As a result, the electric field generated between the first electrode 24 and the second electrode 25 becomes stronger.

[0188] When viewed from above, the through hole of electrode hole 41 and the through hole of electrode hole 42 do not completely overlap, but are positioned about half the width of the through hole in the short side direction (left-right direction).

[0189] According to this embodiment, electrode holes 41 with multiple through holes are formed on the electrode surface of the first electrode 24. Therefore, the region on the electrode surface of the first electrode 24 where a high-intensity electric field is formed is uniformly distributed. That is, the edges of the opening portions in the electrode holes 41 become electric field concentration regions on the electrode surface of the first electrode 24. As a result, uniform dielectric heating of the stored item is possible.

[0190] Figure 11The shapes and configurations of the electrode holes 41 and 42 shown are examples. The shapes and configurations of the electrode holes 41 and 42 are appropriately designed according to the specifications, structure, efficiency, and manufacturing costs of the cold storage. For example, the through holes of the electrode holes 41 and 42 can also be perfectly circular. In this case, it is preferable that, as described above, when viewed from above, the through holes of electrode holes 41 and 42 do not completely overlap, and are configured to deviate from approximately half their diameter in any direction.

[0191] The first electrode 24 of this invention is not limited to the structure described above; for example, it can be made as long as it has at least one opening. The edge of the opening becomes an electric field concentration region on the electrode surface of the first electrode 24. That is, the first electrode 24 of this invention can be configured such that the electric field concentration region is dispersed on the electrode surface.

[0192] Furthermore, the second electrode 25 of this invention is not limited to the above structure, as long as it has an opening for forming the required electric field between the two electrodes.

[0193] The electrode holding circuit board 52 is configured to separate the first electrode 24 and the second electrode 25 by a predetermined interval (e.g., see reference). Figure 8 The electrode spacing H is reliably maintained. This specified spacing (refer to...) Figure 8 The electrode spacing H is equal to the length of the long side of the first electrode 24. Figure 11 The dimension D) is short. When the first electrode 24 is circular, it is preferable that the electrode spacing H is shorter than its diameter; when the first electrode 24 is elliptical, it is preferable that the electrode spacing H is shorter than its major axis.

[0194] Figure 12 Indicates the electrode spacing H (e.g., reference). Figure 8 The relationship between the electric field strength and the electric field strength between the two electrodes. For example... Figure 12 As shown, there is a tendency for the electric field strength to be smaller as the electrode spacing H increases.

[0195] In particular, when the electrode spacing H exceeds H1 (100 mm), the electric field strength decreases significantly. When the electrode spacing H further exceeds H2 (125 mm), the electric field strength decreases to a level where heating is impossible. Therefore, the electrode spacing H needs to be 125 mm or less, preferably 100 mm or less.

[0196] The inventors simulated the generation of an electric field between the electrodes using a freeze / thaw chamber 6 having the electrode structure of this embodiment and a freeze / thaw chamber 6 having the electrode structure of a comparative example. The electrode structure of the comparative example is an electrode structure in which the first electrode 24 or the second electrode 25 does not have an electrode hole.

[0197] Figure 13AThe results are shown in the simulation obtained using a freeze / thaw chamber 6 with a comparative electrode structure. Figure 13B The results are shown in the simulation obtained using a freezing / thawing chamber 6 having the electrode structure of this embodiment. Figure 13A and Figure 13B In the diagram, the darker areas represent regions where the electric field is concentrated. Based on these results, it can be understood that... Figure 13B In the case shown, with Figure 13A Compared to the situation shown, the electric field concentration across the entire electrode is mitigated, enabling the electric field to be homogenized.

[0198] In this embodiment, such as Figure 11 As shown, the first electrode 24 and the second electrode 25 are configured such that the central axis along the vertical direction of electrode hole 41 is not aligned with the central axis along the vertical direction of electrode hole 42. The vertical direction of electrode hole 41 is along the normal direction of the plate-shaped first electrode 24, and the vertical direction of electrode hole 42 is along the normal direction of the plate-shaped second electrode 25. This structure mitigates the concentration of the electric field across the entire electrode.

[0199] Furthermore, in the electrode structure in which the first electrode 24 and the second electrode 25 are arranged such that their central axes along the vertical direction of electrode hole 41 and vertical direction of electrode hole 42 are aligned, the concentration of the electric field is generally mitigated compared to an electrode structure including a second electrode 25 without electrode holes. The mitigation of electric field concentration is particularly significant at the four corners.

[0200] In this embodiment, such as Figure 3 , Figure 4 As shown, the freezer / defreeze chamber 6 has a storage box 31 fixed to the back of the door 29. The storage box 31 moves back and forth inside the freezer / defreeze chamber 6 as the door 29 is opened and closed.

[0201] The freezer / defreeze chamber 6 has guide rails disposed on both sides, allowing the storage box 31 to move smoothly inside the freezer / defreeze chamber 6. Additionally, the freezer / defreeze chamber 6 has sliding components disposed on the outer sides of the storage box 31 and sliding along the guide rails. The guide rails and sliding components are positioned outside the area within the freezer / defreeze chamber 6 sandwiched between the first electrode 24 and the second electrode 25, so that they are not heated by the medium.

[0202] [1-8. Heating treatment based on electric field]

[0203] In the cold storage 1 of this embodiment, when an electric field generation command is input to the operation unit 47, an electric field generation process is performed on the space between the first electrode 24 and the second electrode 25 in the freezing / thawing chamber 6.

[0204] In the electric field generation process of this embodiment, as described later, the control unit 50 controls not only the medium heating mechanism, but also the cooling mechanism and the cold air introduction mechanism. The cooling mechanism includes the refrigeration cycle of the compressor 19 and the cooler 13, etc. The cold air introduction mechanism includes the cooling fan 14 and the damper 12a, etc.

[0205] In the electric field generation process of this embodiment, a predetermined high-frequency voltage is applied between the first electrode 24 and the second electrode 25, and the food is heated by the high-frequency electric field between the electrodes. During the heating process, the control unit 50 controls the opening and closing of the damper 12a to continuously or intermittently introduce cold air.

[0206] Figure 14 The control signals (waveforms (a), (b)) input to the medium heating mechanism (oscillation circuit 22) and the cold air introduction mechanism (damper 12a) during the electric field generation process, the temperature [°C] of the food and freezing / thawing chamber 6 (waveform (c)), and the humidity [%RH] of the freezing / thawing chamber 6 (waveform (d)) are represented.

[0207] Due to the frequency characteristics used in the electric field generation process, structures using VHF waves are less prone to "localized overheating (uneven localized heating)" compared to structures using microwaves. To further achieve more uniform thawing, the cold storage 1 of this embodiment includes an electrode holding circuit board 52. This allows the flat first electrode 24 and the second electrode 25 to be separated by a predetermined interval (see reference...). Figure 8 The electrodes are kept approximately parallel by a spacing H.

[0208] like Figure 14 As shown, when the input electric field generates a command ( Figure 14 (tm1), the oscillation circuit 22 is turned on ( Figure 14 A waveform (a) is applied, for example, a high-frequency voltage of 40.68 MHz, between the first electrode 24 and the second electrode 25. This initiates the thawing process. At this time, because the damper 12a is opened, the temperature of the freezing / thawing chamber 6 is maintained at the freezing temperature t1 (e.g., -20°C).

[0209] After a specified period has elapsed since the start of thawing ( Figure 14 (tm2), and then close the damper 12a. When the damper 12a is closed, the temperature of the freezing / thawing chamber 6 begins to rise. In the electric field generation process of this embodiment, the opening and closing of the damper 12a is controlled together with the medium heating. As a result, the rise in the surface temperature of the frozen product can be suppressed, and thawing can be performed in a manner that does not produce so-called "local overheating".

[0210] The control unit 50 controls the opening and closing of the damper 12a based on reflectivity. When the reflectivity increases and reaches a preset threshold, the control unit 50 opens the damper 12a, causing the temperature of the freezer / defreeze chamber 6 to decrease. Figure 14 tm3).

[0211] In this way, by controlling the opening and closing of the damper 12a, cold air is intermittently introduced into the freezer / defrost chamber 6. Figure 14 The waveform (b) shows that, therefore, the contents stored in the freeze / thaw chamber 6 are kept in the required frozen state while being heated by the medium, and the temperature of the contents reaches the target temperature t2. Figure 14 The waveform (c)). When the control unit 50 detects the required thawing state based on the reflectivity, it ends the electric field generation process.

[0212] When the preserved item is gradually melted by heating with a medium, the number of melted water molecules increases, causing a change in the dielectric constant of the preserved item. This shifts the impedance matching state, increasing reflectivity. When the reflectivity reaches a preset threshold, the control unit 50 causes the matching circuit 23 to perform impedance matching, reducing the reflectivity.

[0213] In the electric field generation process of this embodiment, the control unit 50 detects that thawing is complete when the reflectivity after impedance matching by the matching circuit 23 exceeds a threshold for detecting completion of thawing. The threshold for detecting completion of thawing is a preset value for detecting when the thawing of the preserved food has reached the required thawing state.

[0214] Here, the required thawing state of the preserved item means that the user can cut the preserved item with one hand and that very little juice (dripping water) is released from the preserved item.

[0215] As described above, by controlling the opening and closing of the damper 12a, relatively low humidity cold air is intermittently supplied to the freezer / defrost chamber 6 via the air duct 12 and the cold air inlet 20. Therefore, unlike the case where the damper 12a is always closed, the humidity of the freezer / defrost chamber 6 will not reach 100%. Figure 14 The waveform (d) is shown. As a result, condensation in the freeze / thaw chamber 6 can be prevented.

[0216] [1-9. Storage Processing Based on Electric Field Generation]

[0217] Figure 15 This is a flowchart illustrating the control process for cooling and generating an electric field to allow food to be in any state within the freezing / thawing chamber 6.

[0218] As described above, when the reflectivity exceeds the threshold used to detect the completion of thawing after impedance matching is performed in the electric field generation process, the control unit 50 performs... Figure 15The electric field shown is used to control the process after thawing. For example, the preserved item is maintained in the required thawed state after the thawing process is completed.

[0219] One method for controlling this is to adjust the temperature of the freezer / thaw chamber 6 to a so-called micro-freezing temperature range, for example, about -1°C to -3°C. Another method is to adjust the temperature of the freezer / thaw chamber 6 to a freezing temperature range, for example, -18°C to -20°C.

[0220] The temperature of the freezing / thawing chamber 6 can also be periodically varied. By periodically varying the temperature of the freezing / thawing chamber 6, for example, within the range of -12°C to -5°C, the composition of the food can be affected. In the above control method, cooling and heating are performed by continuously applying a low-output high-frequency electric field or intermittently applying a high frequency, thereby maintaining the preserved food within the required temperature range.

[0221] like Figure 15 As shown, in step S101, after the preservation process begins, the control unit 50 detects whether there is a preserved item in the freeze / thaw chamber 6 based on reflectivity (step S101).

[0222] Specifically, the control unit 50 causes the matching circuit 23 to operate intermittently and the oscillation circuit 22 to output low-power electromagnetic waves intermittently. The control unit 50 compares the reflectivity with a preset threshold for detecting the presence or absence of stored items to determine whether there are stored items in the freezer / thaw chamber 6.

[0223] If no contents are detected in the freeze / thaw chamber 6 (in the case of "No" in step S101), the control unit 50 transfers the process to step S105. In step S105, the control unit 50 adjusts the temperature of the freeze / thaw chamber 6 to a freezing temperature range, for example, -18°C to -20°C. Hereinafter, the process in step S105 will be referred to as the freezing process.

[0224] If the presence of a preserved item is detected in the freeze / thaw chamber 6 (Yes in step S101), the control unit 50 determines in step S102 whether the preserved item includes a thawed, unfrozen item based on the change in reflectivity.

[0225] There are situations where, even after the electric field treatment of the preserved items is completed, the user does not immediately remove the items from the freezer / thaw chamber 6. In this case, the control unit 50 controls the cooling mechanism to maintain the micro-freezing temperature zone for a predetermined time, which keeps the preserved items in the freezer / thaw chamber 6 in the required thawed state. If the preserved items are stored for longer than the predetermined time, in order to maintain the freshness of the preserved items, the control unit 50 transfers the temperature of the freezer / thaw chamber 6 to the freezing temperature zone.

[0226] In step S102, if the control unit 50 determines that the time elapsed after the thawing of the preserved item in the thawed state exceeds a predetermined time (step S102), the process is transferred to step S105 to perform freezing.

[0227] In step S102, when the control unit 50 determines that no thawed unfrozen products are stored in the freezer / thaw chamber 6 (in the case of "No" in step S102), the process is transferred to step S103.

[0228] In step S103, the control unit 50 determines whether the food temperature exceeds the target temperature. If the food temperature exceeds the target temperature ("Yes" in step S103), the control unit 50 transfers the process to step S105 for freezing. If not ("No" in step S103), the control unit 50 transfers the process to step S104, where an electric field is generated to raise the temperature of the food.

[0229] The following is a specific example of this control. In the freezing process of the cold storage 1 of this embodiment, the medium is heated in a manner that preserves the food in the required state.

[0230] Normally, when food is frozen, frost forms on the inner surface of the food packaging material due to moisture inside the freezer / thaw chamber 6 and the food itself. When frost forms on the food surface, the food suffers frostbite (freezing burn). Frostbite is caused by freezing, which dries the food, making it dry and less fresh and palatable.

[0231] To prevent frostbite, the cold storage 1 in this embodiment simultaneously performs cooling and medium heating.

[0232] Figure 16A , Figure 16B It is a waveform diagram that shows the state of each element in the cooling process. Figure 16A It is a waveform diagram representing the cooling action of a cold storage facility using existing technology. Figure 16B This is a waveform diagram showing the cooling operation of the cold storage 1 in this embodiment.

[0233] exist Figure 16A In the diagram, waveform (1) represents the ON / OFF (on / off) of the cooling operation. The ON / OFF of the cooling operation is equivalent to, for example, the opening and closing of the damper 12a, or the ON / OFF (on / off) of the compressor 19. That is, when the cooling operation is "ON (on)," cold air is introduced into the freezer compartment 8. When the cooling operation is "OFF (off)," the damper 12a is closed, cutting off the introduction of cold air into the freezer compartment 8.

[0234] Therefore, as Figure 16AAs shown in waveform (2), the temperature of the food in the freezer compartment 8 fluctuates significantly around a preset freezing temperature t1 (e.g., -20°C). As a result, during the cooling operation of the prior art, the food surface in the freezer compartment 8 repeatedly experiences moisture evaporation and frost formation, resulting in an unsatisfactory freezing state.

[0235] On the other hand, Figure 16B The cooling action of the cold storage 1 shown is different from the cooling action of the prior art, in which the food is simultaneously cooled and heated by the medium. Figure 16B The waveform (1) represents the opening and closing of the damper 12a.

[0236] exist Figure 16B In this embodiment, "ON" indicates that the damper 12a is open. In this state, cold air is introduced into the freezing / thawing chamber 6 through the air duct 12 and the cold air inlet 20. "OFF" indicates that the damper 12a is closed. In this state, the introduction of cold air into the freezing / thawing chamber 6 is cut off. In the cooling operation of this embodiment, the introduction of cold air and the heating of the medium are carried out simultaneously. Therefore, in order to prevent a reduction in cooling capacity, the cold air introduction time is set to be longer than in the prior art.

[0237] Figure 16B The waveform (2) represents the operating state of the oscillating circuit 22. For example... Figure 16B As shown in waveform (2), when the damper 12a is opened, the control unit 50 turns the oscillation circuit 22 ON to heat the medium.

[0238] In the cooling operation of this embodiment, the medium is heated with a lower power than that used in the defrosting operation. The control unit 50 adjusts the output power by controlling the electrical power supplied to the oscillation circuit 22 or by performing PWM control (intermittent control) on the output of the oscillation circuit 22.

[0239] The result is, as Figure 16B As shown in waveform (3), the food temperature in the freezing / thawing chamber 6 is maintained at a preset freezing temperature t1 (e.g., -20°C). That is, it can suppress fluctuations in food temperature.

[0240] The results of this experiment show that if the temperature fluctuation of the food is less than 0.1K, the formation of frost can be eliminated. In other words, by suppressing temperature fluctuations in the food, the formation of frost can be suppressed.

[0241] Furthermore, by using a medium that operates at the same frequency as during thawing but with a lower output power, the growth of ice crystals inside the food can be suppressed. During medium heating, the electric field tends to concentrate at the tip of the ice crystals formed within the food. Therefore, even when the temperature inside the freezing / thawing chamber 6 is below the maximum ice crystal formation zone, ice crystals grow only slowly.

[0242] As described above, the cold storage 1 of this embodiment can freeze and preserve frozen products in the required state by heating the medium during the cooling operation in the freezing preservation process.

[0243] [1-10. Freezing Process Based on Electric Field]

[0244] In this embodiment, the cold storage 1 freezes non-frozen foods that have been placed back into the freezer / thaw chamber 6 based on user instructions input via the operation unit 47. Figure 17 It is a waveform diagram showing the state of each element in the rapid cooling (sudden cooling) action as a freezing process.

[0245] Figure 17 The waveform (a) indicates whether there is preserved food in the freezer / thaw chamber 6. The control unit 50 determines whether there is preserved food in the freezer / thaw chamber 6 based on reflectivity.

[0246] Figure 17 The waveform (b) indicates that the control unit 50 intermittently acquires information from the matching circuit 23 and the detector unit 51. Figure 17 The waveform (c) represents an example of the shift in reflectivity. When the reflectivity falls below the first threshold R1 [%], the control unit 50 determines that a preserved item has been placed in the freeze / thaw chamber 6.

[0247] During the rapid cooling operation of food stored in the freezer / thaw compartment 6, the control unit 50 forces continuous operation to increase the speed of the compressor 19 and cooling fan 14 of the cooling mechanism to enhance cooling capacity. Figure 17 As shown in waveform (d), the control unit 50 forcibly opens the damper 12a of the air duct 12 connected to the freezer / thaw chamber 6 to introduce cold air.

[0248] During rapid cooling, medium heating is performed to suppress ice crystal growth when the food temperature is within the maximum ice crystal formation zone (approximately -1°C to approximately -5°C). To reduce the output power compared to thawing (e.g., below tens of W), this medium heating is performed intermittently. Figure 17 The period h in the waveform (e).

[0249] In order to initiate medium heating, the control unit 50 detects an increase in the reflectivity of the food as it passes through the latent heat region, indicating that the food temperature has entered the maximum ice crystal formation zone. In this embodiment, medium heating is initiated when the detected reflectivity reaches a preset second threshold R2 [%] (see reference). Figure 17 The waveform (e)).

[0250] When the reflectance is in the region between the second threshold R2 [%] and the third threshold R3 [%], the control unit 50 determines that the temperature of the food is in the maximum ice crystal formation zone and continues to heat the medium. A predetermined time pr1 (refer to...) has elapsed since the reflectance entered the third threshold R3 [%]. Figure 17 In the case of waveform diagram (c), it is determined that the temperature of the food has passed the maximum ice crystal formation zone, and the heating medium is stopped.

[0251] As described above, the control unit 50 stops the medium heating and ends the rapid cooling operation, and performs a normal cooling operation. In this way, even when a rapid cooling operation is performed, the food can be kept in a satisfactory frozen state by heating the medium for the desired period of time.

[0252] [1-11. Safety control based on door switches]

[0253] As described above, in order to prevent electromagnetic waves from leaking to the outside, the cold storage 1 of this embodiment includes an electromagnetic wave shield 26 surrounding the freezing / thawing chamber 6. The steel plate itself also functions as an electromagnetic wave shield, thus the external leakage of electromagnetic waves can be prevented by using the closed door 29.

[0254] However, when door 29 is opened, electromagnetic waves may leak from the opening of the freezer / thaw chamber 6. Therefore, safety measures are needed.

[0255] The cold storage 1 in this embodiment includes a door opening / closing detection unit 55a for detecting the opening of the door 29 (see reference). Figure 9 When the door opening / closing detection unit 55a detects that the door 29 is open, the control unit 50 stops the oscillation circuit 22 and stops supplying electrical power to the first electrode 24.

[0256] In addition to the door 29 of the freezer / thaw compartment 6, the cold storage 1 also includes multiple doors covering the front openings of the cold storage compartment 5, the ice-making compartment 7, the freezer compartment 8, and the vegetable compartment 9. Furthermore, the cold storage 1 includes door opening / closing detection units 55b, 55c, 55d, and 55e. Door opening / closing detection units 55b, 55c, 55d, and 55e respectively detect the opening of the doors of the cold storage compartment 5, the ice-making compartment 7, the freezer compartment 8, and the vegetable compartment 9.

[0257] If the electromagnetic wave shielding component 26 functions properly, there will be no external leakage of electromagnetic waves exceeding the specified level. Therefore, even if any of the door opening / closing detection units 55b to 55e detects the opening of the door to the storage compartment other than the freezer / thaw chamber 6, the control unit 50 will continue to operate the oscillation circuit 22.

[0258] However, if the electromagnetic wave shielding component 26 does not adequately surround the freezing / thawing chamber 6 due to design issues, countermeasures are needed to prevent external leakage of electromagnetic waves.

[0259] In cases where the electromagnetic wave shielding member 26 cannot be positioned on the top surface of the freezer / thaw chamber 6, the storage chamber above the freezer / thaw chamber 6 (in this embodiment, the cold storage chamber 5 (see reference 5)) Figure 1 When the door is open, the control unit 50 stops the oscillation circuit 22.

[0260] In cases where the electromagnetic wave shielding member 26 cannot be positioned on the bottom surface of the freezing / thawing chamber 6, the storage chamber below the freezing / thawing chamber 6 (in this embodiment, the freezing chamber 8 and the vegetable chamber 9 (see reference 1)) Figure 1 When the door is open, the control unit 50 stops the oscillation circuit 22.

[0261] In cases where the electromagnetic wave shielding member 26 cannot be positioned on the side of the freezer / thaw chamber 6, the storage chamber on the side of the freezer / thaw chamber 6 (in this embodiment, the ice-making chamber 7 (see reference 6)) is used. Figure 1 When the door is open, the control unit 50 stops the oscillation circuit 22.

[0262] Thus, when the door of the storage room on the side where the electromagnetic wave shield 26 cannot be installed is opened, the control unit 50 stops the oscillation circuit 22 to prevent electromagnetic wave leakage.

[0263] The method for stopping the oscillation circuit 22 will be described below.

[0264] Figure 18A This describes a structure that uses the door opening / closing detection unit 55a to cut off the power supply from the power supply unit 48 to the oscillation circuit 22. For example... Figure 18A As shown, the door opening / closing detection unit 55a is a switching mechanism that is activated when the door 29 is closed and deactivated when the door 29 is opened. When the door 29 is opened, the door opening / closing detection unit 55a cuts off the power supply to the oscillation circuit 22, reliably stopping the operation of the oscillation circuit 22.

[0265] Figure 18B This describes a structure that uses the door opening / closing detection unit 55a to stop the operation of the power control unit 48a of the control power supply unit 48. For example... Figure 18B As shown, the door opening / closing detection unit 55a is related to... Figure 18A The same switching mechanism. When the door 29 is opened, the door opening and closing detection unit 55a cuts off the power supply to the power control unit 48a, thereby cutting off the power supply from the power supply unit 48 to the oscillation circuit 22 and reliably stopping the operation of the oscillation circuit 22.

[0266] exist Figure 18BIn the structure shown, the operation of the oscillation circuit 22 is stopped by cutting off the power supply to the circuit inside the power control unit 48a, but the present invention is not limited to this.

[0267] For example, the power control unit 48a may also include an overcurrent protection circuit that detects overcurrent. In this case, when the overcurrent protection circuit detects the occurrence of overcurrent, the power control unit 48a stops the power supply. The power supply unit 48 may also identify the occurrence of overcurrent as an overload condition and stop the power supply.

[0268] Figure 18C This indicates a structure that uses a door opening / closing detection unit 55a and a magnetic sensor 55f to determine the opening and closing of door 29. For example... Figure 18C As shown, the door opening / closing detection unit 55a is disposed between the magnetic sensor 55f and the control unit 50.

[0269] The door opening / closing detection unit 55a is activated when the door 29 is closed and deactivated when the door 29 is opened. The magnetic sensor 55f sends a signal indicating whether the door 29 is open or closed to the control unit 50. Based on the signal from the magnetic sensor 55f, the control unit 50 sends a signal indicating whether the operation of the power control unit 48a is permissible.

[0270] according to Figure 18C As shown in the structure, when door 29 is opened, the power control unit 48a becomes unable to receive signals from the magnetic sensor 55f. Therefore, power supply to the oscillation circuit 22 can be stopped.

[0271] exist Figures 18A to 18C The structure shown utilizes hardware to implement power supply and control signal switching. Therefore, it is highly resistant to high-frequency noise and external noise, and is less prone to malfunctions.

[0272] In addition, Figure 18B and Figure 18C In the structure shown, the door opening / closing detection unit 55a is turned on when the door 29 is closed and turned off when the door 29 is opened. However, a circuit can also be used where the circuit is turned off when the door 29 is closed and turned on when the door 29 is open. In this case, the logic of the power-off control unit 48a is reversed.

[0273] The cold storage 1 in this embodiment includes a freezer / thaw chamber 6 with both freezing and thawing functions. However, according to this invention, the same effect can be obtained even in a structure that includes a thawing chamber with only a thawing function.

[0274] [2-1. Effects, etc.]

[0275] As described above, one embodiment of the cold storage 1 of this invention includes a main body 2, a storage chamber (freezing / thawing chamber 6), an oscillation circuit 22, electrodes (first electrode 24, second electrode 25), and connecting wires (coaxial cable 56). The storage chamber (freezing / thawing chamber 6) is disposed in the main body 2 and has a storage space capable of storing preserved items. The oscillation circuit 22 generates high-frequency electrical power. The electrodes (first electrode 24, second electrode 25) are disposed in the storage chamber (freezing / thawing chamber 6) and generate an electric field corresponding to the high-frequency electrical power in the storage chamber (freezing / thawing chamber 6). The connecting wires (coaxial cable 56) connect the oscillation circuit 22 and the electrodes (first electrode 24). The connecting wires (coaxial cable 56) include: an oscillation-side wire (coaxial cable 56c) extending from the oscillation circuit 22, a load-side wire (coaxial cable 56d) extending from the first electrode 24, and a wire connection portion 60 connecting the oscillation-side wire (coaxial cable 56c) and the load-side wire (coaxial cable 56d). The wire connection portion 60 is positioned closer to the front side than the center in the depth direction of the main body 2.

[0276] This structure prevents the wire connection 60 from being cooled. As a result, the impedance of the high-frequency power transmission path can be stabilized.

[0277] In addition, the cold storage of this utility model also includes a storage space 61 for storing the wire connection part 60. This further improves heat insulation and operability.

[0278] Furthermore, the oscillation circuit 22 is disposed on the upper part of the main body 2. By displacing the heat-generating oscillation circuit 22 away from the wire connection portion 60, the impedance of the high-frequency power transmission path can be stabilized.

[0279] Industrial availability

[0280] This invention is applicable to various cold storage facilities.

[0281] Explanation of reference numerals in the attached figures

[0282] 1. Cold storage

[0283] 2. Main Body

[0284] 3 outer box

[0285] 4. Inner Box

[0286] 5 Cold room

[0287] 6 Freezer / Defrost Compartment

[0288] 7 Ice-making room

[0289] 8. Freezer

[0290] 9 Vegetable Room

[0291] 10. Machine Room

[0292] 11 Cooling Chamber

[0293] 12 air ducts

[0294] 12a Air damper

[0295] 13 Cooler

[0296] 14 Cooling Fan

[0297] 15 Defrosting Heater

[0298] 16 Drainage trays

[0299] 17 Drainage pipe

[0300] 18 Evaporating dish

[0301] 19 Compressors

[0302] 20 Cold air inlet vents

[0303] 21. Transverse beam

[0304] 22 Oscillating Circuit

[0305] 22a Oscillation Source

[0306] 22b First Amplifier Circuit

[0307] 22c Second Amplifier Circuit

[0308] 23 Matching Circuit

[0309] 24 First Electrode

[0310] 24a, 24b, 24c Positive extremes

[0311] 25 Second electrode

[0312] Cathode terminals 25a, 25b, 25c

[0313] 26 Electromagnetic wave shielding components

[0314] 26a Top-side electromagnetic wave shielding component

[0315] 26b Rear side electromagnetic wave shielding component

[0316] 26c Bottom-side electromagnetic wave shielding component

[0317] 26d door-side electromagnetic wave shielding component

[0318] 29 doors

[0319] 30 Electrode holding area

[0320] 31 Storage Boxes

[0321] 32, 32a, 32b, 32c Inner surface components

[0322] 36 Washer

[0323] 40 Thermal insulation materials

[0324] 41 Electrode holes

[0325] 42 Electrode holes

[0326] 47 Operations Department

[0327] 48 Power Supply Section

[0328] 48a Power Control Section

[0329] 49 Temperature Sensor

[0330] 50 Control Department

[0331] 51. Detector Section

[0332] 52 Electrode Holding Circuit Board

[0333] 53 High-frequency heating module

[0334] 54 pillars

[0335] Door opening and closing detection department (55a, 55b, 55c, 55d, 55e)

[0336] 55F magnetic sensor

[0337] 56, 56a, 56b, 56c, 56d coaxial cables

[0338] 57 Shielding Box

[0339] 58 Cooling Fan

[0340] 59a Inlet

[0341] 59b Discharge

[0342] 60 Wire connection part

[0343] 60C and 60D high-frequency connectors

[0344] 61. Storage Space Section.

Claims

1. A cold storage warehouse, characterized in that, include: main body; A storage room, which is located in the main body, has storage space capable of storing and preserving items; An oscillating circuit, configured to generate high-frequency electrical power; Electrodes, disposed in the storage chamber, are configured to generate an electric field in the storage chamber corresponding to the high-frequency electric power; and A connecting wire connects the oscillation circuit and the electrode. The connecting wire includes: an oscillation-side wire extending from the oscillation circuit; a load-side wire extending from the electrode; and a wire connection portion connecting the oscillation-side wire and the load-side wire. The wire connection portion is positioned further forward than the center of the main body in the depth direction.

2. The cold storage warehouse according to claim 1, characterized in that: It also includes a storage space for storing the wire connection portion.

3. The cold storage warehouse according to claim 1, characterized in that: The oscillation circuit is disposed on the upper part of the main body.

Citation Information

Patent Citations

  • Business-use refrigerator provided with defrosting function

    JP2002147919A