Sensor calibration apparatus, sensor loading apparatus, and semiconductor apparatus

Abstract

The utility model belongs to the technical field of semiconductor detection, disclose a kind of sensor calibration device, sensor loading equipment and semiconductor equipment.Sensor calibration device includes shell, first baffle, second baffle and third baffle.Shell is used to be placed at equipment loading entrance, the appearance of shell is matched with the appearance of standard wafer box, when shell is placed at equipment loading entrance, with the position and level of standard wafer box when being placed at equipment loading entrance same.Shell includes bottom plate, the projection point of wafer center in standard wafer box at equipment loading entrance is located on the projection line of second baffle at equipment loading entrance, first baffle is used to judge incident light point position, second baffle is used to judge whether the optical axis of incident light passes through wafer center, third baffle is used to judge whether optical axis passes through standard wafer box.Sensor loading equipment uses the above-mentioned sensor calibration device to calibrate sensor.Semiconductor equipment includes the above-mentioned sensor calibration device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, and in particular to a sensor calibration device, a sensor loading device, and a semiconductor device. Background Technology

[0002] In the semiconductor manufacturing process, automated wafer transfer is a crucial step in ensuring production efficiency and product yield. Pre-transfer wafer status inspection is a core prerequisite for safe transfer. Before a semiconductor device automatically transfers a wafer via a robotic arm, it must accurately detect the wafer's placement within the wafer cassette. Key inspection items include abnormalities such as wafer misalignment, in-place wafers, wafer stacking, and wafer crossing. Only when the wafer placement is confirmed to meet safe transfer standards can subsequent transfer operations be initiated, preventing production accidents such as wafer breakage and equipment malfunction due to abnormal conditions.

[0003] As the semiconductor industry develops, wafers are becoming smaller, and with the reduction in wafer size, the volume of the wafer cassette also decreases. Due to the reduced wafer cassette volume, the gap between the wafer and the cassette becomes smaller. The traditional through-beam inspection method, which involves inserting the sensor into the wafer cassette, is highly susceptible to physical contact with the wafer during sensor movement or installation, potentially crushing the wafer and causing significant economic losses. This method can no longer meet the safety inspection requirements for small-sized wafers.

[0004] To address the aforementioned safety hazards, the industry is gradually adopting front-to-back or reflective sensors to replace traditional left-to-right through-beam detection solutions. However, both front-to-back and reflective sensors have strict installation angle requirements. Through-beam sensors typically require a small angle with the wafer surface, while reflective sensors typically require parallel alignment with the wafer. Angle deviations directly affect detection accuracy. Current sensor installation and debugging processes heavily rely on engineers' experience and subjective judgment, often adjusting sensor angles by hand and calibrating by visually observing signal feedback. This approach is not only inefficient but also fails to quantify and accurately measure installation results, making it difficult to ensure the sensor is always in optimal detection condition. Utility Model Content

[0005] The purpose of this invention is to provide a sensor calibration device, a sensor loading device, and a semiconductor device, which aims to solve the problems in the prior art where the sensor installation and debugging process relies on operational experience and subjective judgment, resulting in low calibration efficiency and the inability to quantify and accurately measure the installation results. This sensor calibration device, sensor loading device, and semiconductor device effectively improve calibration efficiency and calibration accuracy.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] Sensor calibration device, including:

[0008] A housing for placement at the equipment loading inlet, the housing having an outline that matches the outline of a standard wafer cassette, the housing having the same position and level as the standard wafer cassette when placed at the equipment loading inlet, and the housing including a base plate;

[0009] The sensor calibration device further includes a first baffle, a second baffle, and a third baffle. The first baffle, the second baffle, and the third baffle are coaxially and spaced apart on the base plate. The projection point of the center of the wafer in the standard wafer cassette at the device loading inlet is located on the projection line of the second baffle at the device loading inlet. The first baffle is used to determine the position of the incident light point, the second baffle is used to determine whether the optical axis of the incident light passes through the center of the wafer, and the third baffle is used to determine whether the optical axis passes through the standard wafer cassette.

[0010] In some possible implementations, the housing further includes two side plates, which are spaced apart and symmetrically arranged on the bottom plate. The first baffle, the second baffle, and the third baffle are all disposed between the two side plates, and both ends of the first baffle, the second baffle, and the third baffle are detachably connected to the two side plates respectively.

[0011] In some possible implementations, the side plate includes a first flat plate, an arc-shaped plate, and a second flat plate connected sequentially along the length of the base plate. The arc-shaped plate matches the shape of the wafer. The gap between the two first flat plates of the two side plates forms a first opening. A first baffle is disposed at the first opening. The gap between the two second flat plates of the two side plates forms a second opening. A third baffle is disposed at the second opening. The width of the first opening is greater than the width of the second opening.

[0012] In some possible implementations, the sensor calibration device further includes two handles, which are symmetrically arranged on opposite outer sides of the two first planar plates.

[0013] In some possible implementations, the first baffle, the second baffle, and the third baffle are all made of a semi-transparent material.

[0014] In some possible implementations, the first baffle, the second baffle, and the third baffle are all made of polycarbonate or polymethyl methacrylate.

[0015] In some possible implementations, the first baffle, the second baffle, and the third baffle are all provided with grid-like coordinate scale lines, and all the grid-like coordinate scale lines are arranged facing each other.

[0016] A sensor loading device includes a linear module and a sensor, the sensor being mounted on a slider of the linear module, and the sensor loading device calibrating the sensor using a sensor calibration device as described in any of the above embodiments.

[0017] In some possible implementations, the sensor is a reflective sensor or a through-beam sensor.

[0018] A semiconductor device, including a sensor loading device as described above and a sensor calibration device as described in any of the above embodiments, wherein the housing can be selectively placed at the device loading port of the semiconductor device.

[0019] The beneficial effects of this utility model are:

[0020] The sensor calibration device provided by this utility model, by setting up a housing, a first baffle, a second baffle, and a third baffle, allows for the calibration of the sensor's installation position. The housing is placed at the equipment loading inlet, the first baffle is used to determine the position of the incident light point, the second baffle is used to determine whether the optical axis of the incident light passes through the center of the wafer, and the third baffle is used to determine whether the optical axis passes through the wafer box. This makes the sensor calibration process more intuitive and improves calibration efficiency and accuracy compared to the existing sensor installation and debugging process that relies on operational experience and subjective judgment. Attached Figure Description

[0021] Figure 1 This is a three-dimensional view of the sensor calibration device provided in this embodiment of the present invention;

[0022] Figure 2 This is a top view of the sensor calibration device provided in this embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the light spot of the light spot type sensor on the first baffle provided in this embodiment of the utility model;

[0024] Figure 4 This is a schematic diagram of the light spot on the first baffle provided by the regional sensor in this embodiment of the present invention;

[0025] Figure 5 This is a top view of the propagation path of incident light during sensor calibration provided in an embodiment of this utility model;

[0026] Figure 6 This is a schematic diagram of the propagation path of incident light during sensor calibration provided in an embodiment of this utility model;

[0027] Figure 7 This is a schematic diagram of the angle α between the incident light and the wafer of the through-beam sensor provided in this embodiment of the present invention.

[0028] In the picture:

[0029] 100. Housing; 110. Base plate; 120. Side plate; 121. First flat plate; 122. Arc plate; 123. Second flat plate; 200. First baffle; 300. Second baffle; 400. Third baffle; 500. Grid-like coordinate scale lines; 201. Reflective sensor; 2021. Transmitter of through-beam sensor; 2022. Receiver of through-beam sensor; 301. Wafer. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0033] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0034] like Figure 1 and Figure 2As shown, this utility model provides a sensor calibration device, including a housing 100, a first baffle 200, a second baffle 300, and a third baffle 400. The housing 100 is used to be placed at the equipment loading inlet. The shape of the housing 100 matches the shape of the standard wafer cassette. When the housing 100 is placed at the equipment loading inlet, its position and level are the same as when the standard wafer cassette is placed at the equipment loading inlet. The housing 100 includes a base plate 110. The first baffle 200, the second baffle 300, and the third baffle 400 are coaxially and spaced apart on the base plate 110. The projection point of the center of the wafer 301 in the standard wafer cassette at the equipment loading inlet is located on the projection line of the second baffle 300 at the equipment loading inlet. The first baffle 200 is used to determine the position of the incident light point, the second baffle 300 is used to determine whether the optical axis of the incident light passes through the center of the wafer 301, and the third baffle 400 is used to determine whether the optical axis passes through the standard wafer cassette.

[0035] The sensor calibration device provided in this embodiment, by setting up a housing 100, a first baffle 200, a second baffle 300, and a third baffle 400, allows for the calibration of the sensor's installation position. When calibrating the sensor's installation position, the housing 100 is placed at the device loading inlet. The first baffle 200 is used to determine the position of the incident light point, the second baffle 300 is used to determine whether the optical axis of the incident light passes through the center of the wafer 301, and the third baffle 400 is used to determine whether the optical axis passes through the standard wafer cassette. This makes the sensor calibration process more intuitive and improves calibration efficiency and accuracy compared to the existing sensor installation and debugging process that relies on operational experience and subjective judgment.

[0036] Optionally, the housing 100 further includes two side plates 120, which are spaced apart and symmetrically arranged on the base plate 110. A first baffle 200, a second baffle 300, and a third baffle 400 are all disposed between the two side plates 120. Both ends of the first baffle 200, the second baffle 300, and the third baffle 400 are detachably connected to the two side plates 120, improving the ease of assembly and disassembly. For example, the first baffle 200, the second baffle 300, and the third baffle 400 can be connected to the two side plates 120 through a snap-fit ​​structure or threaded parts.

[0037] Furthermore, the side plate 120 includes a first flat plate 121, an arc-shaped plate 122, and a second flat plate 123 connected sequentially along the length of the base plate 110. The arc-shaped plate 122 matches the shape of the wafer 301. The gap between the two first flat plates 121 of the two side plates 120 forms a first opening, and a first baffle 200 is disposed at the first opening. The gap between the two second flat plates 123 of the two side plates 120 forms a second opening, and a third baffle 400 is disposed at the second opening. The width of the first opening is greater than the width of the second opening. The first baffle 200 and the third baffle 400 are respectively installed at the first opening and the second opening, which is simple to assemble and easy to operate.

[0038] Optionally, the sensor calibration device also includes two handles (not shown in the figure), which are symmetrically arranged on the opposite outer sides of the two first planar plates 121. The handles are directly located on the opposite outer sides of the first planar plates 121, eliminating the need to find additional gripping points and allowing for easy handling; the symmetrical distribution of the two handles ensures more even force distribution during handling, preventing tilting and collisions with external components. For example, the handles can be U-shaped, resulting in a simple and easy-to-manufacture structure.

[0039] Preferably, the first baffle 200, the second baffle 300 and the third baffle 400 are all made of semi-transparent material. Semi-transparent material can soften the light, reduce the interference of direct external ambient light on the calibration process, maintain a stable calibration environment, and make the calibration process visible.

[0040] Optionally, the first baffle 200, the second baffle 300, and the third baffle 400 are all made of polycarbonate or polymethyl methacrylate. Polycarbonate has strong impact resistance; polymethyl methacrylate has good weather resistance. In other embodiments, the first baffle 200, the second baffle 300, and the third baffle 400 can also be made of other materials, as long as the requirements are met.

[0041] In this embodiment, the first baffle 200, the second baffle 300, and the third baffle 400 are all provided with grid-like coordinate scale lines 500, and all grid-like coordinate scale lines 500 are arranged facing each other. The grid-like coordinate scale lines 500 in this embodiment include X-axis coordinate lines and Y-axis coordinate lines. The setting of the grid-like coordinate scale lines 500 enables quantitative judgment and precise measurement of the calibration results.

[0042] This embodiment also provides a sensor loading device, including a linear module and a sensor. The sensor is mounted on a slider of the linear module, and the sensor loading device calibrates the sensor using the aforementioned sensor calibration device.

[0043] In this embodiment, the sensor loading device can adjust the position of the sensor by controlling the movement of the linear module during the sensor calibration process using the aforementioned sensor calibration device, thereby improving calibration efficiency.

[0044] Optionally, the sensor loading device also includes a bracket, which is set on one side of the sensor calibration device and directly opposite it. Multiple linear modules and sensors are provided, with each sensor corresponding to a linear module. The linear modules and sensors are evenly distributed on the bracket relative to the sensor calibration device, which can improve the accuracy of the calibration process.

[0045] Optionally, the sensor can be a reflective sensor 201 or a through-beam sensor. The reflective sensor 201 is easy to install, requiring only one-sided installation, thus saving installation space; the through-beam sensor has strong anti-interference capabilities, is not easily affected by the environment, and has high detection accuracy.

[0046] Taking the use of reflective sensor 201 and the setting of three reflective sensors 201 as an example, the calibration process includes:

[0047] S1. Adjust the roll angle of one of the reflective sensors 201 so that the shape of the light spot formed by the first baffle 200 is parallel to the X-axis coordinate line.

[0048] like Figure 3 and Figure 4 As shown, Figure 3 The shape of the light spot in the light spot type sensor, Figure 4 The shape of the light spot for a regional sensor.

[0049] S2, see also Figure 5 Adjust the yaw angle of the reflective sensor 201 so that its laser beam enters from the first baffle 200, passes through the center of the X-axis coordinate line of the second baffle 300, and exits from the third baffle 400.

[0050] S3, see also Figure 6 Adjust the pitch angle of the reflective sensor 201 so that the height of the light spot on the first baffle 200, the second baffle 300, and the third baffle 400 is the same, that is, the Y-axis coordinates on the Y-axis coordinate line are the same. After the reflective sensor 201 is adjusted, its optical axis will be parallel to the wafer 301 and pass through the center of the wafer 301 when it is working.

[0051] S4. Adjust the other two reflective sensors 201 according to steps S1-S3 so that the height of the light spots of the other two reflective sensors 201 on the first baffle 200, the second baffle 300, and the third baffle 400 is the same, and the Y-axis coordinate of each is the same as that of the first adjusted reflective sensor 201. In this way, the three reflective sensors 201 are all in the same detection plane, and the detection plane is parallel to the wafer 301 plane.

[0052] Taking the use of through-beam sensors, and setting three through-beam sensors as an example, the difference in the calibration process compared to the reflective sensor 201 is that: based on the height of the light spot on the first baffle 200 and the third baffle 400, and the distance between the first baffle 200 and the third baffle 400, the actual incident angle α of the transmitting end 2021 and the receiving end 2022 of the through-beam sensor needs to be calculated, such as... Figure 7 As shown, Figure 7This is a schematic diagram of angle a, ensuring it meets the angle setting range of the through-beam sensor; preventing the angle from being too small, causing the light spot to pass through wafer 301 and resulting in a missing wafer; or the angle from being too large, leading to inaccurate results; adjusting the angle of each through-beam sensor and the height of the light spot on all the baffles in sequence to make the detection planes of each through-beam sensor parallel.

[0053] This embodiment also provides a semiconductor device, including the sensor loading device and the sensor calibration device described above, wherein the housing 100 can be selectively placed at the device loading port of the semiconductor device.

[0054] The semiconductor device in this embodiment uses a sensor calibration apparatus to calibrate the position of the sensor mounted on the sensor device, thereby improving calibration efficiency and accuracy.

[0055] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A sensor calibration device, characterized in that, include: A housing (100) is used to be placed at the equipment loading inlet. The shape of the housing (100) matches the shape of the standard wafer cassette. When the housing (100) is placed at the equipment loading inlet, its position and level are the same as when the standard wafer cassette is placed at the equipment loading inlet. The housing (100) includes a base plate (110). The sensor calibration device further includes a first baffle (200), a second baffle (300), and a third baffle (400). The first baffle (200), the second baffle (300), and the third baffle (400) are coaxial and spaced apart on the base plate (110). The projection point of the center of the wafer (301) in the standard wafer cassette at the device loading inlet is located on the projection line of the second baffle (300) at the device loading inlet. The first baffle (200) is used to determine the position of the incident light point, the second baffle (300) is used to determine whether the optical axis of the incident light passes through the center of the wafer (301), and the third baffle (400) is used to determine whether the optical axis passes through the standard wafer cassette.

2. The sensor calibration device according to claim 1, characterized in that, The housing (100) further includes two side plates (120), which are spaced apart and symmetrically arranged on the bottom plate (110). The first baffle (200), the second baffle (300) and the third baffle (400) are all arranged between the two side plates (120), and the two ends of the first baffle (200), the second baffle (300) and the third baffle (400) are detachably connected to the two side plates (120) respectively.

3. The sensor calibration device according to claim 2, characterized in that, The side plate (120) includes a first flat plate (121), an arc plate (122), and a second flat plate (123) connected sequentially along the length direction of the base plate (110). The arc plate (122) matches the shape of the wafer (301). The gap between the two first flat plates (121) of the two side plates (120) forms a first opening. The first baffle (200) is disposed at the first opening. The gap between the two second flat plates (123) of the two side plates (120) forms a second opening. The third baffle (400) is disposed at the second opening. The width of the first opening is greater than the width of the second opening.

4. The sensor calibration device according to claim 3, characterized in that, The sensor calibration device also includes two handles, which are symmetrically arranged on the opposite outer sides of the two first planar plates (121).

5. The sensor calibration device according to claim 1, characterized in that, The first baffle (200), the second baffle (300) and the third baffle (400) are all made of semi-transparent material.

6. The sensor calibration device according to claim 5, characterized in that, The first baffle (200), the second baffle (300) and the third baffle (400) are all made of polycarbonate or polymethyl methacrylate.

7. The sensor calibration device according to claim 1, characterized in that, The first baffle (200), the second baffle (300) and the third baffle (400) are all provided with grid-shaped coordinate scale lines (500), and all the grid-shaped coordinate scale lines (500) are arranged facing each other.

8. A sensor loading device, characterized in that, The device includes a linear module and a sensor, the sensor being mounted on a slider of the linear module, and the sensor loading device calibrating the sensor using a sensor calibration device as described in any one of claims 1-7.

9. The sensor loading device according to claim 8, characterized in that, The sensor is a reflective sensor (201) or a through-beam sensor.

10. A semiconductor device, characterized in that, Including the sensor loading device as claimed in claim 8 and the sensor calibration device as claimed in any one of claims 1-7, the housing (100) can be selectively placed at the device loading port of the semiconductor device.

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