A hot air type silicon wafer drying device

Abstract

The utility model discloses a hot -blast type silicon wafer drying device, it includes: sliding seat, drying box, hot -blast machine, cloth gas board and silicon wafer stage, the sliding seat can be inside and outside removal setting in drying box, be provided with the cushion block on the sliding seat, the silicon wafer stage sets up on the cushion block, the cloth gas board sets up below the silicon wafer stage, the cloth gas board is provided with the air -blowing hole that points to the silicon wafer stage upwards at intervals, the sliding seat front end is provided with the socket, the socket with cloth gas board between is provided with the trachea, the hot -blast machine sets up at the front end of drying box, the air outlet of hot -blast machine is provided with the plug that carries out the plug -in of socket, the front end of drying box is provided with the circulating air -inlet that corresponds with the air inlet of hot -blast machine, and hot -blast machine circulates and sends hot -blast into cloth gas board, carries out the heating of silicon wafer stage, utilizes silicon wafer stage to carry out direct heating to silicon wafer, and the evenness is good, and the surrounding airflow is used for the auxiliary heating to silicon wafer, and the drying efficiency is promoted.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a hot air silicon wafer drying device. Background Technology

[0002] In the silicon wafer processing, after cleaning, drying equipment is needed to remove moisture.

[0003] Silicon wafer drying equipment can use either circulating hot air or infrared heating to dry silicon wafers. Circulating hot air drying equipment has a higher drying efficiency, but the airflow is difficult to control and can easily blow away the silicon wafers, causing collisions and damage. Infrared heating drying equipment does not require circulating air, but the heat is more concentrated, which can easily lead to excessive local heating of the silicon wafers, resulting in uneven drying and lower drying efficiency, requiring improvement. Utility Model Content

[0004] The purpose of this invention is to provide a hot air silicon wafer drying device that improves drying efficiency and avoids damage to the silicon wafers.

[0005] To achieve this objective, the present invention adopts the following technical solution: A hot air silicon wafer drying device includes: a slide, a drying chamber, a hot air blower, an air distribution plate, and a silicon wafer stage. The slide is movably disposed in the drying chamber, and a pad is provided on the slide. The silicon wafer stage is disposed on the pad, and the air distribution plate is disposed below the silicon wafer stage. The air distribution plate has air holes spaced apart and pointing upwards towards the silicon wafer stage. A socket is provided at the front end of the slide, and an air pipe is provided between the socket and the air distribution plate. The hot air blower is disposed at the front end of the drying chamber, and a plug for connecting to the socket is provided at the air outlet of the hot air blower. A circulating air outlet corresponding to the air inlet of the hot air blower is provided at the front end of the drying chamber.

[0006] The rear of the slide is provided with a door panel corresponding to the opening of the drying oven.

[0007] It also includes a controller, and the drying chamber is equipped with a temperature and humidity sensor, which is connected to the controller to send signals.

[0008] The controller is connected to the hot air blower for operation control.

[0009] The drying chamber is equipped with an air inlet valve and an air outlet valve on its top. The air inlet valve is connected to an inert gas supply pipe. The controller is connected to the air inlet valve and the air outlet valve to control their opening and closing.

[0010] The drying chamber is equipped with a slide rail located below the slide block, and a slider located on the slide rail is provided at the bottom of the slide block.

[0011] The air distribution plate has a cavity, and the air blowing hole and air pipe are respectively connected to the cavity.

[0012] The beneficial effects of this utility model are as follows: A hot air type silicon wafer drying device uses a hot air blower to circulate hot air into an air distribution plate. The air distribution plate blows the hot air towards the bottom of the silicon wafer stage to heat the silicon wafer stage. This avoids direct blowing on the silicon wafers on the stage, thus strengthening the protection of the silicon wafers and preventing damage. Direct heating of the silicon wafers using the silicon wafer stage ensures good uniformity. The surrounding airflow provides auxiliary heating to the silicon wafers, accelerating the evaporation of moisture and improving drying efficiency. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 yes Figure 1 A schematic diagram of the structure after the slide block is moved outward. Detailed Implementation

[0014] The following is combined with Figures 1-2 The technical solution of this utility model will be further illustrated through specific embodiments.

[0015] like Figure 1 and Figure 2 The hot air silicon wafer drying device shown includes: a controller 18, a slide 4, a drying chamber 1, a hot air blower 10, an air distribution plate 7, and a silicon wafer stage 6. The slide 4 is movably disposed in the drying chamber 1. In this embodiment, the drying chamber 1 is provided with a slide rail 15 located below the slide 4, and the bottom of the slide 4 is provided with a slider 14 located on the slide rail 15. Through the cooperation between the slider 14 and the slide rail 15, the smoothness of the inward and outward movement of the slide 4 is improved.

[0016] A pad 5 is provided on the slide 4, and the silicon wafer stage 6 is placed on the pad 5. The silicon wafer can be placed on the silicon wafer stage 6 and positioned by the slots on the silicon wafer stage 6, and then sent into the drying oven 1 with the slide 4. The tail of the slide 4 is provided with a door panel 3 corresponding to the opening of the drying oven 1. After the slide 4 enters the drying oven 1, the door panel 3 seals the opening of the drying oven 1 to prevent air leakage.

[0017] like Figure 1 As shown, a temperature and humidity sensor 2 is installed in the drying oven 1. The temperature and humidity sensor 2 is connected to the controller 18 to transmit signals. The drying temperature of the silicon wafer can be adjusted and set according to specific process requirements, ranging from 60℃ to 120℃, to avoid high-temperature deformation or damage to the silicon wafer.

[0018] An inlet valve 12 and an exhaust valve 11 are installed at the top of the drying chamber 1. The inlet valve 12 is connected to an inert gas supply pipe. The controller 18 is connected to the inlet valve 12 and the exhaust valve 11 to control their opening and closing. First, the inlet valve 12 and the exhaust valve 11 are opened to send inert gas (such as nitrogen) into the drying chamber 1, expelling the air inside the drying chamber 1, removing moisture and oxygen, thus enhancing the protection of the silicon wafers and reducing the high-temperature oxidation problem of the silicon wafers during the heating and drying process. In addition, the inlet valve 12 and the exhaust valve 11 can be closed at the beginning of heating to reduce the consumption of inert gas. During the heating process, when the humidity in the drying chamber 1 is high, the inlet valve 12 and the exhaust valve 11 are opened to concentrate and expel the moisture, ensuring the drying effect of the silicon wafers.

[0019] The air distribution plate 7 is positioned below the silicon wafer stage. Air holes 17, spaced apart on the air distribution plate 7 and pointing upwards towards the silicon wafer stage 6, are provided on the air distribution plate 7. A socket 8 is provided at the front end of the slide block 4, and an air pipe 13 is provided between the socket 8 and the air distribution plate 7. In this embodiment, as... Figure 2 As shown, the air distribution plate 7 is provided with a cavity 16, and the air blowing hole 17 and the air pipe are respectively connected to the cavity 16 to ensure smooth air supply to the air distribution plate 7.

[0020] like Figure 1 As shown, the hot air blower 10 is located at the front end of the drying chamber 1. The air outlet of the hot air blower 10 is provided with a plug 9 that is connected to the socket 8. During the process of the slide 4 entering the drying chamber 1, the plug 9 is automatically connected to the socket 8. The controller 18 is connected to the hot air blower 10 for operation control, and hot air is sent into the air distribution plate 7.

[0021] In this embodiment, the front end of the drying chamber 1 is provided with a circulating air inlet 19 corresponding to the air inlet of the hot air blower 10, so as to circulate and heat the airflow in the drying chamber 1, thereby reducing energy consumption. The air distribution plate 7 blows hot air towards the bottom of the silicon wafer stage 6 to heat the silicon wafer stage 6, avoiding direct blowing on the silicon wafers on the silicon wafer stage 6, thus strengthening the protection of the silicon wafers and avoiding damage. Direct heating of the silicon wafers by the silicon wafer stage 6 results in good uniformity, and the circulating airflow around the silicon wafer stage 6 provides auxiliary heating to the silicon wafers, accelerating the evaporation of moisture on the silicon wafers and improving drying efficiency.

[0022] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A hot air silicon wafer drying device, characterized in that, include: The equipment includes a slide, a drying oven, a hot air blower, an air distribution plate, and a silicon wafer stage. The slide is movable inward and outward within the drying oven. A pad is provided on the slide, and the silicon wafer stage is placed on the pad. The air distribution plate is located below the silicon wafer stage and has air holes spaced apart, pointing upward toward the silicon wafer stage. A socket is provided at the front end of the slide, and an air pipe is provided between the socket and the air distribution plate. The hot air blower is located at the front end of the drying oven, and a plug that connects to the socket is provided at the air outlet of the hot air blower. A recirculating air outlet corresponding to the air inlet of the hot air blower is provided at the front end of the drying oven.

2. The hot air silicon wafer drying apparatus according to claim 1, characterized in that, The rear of the slide is provided with a door panel corresponding to the opening of the drying oven.

3. The hot air silicon wafer drying apparatus according to claim 1, characterized in that, It also includes a controller, and the drying chamber is equipped with a temperature and humidity sensor, which is connected to the controller to send signals.

4. The hot air silicon wafer drying apparatus according to claim 3, characterized in that, The controller is connected to the hot air blower for operation control.

5. The hot air silicon wafer drying apparatus according to claim 3, characterized in that, The top of the drying chamber is equipped with an air inlet valve and an air outlet valve. The air inlet valve is connected to an inert gas supply pipe. The controller is connected to the air inlet valve and the air outlet valve to control their opening and closing.

6. The hot air silicon wafer drying apparatus according to claim 1, characterized in that, The drying oven is equipped with a slide rail located below the slide block, and a slider located on the slide rail is provided at the bottom of the slide block.

7. The hot air silicon wafer drying apparatus according to claim 1, characterized in that, The air distribution plate has a cavity, and the air blowing hole and air pipe are respectively connected to the cavity.

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