A can bus depth sensor

Abstract

The utility model discloses a CAN bus depth sensor, include: pressure sensitive component for guiding measurement medium and transmission pressure signal, casing, cover is located on pressure sensitive component, is used for protecting internal element, support, be located in casing, micro rectangle electric connector, be located in casing top, be used for connecting power supply and output signal, power supply circuit component, be used for reducing voltage to input power supply, signal conditioning circuit component, be used for the signal conditioning and conversion of pressure sensitive component output.

Description

Technical Field

[0001] This utility model belongs to the field of pressure sensor technology, and in particular relates to a CAN bus depth sensor. Background Technology

[0002] Pressure sensors are widely used in industrial automation environments, especially underwater equipment which requires high-precision, high-reliability depth sensors. Existing depth sensors suffer from susceptibility to corrosion, poor anti-interference capabilities, and low integration, making them unsuitable for harsh underwater environments. Therefore, a depth measurement sensor capable of withstanding high-pressure, corrosive environments and easily integrated into existing systems is needed. Utility Model Content

[0003] The summary section of this application is intended to provide a brief overview of the concepts, which will be described in detail in the detailed description section below. This summary section is not intended to identify key or essential features of the claimed technical solutions, nor is it intended to limit the scope of the claimed technical solutions.

[0004] To address the technical problems mentioned in the background section above, some embodiments of this application provide a CAN bus depth sensor, including: Pressure-sensitive components are used to guide the measuring medium and transmit pressure signals; A housing, covering the pressure-sensitive component, is used to protect the internal components; The support column is located inside the housing; A micro rectangular electrical connector is located on the top of the housing and is used to connect the power supply and output signal; Power supply circuit components used to step down the input power supply; Signal conditioning circuit components are used to condition and convert the signals output by pressure-sensitive components.

[0005] Preferably, the pressure-sensitive component includes a pressure core and a connecting nozzle, which are sealed by continuous laser welding.

[0006] Preferably, both the power supply circuit components and the signal conditioning circuit components are coated with a three-proof insulating varnish.

[0007] Preferably, the housing is made of a corrosion-resistant material.

[0008] Preferably, the housing is connected to the connector by screws.

[0009] This application provides a CAN bus depth sensor adapted to high-pressure and corrosive environments. Attached Figure Description

[0010] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application.

[0011] Furthermore, throughout the accompanying drawings, the same or similar reference numerals denote the same or similar elements. It should be understood that the drawings are schematic, and the elements are not necessarily drawn to scale.

[0012] In the attached diagram: Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0014] Figure 3 This is a partial structural schematic diagram of the present invention.

[0015] Reference numerals: 2. Housing; 21. Screw; 3. Support; 4. Pressure-sensitive component; 41. Pressure core; 42. Connector; 5. Micro rectangular electrical connector; 6. Power circuit assembly; 7. Signal conditioning circuit assembly. Detailed Implementation

[0016] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the accompanying drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0017] It should also be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. Unless otherwise specified, the embodiments and features described in this disclosure can be combined with each other.

[0018] It should be noted that the concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to limit the order of functions performed by these devices, modules or units or their interdependencies.

[0019] It should be noted that the terms "a" and "a plurality of" used in this disclosure are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise expressly indicated in the context, they should be understood as "one or more".

[0020] This disclosure will now be described in detail with reference to the accompanying drawings and embodiments.

[0021] like Figure 1-3As shown, a CAN bus depth sensor includes: a housing 2, a support column 3, a pressure-sensitive component 4, a micro-rectangular electrical connector 5, a power supply circuit assembly 6, and a signal conditioning circuit assembly 7. The housing 2 covers the pressure-sensitive component 4 and is detachably connected to the pressure-sensitive component 4 by screws 21, which is used to protect the internal components and prevent dust, metal shavings, fibers, etc. from entering the sensor. The support column 3 is fixed on the pressure-sensitive component 4 to support other components. The pressure-sensitive component 4 is fixed on a mounting base to guide the measuring medium and transmit pressure signals efficiently and reliably. The micro-rectangular electrical connector 5 is fixed on the top of the housing 2 to provide the required power to the sensor and transmit the output signal to an external system. The power supply circuit assembly 6 adopts a two-stage architecture of isolation conversion and linear voltage regulation to convert the input DC voltage into a stable low-voltage DC voltage that is electrically isolated from the input side. The input power supply is connected to the input terminal of the isolation power supply module, and the output terminal of the isolation power supply module is connected to the input terminal of the linear regulator. The output terminal of the linear regulator provides the final stable output voltage, thereby safely and efficiently stepping down the 28V input power supply to 5V, providing a stable and reliable operating voltage for the low-voltage circuits in the device. The signal conditioning circuit component 7 is used to perform temperature compensation, amplification, filtering, and conversion on the weak, non-standard raw signal output by the pressure-sensitive component 4. During measurement, the signal conditioning circuit component 7 acquires the millivolt-level differential voltage signal output by the pressure-sensitive component 4, amplifies it, and converts it into a digital signal. After the MCU microprocessor reads the digital signal, it performs multi-temperature point and multi-pressure point calibration and adjustment, and a high-precision pressure signal can be obtained after calibration. The actual water depth is then calculated using the hydrostatic formula P=ρgh (where h is the water depth, P is the measured static pressure, ρ is the water density, and g is the gravitational acceleration). The microprocessor encapsulates the water depth data into a standard data frame conforming to the CAN 2.0b protocol. This application constructs a complete functional architecture for the sensor, with each component forming a closed-loop link of "signal acquisition - protection support - energy supply - signal processing - signal output".As a front-end sensing unit, the pressure-sensitive component guides the measuring medium (such as seawater or industrial liquid) to contact the sensitive element through its own structure, converting the pressure physical quantity corresponding to the depth into an initial electrical signal. The housing acts as a protective carrier, covering the pressure-sensitive component, while internal supports provide fixed support for core electrical components such as the power supply circuit and signal conditioning circuit, preventing structural displacement caused by vibration. The micro-rectangular electrical connector integrates power input and signal output interfaces, realizing the transmission of external energy supply and processed signals. The power supply circuit component steps down the external input power (such as the commonly used 28V power supply in industry) to the working voltage (such as 5V) suitable for each component, ensuring stable circuit operation. The signal conditioning circuit component amplifies, filters, temperature compensates, and converts the weak and easily interfered raw signal output by the pressure-sensitive component into a digital-to-analog converter, ultimately generating a standard signal conforming to the CAN bus protocol and outputting it through the connector. This solves the core pain points of existing sensors: "low integration, poor anti-interference, and weak adaptability." The overall modular structure improves assembly and maintenance efficiency, and the combined design of the housing and support protects internal components from damage caused by dust, metal shavings, and external impacts. The integrated design of the micro rectangular electrical connector simplifies external connections and avoids the contact problems of traditional discrete interfaces. The voltage reduction adaptation of the power circuit and the precise processing of signal conditioning ensure stable power supply and signal quality for the sensor in complex scenarios such as industrial automation and underwater equipment. With the CAN bus signal output, it achieves high-efficiency compatibility with existing industrial systems, filling the shortcomings of traditional depth sensors in terms of integration and environmental adaptability.

[0022] As a preferred embodiment, the pressure-sensitive component 4 includes a pressure core 41 and a connecting nozzle, which are sealed by continuous laser welding. The pressure core 41 directly senses the external water pressure and converts it into a millivolt-level differential voltage signal output proportional to the pressure. The weld seam sealing performance of the continuous laser welding reaches IP67 or higher. In underwater high-pressure and corrosive media (such as seawater and industrial acid and alkali solutions), it can effectively prevent the medium from seeping into the component and damaging the pressure core, ensuring the accuracy of pressure signal acquisition. Compared with traditional welding or mechanical seals, laser welding has higher weld seam strength and excellent vibration and fatigue resistance, which extends the service life of the sensor by more than 30% in scenarios such as underwater equipment turbulence and industrial pipeline vibration. At the same time, the consistency of the sealing process ensures the product qualification rate during mass production and reduces the later maintenance costs.

[0023] As a preferred option, to adapt to the underwater corrosive environment, both the power supply circuit assembly 6 and the signal conditioning circuit assembly 7 are coated with a three-proof insulating varnish to protect the electronic components.

[0024] As a preferred option, housing 2 is made of corrosion-resistant material, isolating the internal components from high-pressure, corrosive aquatic environments. A uniform, dense insulating protective film is formed on the surface of the circuit components through dip coating or spraying and after curing. This film blocks contact between the circuit components and corrosive or conductive media such as water vapor, salt spray, and dust in the external environment, while maintaining good insulation performance and not affecting the heat dissipation efficiency or electrical signal transmission of the circuit components. This significantly improves the reliability of the sensor in harsh environments and solves the pain points of traditional circuit components being "susceptible to corrosion and weak anti-interference ability." In underwater, humid industrial workshops, and coastal high-salt-spray scenarios, the varnish protective film can effectively prevent short circuits caused by water vapor and oxidation and corrosion of components caused by salt spray, expanding the sensor's environmental adaptability from dry and clean environments to complex and corrosive environments. At the same time, the wear-resistant properties of the varnish also reduce physical damage to the circuit components during assembly and maintenance.

[0025] The above description is merely a selection of preferred embodiments of this disclosure and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in the embodiments of this disclosure is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-described inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in the embodiments of this disclosure.

Claims

1. A CAN bus depth sensor, characterized in that, include: Pressure-sensitive components are used to guide the measuring medium and transmit pressure signals; A housing, covering the pressure-sensitive component, is used to protect the internal components; A support column is located inside the housing; a micro rectangular electrical connector is located on the top of the housing for connecting power supply and output signal; a power supply circuit assembly is used to step down the input power supply; and a signal conditioning circuit assembly is used to condition and convert the signal output by the pressure-sensitive component.

2. The CAN bus depth sensor according to claim 1, characterized in that: The pressure-sensitive component includes a pressure core and a connector, which are sealed by continuous laser welding.

3. The CAN bus depth sensor according to claim 1, characterized in that: Both the power supply circuit assembly and the signal conditioning circuit assembly are coated with a three-proof insulating varnish.

4. The CAN bus depth sensor according to claim 1, characterized in that: The shell is made of corrosion-resistant material.

5. The CAN bus depth sensor according to claim 1, characterized in that: The housing is connected to the connector by screws.

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