A silicon wafer heating and drying apparatus

Abstract

The utility model discloses a kind of silicon wafer heating drying equipment, it is related to silicon wafer processing technical field.It includes: heating furnace body, heating furnace body is composed of heating furnace main body and conveyer belt;Lifting mechanism, lifting mechanism is set to one side of conveyer belt;Lifting mechanism includes: rectangle ring, rectangle ring is located one side of conveyer belt, rectangle ring is fixedly connected in heating furnace main body;Through hole, through hole is set in the top of rectangle ring;Laser generator, laser generator is fixedly installed in the inner chamber of through hole, and laser generator is used to emit laser signal.The utility model utilizes the setting of lifting mechanism, cooperate between rectangle ring, laser generator, laser receiver, buzzer, guide rod and delay component, silicon wafer and silicon wafer tray can be reminded staff to have separated from tunnel and extend before time of falling, convenient staff to take away silicon wafer in time, effectively avoid silicon wafer falling damage, ensure production cost.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a silicon wafer heating and drying equipment. Background Technology

[0002] Silicon wafers are thin sheets made from high-purity silicon and are the core basic material of the semiconductor industry. They are mainly used to manufacture chips, solar cells, etc. Tunnel microwave heating furnaces are a type of continuous industrial heating equipment commonly used for heating and drying silicon wafers. They convert microwaves directly into heat energy by penetrating the material. The furnace body is tunnel-shaped, and the material continuously passes through the heating zone with a conveyor belt. It has the characteristics of fast heating speed, good uniformity, and low energy consumption.

[0003] Some tunnel-type microwave heating furnaces, due to design considerations such as compatibility and avoiding collisions and jams, do not have physical obstruction structures at the feed and discharge ends of the conveyor belt. Although this design ensures the smooth operation of the equipment, in actual production, there are instances where workers are focused on adjusting the control panel parameters such as furnace temperature and microwave power and fail to remove the heated and dried silicon wafers and wafer trays from the conveyor belt in time. This can easily lead to the silicon wafers falling and getting damaged, increasing production costs. Utility Model Content

[0004] Therefore, it is necessary to provide a silicon wafer heating and drying device to address the problem that workers are focused on adjusting the control panel parameters such as furnace temperature and microwave power and fail to remove the heated and dried silicon wafers and wafer trays from the conveyor belt in a timely manner.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a silicon wafer heating and drying device, comprising: The furnace body consists of a furnace main body and a conveyor belt. An elongation mechanism is disposed on one side of the conveyor belt, and the elongation mechanism is used to remind and extend the time before the silicon wafer and silicon wafer tray fall.

[0006] Preferably, the lifting mechanism includes: A rectangular ring is located on one side of the conveyor belt and is fixedly connected to the main body of the heating furnace; A through hole is provided at the top of the rectangular ring; A laser generator is fixedly installed in the inner cavity of the through hole, and the laser generator is used to emit laser signals; A circular groove is formed at the bottom of the inner wall of a rectangular ring; A laser receiver is fixedly installed in the inner cavity of the central groove, with the laser receiving end of the laser receiver facing the laser generator. The laser receiver is used to receive the laser signal emitted by the laser generator. A buzzer alarm is fixedly installed on the top of the heating furnace body. The buzzer alarm is located on one side of a rectangular ring. The signal control terminal of the buzzer alarm is electrically connected to the signal output pin of the laser receiver. A guide rod is rotatably connected to the inner cavity of the heating furnace body, and the rectangular ring is located between the conveyor belt and the guide rod; A delay component, located on one side of a rectangular ring, is used to extend the time before the silicon wafer and wafer tray fall.

[0007] Preferably, the delay component includes: Two fixing blocks are symmetrically fixedly connected to one side of the heating furnace body; A rotating shaft is rotatably connected between two fixed blocks; An extension plate is fixedly sleeved onto the outer wall of the rotating shaft; Two threaded holes are provided on one side of one of the fixing blocks; Two locking holes are provided on one side of another fixing block; A strip-shaped through hole is formed on one side of the extension plate; Two locking bolts, the outer walls of the two locking bolts are threaded to the inner walls of the corresponding threaded holes, and one end of each of the two locking bolts is movably sleeved with the inner cavity of the strip-shaped through hole; A locking rod is movably sleeved in the inner cavity of a strip-shaped through hole, and one end of the locking rod is movably sleeved in the inner cavity of a corresponding locking hole.

[0008] Preferably, the delay component further includes: An annular groove, wherein the annular groove is formed on the inner wall of the strip-shaped through hole; An annular slider is slidably fitted into the inner cavity of an annular groove, and the annular slider is fixedly fitted into the outer wall of the locking rod.

[0009] Preferably, the delay component further includes: A return spring is located inside the annular groove. One end of the return spring is fixedly connected to one side of the inner wall of the annular groove, and the other end of the return spring is fixedly connected to the front of the annular slider. The return spring is used to drive the annular slider and the locking rod to automatically perform a reset movement.

[0010] Preferably, the delay component further includes: Two strip baffles are symmetrically fixedly connected to the top of the extension plate. The strip baffles are used to prevent the silicon wafers and silicon wafer trays from detaching from the two sides of the top of the extension plate.

[0011] Preferably, the delay component further includes: A rectangular notch is formed at the top of one of the strip baffles; A level is fixedly connected to the inner cavity of a rectangular notch groove. The level is used to determine whether the extension plate is level.

[0012] In summary, this utility model has at least one of the following beneficial technical effects: This invention utilizes a lifting mechanism that, through the coordination of a rectangular ring, a laser generator, a laser receiver, a buzzer alarm, a guide rod, and a delay component, can alert workers that the silicon wafers and wafer trays have detached from the tunnel and extend the time before they fall. This allows workers to promptly remove the silicon wafers and wafer trays, effectively preventing damage from falling wafers and ensuring production efficiency.

[0013] This utility model utilizes the arrangement of threaded holes, strip-shaped through holes, locking holes, locking bolts, and locking rods to improve the stability of the extension plate in both horizontal and vertical states through the cooperation between the threaded holes, strip-shaped through holes, locking holes, locking bolts, and locking rods. Attached Figure Description

[0014] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a top sectional view of the locking rod of this utility model. Figure 3 This is a front cross-sectional view of the rectangular ring structure of this utility model; Figure 4 For the present utility model Figure 1 A magnified schematic diagram of the structure at point A in the middle.

[0015] In the attached image: 1. Heating furnace body; 11. Heating furnace main body; 12. Conveyor belt; 2. Lifting mechanism; 21. Rectangular ring; 22. Laser generator; 23. Laser receiver; 24. Buzzer alarm; 25. Guide rod; 26. Delay component; 261. Fixing block; 262. Rotating shaft; 263. Extension plate; 264. Locking bolt; 265. Locking rod; 266. Annular slider; 267. Return spring; 268. Strip baffle; 269. Level. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] exist Figure 1-4 In the illustrated embodiment, the present invention provides a technical solution: a silicon wafer heating and drying device, comprising: a heating furnace body 1, which is composed of a heating furnace main body 11 and a conveyor belt 12; and a lifting mechanism 2, which is disposed on one side of the conveyor belt 12 and is used to remind and extend the time before the silicon wafer and silicon wafer tray fall.

[0018] The stretching mechanism 2 includes: a rectangular ring 21 located on one side of the conveyor belt 12 and fixedly connected to the furnace body 11; a through hole located at the top of the rectangular ring 21; a laser generator 22 fixedly installed in the cavity of the through hole, used to emit laser signals, and the emitted beam must not damage the silicon wafer; a circular groove located at the bottom of the inner wall of the rectangular ring 21; and a laser receiver 23 fixedly installed in the cavity of the circular groove, with its laser receiving end facing the laser generator 22. The laser receiver 23 is used to receive the laser signals emitted by the laser generator 22 and must be compatible with the laser generator 22. The laser generator 22 can be a Thorlabs CPS650, and the laser receiver 23 can be a Thorlabs... PDA100A2; Buzzer alarm 24, which is fixedly installed on the top of the heating furnace body 11 and located on one side of the rectangular ring 21. The signal control terminal of the buzzer alarm 24 is electrically connected to the signal output pin of the laser receiver 23. The buzzer alarm 24 can be HNB09A05; Guide rod 25, which is rotatably connected to the inner cavity of the heating furnace body 11. The rectangular ring 21 is located between the conveyor belt 12 and the guide rod 25; Delay component 26, which is located on one side of the rectangular ring 21 and is used to extend the time before the silicon wafer and silicon wafer tray fall.

[0019] Specifically, the delay component 26 includes: two fixing blocks 261, which are symmetrically fixedly connected to one side of the heating furnace body 11; a rotating shaft 262, which is rotatably connected between the two fixing blocks 261; an extension plate 263, which is fixedly sleeved on the outer wall of the rotating shaft 262, with a round hole on its front side, through which the extension plate 263 is fixedly sleeved on the outer wall of the rotating shaft 262; two threaded holes, which are opened on one side of one of the fixing blocks 261; and two locking holes. Two locking holes are formed on one side of another fixing block 261; a strip-shaped through hole is formed on one side of the extension plate 263; two locking bolts 264 are threaded to the inner wall of the corresponding threaded hole, and one end of each locking bolt 264 is movably sleeved in the inner cavity of the strip-shaped through hole; a locking rod 265 is movably sleeved in the inner cavity of the strip-shaped through hole, and one end of the locking rod 265 is movably sleeved in the inner cavity of the corresponding locking hole; an annular groove is formed. The annular slider 266 is slidably sleeved in the inner cavity of the annular groove and fixedly sleeved on the outer wall of the locking rod 265. The annular groove and the annular slider 266 are used to limit the movement trajectory of the locking rod 265. A return spring 267 is located in the inner cavity of the annular groove. One end of the return spring 267 is fixedly connected to one side of the inner wall of the annular groove, and the other end of the return spring 267 is fixedly connected to the front of the annular slider 266. The return spring 267 is used to... The moving ring slider 266 and locking rod 265 automatically perform a reset movement; two strip baffles 268 are symmetrically fixedly connected to the top of the extension plate 263, and the strip baffles 268 are used to prevent the silicon wafers and silicon wafer trays from detaching from the two sides of the top of the extension plate 263; a rectangular notch is formed on the top of one of the strip baffles 268; a level 269 is fixedly connected to the inner cavity of the rectangular notch; the level 269 is used to determine whether the extension plate 263 is level.

[0020] The specific working principle of this utility model will be explained in detail below: If the staff is focused on adjusting the control panel parameters such as furnace temperature and microwave power and does not notice the silicon wafers and wafer trays emerging from the tunnel, the silicon wafers and wafer trays will continue to move with the conveyor belt 12. When they reach the rectangular ring 21, the continuing silicon wafers and wafer trays will pass through the rectangular ring 21 and move onto the extension plate 263 under the drive of the conveyor belt 12, eventually stopping temporarily on the extension plate 263. During this process, if the laser beam emitted by the laser generator 22 is blocked by the silicon wafers and wafer trays and cannot reach the laser receiving end of the laser receiver 23, the buzzer alarm 24 connected to the laser receiver 23 will sound an alarm to remind the staff. This reminder, combined with the extended time before the silicon wafers and wafer trays fall, allows the staff to remove the silicon wafers and wafer trays in time, avoiding damage from falling silicon wafers and ensuring production costs.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer heating and drying device, characterized in that, include: The heating furnace body (1) is composed of a heating furnace body (11) and a conveyor belt (12); The lifting mechanism (2) is located on one side of the conveyor belt (12) and is used to remind and extend the time before the silicon wafer and silicon wafer tray fall.

2. The silicon wafer heating and drying equipment according to claim 1, characterized in that, The delay mechanism (2) includes: A rectangular ring (21) is located on one side of the conveyor belt (12) and is fixedly connected to the heating furnace body (11). A through hole is provided at the top of the rectangular ring (21); A laser generator (22) is fixedly installed in the inner cavity of the through hole, and the laser generator (22) is used to emit laser signals; A circular groove is formed at the bottom of the inner wall of the rectangular ring (21); A laser receiver (23) is fixedly installed in the inner cavity of the central groove. The laser receiving end of the laser receiver (23) faces the laser generator (22). The laser receiver (23) is used to receive the laser signal emitted by the laser generator (22). A buzzer alarm (24) is fixedly installed on the top of the heating furnace body (11). The buzzer alarm (24) is located on one side of the rectangular ring (21). The signal control terminal of the buzzer alarm (24) is electrically connected to the signal output pin of the laser receiver (23). Guide rod (25), the guide rod (25) is rotatably connected to the inner cavity of the heating furnace body (11), and the rectangular ring (21) is located between the conveyor belt (12) and the guide rod (25); Delay component (26), which is located on one side of rectangular ring (21), is used to extend the time before the silicon wafer and silicon wafer tray fall.

3. The silicon wafer heating and drying equipment according to claim 2, characterized in that, The delay component (26) includes: Two fixing blocks (261) are symmetrically fixedly connected to one side of the heating furnace body (11); A rotating shaft (262) is rotatably connected between two fixed blocks (261); An extension plate (263) is fixedly sleeved on the outer wall of the rotating shaft (262); Two threaded holes are provided on one side of one of the fixing blocks (261); Two locking holes are provided on one side of another fixing block (261); A strip-shaped through hole is provided on one side of the extension plate (263); Two locking bolts (264), the outer walls of the two locking bolts (264) are threaded to the inner walls of the corresponding threaded holes, and one end of each of the two locking bolts (264) is movably sleeved with the inner cavity of the strip-shaped through hole; Locking rod (265), the locking rod (265) is movably sleeved in the inner cavity of the strip-shaped through hole, and one end of the locking rod (265) is movably sleeved in the inner cavity of the locking hole corresponding to the position.

4. The silicon wafer heating and drying equipment according to claim 3, characterized in that, The delay component (26) further includes: An annular groove, wherein the annular groove is formed on the inner wall of the strip-shaped through hole; An annular slider (266) is slidably sleeved in the inner cavity of an annular groove, and the annular slider (266) is fixedly sleeved on the outer wall of the locking rod (265).

5. The silicon wafer heating and drying equipment according to claim 4, characterized in that, The delay component (26) further includes: A reset spring (267) is located in the inner cavity of the annular groove. One end of the reset spring (267) is fixedly connected to one side of the inner wall of the annular groove, and the other end of the reset spring (267) is fixedly connected to the front of the annular slider (266). The reset spring (267) is used to drive the annular slider (266) and the locking rod (265) to automatically perform a reset movement.

6. The silicon wafer heating and drying equipment according to claim 3, characterized in that, The delay component (26) further includes: Two strip baffles (268) are symmetrically fixed to the top of the extension plate (263). The strip baffles (268) are used to prevent the silicon wafers and silicon wafer trays from detaching from the two sides of the top of the extension plate (263).

7. The silicon wafer heating and drying equipment according to claim 6, characterized in that, The delay component (26) further includes: A rectangular notch is formed on the top of one of the strip baffles (268); A level (269) is fixedly connected to the inner cavity of a rectangular notch groove. The level (269) is used to determine whether the extension plate (263) is horizontal.

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