A metrology device for surface topography of a semiconductor chip

Abstract

The utility model relates to chip surface measurement technical field, concretely to a kind of surface topography of semiconductor chip's measuring device, including base, the base top end is fixedly installed with optical profilometer, positioning mechanism is equipped on the base, the positioning mechanism includes support seat, mounting seat and two auxiliary magnets, the support seat is fixedly connected with the multiple connecting pipes of array arrangement on, the top end of the connecting pipe is fixedly connected with suction cup, the bottom end of the connecting pipe is fixedly connected with gas collector collectively, the mounting seat is fixedly connected with gas collector pipe, piston is slidably connected in the gas collector pipe, the utility model has beneficial effect: can quickly be adsorbed and fixed in the top end of suction cup to wafer, not only convenient and efficient operation, wafer fixing can be completed without complex process, and overall structure composition is simple and compact, simultaneously, the component layout is reasonable exposed outside, will not cause any interference to the operation of staff placing wafer.

Description

Technical Field

[0001] This utility model relates to the field of chip surface measurement technology, specifically a measurement device for the surface morphology of a semiconductor chip. Background Technology

[0002] Wafer chip surface topography metrology devices have gradually developed in response to the demand for precise topography control in semiconductor manufacturing. In semiconductor chip manufacturing, key processes such as photolithography, etching, and CMP directly affect parameters such as surface roughness, step height, and flatness of the wafer. These topographic features are crucial to chip circuit connections and performance stability, which has spurred the development of dedicated metrology technologies. Early metrology relied on contact probe measurements. With the expansion of wafer size (from 6 inches to 12 inches) and the advancement of advanced processes (below 7nm), non-contact optical measurement technology has become mainstream. Its core is based on principles such as interference, confocalization, and atomic force, combined with image sensing and 3D reconstruction algorithms to achieve accurate capture of topographic parameters. Adapting to the working conditions of semiconductor cleanrooms, the devices need to meet the requirements of high resolution and high stability, forming a full-scenario equipment system from offline laboratory measurement to online monitoring on the production line.

[0003] Existing patent document CN216846194U discloses a device for measuring the surface three-dimensional morphology of a large-size wafer. The device includes a base, a column fixedly connected to the top center of the base, a receiving platform rotatably connected to the top of the column via a bearing, and a placement seat fixedly connected to the bottom center of the receiving platform. Clamping components are provided around the top perimeter of the receiving platform. This device, by incorporating clamping and adjusting components, allows the large-size wafer to be placed on the placement seat during use. Simultaneously, four first motors are activated, each driving four first gears to move four geared columns within the four fixed columns, thereby... Four clamps fix the large-size wafer in four positions, further improving measurement accuracy. The four sets of springs provide good cushioning during clamping, preventing damage to the surface of the large-size wafer. Although the above application has many beneficial effects, it still has the following shortcomings: the device has too many motors and a complex overall structural design. Moreover, all transmission components are exposed, which will significantly interfere with the operator's wafer placement operation, affecting the smoothness and convenience of operation. In addition, the excessive number of motors not only increases the initial purchase cost, but also incurs additional expenses for subsequent maintenance and replacement, resulting in high overall operating costs and poor overall practicality. Utility Model Content

[0004] The purpose of this invention is to provide a measuring device for the surface morphology of a semiconductor chip, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a measuring device for the surface morphology of a semiconductor chip, comprising a base, an optical profilometer fixedly mounted on the top of the base, a positioning mechanism on the base, the positioning mechanism comprising a support base, a mounting base and two auxiliary magnets, a plurality of connecting tubes arranged in an array fixedly connected to the support base, a suction cup fixedly connected to the top of each connecting tube, a gas collecting box fixedly connected to the bottom of the connecting tubes, a gas collecting pipe fixedly connected to the mounting base, a piston slidably connected inside the gas collecting pipe, a moving rod fixedly connected to the center of the piston, a handle fixedly connected to one end of the moving rod, and symmetrically arranged main magnets fixedly connected to the handle.

[0006] Preferably, the support base is fixedly connected to the top of the base at the position corresponding to the bottom of the optical profilometer.

[0007] Preferably, the mounting base is fixedly connected to the top of the base at a position adjacent to the support base, and the auxiliary magnet is symmetrically fixedly connected to the top of the base at a position adjacent to the mounting base.

[0008] Preferably, the position of the main magnet corresponding to the position of the secondary magnet is set as the south pole, and the position of the secondary magnet corresponding to the position of the south pole of the main magnet is set as the north pole.

[0009] Preferably, one end of the moving rod slides through the front wall of the gas collecting pipe and is fixedly connected to the handle, and a sealing ring is provided at the connection between the gas collecting pipe and the moving rod.

[0010] Preferably, the gas collection box, connecting pipe, suction cup, and gas collection pipe are in communication.

[0011] Compared with the prior art, the advantages of this utility model are: the positioning mechanism creates negative pressure on each suction cup by moving the piston, which can quickly adsorb and fix the wafer on the top of the suction cup. It is not only convenient and efficient to operate, but also completes wafer fixation without complicated procedures. Moreover, the overall structure is simple and compact. At the same time, the exposed parts are reasonably arranged and will not interfere with the operation of the operator placing the wafer. It is suitable for the operation scenario of wafer placement, has low operating cost, and is highly practical. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the main structure of this utility model; Figure 2 This is a schematic diagram of the separate support base and base structure of this utility model; Figure 3 This is a schematic diagram of the back structure of this utility model; Figure 4 This is a cross-sectional view of the gas collecting pipe of this utility model.

[0013] In the diagram: 1. Base; 2. Optical profilometer; 3. Positioning mechanism; 31. Support base; 32. Mounting base; 33. Secondary magnet; 34. Connecting pipe; 35. Suction cup; 36. Air collection box; 37. Air collection pipe; 38. Piston; 39. Moving rod; 40. Handle; 41. Main magnet. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-4 The present invention provides the following technical solution: A measuring device for measuring the surface morphology of a semiconductor chip includes a base 1. An optical profilometer 2 is fixedly mounted on the top of the base 1. A positioning mechanism 3 is provided on the base 1. The positioning mechanism 3 includes a support 31, a mounting base 32, and two auxiliary magnets 33. Multiple connecting tubes 34 arranged in an array are fixedly connected to the support 31. A suction cup 35 is fixedly connected to the top of each connecting tube 34. A gas collecting box 36 is fixedly connected to the bottom of the connecting tubes 34. A gas collecting pipe 37 is fixedly connected to the mounting base 32. A piston 38 is slidably connected inside the gas collecting pipe 37. A moving rod 39 is fixedly connected to the center of the piston 38. A handle 40 is fixedly connected to one end of the moving rod 39. Symmetrically arranged main magnets 41 are fixedly connected to the handle 40.

[0016] The support base 31 is fixedly connected to the top of the base 1 at the position corresponding to the bottom of the optical profilometer 2. The mounting base 32 is fixedly connected to the top of the base 1 at the position adjacent to the support base 31. The auxiliary magnets 33 are symmetrically fixedly connected to the top of the base 1 at the position adjacent to the mounting base 32. The main magnet 41 is set as the south pole corresponding to the position of the auxiliary magnet 33, and the auxiliary magnet 33 is set as the north pole corresponding to the south pole of the main magnet 41. The main magnet 41 and the auxiliary magnet 33 can be fixedly fixed by mutual magnetic attraction of opposite poles. One end of the moving rod 39 slides through the front wall of the gas collecting pipe 37 and is fixedly connected to the handle 40. A sealing ring is provided at the connection between the gas collecting pipe 37 and the moving rod 39. The handle 40 makes it easy to pull the moving rod 39 to move, and the sealing ring can prevent air leakage at the connection between the moving rod 39 and the gas collecting pipe 37. The gas collecting box 36, the connecting pipe 34, the suction cup 35 and the gas collecting pipe 37 are in a connected state.

[0017] In use, the wafer is placed on top of each suction cup 35. Then, the handle 40 is used to pull the moving rod 39 away from the gas collecting tube 37. The movement of the moving rod 39 will cause the piston 38 to move in the gas collecting tube 37. The movement of the piston 38 will cause the gas collecting tube 37 to draw in external air through the gas collecting box 36, connecting pipe 34 and suction cup 35. Because the suction cup 35 is in contact with the wafer, a negative pressure will be formed at the contact point between the suction cup 35 and the wafer. The suction cup 35 will deform due to the negative pressure. At this time, the wafer can be attracted and fixed by multiple suction cups 35. At this time, the handle 40 also moves the two main magnets 41 to the corresponding auxiliary magnets. At position 33, the main magnet 41 and the auxiliary magnet 33 will be magnetically attracted together due to the attraction between opposite poles, thus fixing the position of the moving rod 39 and the piston 38. At this time, the optical profilometer 2 can be activated to collect data on the wafer surface and complete the chip surface measurement. The whole operation is convenient and quick, and can quickly adsorb and fix the wafer on the top of the suction cup 35. The overall structure is simple and compact. At the same time, the exposed parts are reasonably arranged and will not cause any interference to the operator's wafer placement operation. It is suitable for the wafer placement operation scenario, has low operating cost, and is highly practical.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A measuring device for the surface morphology of a semiconductor chip, characterized in that: The device includes a base (1), an optical profilometer (2) fixedly mounted on the top of the base (1), a positioning mechanism (3) provided on the base (1), the positioning mechanism (3) including a support base (31), a mounting base (32) and two auxiliary magnets (33), multiple connecting tubes (34) arranged in an array fixedly connected on the support base (31), suction cups (35) fixedly connected to the top of each connecting tube (34), and a gas collection box (36) fixedly connected to the bottom of the connecting tubes (34), a gas collection pipe (37) fixedly connected on the mounting base (32), a piston (38) slidably connected inside the gas collection pipe (37), a moving rod (39) fixedly connected at the center of the piston (38), a handle (40) fixedly connected to one end of the moving rod (39), and symmetrically arranged main magnets (41) fixedly connected to the handle (40).

2. The measuring device for the surface morphology of a semiconductor chip according to claim 1, characterized in that: The support base (31) is fixedly connected to the top of the base (1) at the position corresponding to the bottom of the optical profilometer (2).

3. The measuring device for the surface morphology of a semiconductor chip according to claim 1, characterized in that: The mounting base (32) is fixedly connected to the top of the base (1) at a position adjacent to the support base (31), and the auxiliary magnet (33) is symmetrically fixedly connected to the top of the base (1) at a position adjacent to the mounting base (32).

4. The measuring device for the surface morphology of a semiconductor chip according to claim 1, characterized in that: The main magnet (41) is positioned at the south pole corresponding to the position of the secondary magnet (33), and the secondary magnet (33) is positioned at the north pole corresponding to the position of the south pole of the main magnet (41).

5. The measuring device for the surface morphology of a semiconductor chip according to claim 1, characterized in that: One end of the moving rod (39) slides through the front wall of the gas collecting pipe (37) and is fixedly connected to the handle (40). A sealing ring is provided at the connection between the gas collecting pipe (37) and the moving rod (39).

6. The measuring device for the surface morphology of a semiconductor chip according to claim 1, characterized in that: The gas collection box (36), connecting pipe (34), suction cup (35) and gas collection pipe (37) are in a connected state.

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