Sensor protection structure, hall sensor and controller

Abstract

The embodiment of the application provides a sensor protection structure, a Hall sensor and a controller, the sensor protection structure comprises a protection shell and a bonding part, the protection shell is provided with a mounting cavity, a sensor chip is arranged in the mounting cavity, the sensor chip can be protected by the protection shell, the Hall sensor is electrically connected with a circuit board through a pin, and the protection shell is fixed on the circuit board, so that the sensor chip can be protected in the periphery of the sensor chip. Since the end edge of the protection shell is provided with the bonding part, the bonding part can be bonded with a bonding site on the circuit board through a surface protruding from the surface of the protection shell or a bonding surface flush with the surface of the protection shell, so that the protection shell is fixed on the circuit board, and then the protection shell does not need to be fixed through a complex process, the assembly process is simplified, and the assembly difficulty of the protection structure is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a sensor protection structure, a Hall sensor, and a controller. Background Technology

[0002] Hall effect sensors play a crucial role in electric drive controllers. Their core function is to detect changes in the magnetic field to sense the direction and intensity of current, thereby enabling precise control of the motor's output current. Because the pins of Hall effect sensors are weak, they are easily tilted by external influences. If the Hall effect sensor tilts, it will affect the sampling accuracy of the output current, ultimately impacting the control performance of the electric drive controller. To ensure the stability of the Hall effect sensor, a protective structure is needed around it.

[0003] Currently, the protective structure of Hall effect sensors typically employs a combination of metal leads and a plastic housing. Specifically, the metal leads are embedded in the plastic housing through injection molding to form a shock absorber. This shock absorber is connected to solder points on the PCB board via the metal leads and is fixed to the PCB surface using a reflow soldering process, making the assembly process relatively complex. Utility Model Content

[0004] To address the technical problem of complex assembly processes for the protective structures of current Hall sensors, this application provides a sensor protective structure, a Hall sensor, and a controller. Through structural optimization, the sensor protective structure can be bonded to the PCB surface, thereby facilitating its assembly.

[0005] In a first aspect, this application provides a sensor protection structure, comprising:

[0006] The protective housing has a mounting cavity for mounting the sensor chip.

[0007] An adhesive portion is attached to the end edge of the protective shell. The adhesive portion has an adhesive surface that protrudes from or is flush with the surface of the protective shell and is configured to bond with the surface of the PCB circuit board.

[0008] In some embodiments, the protective shell and the adhesive portion are integrally formed by injection molding.

[0009] In some embodiments, the wall thickness of the protective shell is between 0.3 and 0.5 mm.

[0010] In some embodiments, the adhesive portion includes a plurality of legs, the plurality of legs being spaced apart along the circumferential direction of the protective shell, and the adhesive surface being disposed on each of the legs.

[0011] In some embodiments, the protective shell is provided with a first side and a second side opposite to the first side, and the number of legs is at least three, with each leg located on the first side and the second side respectively. Each leg on the first side is located in the middle of the first side, and each leg on the second side is located at both ends of the second side and is located on both sides of all the legs on the first side.

[0012] In some embodiments, a thickened portion is provided between the support leg and the protective shell, the thickened portion being an arc-shaped structure recessed toward the support leg and the protective shell.

[0013] In some embodiments, the protective shell is further provided with an installation port that communicates with the installation cavity, and the adhesive portion is disposed on the periphery of the installation port.

[0014] In some embodiments, the end face of the protective shell near the mounting port is provided with a demolding surface, which is used for pressing by ejector pins. The demolding surface is recessed so that the demolding surface and the bonding surface are on different planes.

[0015] Secondly, this application provides a Hall sensor, comprising:

[0016] Such as the sensor protection structure mentioned above; and

[0017] A sensor chip is installed in the mounting cavity, and the sensor body is provided with pins that extend out of the mounting cavity.

[0018] Thirdly, this application provides a controller, including:

[0019] Circuit board, the circuit board having adhesive bonding positions; and

[0020] The Hall sensor described above is disposed at the adhesive position via an adhesive surface;

[0021] An adhesive structure that bonds the adhesive surface to the adhesive position.

[0022] The sensor protection structure provided in this application embodiment includes a protective shell and an adhesive part. The protective shell has a mounting cavity. After the sensor chip is installed in the mounting cavity, it can be protected by the protective shell. The Hall sensor is electrically connected to the circuit board through pins. After the protective shell is fixed to the circuit board, it can protect the sensor chip from the outside. Since the end edge of the protective shell is provided with an adhesive part, the adhesive part can form an adhesive with the adhesive position on the circuit board through an adhesive surface that protrudes from the surface of the protective shell or is flush with the surface of the protective shell, thereby fixing the protective shell on the circuit board. This eliminates the need for complicated processes to fix the protective shell, simplifies the assembly process, and effectively reduces the assembly difficulty of the protective structure. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 This is a schematic diagram of the sensor protection structure provided in the embodiments of this application;

[0025] Figure 2 This is a top view of the sensor protection structure provided in the embodiments of this application;

[0026] Figure 3 This is a top view of the Hall sensor provided in the embodiments of this application;

[0027] Figure 4 This is a front view of the controller provided in the embodiments of this application;

[0028] Figure 5 This is a top view of the controller provided in the embodiments of this application.

[0029] Figure label:

[0030] 10. Protective shell; 11. Mounting cavity; 12. Mounting port; 13. Demolding surface;

[0031] 20. Adhesive part; 21. Adhesive surface; 22. Support leg; 23. Thickened part; 24. First side; 25. Second side;

[0032] 30. Sensor chip; 31. Pin; 40. Hall sensor; 50. Circuit board; 51. Bonding position; 60. Hall magnetic core; 70. Copper busbar.

[0033] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0034] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0035] Hall effect sensors require a protective structure. Currently, this structure consists of metal pins embedded in a plastic shell using injection molding to form a shock absorber. This shock absorber is connected to solder points on a PCB board via the metal pins and fixed to the PCB surface using reflow soldering. This assembly process is quite complex. Furthermore, due to the embedding of the metal pins, the plastic shell needs to be thickened to ensure its strength, resulting in a large wall thickness, typically exceeding 0.8mm. This leads to a bulky protective structure, making it difficult to install on the narrow surface of a PCB board and limiting its applicability.

[0036] To address the complex assembly process and large size of current Hall sensor protective structures, this application provides a sensor protective structure, a Hall sensor, and a controller. The optimized structure allows for adhesive bonding to the PCB board surface, facilitating assembly. Furthermore, the integrated injection molding of the protective shell and the bonding area reduces the size of the protective structure while maintaining its anti-slip strength.

[0037] It should be noted that the sensor protection structure described in this application is used for, but is not limited to, the protection of Hall sensors, and can also be used for other electronic components or devices that require protection, such as magnetoresistive sensors and angle sensors. This protection structure, with its unique adhesive fixing method, not only simplifies the assembly process but also effectively absorbs and disperses external impact forces, providing reliable protection for internal components.

[0038] For ease of explanation, this application only uses the application of sensor protection structure to Hall sensor protection as an example. The protection principle of sensor protection structure applied to other electronic components or devices is essentially the same as that applied to Hall sensor protection, and will not be elaborated here.

[0039] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0040] To better understand this application, the following is combined with... Figures 1 to 5 The technical solution of this application is described in detail below:

[0041] This application provides a sensor protection structure, such as... Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5As shown, it includes a protective shell 10 and an adhesive part 20. The protective shell 10 is provided with a mounting cavity 11 for mounting a sensor chip 30. The adhesive part 20 is connected to the end edge of the protective shell 10 and is provided with an adhesive surface 21. The adhesive surface 21 protrudes from the surface of the protective shell 10 or is flush with the surface of the protective shell 10 and is configured to form an adhesive bond with the surface of the PCB circuit board 50.

[0042] Specifically, the sensor protection structure provided in this embodiment includes a protective shell 10 and an adhesive portion 20. The protective shell 10 has a mounting cavity 11. After the sensor chip 30 is installed in the mounting cavity 11, it can be protected by the protective shell 10. The Hall sensor 40 is electrically connected to the circuit board 50 through pins 31. After the protective shell 10 is fixed to the circuit board 50, it can protect the sensor chip 30 from the outside. Since the end edge of the protective shell 10 is provided with an adhesive portion 20, the adhesive portion 20 is provided with an adhesive surface 21 that can be bonded to the circuit board 50 through an adhesive structure. In order to avoid the protective shell 10 obstructing the bonding of the adhesive surface 21 to the circuit board 50, and to ensure that the adhesive surface 21 can be smoothly bonded to the circuit board 50, the adhesive surface 21 protrudes from the surface of the protective shell 10 or is flush with the surface of the protective shell 10.

[0043] The adhesive portion 20 adheres to the adhesive position 51 on the circuit board 50 through an adhesive surface 21 that protrudes from or is flush with the surface of the protective shell 10, thereby fixing the protective shell 10 to the circuit board 50. This eliminates the need for complex processes to fix the protective shell 10, simplifying the assembly process and effectively reducing the assembly difficulty of the protective structure. Furthermore, because the adhesive surface area 21 between the adhesive portion 20 and the circuit board 50 is relatively large, it can withstand greater external forces, ensuring that the protective shell 10 is firmly fixed to the circuit board 50, preventing loosening or detachment, thus improving the reliability and stability of the assembly. Moreover, the larger adhesive area means that the adhesive portion 20 does not need to be excessively long, thereby reducing the volume of the protective structure and facilitating installation and use within limited spaces.

[0044] In this embodiment, the protective shell 10 is a rigid structural component used to enclose the Hall sensor 40 chip 30. Its function is to provide physical protection around the Hall sensor 40 chip 30 to prevent the sensor from tilting under impact. Its shape is adapted to the shape of the Hall sensor 40 chip 30.

[0045] For example, the protective shell 10 can be molded from plastic materials such as PBT and ABS through an injection molding process, and the interior is hollow to accommodate the Hall sensor 40 chip 30.

[0046] For example, the adhesive portion 20 can be made of the same material as the protective shell 10 or a different material, as long as it can form an adhesive bond with the surface of the PCB circuit board 50. For example, the adhesive portion 20 can be made of the same plastic material as the protective shell 10, such as PBT or ABS.

[0047] The adhesive portion 20 can also be made of other materials with good adhesion and elasticity, such as silicone. The silicone adhesive portion 20 not only has a good adhesive effect, ensuring a tight connection between the protective shell 10 and the circuit board 50, but its elastic properties can also better absorb and disperse external forces, reducing the risk of damage to the protective shell 10 due to external impact.

[0048] In one embodiment, the protective shell 10 and the adhesive portion 20 are integrally formed by injection molding.

[0049] In this embodiment, the protective shell 10 and the adhesive part 20 are made of the same plastic material. This integral molding of the same plastic material effectively reduces the molding difficulty and manufacturing cost of the protective structure. The integral molding also ensures good compatibility and bonding strength between the two, avoiding stress concentration and cracking problems caused by material differences. Therefore, the strength of the protective structure can be guaranteed with a thinner wall thickness. The thin-walled protective shell 10 further enables a small-volume protective structure, making it suitable for compact installation environments and meeting the sensor protection needs in different scenarios. Furthermore, it reduces the weight of the protective structure, thereby reducing the overall weight of the circuit board 50. This makes the sensor protection structure more convenient to install and use, without adding excessive burden to the sensor and related equipment, which is beneficial to improving the stability and reliability of the entire system, especially suitable for applications with strict weight restrictions.

[0050] In one embodiment, the wall thickness of the protective shell 10 is between 0.3 and 0.5 mm. Specifically, based on the injection molding process that integrally forms the protective shell 10 and the adhesive portion 20, it is possible to form a protective shell 10 with such a small wall thickness while ensuring the strength of the protective shell 10.

[0051] Within this wall thickness range, good structural strength and protective performance can be achieved while significantly reducing the overall volume of the protective structure, allowing it to be flexibly adapted to various compact installation spaces. This increases the applicability of the protective structure.

[0052] For example, the wall thickness of the protective shell can be any value between 0.3 and 0.5 mm, such as 0.3 mm, 0.28 mm, 0.4 mm or 0.5 mm.

[0053] In this embodiment, the adhesive surface 21 refers to the contact surface of the adhesive portion 20 used for bonding with the surface of the PCB circuit board 50, and its surface treatment can enhance the adhesion of the adhesive. The adhesive surface 21 forms a fixed connection with the PCB surface through a dispensing process.

[0054] In this embodiment, the dispensing process refers to achieving a fixed connection between the support 22 and the PCB by applying an adhesive (such as epoxy) to the PCB surface. For example, adhesive is applied to a predetermined area of ​​the PCB using dispensing equipment, and pressure is applied to fill the gap between the support 22 and the PCB and cure the adhesive.

[0055] For example, the adhesive surface 21 can be a flat surface or a textured surface, and the textured surface can increase the area of ​​the adhesive surface 21.

[0056] Specifically, during assembly, the adhesive fills the gap between the bonding surface 21 and the PCB, forming a stable mechanical connection after curing. Surface treatment of the bonding surface 21 (such as texturing) enhances the adhesion of the adhesive, ensuring that the legs 22 maintain a stable connection under complex operating conditions. The combination of surface treatment of the bonding surface 21 and the dispensing process enhances the connection stability between the bonding part 20 and the PCB.

[0057] For example, the adhesive portion 20 can surround the end edge of the protective shell 10 to form a wrap-around adhesive to the end of the protective shell 10. This adhesive method can further enhance the connection stability between the protective shell 10 and the circuit board 50, effectively preventing the protective shell 10 from warping or separating when subjected to external impact. Moreover, the wrap-around adhesive design can also disperse external force to a certain extent, reducing the risk of damage to the protective shell 10 and the adhesive portion 20 caused by local stress concentration.

[0058] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the adhesive portion 20 includes a plurality of legs 22, which are spaced apart along the circumferential direction of the protective shell 10, and the adhesive surface 21 is disposed on each leg 22. In this embodiment, the protective shell 10 can be fixed on the PCB circuit board 50 by bonding each leg 22 to the PCB circuit board 50.

[0059] Specifically, the protective structure can be adapted to different shapes and numbers of supports 22 depending on the mounting environment of the PCB circuit board 50. For example, in areas with limited space, fewer supports 22 with flatter shapes can be used to reduce space occupation while ensuring basic bonding stability. In areas with more open space and higher requirements for connection strength, more supports 22 with more complex shapes and larger bonding areas can be used to enhance the connection stability with the PCB circuit board 50. This increases the applicability of the protective structure.

[0060] Understandably, each support leg 22 is customized according to the actual shape and size of the protective shell 10 to achieve the best bonding effect. For example, for a circular protective shell 10, the supports 22 can be evenly distributed on the circumference; for a square or rectangular protective shell 10, the supports 22 can be placed at the four corners or the midpoint of the side. The shape of the supports 22 can also be adjusted as needed, such as using L-shape, T-shape, or strip shape. In addition, the thickness and length of the supports 22 also need to be optimized according to the actual application scenario to ensure that they can maintain sufficient strength and stability when subjected to external forces.

[0061] Specifically, the protective structure achieves structural simplification and functional integration through the integrated design of the protective shell 10 and the support leg 22. The protective shell 10 is injection molded into a hollow cavity structure to enclose the Hall sensor 40 body and prevent it from tilting due to external vibration or impact. The support leg 22 is injection molded simultaneously with the protective shell 10 and is fixedly connected to the PCB surface through a dispensing process. During assembly, the dispensing equipment applies adhesive to the PCB surface. After the support leg 22 is aligned with the mounting position on the PCB, the adhesive fills the gap between the support leg 22 and the PCB and cures, forming a stable mechanical connection.

[0062] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the protective shell 10 has a first side 24 and a second side 25 opposite to the first side 24. The number of supports 22 is at least three, with each support 22 located on the first side 24 and the second side 25. The supports 22 on the first side 24 are located in the middle of the first side 24, and the supports 22 on the second side 25 are located at both ends of the second side 25, situated on both sides of all the supports 22 on the first side 24. Specifically, through the above arrangement of the supports 22, the supports 22 can be combined to form a three-point support. The three-point support structure design can significantly improve the stability of the protective structure on the PCB circuit board 50. When subjected to external force, the three supports 22 can evenly distribute the stress, avoiding damage or detachment caused by localized stress concentration. Furthermore, the three-point support structure also has a certain degree of fault tolerance; even if one of the supports 22 has a minor error during manufacturing or installation, it will not significantly affect the stability of the entire protective structure.

[0063] In one embodiment, such as Figure 1As shown, a thickened portion 23 is provided between the support leg 22 and the protective shell 10. The thickened portion 23 is an arc-shaped structure that is recessed towards the support leg 22 and the protective shell 10. Specifically, the thickened portion 23 can enhance the connection strength between the support leg 22 and the protective shell 10, effectively resisting the impact and vibration of external forces. Since the thickened portion 23 is recessed towards the support leg 22 and the protective shell 10 and forms an arc-shaped structure, rounded corners can be formed on the support leg 22 and the protective shell 10, which facilitates the molding of the thickened portion 23.

[0064] In one embodiment, the cross-sectional thickness of the support leg 22 is greater than the wall thickness of the protective shell 10, thereby increasing its bending resistance. The wall thickness of the protective shell 10 is optimized to balance rigidity and vibration damping requirements.

[0065] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the protective shell 10 is also provided with an installation port 12, which is connected to the installation cavity 11, and the adhesive part 20 is provided on the periphery of the installation port 12.

[0066] Specifically, the mounting port 12 facilitates the installation and removal of the sensor. When maintenance or replacement of the sensor is required, personnel can easily operate through the mounting port 12. The adhesive part 20 is located around the mounting port 12, providing a good fixing effect.

[0067] In one embodiment, such as Figure 1 and Figure 2 As shown, the protective shell 10 has a demolding surface 13 on its end face near the mounting port 12. The demolding surface 13 is used for pressing by ejector pins. The demolding surface 13 is recessed so that it is on a different plane from the bonding surface 21. Specifically, when demolding the protective structure, ejector pins can press the demolding surface 13 to assist in demolding. Since the demolding surface 13 is the pressing surface of the ejector pins, its surface is relatively rough and prone to forming burrs. At the same time, the recessed setting of the demolding surface 13 allows it to be away from the PCB circuit board 50, maintaining a certain distance. This avoids the PCB circuit board 50 being scratched by the burrs on the demolding surface and also prevents the demolding surface 13 from obstructing the contact between the bonding surface 21 and the PCB circuit board 50, ensuring the connection strength between the bonding surface 21 and the PCB circuit board 50.

[0068] In this embodiment, the recessed setting of the demolding surface 13 allows a clearance space to be formed between the demolding surface 13 and the end face of the protective shell, and the clearance space is connected to the mounting cavity 11. The clearance space not only avoids obstruction of the PCB circuit board 50, but also helps dissipate the heat generated by the sensor during operation, preventing heat accumulation from affecting the sensor's performance and lifespan. The clearance space provides heat dissipation near the PCB circuit board 50, effectively reducing the operating temperature of the PCB circuit board 50 and providing protection for it.

[0069] In one embodiment, the inner wall of the protective housing 10 is provided with a buffer layer. The buffer layer is a structural layer on the inner wall of the protective housing 10 used to absorb external vibration energy, and its deformation capability can reduce the risk of sensor tilting.

[0070] For example, the buffer layer can be injection molded from an elastic plastic material (such as polyurethane). The buffer layer is made of polyurethane and is integrally injection molded with the protective shell 10. The buffer layer is molded from polyurethane material and is simultaneously molded with the protective shell 10 using the injection molding process. The high elasticity of polyurethane allows the buffer layer to deform and disperse stress when subjected to external impact. Integral injection molding reduces the complexity of traditional multi-part assembly. The high elasticity of polyurethane material and the integral injection molding process enhance the shock absorption capacity of the buffer layer. The elastic deformation characteristics of polyurethane can effectively absorb high-frequency vibration energy, while the integral molded structure avoids the process redundancy problems of traditional split designs.

[0071] For example, the buffer layer can also absorb external vibration energy through a wave-shaped or honeycomb structure design.

[0072] The sensor protection structure provided in this application eliminates the metal pins 31 through a pure injection molding process, directly utilizing the plasticity of the material to achieve an integrated design of the protective shell 10 and the support 22. Simultaneously, it uses a dispensing process instead of reflow soldering, eliminating the need for solder paste printing and high-temperature curing. The injection-molded plastic material is lightweight, significantly reducing the structural volume and weight; the dispensing process eliminates the need for high-temperature treatment, reducing energy consumption and equipment costs. Furthermore, the integrated structure reduces the complexity of traditional multi-component assembly, avoiding the process redundancy problems caused by the separate design of the metal pins 31 and the plastic shell. This solution, through the synergistic effect of material substitution and process optimization, achieves a comprehensive reduction in cost, volume, and manufacturing complexity, while maintaining the physical stability of the Hall sensor 40 under complex operating conditions, providing crucial support for the miniaturization and low-cost application of electric drive controllers.

[0073] This application embodiment also provides a Hall sensor 40, such as Figure 3As shown, the sensor includes the aforementioned sensor protection structure and sensor chip 30. The sensor chip 30 is installed in the mounting cavity 11, and the sensor body is provided with pins 31, which extend out of the mounting cavity 11.

[0074] Specifically, by incorporating the aforementioned sensor protection structure, the Hall sensor 40 not only inherits the advantages of lightweight, low-cost, and simple manufacturing processes, but also, with its sensor chip 30 housed within the mounting cavity 11, effectively prevents interference and damage from the external environment, thus improving the sensor's reliability and stability. The design of the pins 31 extending out of the mounting cavity 11 facilitates the connection of the Hall sensor 40 to external circuits, resulting in more stable and reliable signal transmission.

[0075] This application also provides a controller, such as... Figure 4 and Figure 5 As shown, the device includes a circuit board 50, the aforementioned Hall sensor 40, and an adhesive structure. The circuit board 50 is provided with an adhesive position 51. The Hall sensor 40 is disposed on the adhesive position 51 through an adhesive surface 21. The adhesive structure adheres the adhesive surface 21 to the adhesive position 51.

[0076] For example, the bonding structure can be any fixing structure formed by the bonding surface 21 and the PCB circuit board 50 through a dispensing process. For instance, the bonding structure can be an adhesive that can bond plastic and the PCB circuit board 50. Alternatively, double-sided tape can be used as the bonding structure, which has the advantages of being easy to operate and inexpensive, while also providing sufficient adhesive force to fix the Hall sensor 40. Furthermore, hot melt adhesive can also be considered as the bonding structure. It is melted by heating and applied to the bonding surface 21, and after cooling and curing, a strong bond is achieved. This bonding method is suitable for applications requiring high bonding strength.

[0077] In one embodiment, the adhesive structure includes a bottom adhesive layer and an upper buffer layer, wherein the bottom adhesive layer is made of a high-strength adhesive and the upper buffer layer is made of an elastic adhesive.

[0078] In this embodiment, the bottom adhesive layer is the adhesive material layer used to achieve a rigid connection between the support 22 and the PCB circuit board 50 in the adhesive structure. It can be made of epoxy adhesive or polyurethane adhesive. The upper buffer layer is the elastic adhesive material layer used to absorb vibration energy in the adhesive structure. It can be made of silicone or elastic acrylic adhesive.

[0079] Specifically, the bottom adhesive layer uses high-strength adhesive to rigidly fix the support 22 to the PCB circuit board 50, while the upper buffer layer uses elastic adhesive to absorb vibration energy. This layered design allows the adhesive layer to meet both the mechanical strength requirements and the stress dispersion through elastic deformation. The mechanical properties of the layered adhesive structure enhance the overall performance of the adhesive layer. The bottom adhesive layer ensures a stable connection between the support 22 and the PCB, while the upper buffer layer absorbs vibration energy through elastic deformation, reducing indirect impact on the Hall sensor 40.

[0080] In this embodiment, as Figure 4 and Figure 5 As shown, the controller also includes a Hall magnetic core 60 and a copper busbar 70. The Hall magnetic core 60 is a key component that works in conjunction with the Hall sensor 40. It enhances the magnetic field signal, enabling the Hall sensor 40 to detect magnetic field changes more accurately, thereby improving the overall controller's detection accuracy and response speed for relevant physical quantities. The copper busbar 70, as a conductive connection component, is used to achieve stable current transmission in the circuit. It has good conductivity and heat dissipation performance, meeting the controller's current transmission requirements during operation.

[0081] Finally, it should be noted that other embodiments of this utility model will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of this utility model that follow the general principles of this utility model and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A sensor protection structure, characterized in that, include: The protective shell (10) is provided with a mounting cavity (11), which is used to mount the sensor chip (30). An adhesive portion (20) is connected to the end edge of the protective shell (10). The adhesive portion (20) is provided with an adhesive surface (21). The adhesive surface (21) protrudes from the surface of the protective shell (10) or is flush with the surface of the protective shell (10) and is configured to form an adhesive with the surface of the PCB circuit board (50).

2. The sensor protection structure according to claim 1, characterized in that, The protective shell (10) and the adhesive part (20) are integrally formed by injection molding.

3. The sensor protection structure according to claim 1, characterized in that, The wall thickness of the protective shell (10) is between 0.3 and 0.5 mm.

4. The sensor protection structure according to any one of claims 1-3, characterized in that, The adhesive part (20) includes a plurality of legs (22), which are spaced apart along the circumferential direction of the protective shell (10), and the adhesive surface (21) is disposed on each of the legs (22).

5. The sensor protection structure according to claim 4, characterized in that, The protective shell (10) is provided with a first side (24) and a second side (25) opposite to the first side (24). The number of legs (22) is at least 3. Each leg (22) is located on the first side (24) and the second side (25). Each leg (22) on the first side (24) is located in the middle of the first side (24), and each leg (22) on the second side is located at both ends of the second side (25) and is located on both sides of all the legs (22) on the first side (24).

6. The sensor protection structure according to claim 4, characterized in that, A thickened portion (23) is provided between the support leg (22) and the protective shell (10). The thickened portion (23) is an arc-shaped structure that is recessed towards the support leg (22) and the protective shell (10).

7. The sensor protection structure according to any one of claims 1-3, characterized in that, The protective shell (10) is also provided with an installation port (12), which is connected to the installation cavity (11), and the adhesive part (20) is provided on the periphery of the installation port (12).

8. The sensor protection structure according to claim 7, characterized in that, The protective shell (10) has a demolding surface (13) on the end face near the mounting port (12). The demolding surface (13) is used for the ejector pin to press. The demolding surface (13) is recessed so that the demolding surface (13) and the bonding surface (21) are on different planes.

9. A Hall sensor, characterized in that, include: The sensor protection structure as described in any one of claims 1-8; as well as A sensor chip (30) is installed in the mounting cavity (11), and the sensor body is provided with pins (31) that extend out of the mounting cavity (11).

10. A controller, characterized in that, include: Circuit board (50), wherein the circuit board (50) is provided with adhesive positions (51); as well as The Hall sensor (40) as described in claim 9 is disposed on the adhesive position (51) via the adhesive surface (21). An adhesive structure that bonds the adhesive surface (21) to the adhesive position (51).

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