Multi-element environmental monitoring sensor
Patent Information
- Application Number
- CN202522410907.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-13
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-11-13
AI Technical Summary
[0004]本申请的目的是提供多要素环境监测传感器,具备可以对根据传感器的工况对传感器的工作温度进行调控,避免传感器受外界环境影响等因素会出现温度较高或较低的情况,使传感器可以良好的应对复杂的环境状况,防止环境因素会影响传感器的监测精度等优点,解决了现有的多要素环境监测传感器在使用时无法良好的应对复杂的环境情况,传感器容易受到外界环境的影响出现温度过高或过低的情况,影响传感器的工作状态,会导致传感器的监测精度降低的问题
该多要素环境监测传感器,通过半导体制冷片降温或加热片升温,对核心监测单元的温度进行调节,使核心监测单元保持在合适的工作温度,清洁马达工作,带动清洁刷对探测头的表面进行清理,达到了可以对根据传感器的工况对传感器的工作温度进行调控,避免传感器受外界环境影响等因素会出现温度较高或较低的情况,使传感器可以良好的应对复杂的环境状况,防止环境因素会影响传感器的监测精度。
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Figure CN224802462U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of environmental monitoring, and in particular to multi-element environmental monitoring sensors. Background Technology
[0002] In key sectors such as power and transportation, environmental monitoring is a core component in ensuring the stable operation and safe operation of equipment. As the power and transportation sectors transform towards "unmanned and intelligent" systems, the demand for "multi-parameter, high-precision, and low-maintenance" environmental monitoring is becoming increasingly urgent. This necessitates multi-faceted environmental monitoring, which will utilize multi-element environmental monitoring sensors.
[0003] Existing multi-element environmental monitoring sensors cannot effectively cope with complex environmental conditions. The sensors are easily affected by the external environment, resulting in excessively high or low temperatures, which affects the working state of the sensors and leads to a decrease in monitoring accuracy. Utility Model Content
[0004] The purpose of this application is to provide a multi-element environmental monitoring sensor that can regulate the sensor's operating temperature according to its working conditions, preventing the sensor from experiencing excessively high or low temperatures due to external environmental factors. This allows the sensor to effectively cope with complex environmental conditions and prevents environmental factors from affecting the sensor's monitoring accuracy. It solves the problem that existing multi-element environmental monitoring sensors cannot effectively cope with complex environmental conditions, and are easily affected by external environmental factors, resulting in excessively high or low temperatures that affect the sensor's working state and reduce its monitoring accuracy.
[0005] The multi-element environmental monitoring sensor provided in this application adopts the following technical solution: The multi-element environmental monitoring sensor includes a sensor housing. A detection component is installed inside the sensor housing. The detection component includes a core monitoring unit. A probe is provided at the front end of the core monitoring unit. A control motherboard is fixedly installed at the rear end of the detection component. The control motherboard is electrically connected to the core monitoring unit. A temperature control component is provided inside the sensor housing. The temperature control component includes a thermoelectric cooler and a heating element. The thermoelectric cooler and heating element are fixedly installed on the outer surface of the middle part of the core monitoring unit. The thermoelectric cooler and heating element are electrically connected to the control motherboard. A cleaning component is provided inside the sensor housing. The cleaning component includes a cleaning motor. A cleaning brush is fixedly installed at one end of the output shaft of the cleaning motor. The cleaning motor is located on one side of the probe. A cleaning cotton on one side of the cleaning brush is slidably connected to the outer surface of one end of the probe. The cleaning motor is electrically connected to the control motherboard.
[0006] By adopting the above technical solution, the detection components can realize multi-element environmental monitoring, the control motherboard can coordinate the operation of each component, and adjust the temperature of the core monitoring unit by cooling the semiconductor cooling chip or heating the heating chip according to the temperature of the core monitoring unit, so as to avoid the core monitoring unit from being affected by excessively high or low temperature. The cleaning motor drives the cleaning brush to rotate and clean the probe head, preventing the surface of the probe head from being affected by dirt and affecting the monitoring accuracy. In summary, the sensor monitoring accuracy is improved.
[0007] Preferably, the semiconductor cooling chip and the heating chip are fixedly disposed on the front and rear outer surfaces and the left and right outer surfaces of the core monitoring unit, respectively.
[0008] By adopting the above technical solution, the semiconductor cooling chip and the heating chip are fixed to the front and rear outer surfaces and the left and right outer surfaces of the core monitoring unit, respectively. Through the symmetrical arrangement of the semiconductor cooling chip and the heating chip, the cooling effect of the semiconductor cooling chip and the heating effect of the heating chip can be balanced to regulate the temperature of the core monitoring unit, avoid local temperature anomalies in the core monitoring unit, and further ensure that the core monitoring unit is always at a suitable working temperature, maintain a stable working state, and ensure monitoring accuracy.
[0009] Preferably, a plurality of heat dissipation fins are fixedly disposed on one outer surface of the semiconductor cooling chip, and heat conduction pipes are fixedly disposed on the inner walls of the plurality of heat dissipation fins, and the plurality of heat dissipation fins are connected in series through the heat conduction pipes.
[0010] By adopting the above technical solution, heat dissipation fins are set on one outer surface of the thermoelectric cooler, and multiple heat dissipation fins are connected in series through heat pipes. The heat dissipation fins can increase the heat dissipation area, and the heat pipes can promote the rapid transfer of heat, effectively improving the heat dissipation efficiency of the thermoelectric cooler during operation. This avoids the thermoelectric cooler from affecting the cooling effect due to its own heat accumulation, ensuring that the thermoelectric cooler can stably cool the core monitoring unit and guarantee the temperature stability of the core monitoring unit.
[0011] Preferably, a dustproof component is installed at one end of the sensor housing. The dustproof component includes a dustproof cover, which is threaded onto the outer surface of one end of the sensor housing. A detection hole is provided at one end of the dustproof cover, and the position of the detection hole corresponds to the position of the detection head.
[0012] By adopting the above technical solution, a dustproof component is installed at one end of the sensor housing. The dustproof cover can prevent a large amount of external dust from entering the sensor housing, avoiding dust adhering to the surface of internal components such as the detection component and control motherboard and affecting their operation. The opening position of the detection hole corresponds to the detection head, so it does not affect the normal environmental detection of the detection head. While preventing dust, it ensures the normal monitoring function of the sensor and reduces the interference of dust on the monitoring accuracy.
[0013] Preferably, multiple positioning cards are fixedly installed on the inner wall of the middle part of the sensor housing by multiple fixing brackets. The multiple positioning cards correspond to the corner positions of the core monitoring unit. The inner side of the positioning card is slidably connected to the outer surface of the corner of the core monitoring unit. The shape of the inner side of the positioning card is adapted to the shape of the corner of the core monitoring unit.
[0014] By adopting the above technical solution, the installation position of the core monitoring unit inside the sensor housing can be located by setting multiple positioning cards. The cooperation between the multiple positioning cards and the corners of the core monitoring unit can improve the stability of the core monitoring unit inside the sensor housing, and the core monitoring unit can be easily disassembled from the sensor housing for maintenance.
[0015] Preferably, a baffle is fixedly provided at the tail end of the positioning card.
[0016] By adopting the above technical solution, a baffle is set at the tail end of the positioning card. The baffle can restrict the installation position of the core monitoring unit, preventing the core monitoring unit from being installed too deep during installation or use, and further ensuring the positioning accuracy of the core monitoring unit inside the sensor housing.
[0017] Preferably, a plurality of positioning plates are fixedly installed on the outer surface of the core monitoring unit near the front end. A positioning ring is provided on one side of the positioning plate. The positioning ring abuts against the plurality of positioning plates. The positioning ring is fixedly installed on the end of the inner wall of the dust cover by a fixing bracket.
[0018] By adopting the above technical solution, when the dust cover is installed on the sensor housing, the positioning ring can enter the interior of the sensor housing and abut against multiple positioning plates. With the baffle at the end of the positioning card, the position of the core monitoring unit inside the sensor housing can be further fixed, preventing the core monitoring unit from shifting inside the sensor housing.
[0019] Preferably, a threaded connecting ring is fixedly provided on one side of the dust cover, a fixing ring is threadedly connected to the outer surface of the middle part of the threaded connecting ring, and a filter cover is fixedly provided at one end of the fixing ring.
[0020] By adopting the above technical solution, the filter cover can filter dust and impurities in the air, preventing dust from adhering to the surface of the probe and affecting monitoring. It can also further prevent dust and impurities from entering the interior of the sensor housing through the probe hole. The filter cover can be easily disassembled through the threaded connection between the threaded connecting ring and the fixing ring, making it convenient to clean or replace the filter cover.
[0021] Preferably, an extension frame is provided between the core monitoring unit and the probe head. The extension frame is fixedly installed at the front end of the core monitoring unit, the probe head is fixedly installed at one end of the extension frame, the cleaning motor is fixedly installed on a fixing plate on one side of the extension frame, and the probe head extends through the extension frame and through the probe hole to the outside of the sensor housing.
[0022] By adopting the above technical solution, the extension frame can isolate the core monitoring unit from the probe head, preventing the temperature of the core monitoring unit from affecting the accuracy of the probe head's monitoring of the ambient temperature. Furthermore, the probe head extends to the outside of the sensor housing via the extension frame, further preventing the temperature inside the sensor housing from affecting the accuracy of the probe head's monitoring of the external ambient temperature. At the same time, it can prevent the temperature generated by the semiconductor cooling chip and heating chip during operation from affecting the probe head, enabling the probe head to accurately monitor the external ambient temperature.
[0023] In summary, this application includes at least one of the following beneficial technical effects: This multi-element environmental monitoring sensor regulates the temperature of the core monitoring unit by using a semiconductor cooling chip for cooling or a heating chip for heating, keeping the core monitoring unit at a suitable operating temperature. A cleaning motor operates, driving a cleaning brush to clean the surface of the probe. This allows for temperature control based on the sensor's operating conditions, preventing the sensor from experiencing excessively high or low temperatures due to external environmental factors. This enables the sensor to effectively cope with complex environmental conditions and prevents environmental factors from affecting the sensor's monitoring accuracy. Attached Figure Description
[0024] Figure 1 This is a three-dimensional structural diagram of this application; Figure 2 This is a three-dimensional sectional view of the structure of this application; Figure 3 This is a schematic cross-sectional view of the structure on the right side of this application; Figure 4 This is a schematic diagram of the connection structure between the core monitoring unit and the positioning card in this application; Figure 5 This is a schematic diagram of the connection structure between the positioning card and the baffle in this application; Figure 6 This is an exploded view of a partial structure of this application.
[0025] In the picture: 1. Sensor housing; 2. Detection component; 201. Core monitoring unit; 202. Probe head; 3. Control motherboard; 4. Temperature control component; 401. Semiconductor cooling chip; 402. Heating element; 5. Positioning clip; 6. Dustproof component; 601. Dust cover; 602. Detection hole; 603. Filter cover; 604. Threaded connecting ring; 605. Fixing ring; 7. Cleaning component; 701. Cleaning motor; 702. Cleaning brush; 8. Baffle; 9. Positioning plate; 10. Positioning ring; 11. Heat sink fins; 12. Heat pipe; 13. Extension frame. Detailed Implementation
[0026] The following is in conjunction with the appendix Figure 1 - Appendix Figure 6 This application will be described in further detail below.
[0027] Example 1: Multi-element environmental monitoring sensor, please refer to Figure 1 , Figure 2 and Figure 3 The sensor housing includes a sensor housing 1, inside which a detection component 2 is installed. The detection component 2 includes a core monitoring unit 201, with a probe 202 at the front end of the core monitoring unit 201. A control motherboard 3 is fixedly installed at the rear end of the detection component 2 and is electrically connected to the core monitoring unit 201. A temperature control component 4 is installed inside the sensor housing 1, including a thermoelectric cooler 401 and a heating element 402. The thermoelectric cooler 401 and the heating element 402 are fixedly installed on the outer surface of the middle part of the core monitoring unit 201 and are electrically connected to the control motherboard 3. A cleaning component 7 is installed inside the sensor housing 1, including a cleaning motor 701. A cleaning brush 702 is fixedly installed at one end of the output shaft of the cleaning motor 701. The cleaning motor 701 is located on one side of the probe 202. A cleaning cotton on one side of the cleaning brush 702 is slidably connected to the outer surface of one end of the probe 202. The cleaning motor 701 is electrically connected to the control motherboard 3.
[0028] Please see Figure 2 , Figure 4 and Figure 5 The thermoelectric cooler 401 and the heating element 402 are respectively fixedly disposed on the front and rear outer surfaces and the left and right outer surfaces of the core monitoring unit 201. By fixing the thermoelectric cooler 401 and the heating element 402 to the front and rear outer surfaces and the left and right outer surfaces of the core monitoring unit 201 respectively, the symmetrical arrangement of the thermoelectric cooler 401 and the heating element 402 can balance the cooling effect of the thermoelectric cooler 401 and the heating effect of the heating element 402 to regulate the temperature of the core monitoring unit 201, avoid local temperature abnormalities in the core monitoring unit 201, and further ensure that the core monitoring unit 201 is always at a suitable working temperature, maintain a stable working state, and ensure monitoring accuracy.
[0029] Please see Figure 2 , Figure 4 and Figure 5 Multiple heat dissipation fins 11 are fixedly disposed on one outer surface of the thermoelectric cooler 401. Heat pipes 12 are fixedly disposed on the inner walls of the multiple heat dissipation fins 11. The multiple heat dissipation fins 11 are connected in series through the heat pipes 12. By distributing heat dissipation fins 11 on one outer surface of the thermoelectric cooler 401 and connecting multiple heat dissipation fins 11 in series through the heat pipes 12, the heat dissipation fins 11 can increase the heat dissipation area, and the heat pipes 12 can promote the rapid transfer of heat, effectively improving the heat dissipation efficiency of the thermoelectric cooler 401 during operation, avoiding the thermoelectric cooler 401 from affecting the cooling effect due to its own heat accumulation, ensuring that the thermoelectric cooler 401 can stably cool the core monitoring unit 201, and ensuring the temperature stability of the core monitoring unit 201.
[0030] Please see Figure 1 , Figure 3 and Figure 6 A dustproof component 6 is installed at one end of the sensor housing 1. The dustproof component 6 includes a dustproof cover 601, which is threaded onto the outer surface of one end of the sensor housing 1. A detection hole 602 is opened at one end of the dustproof cover 601. The position of the detection hole 602 corresponds to the position of the detection head 202. By installing the dustproof component 6 at one end of the sensor housing 1, the dustproof cover 601 can prevent a large amount of external dust from entering the interior of the sensor housing 1, avoiding dust from adhering to the surface of internal components such as the detection component 2 and the control motherboard 3 and affecting their operation. The position of the detection hole 602 corresponds to the detection head 202, so it does not affect the normal environmental detection of the detection head 202. While preventing dust, it ensures the normal monitoring function of the sensor and reduces the interference of dust on the monitoring accuracy.
[0031] Please see Figure 2 , Figure 3 and Figure 6 A threaded connecting ring 604 is fixedly provided on one side of the dust cover 601. A fixing ring 605 is threadedly connected to the outer surface of the middle part of the threaded connecting ring 604. A filter cover 603 is fixedly provided at one end of the fixing ring 605. The filter cover 603 can filter dust and impurities in the air, preventing dust from adhering to the surface of the detector head 202 and affecting monitoring. It can also further prevent dust and impurities from entering the interior of the sensor housing 1 through the detector hole 602. The filter cover 603 can be easily disassembled through the threaded connection between the threaded connecting ring 604 and the fixing ring 605, making it convenient to clean or replace the filter cover 603.
[0032] Please see Figure 2 and Figure 3An extension frame 13 is provided between the core monitoring unit 201 and the probe head 202. The extension frame 13 is fixedly installed at the front end of the core monitoring unit 201, and the probe head 202 is fixedly installed at one end of the extension frame 13. The cleaning motor 701 is fixedly installed on a fixing plate on one side of the extension frame 13. The probe head 202 extends to the outside of the sensor housing 1 through the extension frame 13 and through the probe hole 602. The extension frame 13 can isolate the core monitoring unit 201 and the probe head 202, so as to prevent the temperature of the core monitoring unit 201 from affecting the accuracy of the probe head 202 in monitoring the ambient temperature. Furthermore, the extension frame 13 extends the probe head 202 to the outside of the sensor housing 1, which can further prevent the temperature inside the sensor housing 1 from affecting the accuracy of the probe head 202 in monitoring the external ambient temperature. At the same time, it can prevent the temperature generated by the semiconductor cooling chip 401 and the heating chip 402 during operation from affecting the probe head 202, so that the probe head 202 can accurately monitor the external ambient temperature.
[0033] Example 2: Multi-element environmental monitoring sensor, please refer to Figure 2 , Figure 4 and Figure 5 Multiple positioning clips 5 are fixedly installed on the inner wall of the middle part of the sensor housing 1 by multiple fixing brackets. The multiple positioning clips 5 correspond to the corner positions of the core monitoring unit 201. The inner side of the positioning clip 5 is slidably connected to the outer surface of the corner of the core monitoring unit 201. The shape of the inner side of the positioning clip 5 is adapted to the shape of the corner of the core monitoring unit 201. The installation position of the core monitoring unit 201 inside the sensor housing 1 can be positioned by setting multiple positioning clips 5. The cooperation between multiple positioning clips 5 and the corner of the core monitoring unit 201 can improve the stability of the core monitoring unit 201 inside the sensor housing 1, and the core monitoring unit 201 can be easily disassembled from the sensor housing 1 for maintenance.
[0034] Please see Figure 2 , Figure 3 and Figure 5 A baffle 8 is fixedly provided at the tail end of the positioning card 5. The baffle 8 can restrict the installation position of the core monitoring unit 201 to prevent the core monitoring unit 201 from being installed too deep during installation or use, and further ensure the positioning accuracy of the core monitoring unit 201 inside the sensor housing 1.
[0035] Please see Figure 2 , Figure 3 and Figure 5Multiple positioning plates 9 are fixedly installed on the outer surface of the core monitoring unit 201 near the front end. A positioning ring 10 is provided on one side of the positioning plate 9. The positioning ring 10 abuts against the multiple positioning plates 9. The positioning ring 10 is fixedly installed on the end of the inner wall of the dust cover 601 by a fixing bracket. When the dust cover 601 is installed on the sensor housing 1, the positioning ring 10 can enter the interior of the sensor housing 1 and abut against the multiple positioning plates 9. With the help of the baffle 8 at the tail end of the positioning card 5, the position of the core monitoring unit 201 inside the sensor housing 1 can be further fixed to prevent the core monitoring unit 201 from being displaced inside the sensor housing 1.
[0036] The implementation principle of this application embodiment is as follows: The control motherboard 3 is electrically connected to the core monitoring unit 201. The core monitoring unit 201 realizes multi-element environmental monitoring through the front-end probe 202. When the control motherboard 3 detects that the temperature of the core monitoring unit 201 is too high, it controls the semiconductor cooling chip 401 in the temperature control component 4 to work, so that the semiconductor cooling chip 401 cools the core monitoring unit 201. The heat generated by the semiconductor cooling chip 401 is quickly dissipated through multiple heat dissipation fins 11 and heat pipes 12. When the temperature of the core monitoring unit 201 is too low, the control motherboard 3 controls the heating chip 402 to work, so that the heating chip 402 heats the core monitoring unit 201, ensuring that the core monitoring unit 201 is at a suitable working temperature. When it is necessary to clean the dust or other impurities that affect the operation of the probe 202 from the surface of the probe 202, the control motherboard 3 can periodically control the cleaning motor 701 in the cleaning component 7 to work. The cleaning motor 701 drives the cleaning brush 702 to rotate, so that the cleaning brush 702 cleans the surface of the probe 202. Wipe and clean to remove attached stains. The dust cover 601 at one end of the sensor housing 1 can block most of the external dust from entering the interior. The filter cover 603 on one side of the dust cover 601 filters dust and impurities in the air, preventing dust and impurities in the air from directly adhering to the detector head 202 and affecting the monitoring accuracy of the detector head 202. When the filter cover 603 becomes clogged due to filtering too much dust and impurities, rotate the fixing ring 605 to remove the fixing ring 605 from the threaded connection ring 604, and clean or replace the filter cover 603. When it is necessary to repair the core monitoring unit 201, rotate the rod dust cover 601 to remove the dust cover 601 through the threaded connection between the dust cover 601 and the sensor housing 1. When the dust cover 601 is removed, the positioning ring 10 will be removed from the sensor housing 1, releasing the positioning ring 10 from the positioning plate 9. The core monitoring unit 201 can then be slid out from between the multiple positioning clips 5 and removed from the sensor housing 1 for repair.
Claims
1. A multi-element environmental monitoring sensor, comprising a sensor housing (1), characterized in that: The sensor housing (1) is equipped with a detection component (2), which includes a core monitoring unit (201). The front end of the core monitoring unit (201) is provided with a probe (202), and the rear end of the detection component (2) is fixedly provided with a control motherboard (3). The control motherboard (3) is electrically connected to the core monitoring unit (201). The sensor housing (1) is equipped with a temperature control component (4), which includes a thermoelectric cooler (401) and a heating element (402). The thermoelectric cooler (401) and the heating element (402) are fixedly provided in the core monitoring unit. On the outer surface of the middle part of the measuring unit (201), the semiconductor cooling chip (401) and the heating chip (402) are electrically connected to the control motherboard (3). The sensor housing (1) is provided with a cleaning component (7). The cleaning component (7) includes a cleaning motor (701). A cleaning brush (702) is fixedly provided at one end of the output shaft of the cleaning motor (701). The cleaning motor (701) is located on one side of the probe head (202). The cleaning cotton on one side of the cleaning brush (702) is slidably connected to the outer surface of one end of the probe head (202). The cleaning motor (701) is electrically connected to the control motherboard (3).
2. The multi-element environmental monitoring sensor according to claim 1, characterized in that: The semiconductor cooling chip (401) and heating chip (402) are respectively fixedly disposed on the front and rear outer surfaces and the left and right outer surfaces of the core monitoring unit (201).
3. The multi-element environmental monitoring sensor according to claim 1, characterized in that: A plurality of heat dissipation fins (11) are fixedly disposed on one outer surface of the semiconductor cooling chip (401), and heat conduction pipes (12) are fixedly disposed on the inner wall of the plurality of heat dissipation fins (11), and the plurality of heat dissipation fins (11) are connected in series through heat conduction pipes (12).
4. The multi-element environmental monitoring sensor according to claim 1, characterized in that: A dustproof component (6) is installed at one end of the sensor housing (1). The dustproof component (6) includes a dustproof cover (601). The dustproof cover (601) is threaded onto the outer surface of one end of the sensor housing (1). A detection hole (602) is opened at one end of the dustproof cover (601). The opening position of the detection hole (602) corresponds to the position of the detection head (202).
5. The multi-element environmental monitoring sensor according to claim 1, characterized in that: Multiple positioning cards (5) are fixedly installed on the inner wall of the middle part of the sensor housing (1) by multiple fixing brackets. The multiple positioning cards (5) correspond to the corner positions of the core monitoring unit (201). The inner side of the positioning card (5) is slidably connected to the outer surface of the corner of the core monitoring unit (201). The shape of the inner side of the positioning card (5) is adapted to the shape of the corner of the core monitoring unit (201).
6. The multi-element environmental monitoring sensor according to claim 5, characterized in that: A baffle (8) is fixedly provided at the tail end of the positioning card (5).
7. The multi-element environmental monitoring sensor according to claim 1, characterized in that: Multiple positioning plates (9) are fixedly installed on the outer surface of the core monitoring unit (201) near the front end. A positioning ring (10) is provided on one side of the positioning plate (9). The positioning ring (10) abuts against the multiple positioning plates (9). The positioning ring (10) is fixedly installed at the end of the inner wall of the dust cover (601) by a fixing bracket.
8. The multi-element environmental monitoring sensor according to claim 4, characterized in that: A threaded connecting ring (604) is fixedly provided on one side of the dust cover (601), and a fixing ring (605) is threadedly connected to the outer surface of the middle part of the threaded connecting ring (604). A filter cover (603) is fixedly provided at one end of the fixing ring (605).
9. The multi-element environmental monitoring sensor according to claim 1, characterized in that: An extension frame (13) is provided between the core monitoring unit (201) and the probe (202). The extension frame (13) is fixedly installed at the front end of the core monitoring unit (201). The probe (202) is fixedly installed at one end of the extension frame (13). The cleaning motor (701) is fixedly installed on a fixing plate on one side of the extension frame (13). The probe (202) extends through the extension frame (13) and through the probe hole (602) to the outside of the sensor housing (1).