Temperature and pressure sensor

Abstract

The utility model provides a kind of temperature pressure sensor, temperature pressure sensor includes shell and cover plate, cover plate is connected with shell and forms temperature detection chamber and pressure detection chamber, circuit board and pressure chip are provided in pressure detection chamber, and pressure chip and shell form chip chamber separated from circuit board by enclosing, chip chamber and temperature detection chamber are all communicated with medium to be measured;Pressure chip is used to detect the pressure of medium to be measured;Thermistor is provided in temperature detection chamber, and thermistor is used to detect the temperature of medium to be measured.The sensor can separate pressure chip and components on circuit board, can effectively prevent water vapor or oil gas from contacting circuit board to corrode components or solder joints on circuit board, greatly improve the service life of temperature pressure sensor, and also can reduce the production cost of temperature pressure sensor.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and in particular to a temperature and pressure sensor. Background Technology

[0002] Temperature and pressure sensors are important components in automotive electronic control systems, used to monitor and report temperature and pressure information during vehicle operation. Intake air temperature sensors are typically installed near the intake manifold or air filter to detect the temperature and pressure of the gas inside the intake manifold.

[0003] In existing technologies, intake pressure and temperature are typically sensed using a sensor chip and a thermistor, respectively, to obtain real-time intake port pressure and temperature information. Currently, during temperature sensor installation, the temperature sensor's intake port is inserted into the intake manifold. The resistance test chamber and pressure test chamber are connected as a single unit. Pressure gas with temperature characteristics is conducted through the intake port to the chamber containing the thermistor and chip. The thermistor senses the gas temperature, and the chip senses the gas pressure. Finally, the temperature and pressure of the incoming gas are measured by the thermistor's resistance and the chip's output voltage.

[0004] However, in the existing technology, in order to prevent the components and solder joints on the circuit board from being corroded by oil and gas, the circuit board usually needs to be potted, which results in high production costs. Utility Model Content

[0005] The purpose of this invention is to provide a temperature and pressure sensor that can separate the pressure chip from the components on the circuit board. This effectively prevents water vapor or oil vapor in the measured medium from contacting the circuit board and corroding the components or solder joints on the circuit board, greatly improving the service life of the temperature and pressure sensor. At the same time, it can also reduce the production cost of the temperature and pressure sensor, resulting in high economic benefits.

[0006] To achieve the above objectives, this utility model provides a temperature and pressure sensor, including a housing and a cover plate. The cover plate, when connected to the housing, forms a temperature detection chamber and a pressure detection chamber. A circuit board and a pressure chip are disposed in the pressure detection chamber. The pressure chip and the housing enclose a chip chamber separated from the circuit board. Both the chip chamber and the temperature detection chamber are in communication with the medium to be measured. The pressure chip is used to detect the pressure of the medium to be measured. A thermistor is disposed in the temperature detection chamber, and the thermistor is used to detect the temperature of the medium to be measured.

[0007] Optionally, the pressure chip is disposed below the circuit board, and the edge of the pressure chip is sealed to the housing to form the chip chamber.

[0008] Optionally, the pressure chip is bonded to the housing with sealant, or the pressure chip is fixed to the housing by welding.

[0009] Optionally, a partition plate is provided on the side of the cover plate facing the housing, and an extension is provided on the side of the housing facing the partition plate. After the partition plate and the extension of the housing are sealed together, a pressure detection chamber and a temperature detection chamber are formed on both sides of the partition plate. The circuit board is disposed in the pressure detection chamber, and the thermistor is disposed in the temperature detection chamber.

[0010] Optionally, the housing is provided with an air intake channel, which is connected to the temperature detection chamber and is used to connect with the medium to be measured.

[0011] Optionally, the housing is further provided with a through connection channel, one end of which is connected to the air intake channel and the other end of which is connected to the chip chamber.

[0012] Optionally, the connection channel is an oblique hole inclined along the length of the temperature and pressure sensor.

[0013] Optionally, the housing insert is injection molded with a fisheye PIN pin, which is fixedly connected to the circuit board by inserting into a corresponding fixing hole on the circuit board.

[0014] This invention provides a temperature and pressure sensor with a chip chamber separated from the circuit board, thereby separating the measured medium from the components on the circuit board. This design achieves two advantages: firstly, absolute physical isolation between water vapor or oil vapor in the measured medium and electrical components such as the circuit board, effectively preventing water vapor or oil vapor from contacting the circuit board and corroding the components or solder joints, thus greatly extending the service life of the temperature and pressure sensor; secondly, since the pressure chip is sealed within the chip chamber, the circuit board does not require potting or dustproofing treatment, thus reducing the raw material costs and equipment investment costs in the manufacture of the temperature and pressure sensor, resulting in high economic benefits. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the temperature and pressure sensor in a preferred embodiment of the present invention.

[0016] [The annotations in the attached figures are explained below]:

[0017] 1. Housing; 11. Fisheye PIN pin; 12. Extension; 2. Cover plate; 21. Divider plate; 3. Temperature detection chamber; 4. Pressure detection chamber; 41. Chip chamber; 5. Pressure chip; 6. Circuit board; 7. Thermistor; 8. Sealant; 91. Air inlet channel; 92. Connecting channel; 10. Sealing ring. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0019] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0020] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or a connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. In the description of this utility model, "a plurality of" means at least two, such as two, three, or more.

[0021] The present invention will now be described in detail with reference to the accompanying drawings and preferred embodiments. Unless otherwise specified, the following embodiments and features can complement or combine with each other.

[0022] like Figure 1 As shown, a preferred embodiment of this utility model provides a temperature and pressure sensor, including a housing 1 and a cover plate 2. The cover plate 2, connected to the housing 1, forms a temperature detection chamber 3 and a pressure detection chamber 4. A pressure chip 5 and a circuit board 6 are disposed within the pressure detection chamber. The pressure chip 5 and the housing 1 enclose a chip chamber 41 separated from the circuit board 6. Both the chip chamber 41 and the temperature detection chamber 3 are in communication with the medium to be measured. The pressure chip 5 can contact the medium to be measured and is used to detect the gas pressure of the medium. A thermistor 7 (e.g., an NTC thermistor) is disposed within the temperature detection chamber 3, and the thermistor 7 is used to detect the temperature of the medium to be measured.

[0023] This invention provides a temperature and pressure sensor with a chip chamber 41 separated from a circuit board 6, thereby separating the measured medium from the components on the circuit board 6. This design achieves absolute physical isolation between water vapor or oil vapor in the measured medium and electrical components such as the circuit board 6, effectively preventing water vapor or oil vapor from contacting the circuit board 6 and corroding the components or solder joints, thus greatly extending the service life of the temperature and pressure sensor. Furthermore, since the pressure chip 5 is sealed within the chip chamber 41, the circuit board 6 does not require potting or dustproofing treatment, thus reducing the raw material costs and equipment investment costs in manufacturing the temperature and pressure sensor, resulting in higher economic benefits.

[0024] Furthermore, the pressure chip 5 is disposed on the side of the circuit board 6 facing the housing 1, and components (not shown) are disposed on the side of the circuit board 6 facing away from the housing 1.

[0025] Furthermore, the housing 1 is injection molded with a fisheye PIN 11, which is fixedly connected to the circuit board 6 by inserting into a corresponding fixing hole (not labeled) on the circuit board 6.

[0026] Reference Figure 1 As shown, in a preferred embodiment, the pressure chip 5 is disposed below the circuit board 6, and the edge of the pressure chip 5 is sealed to the housing 1 to form a chip chamber 41. At this time, the pressure chip 5 is placed in the chip chamber 41, and the circuit board 6 is placed outside the chip chamber 41.

[0027] Furthermore, the pressure chip 5 is provided with pressure holes (unlabeled), which can guide the gas pressure to the surface of the pressure chip 5, so that the pressure chip 5 can sense the gas pressure and deform.

[0028] In the prior art, the pressure chip 5 is fixed above the circuit board 6, and the pressure holes on the surface of the pressure chip 5 are set facing upwards. Oil and condensate in the intake manifold are more likely to be deposited in the pressure holes of the pressure chip 5, causing the test results of the pressure chip 5 to drift. Once the pressure holes are blocked, the pressure chip 5 will lose its pressure detection capability.

[0029] This application positions the pressure holes on the surface of the pressure chip 5 downwards, which effectively prevents condensation and oil vapor from accumulating on the surface of the pressure chip 5, thus helping to extend the service life of the temperature and pressure sensor and improve the accuracy of the sensor's detection results. Furthermore, when the pressure chip 5 is positioned below the circuit board 6, the circuit board 6 does not require potting, which helps reduce production costs.

[0030] Continue to refer to Figure 1In one specific example, the pressure chip 5 is bonded to the housing 1 using sealant 8; that is, the lower edge of the pressure chip 5 is sealed to the housing 1 using sealant 8 to prevent oil vapor or condensate in the gas from contacting the circuit board 6. In another specific example, the pressure chip 5 and the housing 1 can also be fixed by welding.

[0031] Preferably, a partition plate 21 is provided on the side of the cover plate 2 facing the housing 1, and an extension 12 is provided on the side of the housing 1 facing the partition plate 21. After the partition plate 21 and the extension 12 of the housing 1 are sealed together, a temperature detection chamber 3 and a pressure detection chamber 4 are formed on both sides of the partition plate 21. The circuit board 6 is located in the pressure detection chamber 4, and the thermistor 7 is located in the temperature detection chamber 3.

[0032] Preferably, the edge of the cover plate 2 and the partition plate 21 can be bonded to the housing 1 with sealant 8 respectively. After the cover plate 2 and the housing 1 are connected, they can enclose and form independent temperature detection chamber 3 and pressure detection chamber 4.

[0033] Of course, the cover plate 2 and the housing 1 can also be connected in other ways, such as welding. This application does not limit the connection method between the cover plate 2 and the housing 1.

[0034] Furthermore, the housing 1 is provided with an air inlet channel 91, which is connected to the temperature detection chamber 3 and is used to connect with the medium to be measured.

[0035] As a specific example, the thermistor 7 is fixed inside the air inlet channel 91 of the housing 1. The air inlet channel 91 is connected to the medium to be measured. The thermistor 7 is used to detect the gas temperature of the medium to be measured.

[0036] In actual use, the temperature and pressure sensor uses an intake channel 91 that is inserted into an intake manifold. Gas from the intake manifold enters the intake channel 91 and then flows into the chip chamber 41. The gas in the measured medium, which carries temperature and pressure characteristics, is conducted to the thermistor 7 through the intake channel 91, and the thermistor 7 senses the gas temperature. Simultaneously, after the gas in the measured medium enters the chip chamber 41, its pressure is sensed by the pressure chip 5 within the chip chamber 41.

[0037] Reference Figure 1 As shown, a sealing ring 10 is preferably provided on the outside of the intake passage 91, which can seal the gap between the intake passage 91 and the intake manifold.

[0038] Continue to refer to Figure 1In a preferred embodiment, the housing 1 is further provided with a through connecting channel 92 (i.e., a branching channel). One end of the connecting channel 92 is connected to the temperature detection chamber 3, and the other end of the connecting channel 92 is connected to the chip chamber 41. At this time, the temperature detection chamber 3 and the chip chamber 41 can be connected through the connecting channel 92. The advantage of doing so is that the gas entering the temperature detection chamber 3 can be supplied to the chip chamber 41 at a fixed point through the connecting channel 92, so that the gas flows to the surface of the pressure chip 5.

[0039] Preferably, the connection channel 92 is an oblique hole inclined along the length direction of the temperature and pressure sensor to facilitate the connection between the temperature detection chamber 3 and the chip chamber 41.

[0040] In another preferred embodiment, the housing 1 may also be provided with a first air inlet and a second air inlet (not shown). In this case, the temperature and pressure sensor has two air inlets, wherein the first air inlet is connected to the temperature detection chamber 3, and the second air inlet is connected to the chip chamber 41. Both the first and second air inlets are used to connect to the channel of the medium to be measured. In this case, the temperature detection chamber 3 and the chip chamber 41 can be independently configured and connected to the channel of the medium to be measured through a corresponding air inlet.

[0041] When the temperature and pressure sensor is working, the first and second air inlets can be connected to the intake manifold respectively. Gas in the intake manifold can enter the temperature detection chamber 3 through the first air inlet, and the temperature of the gas can be detected by the thermistor 7. Gas in the intake manifold can also enter the chip chamber 41 through the second air inlet, and the pressure of the gas can be detected by the pressure chip 5.

[0042] In summary, this invention provides a temperature and pressure sensor with a chip chamber 41 separated from the circuit board 6, thereby separating the measured medium from the components on the circuit board 6. This configuration achieves absolute physical isolation between water vapor or oil vapor in the measured medium and electrical components such as the circuit board 6, effectively preventing water vapor or oil vapor from contacting the circuit board 6 and corroding the components or solder joints, thus greatly improving the service life of the temperature and pressure sensor. Furthermore, since the pressure chip 5 is sealed within the chip chamber 41, the circuit board 6 does not require potting or dustproofing treatment, thus reducing the production cost of the temperature and pressure sensor and resulting in higher economic benefits.

[0043] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the present utility model.

Claims

1. A temperature and pressure sensor, characterized in that, The device includes a housing and a cover plate. The cover plate, when connected to the housing, forms a temperature detection chamber and a pressure detection chamber. A circuit board and a pressure chip are disposed in the pressure detection chamber. The pressure chip and the housing enclose a chip chamber separated from the circuit board. Both the chip chamber and the temperature detection chamber are in communication with the medium to be measured. The pressure chip is used to detect the pressure of the medium to be measured. A thermistor is disposed in the temperature detection chamber and is used to detect the temperature of the medium to be measured.

2. The temperature and pressure sensor as described in claim 1, characterized in that, The pressure chip is disposed below the circuit board, and the edge of the pressure chip is sealed to the housing to form the chip chamber.

3. The temperature and pressure sensor as described in claim 2, characterized in that, The pressure chip is bonded to the housing with sealant, or the pressure chip is fixed to the housing by welding.

4. The temperature and pressure sensor as described in claim 1, characterized in that, A partition plate is provided on the side of the cover plate facing the housing, and an extension is provided on the side of the housing facing the partition plate. After the partition plate and the extension of the housing are sealed together, the pressure detection chamber and the temperature detection chamber are formed on both sides of the partition plate. The circuit board is disposed in the pressure detection chamber, and the thermistor is disposed in the temperature detection chamber.

5. The temperature and pressure sensor as described in any one of claims 1 to 4, characterized in that, The housing is provided with an air intake channel, which is connected to the temperature detection chamber and is used to connect with the medium to be measured.

6. The temperature and pressure sensor as described in claim 5, characterized in that, The housing is also provided with a through connection channel, one end of which is connected to the air intake channel and the other end of which is connected to the chip chamber.

7. The temperature and pressure sensor as described in claim 6, characterized in that, The connection channel is an oblique hole that is inclined along the length of the temperature and pressure sensor.

8. The temperature and pressure sensor as described in claim 1, characterized in that, The housing insert is injection molded with a fisheye PIN pin, which is fixedly connected to the circuit board by being inserted into a corresponding fixing hole on the circuit board.

Images